TW524388U - Flip chip package with directed lid attach (DLA) - Google Patents
Flip chip package with directed lid attach (DLA)Info
- Publication number
- TW524388U TW524388U TW91202749U TW91202749U TW524388U TW 524388 U TW524388 U TW 524388U TW 91202749 U TW91202749 U TW 91202749U TW 91202749 U TW91202749 U TW 91202749U TW 524388 U TW524388 U TW 524388U
- Authority
- TW
- Taiwan
- Prior art keywords
- dla
- flip chip
- chip package
- lid attach
- directed lid
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91202749U TW524388U (en) | 2002-03-06 | 2002-03-06 | Flip chip package with directed lid attach (DLA) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91202749U TW524388U (en) | 2002-03-06 | 2002-03-06 | Flip chip package with directed lid attach (DLA) |
Publications (1)
Publication Number | Publication Date |
---|---|
TW524388U true TW524388U (en) | 2003-03-11 |
Family
ID=28038069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91202749U TW524388U (en) | 2002-03-06 | 2002-03-06 | Flip chip package with directed lid attach (DLA) |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW524388U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7298028B2 (en) | 2005-07-14 | 2007-11-20 | Via Technologies, Inc. | Printed circuit board for thermal dissipation and electronic device using the same |
-
2002
- 2002-03-06 TW TW91202749U patent/TW524388U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7298028B2 (en) | 2005-07-14 | 2007-11-20 | Via Technologies, Inc. | Printed circuit board for thermal dissipation and electronic device using the same |
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