TW533116B - Water soluble soldering flux for copper and aluminum - Google Patents

Abstract

Improved water-soluble solder flux for soldering a copper and aluminum parts. Specifically, the water-soluble solder flux comprising a halides (such as fluoride and chloide), a high boiling point polymer carrier, a metallic compounds and a surfactant. When the soldering proceeding, wherein the halides function for removing a copper-oxides and aluminum-oxides, the surfactant enhancing the flux to wetting the surface of copper and aluminum, the high boiling point polymer carrier function for enhancing the fluidity of metallic compounds which being under a meltdown phase, and generating an firm alloy-layer to cover both of the surface of the copper and aluminum parts, and stop an electronic-chemical corrosion before which may occurred therein.

Description

533116 V. Description of the invention (1) [Field of the invention] The present invention relates to a water-soluble flux, especially a water-soluble flux used for welding between copper and aluminum materials, to reduce the potential difference between the two materials due to the potential difference. The electrochemical reaction solves the problem of easy corrosion and spalling at the solder. [Background of the Invention] Aluminum alloys are often used as heat sinks for industrial cooling fins, but the oxide film on the surface of aluminum alloys often hinders the general soldering operation. For copper and aluminum soldering operations, if conventional flux is applied, whether it is a water-soluble flux or a rosin resin flux, the soldering between copper and aluminum is often caused by the three metals: copper, tin, and aluminum. The electrode potential difference is too large, which causes corrosion and peeling of the solder due to electrochemical reaction. To investigate the failure of conventional soldering operations, the main factor is the electrochemical corrosion reaction between metal materials. Because the potential difference is too large, metal ionization occurs in the metal materials involved in welding, and a tendency to move to a metal with a lower potential. In the environment containing hydrogen ions, the electrolysis or battery action further promotes the ionization of metals and causes corrosion, that is, the electrochemical corrosion of metals. The possible reaction modes can be summarized as follows: (a) Mutual replacement of metals: When entering the electrolyte aqueous solution, the ions generated by the metals are soluble in water.

533116 V. Description of the invention (2) Liquid, relatively less metal ionization tendency precipitation (this is the mutual replacement of metals) metal ionization tendency is listed as follows: unstable state (A 1)-zinc (Z η ) —Edit (C d ^ Iron (F e) — Record (N i) — ^ Tin (S η) —Hot (P b) — Hydrogen [Η]-> Copper (C u)-> Silver (A g) (b) Electrolysis: In the electrolyte aqueous solution, the cation and anion are precipitated at the anode and cathode by the ionization effect by the current flowing through the metal body. (C) Battery function: The potential of the electrode 1111 is not phase il Combined with the metal i of · i, when f | put into the electrolyte solution from ^ I, a short-circuit battery will be formed, and the metal running towards the anode (metal with low electrode potential, base metal) is dissolved in the solution, which promotes its corrosion (This is the role of chemical batteries.) To address the above shortcomings, an efficient, long-lasting, water-washable flux is needed to produce a strong soft solder joint that will not collapse due to long-term use. [Objective and Technical Overview]

533116 V. Description of the invention (3) Solder material, solution, soldering, dissolution, dissolution, and dissolution of gold on the subject layer. Special welding for special envoys. The main material of the present invention is the combination of the main aluminum and the poor metal material. The present invention can make use of the present invention to make a water-soluble flux containing: a group of halogen compounds, a group of high boiling point carriers, a Group of metal compounds and a group of surfactants; among them, halogen compounds can be used to remove the oxide film on the surface of copper and shao materials when soldering at high temperature. The surfactant can increase the wetting of copper and aluminum surfaces by flux. High-boiling solvents can increase the fluidity of metal compounds in the smelting state, and further completely and fuse with the soft solder (tin-boat alloy) that has been fused, so that the copper materials connected to the solder and A very uniform and special alloy layer is formed between the shao materials, which completely and uniformly adheres to the surface of copper and aluminum materials, thereby preventing the occurrence of electrochemical corrosion and promoting the welding place to be strong for a long time. [Example 1] The flux provided by the present invention may include four compositions, which are a group of i-synthetic compounds, a group of high boiling point carriers, a group of metal compounds, and a group of surfactants. Wherein the element i compound may be selected from the group consisting of boron trifluoride, ammonium fluoborate, diethanolamine hydrochloride, diethanolamine hydrofluoride, triethanolamine nitrogenate, aminoethyl ethylamine, amine rat vapor, and aminoethyl ethyl acetate. Compounds such as amine hydrochloride, phenylenediamine hydrofluoride, phenylenediamine hydrochloride, fluorenediamine difluoride, fluorenediamine difluoride, etc.

