TW525542U - Improved structure for solder preheating device - Google Patents

Improved structure for solder preheating device

Info

Publication number
TW525542U
TW525542U TW91208848U TW91208848U TW525542U TW 525542 U TW525542 U TW 525542U TW 91208848 U TW91208848 U TW 91208848U TW 91208848 U TW91208848 U TW 91208848U TW 525542 U TW525542 U TW 525542U
Authority
TW
Taiwan
Prior art keywords
improved structure
preheating device
solder preheating
solder
improved
Prior art date
Application number
TW91208848U
Other languages
Chinese (zh)
Inventor
Ming-Sung Chen
Original Assignee
Nat Solbot Electronics Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Solbot Electronics Ind Co filed Critical Nat Solbot Electronics Ind Co
Priority to TW91208848U priority Critical patent/TW525542U/en
Publication of TW525542U publication Critical patent/TW525542U/en

Links

TW91208848U 2002-06-13 2002-06-13 Improved structure for solder preheating device TW525542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91208848U TW525542U (en) 2002-06-13 2002-06-13 Improved structure for solder preheating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91208848U TW525542U (en) 2002-06-13 2002-06-13 Improved structure for solder preheating device

Publications (1)

Publication Number Publication Date
TW525542U true TW525542U (en) 2003-03-21

Family

ID=28451827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91208848U TW525542U (en) 2002-06-13 2002-06-13 Improved structure for solder preheating device

Country Status (1)

Country Link
TW (1) TW525542U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees