TW532717U - A heat sink clip - Google Patents

A heat sink clip

Info

Publication number
TW532717U
TW532717U TW091210507U TW91210507U TW532717U TW 532717 U TW532717 U TW 532717U TW 091210507 U TW091210507 U TW 091210507U TW 91210507 U TW91210507 U TW 91210507U TW 532717 U TW532717 U TW 532717U
Authority
TW
Taiwan
Prior art keywords
heat sink
sink clip
clip
heat
sink
Prior art date
Application number
TW091210507U
Other languages
English (en)
Inventor
Hou-Ben Liu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091210507U priority Critical patent/TW532717U/zh
Priority to US10/299,887 priority patent/US6646880B1/en
Publication of TW532717U publication Critical patent/TW532717U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW091210507U 2002-07-10 2002-07-10 A heat sink clip TW532717U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091210507U TW532717U (en) 2002-07-10 2002-07-10 A heat sink clip
US10/299,887 US6646880B1 (en) 2002-07-10 2002-11-18 Heat sink clip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091210507U TW532717U (en) 2002-07-10 2002-07-10 A heat sink clip

Publications (1)

Publication Number Publication Date
TW532717U true TW532717U (en) 2003-05-11

Family

ID=28789308

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091210507U TW532717U (en) 2002-07-10 2002-07-10 A heat sink clip

Country Status (2)

Country Link
US (1) US6646880B1 (zh)
TW (1) TW532717U (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW588823U (en) * 2002-05-13 2004-05-21 Shuttle Inc CPU heat dissipation apparatus having heat conduction pipe
TW537437U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating fastener
US6980421B2 (en) * 2002-06-28 2005-12-27 Shuttle Inc. Front panel for personal computer
TW539391U (en) * 2002-09-17 2003-06-21 Hon Hai Prec Ind Co Ltd Fixing apparatus
US20040103504A1 (en) * 2002-11-08 2004-06-03 Jen-Cheng Lin Fastener for a CPU radiator
TWM240775U (en) * 2003-03-17 2004-08-11 Shuttle Inc Improved computer host frame
TWM240615U (en) * 2003-03-17 2004-08-11 Shuttle Inc Combination structure of CPU heat dissipating device and power supply
US20040252455A1 (en) * 2003-03-20 2004-12-16 Kuo Yi-Lung Computer cooling system with fan
US7082034B2 (en) * 2004-04-01 2006-07-25 Bose Corporation Circuit cooling
DE102006011332A1 (de) * 2006-03-09 2007-09-20 Behr Industry Gmbh & Co. Kg Spannvorrichtung, Kühlkörperanordnung und Vorrichtung zur Kühlung
US20080035311A1 (en) * 2006-08-11 2008-02-14 Kwo Ger Metal Technology, Inc. Cooler system
US7436670B2 (en) * 2006-10-13 2008-10-14 Inventec Corporation Heat sink retaining device
US8318850B2 (en) * 2009-02-26 2012-11-27 E I Du Pont De Nemours And Company Cured perfluoroelastomer article
CN102938996A (zh) * 2011-08-15 2013-02-20 鸿富锦精密工业(武汉)有限公司 散热器组合
US20140036451A1 (en) * 2012-07-31 2014-02-06 Glenn C. Simon Heat sink assembly
US9049811B2 (en) 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
US10114183B2 (en) * 2015-07-31 2018-10-30 Finisar Corporation Screwless heat sink attachment
CN110275253B (zh) * 2018-03-14 2024-07-26 泰科电子(上海)有限公司 连接器
CN113552391A (zh) * 2020-04-24 2021-10-26 鸿劲精密股份有限公司 温度传导装置及其压接机构、预冷器以及测试分类设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
TW481430U (en) * 2000-06-03 2002-03-21 Foxconn Prec Components Co Ltd Heat sink fastening device
TW516799U (en) * 2000-06-17 2003-01-01 Foxconn Prec Components Co Ltd Snap device of heat sink
TW475828U (en) * 2000-07-20 2002-02-01 Foxconn Prec Components Co Ltd Heat sink fastening device
US6449157B1 (en) * 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism

Also Published As

Publication number Publication date
US6646880B1 (en) 2003-11-11

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees