533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 5_1發明領域： 本發明係有關於一種半導體工廠的派工方法，特別是有關 一種動態產能需求預估方法，可計算出工廠的未來需求。 5-2發明背景： 積體電路之製造過程，通常需要上百個製程，可分為如下 幾類：擴散、微影技術、蝕刻、離子佈植、沉積及濺鍍。在 這幾種製造過程之中，擴散與沉積通常需要較長的製程時間， 因此對於這些製程通常是數片晶圓同時進行，稱為整批處理， 例如擴散製程，大約需要四到十二小時，並可同時處理至多 六個晶片。 在生產的流程之中，是持續的投入一批批的晶圓進入生產 線，而且在一個半導體廠的生產線上，可能還有許多種的產 品同時進行生產，如此一來，各種不同的產品，與各種不同 的機台，同時在生產線上進行製造過程，而每種產品在各個 機台的停留時間不一，於是產生機台派工的問題。 舉例來說，在生產線上可能有N種產品進行生產，每種 產品有數批晶圓投入生產線，當生產流程進行到蝕刻製程時， 產品的蝕刻製程大約有幾種，晶圓的處理量很大，可是蝕刻 機台的數量卻是有限個，約為m個機台，於是產生機台派工 2 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) Γ:...........裝.........訂.........線 (請先閲讀背面之注意事項再填寫本頁) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 與晶圓需求預估的問題，也就是說，如何安排钱刻機台的工 作，譬如對某一個機台排入多少批晶圓等待製程，或者，在 生產線投入多少批晶圓進行製程，甚至於預估在幾天後，需 對生產線投入多少批的晶圓，都是攸關生產線流程的順暢與 否的問題。 若是在某一個生產製程之中，投入太多的晶圓，或者是安 排太少的機台，都會造成生產流程的瓶頸，使得產品等待的 時間過長；或者，投入太少的晶圓，或者是安排太多的機台， 使得機台的空閒時間太多，造成生產線的資源浪費。上述的 生產問題，最常見於剛開始進行量產的半導體廠，在已經正 吊運作的半導體廠之中，每天晶圓的投入數量，都已經是固 定，或者呈現線性的增減，所以較不易產生這類的問題。 傳統的產能檢查方法藉由設備的線性負載，計算機台的使 用情形，然而，此種假設在半導體廠之中並不都是正確的， 特別是在初期試轉的階段，根據此種情況，傳統方法可以使 用的相當好，而在半導體廠之中的產能需求總是有偏差的。 命第一 A圖解釋傳統的產能檢查方法，此方法為機台產量 ，求(每日產量）的計算方法，根據計晝的產品混合，假設進入 $個機台的線性晶圓處理數量，此為靜態產能檢查方法。 當晶圓處理數量沒有呈現線性分佈時，此方法導向偏差的產 3 本紙張尺度適用巾關家標準(cns)A4規格⑵ϋχ297公复y -卜.......…裝.........訂.........線 (請先閱讀背面之注意事項再填寫本頁} 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 量預估。 然而，在半導體晶圓廠之中，會由於快速的需求變化、較 差的機台穩定度與低製程容量，特別在試運轉階段，導致晶 圓處理數量分佈不是線性。移動瓶頸通常存在於這種晶圓處 理數量不線性分佈的半導體製造廠之中。因此，在不同製程 階段與產品之間，配置可使用的機台，以減少移動瓶頸的影 響。 傳統容量計算方法是一種靜態的方法，既有數據包括工作 日的晶圓處理數量，此方法不考慮生產線的運轉比率（turn ratio)，僅考慮晶圓處理數量的數據。因此，此種方法可用於 平衡的生產線上，如果此方法運用在非平衡的生產線上，則 此方法無法計算每個工作日的生產線的每個製程的變化。 因此，需要一種動態產能需求預估的計算方法，此種動態 方法考慮在每個工作日之中，生產線上的變化，並預測一生 產線的容量需求與預估。 5-3發明目的及概述： 本發明是有關一種動態產能需求預估方法，利用生產線的 原始資料，瞭解在第k個生產曰之中，有N種產品在m個製 程步驟之中進行生產，可計算出第i種產品在第j個製程步驟 4 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) Γ ...........裝.........訂.........線 (請先閱讀背面之注意事項再填寫本頁) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 的晶圓處理數量wijk，以及運轉比率Tijk，然後，運用本發明 的計算公式，算出在第k+Ι個生產日的第k日的產量M’ijk， 與晶圓處理數量Wij(k+1)。依照這個方法，算出未來生產日的 所有產品在所有製程的晶圓處理數量，以及所有產品在所有 製程的產量，進而算出在未來生產日的需求容量預估（capacity demand forecast)，決定生產線工具的安排與動態產能要求。 本發明的動態產能需求預估方法，配合運轉比率的計算， 可以準確算出未來生產日的產能，甚至可以逐日調整運轉比 例，計算出正確的產能，預估未來的生產線需求。 5-4圖式簡單說明： 第一 A圖解釋利用習知技術之靜態產量檢查方法，在每 一個月解釋每一個機台的產能需求； 第一 B圖解釋利用本發明之動態產量檢查方法，計算在 未來每一個機台的產量； 值得注意的是，在本發明之中考慮晶圓處理數量曲線與運 轉比例，以取代在習知技術之中所考慮的產品混合。 第二圖顯示利用本發明的方法，加入運轉比率參數，在某 種產品的某個製造過程之中，每天晶圓處理數量與產量計算 的流程圖； 第三圖顯示利用本發明的動態產能需求預估方法，計算動 5 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) -:-..........裝.........訂.........線 (請先閲讀背面之注意事項再填寫本頁) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 態產能要求，與動態工具配置建議的流程圖。 5-5發明詳細說明·· 以下將配合圖式，以具體實施例說明發明的詳細内容。 請參閱第二圖，圖中顯示出某種特定產品在某個特定機台 的產量計算方法，從關鍵製程報表(Key Stage Report，KSR) 得知第一天的晶圓處理數量（work-in-process ; WIP)，與生產 線的運轉比率（Turn Ratio)。然後從晶圓處理數量資料與運轉 比例得知第二天的晶圓處理數量，然後從這兩天得晶圓處理 數量算出第一天的產量。以此類推，如果有第N-1天的晶圓 處理數量與第N-2天的產量，就可以計算出第N天的晶圓處 理數量晶圓處理數量與第N-1天的產量，決定在第N個生產 日，必須投入多少的晶圓數量，進行後續的製程。以下將詳 細敘述計算方法。 於半導體廠的生產流程之中，在第k個生產日之中，有i 種產品，在j個製程中進行製造過程，通常在半導體廠都有關 鍵製程報表(Key Stage Report，KSR)，從報表中得出幾個重要 參數。從關鍵製程報表之中得知生產線的數個參數，舉例來 說，在一個工作日之中一製程的晶圓處理數量，必須從這個 報表之中得知。 6 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 卜..........裝-........訂.........線 (請先閱讀背面之注意事項再填寫本頁) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 第一：決定於第k個生產曰，第i個產品在第j個製程的 運轉比率Tijk(turn ratio)，運轉比率的定義為某一批產品，每 天經過的機台數目，也就是說，每天機台的產量（move)(其單 位為：批/天），除以機台的晶圓處理數量（WIP)(其單位為： 批/站），可以得知一批晶圓每天經過的製程數目（其單位為： 站/天）。若是運轉比率Tijk較高，代表在第k個生產日的第i 種產品，經過第j個製程機台的速度較快；反之，便代表速度 較慢。運轉比例的計算方法，對每一個生產日每一個製程的 每一種產品，可以取前面十個生產日的同一製程同一種產品 的運轉比例的平均值。但是，在本發明的方法之中，運轉比 例的計算方法，並不限定於要對前面十個生產日作取樣，只 要對適當生產日數作取樣即可。 第二：決定於第k個生產日的第i個產品，於第j個製程 的晶圓處理數量Wijk。Wijk的數量可以從關鍵製程報表（KSR) 得知，知道在某特定生產日的某特定產品，在某特定製程之 中，有多少的產品正在進行製程。 於是根據上述的數據，在第k個生產日可以得出一個數據 表，表一： 製程/產品 Turn Ratio 1 2 3 … N-l N 1 Tuk wllk w21k w31k … wnlk 7 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) •卜-..........裝.........訂.........線 (請先閱讀背面之注意事項再填寫本頁) 533363 A7 B7 五、發明説明（ 2533363 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (5) Field of Invention: The present invention relates to a method for dispatching semiconductor factories, especially a method for estimating dynamic capacity demand, which can be calculated. The future needs of the factory. 5-2 Background of the Invention: The manufacturing process of integrated circuits usually requires hundreds of processes, which can be divided into the following categories: diffusion, lithography, etching, ion implantation, deposition, and sputtering. Among these several manufacturing processes, diffusion and deposition usually require a long process time, so for these processes, several wafers are usually performed at the same time, which is called a batch process. For example, the diffusion process requires about four to twelve hours. , And can process up to six chips at the same time. In the production process, batches of wafers are continuously put into the production line, and in a semiconductor factory production line, there may be many kinds of products being produced at the same time. As a result, various products, and A variety of machines are manufactured on the production line at the same time, and the residence time of each product on each machine is different, so the problem of machine dispatching occurs. For example, there may be N types of products on the production line. Each product has several batches of wafers put into the production line. When the production process reaches the etching process, there are several types of product etching processes, and the wafer processing capacity is large. , But the number of etching machines is limited, about m machines, so the machine is sent to send 2 paper size to the Chinese National Standard (CNS) A4 specifications (210X297 mm) Γ: ..... ...... install ......... order ......... line (please read the precautions on the back before filling this page) 533363 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs System A7 B7 V. Explanation of the invention () and wafer demand estimation, that is, how to arrange the work of the money engraving machine, such as how many batches of wafers are put into a certain machine waiting for the process, or in the production line How many batches of wafers are put into the process, and even how many batches of wafers are required to be put into the production line in a few days are all about whether the production line process is smooth or not. If too many wafers are invested in a certain production process, or too few machines are arranged, it will cause a bottleneck in the production process, making the product wait too long; or, too few wafers, or It is because too many machines are arranged, so that the machine has too much idle time, which causes waste of production line resources. The above-mentioned production problems are most common in semiconductor factories that have just begun mass production. Among the semiconductor factories that are already in operation, the number of daily wafer inputs has been fixed or has increased or decreased linearly, so it is not easy. This kind of problem arises. The traditional capacity inspection method uses the linear load of the equipment and the use of the computer station. However, this assumption is not always correct in the semiconductor factory, especially in the initial test phase. According to this situation, the traditional The method can be used quite well, and the demand for capacity among semiconductor factories is always biased. The first chart A illustrates the traditional method of capacity inspection. This method is the output of the machine. Find the (daily output) calculation method. Based on the product mix of the day, assuming the number of linear wafers processed in the machine, this Method for static capacity check. When the number of wafers processed does not show a linear distribution, this method guides the production of deviations. This paper size is applicable to the family standard (cns) A4 size ⑵ϋ 297 public compound y-bu ... ..... order ......... line (please read the precautions on the back before filling out this page) 533363 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () However, in semiconductor wafer fabs, due to rapid demand changes, poor machine stability, and low process capacity, especially during the commissioning phase, the distribution of wafer processing quantities is not linear. Mobile bottlenecks often exist in This type of wafer processing is not linearly distributed in semiconductor manufacturing plants. Therefore, usable machines are configured between different process stages and products to reduce the impact of mobile bottlenecks. Traditional capacity calculation methods are a static method The existing data includes the number of wafers processed during the working day. This method does not consider the turn ratio of the production line, and only considers the number of wafers processed. Therefore, this method can be used for balanced production lines. If this method is applied to an unbalanced production line, this method cannot calculate the change of each process of the production line every working day. Therefore, a calculation method of dynamic capacity demand estimation is needed. This dynamic method considers During the working day, the production line changes, and the capacity demand and estimation of a production line are predicted. 5-3 Purpose and Summary of the Invention: The present invention relates to a dynamic capacity demand estimation method. During k production days, N kinds of products are produced in m process steps, and the i-th product can be calculated in the j-th process step. 4 This paper size is applicable to China National Standard (CNS) A4 specification (210X297). (%) Γ ........... install ......... order ......... line (please read the precautions on the back before filling this page) 533363 Economy Printed by the Intellectual Property Bureau employee consumer cooperative A7 B7 V. The wafer processing quantity wijk of the invention description () and the operation ratio Tijk, and then use the calculation formula of the present invention to calculate the kth on the k + 1th production day The daily output M'ijk, and the number of wafers processed Wij (k + 1). According to this method, calculate the wafer processing quantity of all products in all processes in the future production day, and the output of all products in all processes, and then calculate the capacity demand forecast in the future production day. forecast) to determine the arrangement of production line tools and dynamic capacity requirements. The dynamic capacity demand estimation method of the present invention, in conjunction with the calculation of the operating ratio, can accurately calculate the capacity of the future production day, and even adjust the operating ratio daily to calculate the correct capacity 5-4 Schematic illustration: The first chart A explains the static output inspection method using the conventional technology, explaining the capacity requirements of each machine every month; the first chart B explains the utilization The dynamic yield inspection method of the present invention calculates the yield of each machine in the future; it is worth noting that in the present invention, the wafer processing quantity curve and operation ratio are considered to replace the products considered in the conventional technology mixing. The second figure shows a flow chart for calculating the number of wafers processed and output per day during the manufacturing process of a certain product by adding the operation ratio parameter using the method of the present invention; the third figure shows the dynamic capacity demand using the present invention Estimation method, calculation of 5 paper sizes Applicable to China National Standard (CNS) A4 specification (210X297 mm)-: -.... ....... line (please read the notes on the back before filling out this page) 533363 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () State capacity requirements, and the recommended dynamic tool configuration flow chart. 5-5 Detailed description of the invention ... The details of the invention will be described below with specific examples in conjunction with the drawings. Please refer to the second figure, which shows the calculation method of the output of a specific product on a specific machine. The key-stage report (KSR) is used to know the wafer-work quantity on the first day. -process; WIP), and the turn ratio of the production line. Then, the number of wafers processed on the second day is obtained from the data of the number of wafers processed and the operation ratio, and then the output of the first day is calculated from the number of wafers processed on these two days. By analogy, if there are the number of wafers processed on day N-1 and the output on day N-2, we can calculate the number of wafers processed on day N and the number of wafers processed on day N-1. Decide how many wafers must be invested on the Nth production day for subsequent processes. The calculation method will be described in detail below. In the production process of the semiconductor factory, in the kth production day, there are i products and the manufacturing process is performed in j processes. Generally, the semiconductor factory has a Key Stage Report (KSR). Several important parameters emerge from the report. Several parameters of the production line are known from the key process report. For example, the number of wafers processed in a process in a working day must be known from this report. 6 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) .............. install -......... order ... (Please read the precautions on the back before filling out this page) 533363 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description () First: Determined by the kth production, the ith product is on the jth The operation ratio Tijk (turn ratio) of each process is defined as the number of machines passed by a certain batch of products per day, that is, the daily machine output (the unit is: batch / day), Divide by the wafer processing number (WIP) of the machine (its unit is: batch / station), you can know the number of processes that a batch of wafers go through each day (the unit is: station / day). If the operation ratio Tijk is high, it means that the ith product on the kth production day passes through the jth process machine faster; otherwise, it means that the speed is slower. For the calculation method of the operation ratio, for each product of each process on each production day, the average value of the operation ratio of the same product of the same process in the previous ten production days can be taken. However, in the method of the present invention, the calculation method of the running ratio is not limited to sampling the first ten production days, but only sampling the appropriate number of production days. Second: The number of wafer processing Wijk that is determined for the i-th product on the k-th production day and the j-th process. The number of Wijk can be known from the key process report (KSR), knowing how many products are being processed in a particular process on a particular production day. Therefore, according to the above data, a data table can be obtained on the k-th production day. Table 1: Process / Product Turn Ratio 1 2 3… Nl N 1 Tuk wllk w21k w31k… wnlk 7 This paper size applies to the Chinese National Standard (CNS ) A4 size (210X297mm) • Bu ............... Order ......... line (please read the precautions on the back first) Refill this page) 533363 A7 B7 V. Description of the invention (2
T 12kT 12k
W 12k w 22k w 32k w (n_l)2k w n2k Μ τ lmk w lmk w 2mk 3Mk w (η-1 )mk w nmk 在表一中詳細列示在第k個生產曰之中，有m個生產製 程，N種產品投入生產線之中，每種產品在每種製程之中的 晶圓處理數量（WIP)，以及每種機台每種產品的運轉比率（Turn Ratio)，此處的晶圓處理數量的單位為整批或者為整個晶圓。 第三··計算於第k個生產日的第i個產品，於第j個製程 的生產數量Mijk，計算公式如下： Mijk-E [Ti(j.n)k-integer(Ti(j.n)k)) ]*Wi(j_n)k > n=l~j-l ^ 這個公式的代表含意，對將某個產品的所有製程的運轉比 率，取其小數部份，代表未能完成一個製程的比率，再乘以 在製程的晶圓處理數量，然後對在第j個製程之前的製程作總 和，得到於第k個生產日的第i個產品在第j個製程的產量 Mijk ° Γ:..........裝.........訂.........線 (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 員 工 消 費 合 社 印 製 第四：決定修正後的生產數量M’ijk， M5ijk= min[Mijk ? (Mi(j_1)k + Wijk)]； 因為在現階段的產量，通常是從正在處理的晶圓數量而 來，在加上從上一個製程的產量轉移而來，在第k個生產日 的第j個製程，第i種產品的產量，是不能大於前一個製程的 產篁Mi(卜1)k與晶圓處理數量Wijk的總和，若不符合這條規則， 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 則所得的晶圓產量，會多於投入生產線的晶圓總量。 第五：決定第k+Ι個生產曰，第i個產品的第j個製程的 處理晶圓數Ϊ Wy(k+1) ’W 12k w 22k w 32k w (n_l) 2k w n2k Μ τ lmk w lmk w 2mk 3Mk w (η-1) mk w nmk is listed in detail in Table 1 among the kth production, there are m productions Process, N kinds of products are put into the production line, the wafer processing quantity (WIP) of each product in each process, and the turn ratio of each product of each machine, the wafer processing here The unit of quantity is whole batch or whole wafer. Third: Calculate the production quantity Mijk of the i-th product on the k-th production day and the j-th process, the calculation formula is as follows: Mijk-E [Ti (jn) k-integer (Ti (jn) k)) ] * Wi (j_n) k > n = l ~ jl ^ The representative meaning of this formula is to take the fraction of the operating ratio of all processes of a product, which represents the rate of failing to complete a process, then multiply Take the number of wafers processed in the process, and then sum the processes before the jth process to get the output of the ith product on the kth production day in the jth process. Mijk ° Γ: ..... ................. Order ......... line (Please read the precautions on the back before filling out this page) Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Fourth: Determine the revised production quantity M'ijk, M5ijk = min [Mijk? (Mi (j_1) k + Wijk)]; because the output at this stage usually comes from the number of wafers being processed. In addition, the output from the previous process is transferred. In the j-th process on the k-th production day, the output of the i-type product cannot be greater than the yield of the previous process. Mi (b.1) k and wafer processing number The total amount of Wijk, if it does not meet this rule, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 533363 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Note () The wafer output will be more than the total number of wafers put into the production line. Fifth: Determine the number of processed wafers for the k + 1 production, the i-th product, and the j-th process Ϊ Wy (k + 1) ’
Wij(k+i) =Wijk+ M’i(j_”k，M’ijk， 這個公式是代表於第k+1個生產日之中，第i個產品在第 j個製程的晶圓處理數量Wij(k+1)，是將前一個生產日之中，其 晶圓處理數量Wijk加上前一個製程的產量M’i(j_uk，再減去此 製程的產量M’ijk，便得到晶圓處理數量Wij(k+1)。因為晶圓處 理數量Wij(k+1)，是從上一個生產日的晶圓處理數量Wijk，加 上從上一個製程轉移來的晶圓數量，也就是產量M’i(j_1)k，再 減去已經離開製程的晶圓數量，也就是產量M’ijk，得到下一 個生產日正在進行製程的晶圓處理數量Wij(k+1)。 第六··然後重複第一個到第五個步驟，由運轉比率（Turn Ratio)與晶圓處理數量WiKk+1)，算出第k+1個生產曰，第i個 產品的第j個製程的產量M’ij(k+1) 〇 利用這樣的計算方法，可以輕易算出在幾個生產日之後， 每個產品在每個製程的產量，決定後續需投入生產線的晶圓 數量。 舉例來說，在生產線之中具有三個製程tl、t2與t3，計 9 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) •h:」..........裝.........訂.........線 (請先閲讀背面之注意事項再填寫本頁) 533363 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（） 算在第k個生產日之中，整個生產線需求容量預估（forecast capacity demand)。計算方法如下：將所有產品的產量加總起 來，Wij (k + i) = Wijk + M'i (j_ ”k, M'ijk, This formula represents the number of wafers processed by the i-th product in the j-th process during the k + 1th production day. Wij (k + 1): Wafer processing is performed by adding the wafer processing number Wijk of the previous production day to the output of the previous process M'i (j_uk, and then subtracting the output M'ijk of this process. Quantity Wij (k + 1). Because the wafer processing quantity Wij (k + 1) is the wafer processing quantity Wijk from the previous production day, plus the number of wafers transferred from the previous process, which is the output M. 'i (j_1) k, then subtract the number of wafers that have left the process, which is the output M'ijk, to get the number of wafer processing Wij (k + 1) that is being processed on the next production day. Sixth ... then Repeat the first step to the fifth step, and calculate the output of the k + 1th process, the output of the jth process of the ith product, M'ij from the Turn Ratio and the number of wafers processed WiKk + 1). (k + 1) 〇 With this calculation method, it is easy to calculate the output of each product in each process after a few production days, and determine the wafers to be put into the production line in the future. For example, there are three processes t1, t2, and t3 in the production line, and 9 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) • h: ............ ... install ......... order ......... line (please read the precautions on the back before filling out this page) 533363 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Calculated in the kth production day, the forecast of the entire production line's demand capacity (forecast capacity demand). The calculation method is as follows: the total output of all products,
Mjk=2 M、jk ’ i=l〜N， 得到所有產品在每個製程的總產量，再對tl、t2與t3的 生產製程的生產總量加總起來，得到第k個生產日的需求容 量預估 Tk (forecast capacity demand)，計算方法如下：Mjk = 2 M, jk 'i = l ~ N, get the total output of all products in each process, and then add up the total production of the production processes of tl, t2 and t3 to get the demand on the kth production day The capacity estimation Tk (forecast capacity demand) is calculated as follows:
Tk=HMjk，j=tl、t2、t3 ; 得到第k個生產日需投入的晶圓數量。如此類推，第k+n-1 日的需求預估容量，也可以用這個方法算出，如下所述：Tk = HMjk, j = tl, t2, t3; Get the number of wafers to be invested on the kth production day. By analogy, the estimated demand capacity on day k + n-1 can also be calculated by this method, as follows:
Tk+n-l= Σ Mj(k+n-i) 十tl、t2、t3 〇 算出未來生產日的需求預估容量，可以投入適當的晶圓數 量，得到最好的生產效果。 請參閱第三圖，圖中顯示出本發明之動態產能需求預估方 法的作用。從原始資料100進入運轉比率估算法102，利用原 始資料算出運轉比率104(TumRatio)，運轉比率的計算方法， 運轉比例的計算方法，對每一個生產日每一個製程的每一種 產品，可以取前面十個生產曰的同一製程同一種產品的運轉 比例的平均值。將運轉比率計算104與WIP資料106，輸入 本發明的動態產能需求預估系108統之中，得到未來產量的 需求預估，再對生產線作出改變，例如動態工具配置建議110， 10 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ..........裝.........訂.........線 (請先閲讀背面之注意事項再填寫本頁) 533363 A7 B7 五、發明説明（） 與動態產能要求112，有效分配生產線的資源，縮短產品的製 程時間。根據這兩個建議，來改變生產線的情況，生產 線的控制者可以分配生產線的資源，縮短產品在生產 線之中的製程時間。 以上所述僅為本發明之較佳實施例而已，並非用以限定本 發明之申請專利範圍；凡其它未脫離本發明所揭示之精神下 所完成之等效改變或修飾，均應包含在下述之申請專利範圍 内。例如生產線運轉比率的計算方法，可以使用數個生產日 的平均值，不限定於十個生產日的平均值，都可以計算出生 產線的產量，甚至使用動態變化的運轉比率，對每一個生產 曰計算一次運轉比率，再進行其它資料的計算。 ..........裝.........訂.........線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Tk + n-l = Σ Mj (k + n-i) ten t1, t2, t3 〇 Calculate the estimated demand capacity for the future production day, you can invest in an appropriate number of wafers to get the best production effect. Please refer to the third graph, which shows the effect of the dynamic capacity demand estimation method of the present invention. Enter the operation ratio estimation method 102 from the original data 100, calculate the operation ratio 104 (TumRatio) using the original data, the calculation method of the operation ratio, and the calculation method of the operation ratio. For each product of each process and process on each production day, you can take the previous The average value of the operating ratios of ten products in the same process and the same product. The operation ratio calculation 104 and the WIP data 106 are input into the dynamic capacity demand estimation system 108 of the present invention to obtain a demand forecast for future output, and then changes are made to the production line, such as a dynamic tool configuration proposal of 110, 10 paper sizes Applicable to China National Standard (CNS) A4 specification (210X297mm) ............... install ......... order ......... line (please read the back first Please pay attention to this page and fill in this page again) 533363 A7 B7 V. Description of the invention () and dynamic capacity requirement 112, effectively allocate the resources of the production line and shorten the product process time. According to these two suggestions, to change the situation of the production line, the controller of the production line can allocate the resources of the production line and shorten the process time of the product in the production line. The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of patent application for the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention shall be included in the following Within the scope of patent application. For example, the calculation method of the production line operation ratio can use the average value of several production days, not limited to the average value of ten production days, can calculate the output of the production line, and even use a dynamically changing operation ratio, for each production day Calculate the running ratio once, and then calculate other data. .......... install ......... order ......... line (please read the precautions on the back before filling out this page) Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by Consumer Cooperatives
11 1X 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)11 1X This paper size applies to China National Standard (CNS) A4 (210X297 mm)