533116 V. Description of the invention (4) The high boiling point carrier in the flux can be selected from polyethylene glycol # 4 0 0, polyethylene glycol # 6 0 0, polyethylene glycol # 1 0 0 0, polypropylene glycol, polymer Alkanediol, triethylene glycol, glycerin, alcohol and other water-soluble high-boiling solvents with boiling points at 230 ° C. Suitable metal compounds include zinc fluoroborate, cadmium fluoroborate, tin fluoroborate, zinc fluoride, zinc oxide, zinc carbonate, zinc bromate, zinc chloride, etc. Metal compounds that can assist tin boat alloys to form a eutectic structure. In addition, the surfactant in the flux can be used if it contains anionic surfactants and non-ionic surfactants; for example, ethoxylated alcohol under the trade name T rit 〇rv X-100 by Rohm & Haas. This unique flux can be added for high temperature soldering operations. The halogen compounds can remove the oxide film on the surface of copper and aluminum materials respectively, and the high boiling point solvent can help the fluidity of the metal compound in the molten state, further and has :) : The fused tin alloy is completely fused, and a very uniform alloy is formed between the copper material and the copper material. Surfactants can help the solder to moisturize the surface of copper and IS materials and exert its fluxing effect. The removal of flux residues can be done with water only. According to the present invention, the electrode potentials of metals such as copper, aluminum, tin, lead, etc. used in general soldering operations are very different (as shown in the table above), and it is easy to cause electrochemical corrosion at the soldering place. In the reinforced metal compounds containing zinc or cadmium, tin-lead-structure was formed between copper and aluminum welding parts.

533116 V. Description of the invention (5) Zinc or tin-staggered or tin-staggered-zinc eutectic alloy layer overcomes the phenomenon of chipping caused by too large difference in electrode potential. [Example 2] In this example, three compounds of boron trifluoride, aminoethylethanolamine hydrofluoride, and diethanolamine hydrochloride are used as the halogen compound to remove the oxide film on the surface of aluminum and copper. Triethanolamine is used To adjust the pH value of the flux, the flux can remove the stubborn oxides on the aluminum surface in the soldering environment of weak alkali, so that the active agent can exert its maximum effect, and the high boiling point carrier can use polyethylene glycol # 4 0 0 The details are as follows: Composition of the flux of the second embodiment—boron fluoride 8 weight percent aminoethylethanolamine hydrofluoride 20 weight percent diethanolamine hydrochloride 30 weight percent polyethylene glycol # 600 24 weight percent zinc fluoroborate 3 Weight percent zinc fluoride 2 weight percent diethanolamine (adjust pH value) 10 weight percent Triton X-100 3 weight percent

533116 V. Description of the invention (6) [Example 3] In this example, two compounds of diethanolamine hydrofluoride and diethanolamine hydrochloride are used as the halogen compound to remove the oxide film on the surface of the Ming and copper materials, triethanolamine It is used to adjust the pH value of the flux. The flux can remove the stubborn oxides on the aluminum surface in the weak alkali soldering environment, so that the active agent can exert its maximum effect. The high-boiling point carrier uses solvents such as triethylene glycol and glycerol with a boiling point at 270 ° C to assist the metal compounds zinc fluoborate and zinc fluoride to melt and disperse at high temperatures. The prepared flux is a thick liquid and is suitable for painting copper and aluminum on weldments. Composition of the Flux of Example 3 Diethanolamine Hydrofluoride 36 weight percent diethanolamine hydrochloride 21 weight percent diethylene glycol 10 weight percent propylene glycol 15 weight percent zinc fluoborate 5 weight percent zinc fluoride 3 weight percent diethanolamine (adjust PH value) 8% by weight Ti ^ it on X- 1 00 2% by weight

Page 10 533116 V. Description of the invention (7) The above examples have experimentally confirmed that the solder of the present invention has successfully used tin-lead 6 3-3 7 tin powder (made into a solder paste) in the soldering operation of copper and aluminum. ) And tin pigs (tin-wrong 6 3-3 7) soft solder. [Usage example] For solder paste operators, the flux and tin powder can be mixed at 20/80 or 15/85 (weight ratio), and then applied to the welding place of two pieces of metal and heated externally. The heater is heated until the tin-lead alloy exhibits melt flow dynamics. After the high-boiling-point carrier is evaporated and dried, the weldment is moved to water leeches for cleaning. Using a tin operator, apply a flux to the two pieces of metal to be welded, sandwich the tin of the same area between the two pieces of copper and aluminum, and heat it to the tin alloy with an external heater. Show the melt flow dynamics, and then move the weldment to the leeches for cleaning. [Other examples] A water-soluble flux prepared according to the present invention, which has been added with an acid-base modifier, may be selected from the group consisting of diethanolamine (di-etha η ο 1 amine), triethanolamine (triethanol amine), and phenylenediamine ), Toluenediamine, benzidine, dicyanodiamide, benzyldimethyl-amine, am inoethyl ethanol amine and other boiling points at 2 Above 30 ° C and a water-soluble amine solvent, its acid-base adjustment

Page 11 533116? V. Description of the invention (8) The concentration range of the whole agent can be controlled to 0.5 ~ 2 5 weight percent is the best. [Effects of the invention] The flux of the present invention provides the following advantages: 1. The residue of the weldment can be completely washed with water after soldering, unlike some rosin-based fluxes and related cleaning solvents; for example, 1, 1, 1-trichloro Ethane, chloroform, CFCs and other harmful environmental releases. The residue produced by the flux can be easily and completely cleaned in warm water or hot water, so the flux has a positive effect on environmental safety. 2. The welding part is coated with flux and heated at 250 ° C to 300 ° C for 10 to 15 seconds. After the treatment, it can be completely washed and dried with warm water or hot water, thus eliminating the need for vapor degreasing equipment. High cost. Recycling solvent costs and the costs associated with heating and evaporation can also be saved, and overall manufacturing costs can be significantly reduced. 3. The use of the flux of the present invention provides the ability to weld high-purity aluminum materials (and their alloys) and copper materials with strong, long-lasting, and reliable welding properties, and greatly improves the shortcomings of the poor welding durability in the past. Therefore, the flux of the present invention can be used in industrial liquid manual and automatic soldering operations, especially for copper and aluminum sheets used in radiator materials, which will greatly outperform the traditional flux.

Page 12 533116 V. Description of the invention (9) Although the present invention has been disclosed in the preferred embodiment as above, its purpose is not to limit the present invention. Any person skilled in this invention will not depart from the spirit and scope of the present invention. Within the scope, there should be the ability to make some equivalent designs and retouching; the inventor's right to claim these equivalent designs should still be included in the scope of patent application of the present invention.

Page 13 533116 Brief Description of Drawings (No drawing in this patent application) ΙΛΛΜΜ Page 14

Claims (1)

533116 6. Application patent scope 1. A water-soluble flux for copper and copper materials welding, which is used to coat a surface of a copper material and an aluminum material to be welded together with a soldering flux (tin powder and tin foil), of which The composition of the water-soluble flux may include at least: a halogen compound, which can remove the oxide film on the surface of the copper material and the material at a high temperature when the welding is performed; a surfactant, which is used to increase the water-soluble flux to the Wettability of the surface of copper and shao materials; a compound containing zinc and braided metals; and A high boiling point carrier for increasing the fluidity of a metal compound in a molten state, and forming a alloy layer together with the molten soft solder (tin-lead alloy) and the compound containing zinc and coin metal In order to block the electrochemical reaction between the copper material and the shao material. 2. The water-soluble flux for copper-aluminum welding as described in item 1 of the scope of the patent application, wherein the functional compound is composed of a compound containing an active functional group such as a chlorine atom and a fluorine atom; Atomic compounds and the compounds containing II atoms are capable of removing oxides on the surfaces of the copper material and the shao material 3. The water-soluble flux for copper I Lu material welding as described in item 2 of the scope of the patent application, wherein the element compound is at least selected from boron trifluoride, ammonium fluoborate, diethanolamine hydrogenate, diethanolamine hydrofluoride, Triethanolamine hydrofluoride, aminoethylethanolamine hydrofluoride, aminoethylethanolamine hydrochloride, phenylenediamine hydrofluoride, phenylenediamine hydrochloride, and phenylenediamine hydrofluoride Page 15 533116 6. Scope of patent application Any of the compounds such as 20 ~, phenylenediamine hydrochloride, etc. 4. The water-soluble flux for the welding of copper and aluminum materials as described in item 3 of the scope of the patent application, wherein the concentration of the halogen compound is 70 weight percent. Please apply for application No. 5 No. 5 can be synthesized chemical halogen, the solvent of which is alcohol-soluble diethyl dihydrate, ammonium acid boron welding fluorine materials, Ming Peng Copper Chemicals Institute of Fluoride three 3 compounds ammonia fluoride Chloramine hydroalcohol amine ethanol triethyl, base ethyl fluoroammonium hydrogen, amine alcohol alcohol dichloride, amine alcohol alcohol ethyl chloride nitrogen ethylamine aniline benzene mixture, homologous species fluorine The trinitrogen or amine didiphenyl is meco, also the substance, the chemical chlorine mononitrogen is the amine, the second is the benzene, the physical substance is the chemical gas, the gas, the nitrogen, hydrogenamine, and the amine are two. Chemical halogens This compound is a combination of 5% and 5% of the total weight of the halogens. 6 6. The water-soluble flux for copper-aluminum welding as described in item 5 of the patent application scope, where the high The boiling point carrier is made of polyethylene glycol # 4 0 0, polyethylene glycol # 6 0 0, polyethylene glycol # 1 0 0 0, polypropylene glycol, polyalkylene glycol, triethylene glycol, glycerol, etc. Among the constituent groups, two or three types can be mixed together to form a carrier group. 7. The water-soluble flux for copper-aluminum welding as described in item 1 of the scope of the patent application, wherein the high boiling point carrier is made of polyethylene glycol # 4 0 0, polyethylene glycol # 6 0 0, polyethylene glycol # 1 0 0 0, polypropylene glycol, polyalkylene glycol, triethylene glycol, propylene Page 16 533116 VI. Scope of patent application A mixed carrier composed of a high-boiling-point solvent with a boiling point of 230 ° C and a water solubility. 8. The water-soluble flux for copper-aluminum welding as described in item 7 of the scope of the patent application, wherein the concentration range of the mixed carrier is between 20 and 50% by weight. Water-soluble flux for Ming material welding, which contains zinc and cadmium metal compounds, which is selected from zinc fluoborate, fluoborate, tin oxide, zinc oxide, zinc oxide, zinc acid break, zinc bromate, chlorine Compounds such as zinc compounds can assist soft solder tin-lead alloys to form eutectic metal compounds. 10. The water-soluble flux for copper-aluminum welding according to item 9 of the scope of the patent application, wherein the zinc fluoroborate, cadmium fluoroborate, tin fluoroborate, zinc fluoride, zinc oxide, zinc carbonate, zinc desertate, Zinc chloride is a single or mixed metal compound. 1 1. The water-soluble flux for copper-aluminum welding as described in item 9 of the scope of the patent application, wherein the concentration range of the metal zinc or metal braid compound is between 5 and 2 5 weight percent. 1 2. The water-soluble flux for copper-aluminum welding as described in item 1 of the scope of the patent application, wherein the soft solder is a tin-lead alloy (such as solder wire and solder foil). 533116 VI. Application for patent scope 1 3. Water-soluble flux for copper-aluminum welding as described in item 12 of the scope of patent application, wherein the surfactant is produced by Rohm & Haas Company | product name T rit ο η It is composed of ethoxylated alcohol of X-100, which can be added to about 0.5 to 5.0% by weight of the flux. 14. The water-soluble flux for copper-aluminum welding according to item 1 of the scope of the patent application, wherein the surfactant is an anionic surfactant or a non-ionic surfactant, wherein the concentration range of the surfactant is Department is between 0.5 to 10 weight percent. 15. The water-soluble flux for the welding of copper inscription materials as described in item 1 of the scope of the patent application, which also includes an acid-base adjusting agent, which is selected from the group consisting of diethanolamine (d 1 -ethanol amine) and triethanolamine (triethanol amine). ), Phenylenediamine, toluenedia] nine, benzidine, dicyanodiamide, benzyldimethylamine, amino ethylamine ethanol amine) is an amine solvent with a boiling point above 23 CTC and is mono-water soluble. 16. The water-soluble flux for the welding of copper inscription materials as described in item 15 of the scope of the patent application, wherein the concentration range of the acid-base adjusting agent is between 0.5 and 25 weight percent. Page 18