TW521904U - Stamping mold for conductive sheet of plug - Google Patents
Stamping mold for conductive sheet of plugInfo
- Publication number
- TW521904U TW521904U TW90224460U TW90224460U TW521904U TW 521904 U TW521904 U TW 521904U TW 90224460 U TW90224460 U TW 90224460U TW 90224460 U TW90224460 U TW 90224460U TW 521904 U TW521904 U TW 521904U
- Authority
- TW
- Taiwan
- Prior art keywords
- plug
- conductive sheet
- stamping mold
- stamping
- mold
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90224460U TW521904U (en) | 2001-12-28 | 2001-12-28 | Stamping mold for conductive sheet of plug |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90224460U TW521904U (en) | 2001-12-28 | 2001-12-28 | Stamping mold for conductive sheet of plug |
Publications (1)
Publication Number | Publication Date |
---|---|
TW521904U true TW521904U (en) | 2003-02-21 |
Family
ID=28037751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90224460U TW521904U (en) | 2001-12-28 | 2001-12-28 | Stamping mold for conductive sheet of plug |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW521904U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102832474A (zh) * | 2011-06-14 | 2012-12-19 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其成型方法 |
-
2001
- 2001-12-28 TW TW90224460U patent/TW521904U/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102832474A (zh) * | 2011-06-14 | 2012-12-19 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其成型方法 |
CN102832474B (zh) * | 2011-06-14 | 2015-11-25 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其成型方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |