TW531715B - Read/write device for IC chip - Google Patents

Abstract

The object of the present invention is to provide a read/write device for IC chip, wherein the IC chip can replace the paper card or plastic card, and read or write information in an non-contact manner, and the structure is robust. Also, the present invention can reduce and concentrate the accommodation, reading, writing, standby, recycling, and the like functions for the IC chip, so that the device can be miniaturized totally and may have high speed processing. The solution is to configure a plurality of compartments (10A) for accommodating IC chips (MC) or (SC) on a dispatching disk (10), which is rotatable forwardly and reversibly, and is composed of the stepping motor (11); and, configuring the accommodation position for IC chip (MC), (SC), the accessing position for data reading and writing, and the ejection position and recycling position for ejecting the IC chip (MC), (SC) on the rotational track of the dispatching disk (10).

Description

531715 V. Description of the invention (1) The genital jawbone 2 The invention relates to a suitable IC chip reading and writing device such as access to various facilities mainly in parking lots. Lü Lihe has taken care of the entrance management and usage fees for various facilities, and currently has a processing system using magnetic cards as disclosed in Japanese Patent Laid-Open No. 4_2745 轳 八 = sei Pei 5-1 5 1 402 , JP-A-H30-265083 and JP-A-205083 'are used exclusively by Japan and the non-contact processing system number / report of IC tags such as Japanese Patent Laid-Open No. 8-77 Readable and readable cats want to solve the problem = using the above magnetic card processing system data :: media; make this: so that there is a loss of magnetic data: damage, repeated use, # Π 仏 the existence of the following question: can not be burned Insert the second magnetic card for Y and use the second magnetic card. Stand by and keep it. It is not feasible to continue the process. I asked where the discount rate for the entry fee is the opposite. When using the Shangcheng T Γ system, due to the use of buried% = non-contact processing using a 1C label and the above processing cart using a magnetic card: 1c coin or IC for cattle Therefore, compared to non-contact < j, the amount of information is very large, and the text has excellent durability for long-term use, but 531715

The IC chips in the accommodating chamber of the distribution tray for information exchange and various information are discharged to the clothes rack, and the IC chips in the accommodating chamber are returned to the receiver: and the recycling device is provided. The receiving board in the patent application is equipped with a motor to surround the other side: a dagger, on a distribution tray provided in more than two storage rooms of the device, and turned in a "like manner." There is a receiving position with at least 1C chips, The IC chip is read and written by a non-connected, read-write access position that is set on the suspect track. =: Second, various ICs are ejected to the outside of the device, and the κ chip is recovered in the device.

置 \ The above motor rotates the spoon plate or does not make the JL spinner according to the read and write contents of the 1C chip. 乂 ~ 乂 "仗" so that the IC chip in the storage room is located at any of the above positions. & gt (3) + In addition, the items 3 and 4 of the scope of patent application of the present invention are that the distribution plate is set in an inclined state in which the storage chamber is inclined obliquely upward, and is arranged along the upper surface of the distribution plate in the inclined state to supply IC chips The guide to the receiving tray of the distribution tray is here, and on the way of the guide channel, a wafer stopper is provided, which can temporarily hold the 1C wafer supplied to the guide channel, and keep the card according to the release requirements & (4) In addition, the fifth item of the patent application scope of the present invention is the receiving position of the IC chip, the access position of the IC chip, and the discharge of the IC chip to the outside of the device. The position is set at the same position on the rotation trajectory of the distribution plate, and in the receiving plate that becomes the bottom plate of each accommodating chamber of the distribution plate, a part of the opening at the same position as described above will be provided on the opening portion. will A discharge door for the IC chips in the storage chamber to be discharged to the outside of the device, and

531715 Case No. 90117421 Date and place y · Correction, page 10 V. Description of the invention (4) A non-contact reading and writing unit is set on the door. (5) In addition, items 6 and 7 of the scope of patent application of the present invention are that two guide ports for supplying IC chips are provided at the receiving positions of the distribution tray, and the two guide ports will communicate with 'One guide port of the guide channel is used for supplying new IC chips', and the other guide port is used for receiving IC chips which are input from the outside of the device. (6) In addition, the eighth item of the scope of patent application of the present invention is to set a plurality of reading marks at intervals in the circumferential direction of the distribution plate, and to read and detect the reading marks on the side of the device where the distribution plate is rotatably mounted. Positioning sensor for the position of the tray. (7) In addition, in the patent application scope of the present invention, items 9 and 〇 are that a detectable input IC chip is placed on each of the 1C chip guide channel and the other guide port which are in communication with each other. The chip is put into the sensor. (8) In addition, the items 丨 丨 and 丨 2 of the patent application scope of the present invention are that a supply 1 (: wafer guide port is provided at the receiving position of the distribution tray, and the one guide port is used as a new IC chip and a slave IC together. It is used to receive c-chips that are put in from the outside of the device. Using the device described in (1) above, if c-chips are accommodated in the distribution tray's taxi ^, the c-chips can be stored by rotating the distribution disk with a motor. Bei Xunjing1, IC chip discharge and recovery, non-contact type that can read and write information: buy and write; and [c chip discharge device and recovery device compact, on the rotation track of the distribution tray , Therefore, the available device as a whole adopts the above description in (2) · 4 ______

Page 7 = Smaller, faster and faster processing. Furthermore, by using a strong 1C chip in the structure, it can be used repeatedly for many times. 531715 5. Description of the invention (5) The position can be right! The information read and written by the C chip is read and written. By rotating the read and write distribution disk, the IC chip stored in the accommodating chamber is moved to any one of the discharging, receiving, and standby positions for corresponding processing. It can be arranged to place the IC chip of the storage room in the standby position of the standby position. Therefore, 'for example, after entering the field_wafer first, sequentially = place number, the number of households is 1 (: wafer, discount services, etc. are available. The cost processing of the two L-bits ί ΐ ΐ The distribution disk rotates in the forward and reverse directions, and the IC chip for entry is maintained at the lower level. Because of this, multiple (actually unlimited) service certificates, brothers, and other: —The reading of “recycling” & can be performed with various anti-expanding sickle: cost calculation and processing, @@, at the point that the distribution tray is set to positive = such as' can be accommodated in 1c of each storage room The wafer is changed to a minimum. The time at each position is set to a minimum, and the high-speed process to obtain the processing is described in the device described in the above description. By setting the distribution tray to tilt, when the technology enters the daily film on 1C, Ic can be accommodated in a stable state inside the accommodation chamber In addition, the mechanism for the distribution plate and the structure for turning the Ic car into the early lichen 4 suspected lane, in addition, through the crystal; the second two-way guide through the correct one into the second guide, The day guard card is reserved as a, and one or more 1C chips can be put into the IC chip of the Gurner room in the same way, which can prevent the misoperation of the second and third day chips and B inches into one storage room. Using the above-mentioned (4) The device is equipped with ^ IC e, ^ ^ ,, IC / V? ^ ^ # ^ When the tablet is discharged to the outside of the device, it can read and write the 1C crystal message. The resources for 1C wafers can therefore be inspected immediately.

\\ 312 \ 2d-code \ 90-09 \ 90117421.ptd Page 8 531715 V. Description of the invention (6) Various processes for reading and writing information or information Use the device described in the above section to place the external discharge process. It is used to release another chip from the new 1c chip. Therefore, the structure is simplified, for example, for receiving and receiving, the chip chipper is used for the parking 1C machine that can be used for service, and can meet various uses. Using the cost-effective actuarial cost of the IC car, the device described in (6) above, the position sensor can be used to continuously take the external gear and control the rotation of the motor to the distribution plate. Accurately accommodate in the positions of each storage room = front and back. Use the device described in (7) above to detect the R-day film of the door. If necessary, use the device described in (7) above to separately detect the new IC chip inserted from a guide port and another sensor from another device. The number of the inputs can be counted by the chip: the timing of the whole input of the input. Use the device described in (8) above. Since the new c chip is taken from the outside of the device, the guide port for wafer input is used for ^ input = to simplify the device as a whole. As described above, each of the above-mentioned items (1) and (8) is used. The above-mentioned technical problem and the elimination of the above-mentioned prior art can solve the paste of the invention, Shi Binxiong. Hereinafter, the above-mentioned present invention will be described with reference to the accompanying drawings. Fig. 1 shows the entirety of the present invention. 3, a side view, .., f view, FIG. 3 is a top view illustrating the main part of the present invention, 2 is its pitch 41 < its side section

531715 V. Description of the invention (7) View 'In these drawings', the whole reading and writing device is represented by component number 1' is installed on the receiving plate slanting obliquely on the upper part of the base 丨 κ, and it can be rotatably installed There are distribution trays with a plurality of storage chambers 丨 〇 A. The new jc wafer Me put into 10A of any of these storage chambers or the 1C wafer SC fed from the outside of the device are transferred to the stepper motor 11 The access position, the standby position, the ejection position, and the recovery position on the rotation track of the distribution tray 10 are set to any position, so that the memory (IC element) of each 1 (: wafer MC, Sc) is read without contact. Write various kinds of information, or make these c chips mc, sc standby 'or discharge them to the outside of the device 1, or recycle them in the device 1. In addition, 2 and 2 in the figure are installed across the upper side of the distribution tray 10 above. The left and right frame plates on the upper surface of the receiving plate 1 A are the guide channels 3 for the new IC chip MC formed between these left and right frame plates 2 and 2. The front side of the guide channel 3 is formed by the slide plate "chute 并" (Lower end side), after a success with ° plate 3Α The lower slide plate 3C is placed in communication with the two left and right frame plates 2 and 2: the 扪 guide opening 7 formed by the plates 7A and 7B, and it becomes a new 丨 c chip Mc that sends the V to the channel 3. The structure of the storage room worker 〇a of the distribution tray i 〇 located at the receiving position where the component code DR is not shown in FIG. 3. Also, the 4 is a 1 (for wafer inspection, provided on the guide channel 3). 2 benefit '5 is a notch provided on the d-side slider Φ. By closing the plunger rod, 6 is a feeding solenoid, and then the opening and closing i 5 switching end portion 6 α and the lower end portion of the opening and closing rod 5 can be connected. Rotate even the open position shown by the imaginary line? 1 The locking position shown by the solid line and the card position shown by the line. Normally, the opening and closing lever 5 is placed on the solid block 5A in FIG. 1 to broadcast the 1C chip. MC moves, but Bu

1111

\\ 312 \ 2d-code \ 90-09 \ 90l17421.ptd

Page 10 531715 V. Description of the invention (8) Sending = the electromagnetic coil 6 is turned on and the opening and closing lever 5 is turned to the position of the above imaginary line%: the chip broadcast block 5A enters from the lower slide 3C, the IC chip mc It can be dropped (injected) to the first guide port 7 described above. 8 is a second guide port 'consisting of the one guide plate 7A and the bottom guide plate 8A constituting the above-mentioned] guide port 7 at the second guide port 8 provided below the j-th guide port [Kappa wafer%] fed from the device], and put it into the storage room [0A] of the distribution tray [0] located at the receiving position DR. In addition, 9 is an input sensor, which counts the input number of the wafer c above by making the actuator 9A protrude on the channel of the second guide port 8, and 1C is the left and right frame plates 2, 2 A mounting bracket fixed on the u side of the base. The above-mentioned distribution plate mounted on the receiving plate 1A inclined downwardly is installed obliquely along the receiving plate 1A, which is composed of the bottom plate of each accommodation chamber 10A. ICs that can be input from each of the guide ports 7, 8 The wafers are stored in each of the storage chambers 10A, and the receiving plate DR at the above-mentioned receiving position DR and the portion of the recovery port 17 shown at the upper right in FIGS. 2 and 3 is opened. In FIGS. 1, 3 and 4, 1A is an opening of the receiving plate 1 A formed at the above-mentioned receiving position 卯, and 14 is a hinged discharge door that opens and closes the opening 1A from the bottom surface side. 3 A is the root end 13 of the discharge door 4 which is rotatably installed on the base 1] (the side rotation shaft, 12 is by connecting the front end side of the plunger core 12A with the root end 3) The release / return solenoid coil connected to the lower end to open and close the discharge door 14 is a reading and writing unit for IC data mounted on the bottom surface of the discharge door 14 and is stored in the receiving position DR. The receiving room 10 of the distribution tray 10 (the wafer Mc or li): W312 \ 2d-code \ 90-09 \ 90117421.ptd 531715

sm * Under structure: # * pass in the receiving position dr, read and write various information in a non-contact manner. In the present invention, the receiving position of the 1 c chip 卯 has both read and write information: Ϊ and opening the discharge door 14 to discharge the 1 c chip to the outer row of the device, thereby making the overall structure of the device compact. Also, what about? Figure Γ3: 'The positions corresponding to the left and right storage chambers 10A and 10A indicate the standby positions where the 1C crystal μ is temporarily waiting. In addition, the IC chip is recovered through the chute i 7S shown in FIG. Recycling position in Mc Sue 1. Sigh

i Ξ 2. In FIG. 3, '10M ... is a read mark, which is provided on the distribution tray W to correctly hold the 1C wafer MC or SC accommodated in each of the accommodation chambers 10A = to reach each of the above-mentioned positions, and it is installed by receiving The upper side of the board u, the position sensing sensor 16 reads the read mark 丨 0M, thereby controlling the action of the stepping motor 丨 丨 that rotates the upper plate 10.

In FIG. 1, '11A is the rotation axis of the above-mentioned distribution plate 10, 10S is the central mounting portion of the distribution plate 10 where the A 碇 rotating shaft 11 A is mounted, and i B is a frame plate provided on the base 1K for mounting The above-mentioned rotating shaft 丨 people, stepping motor 丨 丨 and the aforementioned release / return electromagnetic coils 12,1B are brackets that rotatably support the rotating shaft 13A of the discharge door 14 and are connected to the frame plate] ^ . The interval l shown in FIG. 4 is a clearance when an IC chip MC or a small object other than the IC chip or a small coin or a small coin is thrown in due to mischief or mistake. The present invention is structured as described above. First, the first guide port 7 is inserted into the new 1C chip MC of the receiving chamber 10A of the distribution tray 10 located at the receiving position shown in FIG. 5 (a) through the guide channel 3, and the 1C information is transmitted through the device. On the discharge door 14

Page 12 \\ 312 \ 2d-code \ 90-09 \ 90117421.ptd 531715 V. Description of the invention α〇) Read and write on the bottom surface 5 and read to determine whether it is necessary to write the c chip MC After the information is released, return the electromagnetic coil to carry a motion signal, the discharge door 14 opens downward, and the necessary 1C chip MC written at the next time will be issued to the outside of the device 1, and the reader will read it. Send an operation signal to the stepper motor 11 and rotate the distribution plate 10 by 3/8 to the above-mentioned field map (a; counter-k-rotation direction, and return the NG to the recovery port 17 and collect it in the device]. Pianluo, 丄 V: The 1C chip MC after the release described above, when it is communicated from the outside of the device =: port 8 is thrown into the receiving position shown in Figure 5 (a): ^%, also Determine whether to perform the above-mentioned reading. When it is NG, open the row door and return the ic chip MC of the NG to the device! Outside, and in the case of the next time, the fee after calculation based on the read IC information will be in the second ... "section ( (Not shown), turn the second direction of rotation by 9 ° to make 〇 "Sichuan chip MC standby: wait: the acceptance of a piece of SC (such as a service chip). Other jc within m to 1 OA

When you execute other IC chips sc, you will return the distribution plate 10 to the original position, and the item fetch and write unit 15 will delay the implantation of IC chips—I disk 1 〇 Rotate 3/8 / f 'H in the counterclockwise direction. The MC fell to the recovery port 17 and recovered it, and the 1C crystal soared into the receiving room of the receiving position DR at 10A, 2A and 8H 1 (: Japanese film SC and Japanese chip SC read The information is calculated and subtracted by the writing unit 15 from the input situation T ′ calculation: 眚 f This information is displayed on the display as a discount. The new fee for the jaw, and the fee is displayed as 13 Page W312 \ 2d-code \ 90-09 \ 90]] 742] .ptd 531715

V. Description of the invention (π) In addition, after reading the information as described above, the other is c: the beam is read immediately by reading and writing section 15 to cancel the ticket: As shown in Fig. 5 (c), the counterclockwise rotation direction is 3/8, and the discarded 1C wafer SC is dropped to the recovery port and returned to °°; The IC chip MC is also processed for invalidation / same as the IC chip SC described above, and as the distribution tray 10 expands counterclockwise, it falls to the recovery port 17 and is recovered. In addition, when using two or more of the above-mentioned other IC chips SC (service chip), the operations shown in Figs. 5 (b) and (c) are repeated to further increase the discount amount. °

