TW528151U - Improved structure for multi-layer capillary of heat-conductive pipe - Google Patents

Improved structure for multi-layer capillary of heat-conductive pipe

Info

Publication number
TW528151U
TW528151U TW91201801U TW91201801U TW528151U TW 528151 U TW528151 U TW 528151U TW 91201801 U TW91201801 U TW 91201801U TW 91201801 U TW91201801 U TW 91201801U TW 528151 U TW528151 U TW 528151U
Authority
TW
Taiwan
Prior art keywords
heat
improved structure
conductive pipe
layer capillary
capillary
Prior art date
Application number
TW91201801U
Other languages
Chinese (zh)
Inventor
Chao-Chih Kao
Original Assignee
Chao-Chih Kao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chao-Chih Kao filed Critical Chao-Chih Kao
Priority to TW91201801U priority Critical patent/TW528151U/en
Publication of TW528151U publication Critical patent/TW528151U/en

Links

TW91201801U 2002-02-08 2002-02-08 Improved structure for multi-layer capillary of heat-conductive pipe TW528151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91201801U TW528151U (en) 2002-02-08 2002-02-08 Improved structure for multi-layer capillary of heat-conductive pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91201801U TW528151U (en) 2002-02-08 2002-02-08 Improved structure for multi-layer capillary of heat-conductive pipe

Publications (1)

Publication Number Publication Date
TW528151U true TW528151U (en) 2003-04-11

Family

ID=28788850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91201801U TW528151U (en) 2002-02-08 2002-02-08 Improved structure for multi-layer capillary of heat-conductive pipe

Country Status (1)

Country Link
TW (1) TW528151U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237337B2 (en) 2004-06-29 2007-07-03 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same
CN103542751A (en) * 2012-07-09 2014-01-29 富瑞精密组件（昆山）有限公司 Heat pipe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237337B2 (en) 2004-06-29 2007-07-03 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same
US7578338B2 (en) 2004-06-29 2009-08-25 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same
US7730605B2 (en) 2004-06-29 2010-06-08 Industrial Technology Research Institute Method of fabricating heat dissipating apparatus
CN103542751A (en) * 2012-07-09 2014-01-29 富瑞精密组件（昆山）有限公司 Heat pipe

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees