526534 Λ7 B7 五、發明說明（） 發明領域： 本發明係有關於一種光學晶圓感測系統（Optical Wafer Present Sensor System)之反射裝置（Reflecting Device)，特 別是有關於應用在半導體製程設備中的光學晶圓感測系 統。 發明背景： 目前感測器（Sensor)的利用涵蓋範圍很廣，已經以各式 各樣的形式深入各個領域。所謂的感測器其定義為“可將 感測對象物相關的訊息轉變成可以傳送的訊號型態的一種 物件”。 而一般應用在半導體製程設備中的光學晶圓感測系 統，其原理大部份都是以發射光束至預設的位置，並透過 檢測反射回來之光量（Photo Quantity)的大小來判斷晶圓有 否在預設的位置，進而控制相關設備之後續動作。 請參考第1圖，其所繪示為習知半導體製程設備中光 學晶圓感測系統。在反應器上部（Chamber Lid) 1 〇和反應器 下部（Chamber Bottom)20之間有一空間，供晶圓30進出或 本紙張尺度適用中國國家標準（CNS)A4規烙（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) _ H 1 I ^ i J ϋ y I .n Hi n -訂-丨 n ·11 1 11 n 1« M λ 經濟部智慧財產局員工消費合作社印製 526534 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 停留之用，另外，在反應器上部10的預定位置有透明窗 (Transparent Window)60，而在透明窗60上方裝置有光學 感測器50，且光學感測器50之光發射器（Light Emittei〇90 持續射出發射光（Emitting Beam)70 ’穿過這透明窗6〇到達 反應器下部20 〇 首先，晶圓3 0經過反應器之活門40進入反應器上部 1 〇和反應器下部20之間的空間，在到達透明窗60下方的 預定位置時，由於光學感測器50的光發射器90持續射出 發射光70，穿過這透明窗60，所以發射光7〇會遇到晶圓， 而被反射回來，反射回來的光叫反射光（Reflected Light)80，大部份的反射光80會透過透明窗60，而被光接 收器（Light Receiver)〗00所接收，當光接收器100接收到足 夠的光量後，就檢測出晶圓已到達反應器中之預定位置， 進而控制後續製程動作。 半導體製程的設備，絕大部份都是自動化進行，故需 依靠不同類型的感測器，回饋感測訊號到控制系統以作判 斷和控制，故感測器的準確度和靈敏度需要非常嚴謹，才 可讓製程的良率保持在一定的水準，否則只是浪費生產成 本和時間，更甚者會影響人員的安全性。 而有關光學晶圓感測系統，常常發生誤判的情形，其 3 本紙張尺度適用中國國家標準（CNS)A4規格（21〇χ297公釐） -----1 _----II» i I I Γ I ---* 訂-----I--- I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 526534 A7 __B7_ 五、發明說明（） 原因多為難以調整光接收器的敏感度。請參考第2圖，其 所繪示為習知半導體製程設備中晶圓存在時之光學晶圓感 測系統之示意圖，且光接收器調整為低敏感度。當晶圓3 0 在預定位置時，發射光1 3 2透過透明窗60到達晶圓3 0而 被反射，則反射光1 3 4雖然會反射且透過透明窗6 0，但因 為光接收器Π 2調整為低敏感度，故很多時候會因為反射 光134的強度不夠，光接收器112接收的光量不夠，而感 測不到晶圓3 0已到達預定的位置，而做成誤判。 請參考第3圖，其所繪示為習知半導體製程設備中晶 圓不在時，理想情況下之光學晶圓感測系統。在理想情況 下，發射光1 42透過透明窗60到達反應器上部1 0和反應 器下部20之間的空間，因為晶圓並不在預定位置，故發射 光沒有被晶圓反射回光接收器1 44，光接收器1 44檢測不 到足夠的光量，故判斷晶圓沒有在預定位置。 但是在實際情況下，光接收器的敏感度都難以調整至 一精確的程度，若光接收器的敏感度稍低，有可能出現如 第2圖所示之誤判，若光接收器的敏感度稍高，則可能出 現如第4圖所示之誤判。請參考第4圖，其所繪示為習知 半導體製程設備中晶圓不在時之光學晶圓感測系統之示意 圖，且光接收器調整為高敏感度。發射光152透過透明窗 60到達反應器上部1 0和反應器下部20之間的空間，且有 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ϋ —1 ί I I n I ϋ n 18- n 1 · »il ϋ n >V>1 n m Ha 一 · n n n n n n f - I (請先閱讀背面之注意事項再填寫本頁) 526534 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 一部份的發射光1 52到達反應器下部20，而被反應器下部 20的表面反射，其中有一部份反射光154會透過透明窗 60，雖然反射回來的反射光1 54的強度已經很小，但因為 光接收器1 22調整為高敏感度，故很多時候就會因只感測 到一點點的光量，就判定在預定位置上有晶圓的存在，但 實際上晶圓並不存在，所以誤判就此產生。 發明目的及概述： 鑒於上述之發明背景中，在半導體製程設備中，光學 晶圓感測系統主要是感測晶圓有否在預定位置上，然後回 饋一訊號到製程的控制系統，以作判斷和控制後續步驟， 故光學晶圓感測系統的準確性非常重要。但由於難以調整 光學感測器的光接收器之接收敏感度至一精確程度，故常 出現誤判晶圓的存在與否。 本發明的目的為提供一種光學晶圓感測系統之反射裝 置及其應用，本發明係應用在半導體製程設備中之光學晶 圓感測系統’透過在光學晶圓感測系統中加入一反射裝 置’以解決因難以調整光學感測器的光接收器之接收敏感 度所產生之誤判，減少光學晶圓感測系統的調整時間，節 省人力以及提升生產效率。 本纸張又度適用中國國家標準（CNS)A4規格（21〇 X 297公爱） — — — — llirlIL· — —» · .< I I ----I . (請先閱讀背面之注意事項再填寫本頁) 526534 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 根據以上所述之目的，本發明提供了一種光學晶圓感 測系統之反射裝置及其應用。本發明係利用一幾何多邊型 立體（如三角柱體），置於光學晶圓感測系統之光發射器的 對應位置，以反射光發射器所發出的光束至其他方向，而 不被光接收器接收到，達至上述之目的。 圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中輔以下列 圖形做更詳細的闡述，其中： 第1圖為習知半導體製程設備中光學晶圓感測系統之 示意圖。 第2圖為習知半導體製程設備中晶圓存在時，光學晶 圓感測系統在實際情況下運作之示意圖。 第3圖為習知半導體製程設備中晶圓不在時，光學晶 圓感測系統在理想情況下運作之示意圖。 第4圖為習知半導體製程設備中晶圓不在時，光學晶 圓感測系統在實際情況下運作之示意圖。 第5圖為在半導體製程設備中運用本發明之一實施例 的光學晶圓感測系統之示意圖。 第6圖為在半導體製程設備中運用本發明之一實施例 的光學晶圓感測系統之示意圖。 6 本紙張尺度適用中國國豕標準（CNS)A4規格（210 X 297公餐） n n n I* ϋ ϋ .-i n n n n K 1 . «.n n n n n u _ 一aj« I— n D i il n 1·-1 (請先閱讀背面之注意事項再填寫本頁) 526534 A7 B7 五、發明說明（） 第7圖為在半導體製程設備中運用本發明之另一實施 例的光學晶圓感測系統之示意圖。 (請先閱讀背面之注意事項再填寫本頁) 圖號對照說明： 10 反 應 器 上 部 20 反 .應 器 下部 30 晶 圓 40 活 門 50 光 學 感 測 器 60 透 明 窗 70 發 射 光 80 反 射 光 90 光 發 射 器 100 光 接 收 器 1 12 低 敏 感 度 之光接收器 122 敏 感 度之光接收器 132 發 射 光 134 反 射 光 142 發 射 光 144 光 接 收 器 152 發 射 光 154 反 射 光 171 反 應 器 上 部 181 反 應 器 下部 191 晶 圓 201 活 門 211 光 學 感 測 器 221 透 明 窗 23 1 發 射 光 241 反 射 光 251 光 發 射 器 261 光 接 收 器 271 反 射 面 281 發 射 光 291 反 射 光 300 反 射 裝 置 3 10 反 射 面 320 發 射 光 經濟部智慧財產局員工消費合作社印製 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 526534 A7 B7 五、發明說明（ 330 反射光 3 50 反應器下部 370 光學感測器 3 9 0 光發射器 34〇 反應器上部 3 60 活門 3 8 〇 透明窗 4〇〇 光接收器 發明詳細說明： 經濟部智慧財產局員工消費合作社印製 請參考第5圖，其所緣示為在半導體製程設備中運用 本發明之反射裝置的概念所實施的光學晶圓感測系統之示 意圖。請留意第5圖之反應器下部1 8 1，它跟習知之反應 器下部20並不一樣，在反應器下部181與透明窗221相對 應的地方為反射面271，且反射面271與水平面成一夾角。 又因為反射面271為可反射光之光滑面，所以反射面271 為光滑斜面。若把光學感測器2 1 1的光接收器2 6 1調至高 敏感度，當晶圓191不存在時，光發射器251所發射之發 射光2 3 1 ’會透過透明窗2 2 1到達反應器上部1 7 1和反應 器下部1 8 1之間的空間並且到達反應器下部1 8 1，但由於 在反應器下部181與透明窗221相對應的地方為反射面 271，且反射面271為光滑斜面，故到達反應器下部“I之 反射面271的發射光231會被反射至其他方向，而不會被 反射回光接收器2 6 1，所以若把光學感測器2 1 1的光接收 器261調至高敏感度，在晶圓不存在時，光接收器261也 不會接收到反射光241。 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 526534 A7 ----- B7 五、發明說明（） 請參考第6圖，其所繪示為在半導體製程設備中運用 本發明之反射裝置的概念所實施的光學晶圓感測系統之示 意圖，且晶圓1 9 1存在於反應器上部} 7丨和反應器下部i 8 j 之間的空間。將光學感測器2 Η的光接收器26 1調至跟第5 圖一樣的高敏感度，當晶圓i 9 1經過活門20丨到達預定位 置時’因為光學感測器211的光發射器251持續射出發射 光281，穿過這透明窗221，所以發射光281會遇到晶圓 191，而被反射回來，大部份的反射光291會透過透明窗 22 1，而被光接收器26 1所接收，當光接收器26 1接收到足 夠的光量後，就檢測出晶圓已到達反應器中之預定位置， 進而控制後續製程動作，而不會發生如第2圖中，因光接 收器1 1 2接收的光量不夠，而感測不到晶圓3 0已到達預定 位置的誤判了。 請參考第7圖，其所繪示為在半導體製程設備中運用 本發明之一實施例的光學晶圓感測系統之示意圖。在透明 窗380之相對位置，放置本發明所提供之反射體300，此 反射體之形狀可為多邊形立體，如為三角柱形狀。當晶圓 不在時，光發射器390所發射之發射光320，會透過透明 窗3 80到達反應器上部340和反應器下部3 50之間的空間 並且到達本發明之多邊形立體300的反射面310，因為反 射面310為光滑斜面，故發射光320會被反射至其他方向， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —1- H ......- I- - - I i I n n ϋ f> i I «-.1: n n n 11 n an 一°J· K i ί I I ϋ I (請先閱讀背面之注意事項再填寫本頁) 526534 Α7 _ ____Β7 _____ 五、發明說明（） 而不會被反射回光接收器400，這樣就可以解決光學感測 器3 70誤判的問題。 本發明之優點為在半導體製程設備中的光學晶圓感測 系統中，應用本發明所提供之反射體（如三角柱體）作為發 射光之反射裝置，因為藉由本發明所提供之反射體的反射 面’已把發射光導引至其他方向，因此即使把光接收器調 至高敏感度也不會發生誤判。如此可提升光學晶圓感測系 統之判斷準確度，減少判斷錯誤次數。而且更可以減少調 整次數，從而在製程上增加生產速度，提高產能β而且在 光學晶圓感測系統中，加入本發明所提供之反射體作為反 射裝置，其所費之成本極低，但又能有效解決現有問題， 符合經濟效益。 -------_----l---^-----C--- (請先閱讀背面之注意事項再填寫本頁) 優 1 另 之 明 發 本 外 另 及光 體的 射¾. 反類 之同 供不 提合 所配 明以 發改。 本修度 為加確 點稍準 地測 活感 靈升 以提 可， 0^°1'·· ， 使 法統 方系 用測 使感 其學 線. 經濟部智慧財產局員工消費合作社印製 人 之 術 技而 此例 悉施 熟實 如佳 較 之 已 所 員 以 用 br 並 明範 發利 本專 為請 僅申 述之 所明 上發 以本 ，定 的 1 改 效 等 之 成 。 完内 所圍 下範 神利 精專 之請 示申 揭之 所述 明下 發在 本含 離包 脫應 未均 它 ， 其飾 凡修 •， 或 圍變 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t )526534 Λ7 B7 V. Description of the invention () Field of the invention: The present invention relates to a reflective device of an optical wafer sensing system (Optical Wafer Present Sensor System), and more particularly to a device used in semiconductor process equipment. Optical wafer sensing system. Background of the Invention: At present, the use of sensors covers a wide range and has penetrated into various fields in various forms. The so-called sensor is defined as "an object that can transform the information related to the sensing object into a signal type that can be transmitted". The optical wafer sensing system generally used in semiconductor process equipment is based on the principle that most of the principle is to emit a light beam to a preset position and determine the wafer quantity by detecting the amount of light reflected back (Photo Quantity). If it is in the preset position, then control the subsequent actions of related equipment. Please refer to FIG. 1, which shows an optical wafer sensing system in a conventional semiconductor process equipment. There is a space between the upper part of the chamber (Chamber Lid) 10 and the lower part of the reactor (Chamber Bottom) 20 for the wafer 30 to enter or exit or the paper size applies the Chinese National Standard (CNS) A4 gauge (210 X 297 mm) (Please read the notes on the back before filling this page) _ H 1 I ^ i J ϋ y I .n Hi n -Order- 丨 n · 11 1 11 n 1 «M λ Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, A7, B7. 5. Description of the invention () For the purpose of stay. In addition, there is a Transparent Window 60 at the predetermined position on the upper part of the reactor 10, and a device is installed above the transparent window 60. There is an optical sensor 50, and the light emitter of the optical sensor 50 (Light Emittei 〇90 continuously emits emission light (Emitting Beam) 70 ′ passes through the transparent window 60 to reach the lower part of the reactor 20) First, the wafer 3 0 enters the space between the upper part of the reactor 10 and the lower part of the reactor 20 through the valve 40 of the reactor. When reaching a predetermined position below the transparent window 60, the light emitter 90 of the optical sensor 50 continuously emits the emitted light 70 Through this transparent window 60, The emitted light 70 will meet the wafer and be reflected back. The reflected light is called Reflected Light 80. Most of the reflected light 80 will pass through the transparent window 60 and be received by the light receiver. )〗 00, when the light receiver 100 receives a sufficient amount of light, it detects that the wafer has reached a predetermined position in the reactor, and then controls subsequent process operations. Most of the semiconductor process equipment is automated It needs to rely on different types of sensors to return the sensing signals to the control system for judgment and control. Therefore, the accuracy and sensitivity of the sensors need to be very rigorous so that the yield of the process can be maintained at a certain level. Otherwise, it is just a waste of production cost and time, and it will even affect the safety of personnel. Regarding optical wafer sensing systems, misjudgments often occur. The 3 paper standards are applicable to China National Standard (CNS) A4 specifications (21 〇χ297mm) ----- 1 _---- II »i II Γ I --- * Order ----- I --- I (Please read the precautions on the back before filling this page) Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 526534 A7 __B7_ V. Description of the invention () The reason is mostly that it is difficult to adjust the sensitivity of the optical receiver. Please refer to Figure 2, which shows the optical wafer sensing system when a wafer exists in a conventional semiconductor process equipment. And the light receiver is adjusted to low sensitivity. When the wafer 30 is at a predetermined position, the emitted light 1 3 2 passes through the transparent window 60 to reach the wafer 30 and is reflected, although the reflected light 1 3 4 will be reflected. And through the transparent window 60, but because the light receiver Π 2 is adjusted to low sensitivity, many times because the intensity of the reflected light 134 is not enough, the amount of light received by the light receiver 112 is not enough, and the wafer 30 cannot be sensed. It has reached the predetermined position and it is misjudged. Please refer to Figure 3, which shows an ideal optical wafer sensing system when the wafer is absent in conventional semiconductor process equipment. In an ideal case, the emitted light 1 42 passes through the transparent window 60 to reach the space between the upper part of the reactor 10 and the lower part of the reactor 20 because the wafer is not at the predetermined position, so the emitted light is not reflected by the wafer back to the light receiver 1 44. The light receiver 1 44 cannot detect a sufficient amount of light, so it is determined that the wafer is not at a predetermined position. However, in practical situations, it is difficult to adjust the sensitivity of the optical receiver to an accurate level. If the sensitivity of the optical receiver is slightly lower, there may be misjudgment as shown in Figure 2. If the sensitivity of the optical receiver is Slightly higher, there may be misjudgment as shown in Figure 4. Please refer to FIG. 4, which shows a schematic diagram of an optical wafer sensing system in a conventional semiconductor process equipment when a wafer is absent, and the light receiver is adjusted to high sensitivity. The emitted light 152 reaches the space between the upper part of the reactor 10 and the lower part of the reactor 20 through the transparent window 60, and there are 4 paper sizes applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ϋ —1 ί II n I ϋ n 18- n 1 (5) Description of the invention () A part of the emitted light 152 reaches the lower part of the reactor 20 and is reflected by the surface of the lower part 20 of the reactor, and a part of the reflected light 154 will pass through the transparent window 60, although the reflected light reflected back The intensity of 1 54 is very small, but because the light receiver 1 22 is adjusted to high sensitivity, it is often judged that there is a wafer at a predetermined position because only a small amount of light is sensed, but the actual situation The upper wafer did not exist, so the misjudgment occurred. Object and summary of the invention: In view of the above background of the invention, in semiconductor process equipment, the optical wafer sensing system mainly detects whether the wafer is in a predetermined position, and then returns a signal to the process control system for judgment. And controlling subsequent steps, the accuracy of the optical wafer sensing system is very important. However, it is difficult to adjust the receiving sensitivity of the optical receiver of the optical sensor to a precise level, so the existence of a wafer is often misjudged. The object of the present invention is to provide a reflection device of an optical wafer sensing system and its application. The present invention is an optical wafer sensing system used in a semiconductor process equipment, by adding a reflection device to the optical wafer sensing system. 'In order to solve the misjudgment caused by the difficulty of adjusting the receiving sensitivity of the optical receiver of the optical sensor, reduce the adjustment time of the optical wafer sensing system, save manpower and improve production efficiency. This paper is again applicable to the Chinese National Standard (CNS) A4 specification (21〇X 297 public love) — — — — llirlIL · — — »·. ≪ II ---- I. (Please read the notes on the back first (Fill in this page again) 526534 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of the invention () According to the above-mentioned purpose, the present invention provides a reflection device for an optical wafer sensing system and its application. The present invention uses a geometric polygonal cube (such as a triangular cylinder) to be placed at the corresponding position of the light emitter of the optical wafer sensing system to reflect the light beam emitted by the light emitter to other directions without being received by the light receiver. Received, to achieve the above purpose. Brief description of the drawings: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, where: Figure 1 is a schematic diagram of an optical wafer sensing system in a conventional semiconductor process equipment . Fig. 2 is a schematic diagram of the operation of an optical wafer sensing system under actual conditions when a wafer exists in a conventional semiconductor process equipment. Fig. 3 is a schematic diagram showing the operation of an optical wafer sensing system under ideal conditions when a wafer is absent in a conventional semiconductor process equipment. Fig. 4 is a schematic diagram showing the operation of an optical wafer sensing system under actual conditions when a wafer is absent in a conventional semiconductor process equipment. FIG. 5 is a schematic diagram of an optical wafer sensing system using an embodiment of the present invention in a semiconductor process equipment. FIG. 6 is a schematic diagram of an optical wafer sensing system using an embodiment of the present invention in a semiconductor process equipment. 6 This paper size applies to China National Standard (CNS) A4 (210 X 297 meals) nnn I * ϋ ϋ .-innnn K 1. «.Nnnnnu _ aaj« I— n D i il n 1 · -1 (Please read the precautions on the back before filling this page) 526534 A7 B7 V. Description of the invention () Figure 7 is a schematic diagram of an optical wafer sensing system using another embodiment of the present invention in a semiconductor process equipment. (Please read the precautions on the back before filling in this page) Drawing number comparison description: 10 reactor top 20 reaction. Reactor bottom 30 wafer 40 valve 50 optical sensor 60 transparent window 70 emitted light 80 reflected light 90 light emission Receiver 100 light receiver 1 12 low sensitivity light receiver 122 sensitive light receiver 132 transmitted light 134 reflected light 142 transmitted light 144 light receiver 152 transmitted light 154 reflected light 171 upper reactor 181 lower reactor 191 crystal Circle 201 Valve 211 Optical sensor 221 Transparent window 23 1 Emitted light 241 Reflected light 251 Light transmitter 261 Light receiver 271 Reflective surface 281 Emitted light 291 Reflected light 300 Reflective device 3 10 Reflective surface 320 Emitted light Intellectual Property Bureau, Ministry of Economic Affairs Printed by employee consumer cooperatives 7 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) 526534 A7 B7 V. Description of the invention (330 reflected light 3 50 lower part of the reactor 370 optical sensor 3 9 0 light Transmitter 34 The upper part of the reactor 3 60 valve 3 8 0 transparent window 400 light receiver invention detailed description: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, please refer to Figure 5, and its reason is to use the present invention in semiconductor process equipment Schematic diagram of the optical wafer sensing system implemented by the concept of the reflection device. Please pay attention to the lower part of the reactor 1 8 1 in Fig. 5, which is different from the conventional lower part of the reactor 20, in the lower part of the reactor 181 and the transparent window The corresponding place of 221 is the reflecting surface 271, and the reflecting surface 271 forms an angle with the horizontal plane. Because the reflecting surface 271 is a smooth surface that can reflect light, the reflecting surface 271 is a smooth inclined surface. If the optical sensor 2 1 1 The light receiver 2 6 1 is adjusted to high sensitivity. When the wafer 191 does not exist, the emitted light 2 3 1 'emitted by the light emitter 251 will pass through the transparent window 2 2 1 to reach the upper part of the reactor 1 7 1 and the lower part of the reactor. The space between 1 8 1 reaches the lower part of the reactor 1 81, but because the reflecting surface 271 is at the lower part of the reactor 181 corresponding to the transparent window 221, and the reflecting surface 271 is a smooth bevel, it reaches the lower part of the reactor " I of The emitted light 231 from the radiation surface 271 will be reflected to other directions and will not be reflected back to the light receiver 2 6 1. Therefore, if the light receiver 261 of the optical sensor 2 1 1 is adjusted to a high sensitivity, the wafer When not present, the light receiver 261 will not receive the reflected light 241. (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 526534 A7 ----- B7 V. Description of the invention () Please refer to FIG. 6, which is a schematic diagram of an optical wafer sensing system implemented by using the concept of the reflection device of the present invention in a semiconductor process equipment, and the wafer 191 exists in The upper part of the reactor} 7 丨 and the lower part of the reactor i 8 j. Adjust the light receiver 26 1 of the optical sensor 2 Η to the high sensitivity as shown in Figure 5. When the wafer i 9 1 passes through the shutter 20 丨 and reaches the predetermined position 'because the light emitter of the optical sensor 211 251 continuously emits the emitted light 281 and passes through the transparent window 221, so the emitted light 281 will meet the wafer 191 and be reflected back. Most of the reflected light 291 will pass through the transparent window 22 1 and be received by the light receiver 26 1 received, when the light receiver 26 1 receives a sufficient amount of light, it detects that the wafer has reached a predetermined position in the reactor, and then controls subsequent process operations, as shown in Figure 2, due to light reception The amount of light received by the device 1 2 is not enough, and the misjudgment that the wafer 30 has reached the predetermined position cannot be detected. Please refer to FIG. 7, which illustrates a schematic diagram of an optical wafer sensing system using an embodiment of the present invention in a semiconductor process equipment. At the relative position of the transparent window 380, the reflector 300 provided by the present invention is placed. The shape of the reflector may be a polygonal solid, such as a triangular column shape. When the wafer is not present, the emitted light 320 emitted by the light emitter 390 will pass through the transparent window 3 80 to reach the space between the upper part 340 and the lower part 3 50 of the reactor and reach the reflecting surface 310 of the polygonal solid 300 of the present invention. Because the reflecting surface 310 is a smooth bevel, the emitted light 320 will be reflected in other directions. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) —1- H ......- I---I i I nn ϋ f > i I «-.1: nnn 11 n an ° J · K i ί II ϋ I (Please read the notes on the back before filling this page) 526534 Α7 _ ____ Β7 _____ Fifth, the invention description () will not be reflected back to the light receiver 400, so that the problem of misjudgment of the optical sensor 3 70 can be solved. The advantage of the present invention is that in the optical wafer sensing system in the semiconductor process equipment, the reflector (such as a triangular cylinder) provided by the present invention is used as a reflection device for emitting light, because the reflection by the reflector provided by the present invention The surface has guided the emitted light to other directions, so even if the light receiver is adjusted to high sensitivity, no misjudgment will occur. This can improve the judgment accuracy of the optical wafer sensing system and reduce the number of judgment errors. In addition, the number of adjustments can be reduced, thereby increasing the production speed in the manufacturing process and increasing the production capacity β. In the optical wafer sensing system, adding the reflector provided by the present invention as a reflection device has a very low cost. It can effectively solve existing problems and is in line with economic benefits. -------_---- l --- ^ ----- C --- (Please read the notes on the back before filling in this page) Excellent 1 Physical shooting ¾. On the contrary, the same thing is not specified for development and reform. This revision is to measure the accuracy of the living sensation to a certain degree to improve the accuracy, 0 ^ ° 1 '··, so that the legal system can use the measurement to sense its learning line. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This example shows that Shi Shushi is better than the one who has used the br and Ming Fanfa. This book is designed to send only the statement of the stated one, and the effect of 1 modification. Fan Shenli's request for application and disclosure, which is enclosed in the end, is not included in this document, which should be included in the package. It should be decorated in any way, or be modified. The paper size is applicable to Chinese national standards (CNS ) A4 size (210 X 297 male t)