The above-mentioned devices of the present invention shown in FIGS. 1 to 5 are provided with two guide ports 7, 8 of the IC chip, and in FIGS. 6 and 7, the structure uses one guide port 2 0. To form the release of the new IC chip MC, the input port of the IC chip MC and the input ports of the other 1C chip SC after service are used. Figures 6 (a), (b), and (c) sequentially explain the new IC. The receiving state of the chip MC, the state of reading and writing the information, and the state of discharging the IC chip MC after the writing is completed to the outside of the device. In these drawings, DX is the receiving position and DY is the reading and writing unit 1 The storage position 5 is DZ, which is the discharge position. The position of the storage chamber 100A on the right side in the figure is the collection position where the collection port 17 (see FIG. 7) is opened. FIG. 7 is a sequential explanation of a processing sequence when a 1-chip or 2-chip IC chip SC for service is added to the IC chip MC released as described above in a device in which the guide port 20 is made one. FIG. After the IC chip MC that has been completed is put into service IC chip SC, the picture (b) shows the situation after the second wafer service wafer SC is continuously put into the picture, and the picture (c) shows the distribution tray 1 〇 from the picture (a) Reverse state

\\ 312 \ 2d-code \ 90-09 \ 90117421.ptd Page 14 531715 V. Description of the invention (12) The IC used after the clockwise rotation is rotated by 2 7 0 ° and the information is read and processed as invalid. The state where the chip MC fell to the recovery port 17 and was recovered. At this time, the information of the two service 1C chips SC and SC was read. In the state shown in Figure (a), the calculation and display fees were based on these service information. It is reduced and the cost is displayed again on the display. In addition, figure (d) shows that with the reading of information, as the distribution tray 10 rotates counterclockwise, it will sequentially use the 2 animal husbandry services that have been processed for invalidation! c The situation where wafers SC and SC fall to the collection port 17 and are recovered. If the IC wafer SC for service is continued to be used, the scheme of forming a discount amount is the same as the embodiment shown in FIGS. 1 to 5 above. . FIG. 8 is a block diagram illustrating the electrical configuration of the c-chip read / write device according to the present invention. The interface 28 connected through the bus bar 27 between the CPU 25 that constitutes the control unit center and the memory 26 containing the system program is connected with the foregoing. Feeding electromagnetic coil 6, reading and writing section 5, 5, release and return electromagnetic coil 12, two wafer input sensors 4, 9 stepper motors, and positioning sensors 1, 6, each of which is stored in memory The system program in the body 26 performs various operations described above under the supervision of the CPU 25. ADVANTAGEOUS EFFECTS OF THE INVENTION According to the above-mentioned sequence, if the IC chip originally put in is rotated on a distribution tray, the information is written and released on the IC chip, or the temporarily used IC chip is invalidated and turned back downward. While reading the IC chip reading and writing device it invented, the storage room of the distribution tray reads and writes the information, or waits on the IC chip, which can be used up or not collected in the recycling port. , So IC coins can be processed variously, and the conveyor

\\ 312 \ 2d-code \ 90-09 \ 90117421.ptd Page 15 531715 V. Description of the invention (13) Compared with the existing processing device which handles IC tags while processing them, the overall structure of the device can be simplified and It can be manufactured compactly, and at the same time, the processing time can be greatly reduced. Combined with the use of IC chips that can be used repeatedly, it is very suitable for management of parking lots and other facilities. Component number description 1 1A 1K 2 3 3A 3B 3C 3D 4, 5 5A 5C 6 6A 7 7A 8 10

7B Reading and writing device Undertake plate Base frame plate Guide channel Slide plate Chute cover Lower slide plate Notch part Wafer input sensor Opening and closing lever Wafer stopper Mounting shaft Feed electromagnetic coil Front end First guide port Guide plate Second guide port Distribution plate

\\ 312 \ 2d-code \ 90-09 \ 90117421.ptd Page 16 531715

10M reading mark ΙΟΑ storage chamber 11 feed motor 12 release / return solenoid 12A plunger core 13 root end 13A rotating shaft 14 discharge door 15 reading and writing unit 16 positioning sensor 17 recovery port 17S chute 20 guide Port 25 CPU 26 Memory 27 Bus 28 Interface MC, SC IC chip DR receiving position DX receiving position DY access position DZ discharge position Page 17 \\ 312 \ 2d-code \ 90-09 \ 90117421.ptd

Claims (1)

531715 original case number 9011 amendment ~, patent application scope __ 1 · An IC chip reads and writes and contacts IC chips are placed and placed, which constitutes a non-writeable 1C that can be put into the device The chip re-ows this = reading and writing of various information including time, will end reading sign: package: return to the device, "recycling in the device, its special distribution plate, JL and right stone, formula 1C chip to ^ Connect more than L r to forward or reverse the non-contact input into the device, and-while using the motor to the position in the circumferential direction; transfer the 1C chip in the above-mentioned storage chamber to the non-contact reading The nest picker i is in a non-contact manner * capacity 2 'It is located on the trajectory of the distribution tray rotation and carries out various kinds of information; The IC chip in the above-mentioned storage room is used for information exchange and placement: Ϊ: and: The IC chips in the accommodating chamber are discharged to 2 times, and the IC chips in the accommodating chamber are collected inside the device. The receiving board is provided with a motor that can rotate freely in both forward and reverse directions. There are two or more distribution trays in the accommodating room, and the rotation track of the distribution tray is provided with a 1C chip receiving position, a non-contact two each: an access position written by "data", and the IC chip is temporarily standby. After the second position, the c position is discharged to the discharge position outside the device, and the 1C chip is recovered in the recovery position inside the device, the motor rotates or does not rotate the distribution tray according to the read and write contents of the IC chip. Therefore, the JC chip in the accommodating room is located at any of the above positions. 3. As for the IC chip reading and writing device of the first scope of the patent application, 90117421.ptc Page 19 531715 MM 90117421 Amendment VI. Patent application scope The distribution plate is set in a tilted state of the storage room obliquely upward, and is arranged along the top of the distribution plate in the inclined state to supply IC chips to the distribution The guide path of the receiving position of the disk, and on the way of the guide path, a wafer stopper is provided, which can temporarily hold the IC chip supplied to the guide path, and according to the release requirements, the IC chip being held in Send out at the above-mentioned receiving position. The I c wafer reading device of the Lee Fan term, wherein the distribution tray blanket chamber is tilted toward the last name, and the IC wafer is supplied to the reception of the distribution tray along the n of the tilted makeup cone. Position guide package iti, and on the way to the channel, there is a chip stopper, which can temporarily give a card to 1 (: 晶 > in the channel ^^, and according to the release requirements will be a taxi. _ 留1 IC chip 1 is sent out at the above-mentioned receiving position. L is the chip reading / writing device as described in the second item of the patent application scope, wherein the IC chip receiving position, the IC chip access position, and the IC chip are discharged to the outside of the device. The discharge position is set at the same position on the rotation trajectory of the distribution plate, and in the receiving plate that becomes the bottom plate of each storage chamber of the distribution plate, a part of the opening at the same position will be opened, and the opening portion can be opened and closed easily. When opening, a discharge door that can discharge the 丨 c chip in the storage room to the outside of the device, and a non-contact reading and writing unit is provided on the discharge door. L As for the IC chip reading and writing device in item 3 of the patent application scope, where In the receiving position of the distribution tray Two guide ports for supplying c wafers are provided. Among these two guide ports, one guide port communicating with a guide channel having a wafer stopper is used as a supply for a new IC chip, and the other guide port is used as an input from the outside of the device. I > IC chip kappa nest reading device of lf—lf ULUJI ^ item, 90117421.ptc Page 20 531715 Case No. 90117421 Date of Patent Application Allocation ^^ -1 for IC crystal 1 ^ 2 with wafer stopper ^ ^ 2 for use; use, will be another--^ It can be used to connect the sheets from the outside of the device. [For example, the patent application scope of the first, second, third, fourth, fifth, and sixth reading and writing devices, wherein the IC chip marks in the circumferential direction of the distribution plate, and on the other hand, the eight are mounted in a freely rotatable manner. Set a number of 5 to read the settings to read the above-mentioned read mark and detect the distribution disk: = device side of the disk,% of the position sensing state 0, set, can detect the IC chip L input as applied for a patent The first special range of IC chip reads and writes. The 1C chip is connected to any one of the guide ports. The guide clothes are placed in the chip. At the .., 1, —r L / V, and the chip of another guide port. Sensing soil-Please refer to IUJ11 item 1C chip for each 1 ^^ chip guide ^ • ·-one ~-the other guide among them, at ^. . Said to invest in UL, such as patent application scope No. 1, 2, 3, 4 or 5., where two two 12: J :: shell: two-way mouth, placed in the receiving position of the distribution tray. A guide port is also used for the acceptance of the IC chip that is externally placed in the new IC chip. The IC chip reader device is used in the 1C chip reader. The panning unit gave a total of 1C chip I to the guide port, and this batch was only put into __ and 2LiL was put into the port i! 531715 _Case No. 90117421_Year Month Date Amendment 6. Scope of Patent Application Acceptance. Circle 1_1 90117421.ptc Page 22