TW524388U - Flip chip package with directed lid attach (DLA) - Google Patents

Flip chip package with directed lid attach (DLA)

Info

Publication number
TW524388U
TW524388U TW91202749U TW91202749U TW524388U TW 524388 U TW524388 U TW 524388U TW 91202749 U TW91202749 U TW 91202749U TW 91202749 U TW91202749 U TW 91202749U TW 524388 U TW524388 U TW 524388U
Authority
TW
Taiwan
Prior art keywords
dla
flip chip
chip package
lid attach
directed lid
Prior art date
Application number
TW91202749U
Other languages
Chinese (zh)
Inventor
Meng-Jen Wang
Hsueh-Te Wang
Chun-Yang Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW91202749U priority Critical patent/TW524388U/en
Publication of TW524388U publication Critical patent/TW524388U/en

Links

TW91202749U 2002-03-06 2002-03-06 Flip chip package with directed lid attach (DLA) TW524388U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91202749U TW524388U (en) 2002-03-06 2002-03-06 Flip chip package with directed lid attach (DLA)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91202749U TW524388U (en) 2002-03-06 2002-03-06 Flip chip package with directed lid attach (DLA)

Publications (1)

Publication Number Publication Date
TW524388U true TW524388U (en) 2003-03-11

Family

ID=28038069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91202749U TW524388U (en) 2002-03-06 2002-03-06 Flip chip package with directed lid attach (DLA)

Country Status (1)

Country Link
TW (1) TW524388U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7298028B2 (en) 2005-07-14 2007-11-20 Via Technologies, Inc. Printed circuit board for thermal dissipation and electronic device using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7298028B2 (en) 2005-07-14 2007-11-20 Via Technologies, Inc. Printed circuit board for thermal dissipation and electronic device using the same

Similar Documents

Publication Publication Date Title
TW531052U (en) Flip chip and flip chip packaging substrate
SG115459A1 (en) Flip chip packaging using recessed interposer terminals
TW572361U (en) Flip-chip package carrier
TWI317991B (en) Semiconductor package with flip chip on leadframe
AU2003277266A8 (en) Semiconductor device package
TW556961U (en) Multi-chip stack flip-chip package
SG104279A1 (en) Enhanced chip scale package for flip chips
AU2003291199A8 (en) Package having exposed integrated circuit device
AU2003299866A8 (en) High frequency chip packages with connecting elements
TW555152U (en) Structure of flip chip package with area bump
SG120073A1 (en) Multiple chip semiconductor packages
TW543923U (en) Structure of chip package
SG117482A1 (en) Flip chip bonder
TW540823U (en) Flip-chip package substrate
HK1063344A1 (en) Surface mount chip package
TW532567U (en) Flip chip package substrate and flip chip
TW200512897A (en) Chip on glass package
TW539238U (en) Flip-chip packaging substrate
TW524388U (en) Flip chip package with directed lid attach (DLA)
TW540816U (en) Semiconductor package
TW545697U (en) Structure of chip package
TW549573U (en) IC package for a multi-chip module
TW528202U (en) Flip chip package with multi-chip module
TW579071U (en) Optoelectronic module package
TW565011U (en) Flip-chip package substrate