520574 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（） 本發明係與致動器有關，特別是指一種壓電式致動器 之製作方法。 按，一般業界所稱之典型壓電式致動器大致分有積層 型（multilayer)、單型態（monomorph)或（unimorph)以及雙型 5 態（bimorph)等，因在使用上其致動位移量及承載力都不能 同時兼顧，所以一直為業界所詬病；也因此，如何研發出 具有高承載力與高位移量兼顧之致動器與製法一直是業界 努力之目標；而最近業界在壓電陶瓷的領域裡，已致力於 提高壓電式致動器的致動能力，且不失其承載力，因而有 10 了各式各樣的製程設計，例如以RAINBOW及THUNDER 等方式製成。 RAINBOW製程的基本做法是將電子陶瓷壓電晶片90 放置於一呈平面的石墨塊91上，再把一锆板92平放於該 壓電片90上，最後將整個構造放入預設之烤箱中燒結而生 15 成具有壓電性與非壓電性兩層結構，經過一端時間後取出 冷卻至室溫後，即因各層結構之膨脹係數不同，而使得整 體產生一弧型之結構（如第一圖所示）。 而THUNDER製程則是將一陶瓷壓電晶片80置於一不 銹鋼平板81上方，該壓電晶片80上方再置放上一鋁板82, 20 而在這三種元件之間以一種高溫黏著劑83加以結合，黏著 劑會使各層板之間的鍵結產生預應力，最後整個構件放入 預設之壓力斧内熱壓，然後取出冷卻至室溫，這時因各元 件熱脹係數的不同，因此使得整體產生一弧型結構（如第 二圖所示）。 -3- 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） (請先閱讀背面/之注意事 d 項再填< 裝—— :寫本頁) ·· 520574 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 由於圓？瓜型的壓電式致動器具有較大的橫向位移量， 而前述兩種之先行技術所製成之壓電式致動器，其共通的 特點就是其外型都是類似彩虹一樣的圓弧型；惟，該二種 先行技術由於原始外型為平板狀態，在該圓弧型態樣的形 * .· 5 成過程中，這兩種製法容易使一壓電晶片與一平板狀基板 間的鍵結容易失去，且’’RAINBOW”和’’THUNDER”製法所 做成之壓電式致動器不容易控制該圓弧型態樣的拱起高度 (即致動器在成型後拱起高度已固定）；因此本發明創作人 也將以不同於’’RAINBOW”和’’THUNDER”的製程設計，發 10 明一種壓電式致動器之製作方法，其能在製作一壓電式致 動器時，精密控制該壓電式致動器的拱起高度，以達到設 計之要求規格，且有效解決一壓電晶片與一平板狀基板間 的键結答易失去之問題。 是以，本發明之主要目的在於提供一種壓電式致動器 15 之製作方法，其能以電鑄之方式精密控制電鑄材質附著於 一基板的内應力，促使所欲製作之壓電式致動器的拱起高 度能達到所設計之要求規格者。 本發明之另一目的在於提供一種壓電式致動器之製作 方法，其能有效解決一壓電晶片與一平板狀基板間的鍵結 20 容易失去之問題者。 緣是，為達成前述之目的，本發明一種壓電式致動器 之製作方法係包含有下列步驟；a.黏著：藉由一具有高強 度、高溫不產生化學與物理變化之高分子膠，將一壓電晶 片黏著於一基板之一側面上；b.覆蓋：將黏著於該基板之 -4- (請先閱讀背面，之注意事 4 •項再填、 裝-- ，寫本頁) "口 讀 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 520574 A7 B7 五、發明説明（） 壓電晶片整面以一絕緣膠帶使之完全覆蓋與外界隔離；C. 電每·在該基板相對於黏者'有該壓電晶片之另一側面上’ 配合一可產生内應力之鑄浴，利用電鑄方式於一預定區域 内進行電鑄；藉此，控制電鑄之時間，以使該預定區域内 5 將形成一預定厚度之鑄膜，利用該鑄膜所產生之拉張應力 促使整個結構彎曲拱成一圓弧狀之壓電式致動器，使得該 壓電式致動器能增加内應力進而增加承載能力，同時可經 由控制電鑄之時間來得到該壓電式致動器所需之拱起高 度。 10 以下即佐以圖式舉一較佳實施例對本發明做進一步說 明，其中： 第三圖係本發明一較佳實施例之製程示意圖。 第四圖係本發明一較佳實施例之運作型態示意圖。 第五圖係本發明一較佳實施例之壓電晶片電壓驅動示 15 意圖。 首先，請參閱第三圖所示，本創作壓電式致動器之製 作方法包含下列步驟：520574 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention () This invention is related to actuators, especially a method for making a piezoelectric actuator. According to the typical piezoelectric actuators generally referred to in the industry, they are mainly divided into multilayer, monomorph or unimorph, and bimorph, etc., because of their activation in use Displacement and bearing capacity cannot be taken into consideration at the same time, so it has been criticized by the industry; therefore, how to develop actuators and manufacturing methods with both high bearing capacity and high displacement has been the goal of the industry's efforts; In the field of electric ceramics, we have been committed to improving the actuation capacity of piezoelectric actuators without losing their bearing capacity. Therefore, there are various process designs, such as RAINBOW and THUNDER. The basic method of the RAINBOW process is to place the electronic ceramic piezoelectric wafer 90 on a flat graphite block 91, then place a zirconium plate 92 on the piezoelectric plate 90, and finally put the entire structure into a preset oven The sintering resulted in a two-layer structure with piezoelectric and non-piezoelectricity. After one end of time, it was taken out and cooled to room temperature, which resulted in an arc-shaped structure as a whole due to the different expansion coefficients of each layer structure (such as Shown in the first picture). In the THUNDER process, a ceramic piezoelectric wafer 80 is placed on a stainless steel plate 81, and an aluminum plate 82, 20 is placed on the piezoelectric wafer 80. The three components are combined with a high-temperature adhesive 83 The adhesive will cause the pre-stress of the bond between the various layers. Finally, the entire component is put into a preset pressure axe and hot-pressed, and then taken out to cool to room temperature. At this time, due to the different thermal expansion coefficients of the components, the overall Create an arc structure (as shown in the second figure). -3- This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) (Please read the back / Notes item d and fill in < Install-: Write this page) · 520574 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The melon-type piezoelectric actuator has a large lateral displacement. The common feature of the piezoelectric actuators made by the two previous technologies is that they have a rainbow-like circle. Arc type; however, since the two previous technologies are in a flat state, the two methods can easily make a piezoelectric chip and a flat substrate during the formation of the arc shape. The bond between them is easy to lose, and the piezoelectric actuator made by `` RAINBOW '' and `` THUNDER '' cannot easily control the arch height of the arc shape (that is, the actuator arches after molding The lifting height has been fixed); therefore, the creator of the present invention will also use a process design different from "RAINBOW" and "THUNDER" to develop a method for manufacturing a piezoelectric actuator, which can produce a piezoelectric When the actuator is a type actuator, the arching height of the piezoelectric actuator is precisely controlled to meet the design requirements, and the problem of easy loss of the bond between a piezoelectric chip and a flat substrate is effectively solved. Therefore, the main purpose of the present invention is to provide a method for manufacturing a piezoelectric actuator 15, which can precisely control the internal stress of an electroformed material attached to a substrate by electroforming, and promote the desired piezoelectric type. The arching height of the actuator can meet the designed specifications. Another object of the present invention is to provide a method for manufacturing a piezoelectric actuator, which can effectively solve the problem that the bond 20 between a piezoelectric wafer and a flat substrate is easily lost. The reason is that, in order to achieve the aforementioned object, a method for manufacturing a piezoelectric actuator according to the present invention includes the following steps; a. Adhesion: by using a high-strength polymer glue that does not cause chemical and physical changes at high temperatures, Adhere a piezoelectric chip to one side of a substrate; b. Cover: Adhere to the substrate of -4- (Please read the back first, note 4 • Items, then fill in,-, write this page) " The size of this paper is applicable to Chinese National Standard (CNS) A4 (210X 297 mm) 520574 A7 B7 V. Description of the invention () The entire surface of the piezoelectric chip is covered with an insulating tape to completely isolate it from the outside world; C. Electrical Every time a substrate with a piezoelectric bath on the other side of the substrate with the piezoelectric chip is equipped with a casting bath that can generate internal stress, electroforming is performed in a predetermined area by means of electroforming; thereby, controlling electroforming Time, so that a cast film of a predetermined thickness will be formed in the predetermined area, and the tensile stress generated by the cast film is used to urge the entire structure into a circular arc-shaped piezoelectric actuator, so that the piezoelectric Actuator can increase the internal stress Increased carrying capacity, and may be controlled by the time of electroforming to obtain the piezoelectric actuator of the arch height required. 10 The following is a further description of the present invention with a preferred embodiment accompanied by a diagram, in which: The third diagram is a schematic diagram of a manufacturing process of a preferred embodiment of the present invention. The fourth diagram is a schematic diagram of the operation mode of a preferred embodiment of the present invention. The fifth diagram is a schematic diagram of a voltage driving of a piezoelectric chip according to a preferred embodiment of the present invention. First, please refer to the third figure. The manufacturing method of this piezoelectric actuator includes the following steps:
a.黏著：取用一具有高強度、高溫不產生化學與物理變 化之高分子膠10 (例如AV-119膠或環氧樹脂高強度結構 20 膠），以塗層方式（如網版印刷方式）塗在一不鏽鋼材質 所製之複合基板20，該高分子膠10在塗層時不可太厚或 不勻，然後再將一以壓電陶瓷（簡稱PZT)為材質之壓電 晶片30藉由該高分子膠10黏附於該複合基板20之一側面 21上，且該基板20上並連接有一導線40 (如第三圖之A -5- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） —-jmp* 裝— (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 520574 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（） 所示）。 b. 覆蓋：將黏著於該基板20之壓電晶片30整面以一絕 緣膠帶50使之完全覆蓋（如第三圖之B所示），且在該基 板20相對於黏著有該壓電晶片30之另一側面22上保留一 5 預定區域23，（如第三圖之C所示）。 c. 預鍍：在進行電鑄成型時，該複合基板20須先進行 一預鍍程序（俗稱電鍍打底），該預鍵程序是為了使表面 形成一界面以利後續電鑄之進行，藉以確保一電鑄材質與 該複合基板30能緊密結合（bonding)。在本實施例中， 10 是將該複合基板20置於鎳酸槽中進行預鍍，其電鍍之時間 以一分鐘内為佳，而其電流密度則取0 · 5 A/dm2來加以進行。 d·電鑄：當該複合基板20完成預鍍程序後，則開始進 行電鑄成型程序；在電鑄時，利用電鑄法並配合一可產生 高内應力之氯化亞鎳浴，於該側面22 —預定區域23内進 15 行電鑄（如第三圖之D所示）；經過一預定時間之電鑄後， 此時該預定區域23内則會形成一鎳鍍膜層60，該鎳鍍膜 層60將產生一拉張應力而使得整個結構彎曲拱成一圓弧 狀之壓電式致動器70 (如第三圖之E所示）。 就先行技藝之壓電理論而言，由於壓電材料為一非等 20 向性（anisotropic)材料，因此在不同方向上的機-電性質均不 相同。壓電材料的性質是以二個下標數字來表示，第一個 數字是指極化方向或施加電場方向，而第二個數字則是指 機械應變或施加應力之方向；另外，對一壓電效應而言， 它所涉及的變數有四個，其中兩個為機械彈性能，即應力 -6- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面，之注意事項再填寫本頁) 1· 項再填- 裝· 訂 4 520574 A7 B7 五、發明説明（） (請先閱讀背面之注意事項再填寫本頁) T及應變S，而另外兩個為介電量，即電場E及電通量密 度D，因此依所選擇的自變數及應變數之不同，壓電方程 式將有四種不同之型態，即所謂之d型態、g型態、e型態 及h型態，而在本實施例中，則是採用d型態來計算。 5 複請參閱第四圖及第五圖所示，藉此，依上述方法所 經濟部智慧財產局員工消費合作社印製 製作完成之壓電式致動器70，當採用d型態來造成壓電式 致動器的位移量在3方向時，亦即在3方向施給電壓而在 1方向產生位移（如第四圖所示），且基於壓電理論的基本 原理，若電壓之驅動方式（如第五圖所示），則可以簡單的 10 方程式ΔΧ = xd31V/z以及z\z =d33V分別表示1方向 與3方向在固定電壓V的作用下的伸長量，而由ΛΧ二 xd31V/z之式子可得知1方向之伸長量與X(即1方向長 度）成正比，因此X值越大時，則1方向之伸長量越大； 而由Δζ =d3 3 V式中可知，3方向之伸長量與驅動電壓成正 15 比，而與z ( 3方向厚度）無關；所以若要以相同之電壓而 得到較大之伸長量，只有在1方向加長；故此，本發明所 製成之壓電式致動器70是將1方向之兩端固定住，利用1 方向之伸長來造成3方向的位移，如此一來不但能使得該 壓電式致動器70橫向位移倍增，同時也可增加承載的力 20 量，使得利用此法所製成之壓電致動器70兼顧有高承載力 與高位移量，同時藉由該高分子膠10高溫硬化之特性，保 持該壓電晶片30與該複合基板20間之鍵結，並可經由控 制電鑄之時間來得到該壓電式致動器70所需之拱起高度。 簡言之，本發明是藉由電鑄法所形成之電鍍鍍膜，其 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 520574 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（） 鍍膜本身所產生之拉張應力來增加弧形壓電式致動器之内 應力；並再藉由精密控制電鑄之時間來得到壓電式致動器 所需之拱起高度，並由其内應力來增加承載能力。 又，本發明在步驟a之黏著程序中，亦可將該黏著有 5 壓電晶片30之基板20放置於一高溫爐中烘烤，以使該高 分子膠10熱固熟化，以使壓電晶片30與基板20間之結構 強度可以顯現出來，然後再進行步騾b之覆蓋程序。 再者，值得一提的是，以上所述之步驟僅為本發明之 一較佳實施例，本發明壓電式致動器之製法，更可依所需 10 之要求以及功能之因應，而在黏著膠、基板、壓電晶片與 電鑄所採用之鑄浴上作一適切之選擇，例如黏著膠除了高 分子AV-119膠外亦可由環氣樹脂替換；而該複合基板材 料之種類亦可選擇一般金屬材料或其它彈性材料（例如不 鏽鋼、青銅、黃銅等）；至於電鑄所採用之鑄浴溶液則更 15 有全氯化物浴、瓦特浴、硬質鎳浴及光澤浴等多種選擇。 综上所述，本發明能有效解決習用電致動器之致動位 移量及承載力都不能同時兼顧之缺失，且也有效解決壓電 晶片與基板間容易失去键結的問題，使得本發明符合未來 講求效率的科技時代需求，是以本發明實已具備發明專利 20 要件，爰依法提出申請。 (請先閱讀背面/之注意事項再填寫本頁) •裝·a. Adhesion: Take a high-strength polymer glue 10 (such as AV-119 glue or epoxy high-strength structure 20 glue) that has high strength and does not cause chemical and physical changes at high temperature, and use coating method (such as screen printing method) ) Coated a composite substrate 20 made of stainless steel, the polymer glue 10 should not be too thick or uneven during coating, and then a piezoelectric chip 30 made of piezoelectric ceramics (PZT for short) is used The polymer glue 10 is adhered to a side surface 21 of the composite substrate 20, and a conductive wire 40 is connected to the substrate 20 (as shown in A in the third figure -5- This paper size applies to Chinese National Standard (CNS) A4 specifications ( 210X 297 mm) —-jmp * equipment— (Please read the precautions on the back before filling out this page) Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 520574 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy A7 B7 Invention description ()). b. Covering: The entire surface of the piezoelectric wafer 30 adhered to the substrate 20 is completely covered with an insulating tape 50 (as shown in B in the third figure), and the piezoelectric wafer is adhered to the substrate 20 relative to the substrate 20. A predetermined area 23 is reserved on the other side 22 of 30 (as shown in FIG. 3C). c. Pre-plating: When performing electroforming, the composite substrate 20 must first undergo a pre-plating process (commonly known as electroplating primer). The pre-bonding process is to make the surface form an interface to facilitate subsequent electroforming. It is ensured that an electroformed material can be tightly bonded to the composite substrate 30. In the present embodiment, the composite substrate 20 is pre-plated in a nickel-acid bath. The plating time is preferably within one minute, and the current density is set to 0 · 5 A / dm2. d · Electroforming: After the composite substrate 20 completes the pre-plating process, the electroforming molding process is started; during electroforming, the electroforming method is used with a nickel chloride bath that can generate high internal stress. Side 22—15 electroformings are performed in the predetermined area 23 (as shown in D in the third figure); after a predetermined time of electroforming, a nickel coating layer 60 is formed in the predetermined area 23, and the nickel The coating layer 60 will generate a tensile stress to bend the entire structure into a circular arc-shaped piezoelectric actuator 70 (as shown in FIG. 3E). As far as the prior art piezoelectric theory is concerned, since the piezoelectric material is an anisotropic material, the electromechanical properties in different directions are different. The properties of piezoelectric materials are represented by two subscript numbers, the first number refers to the direction of polarization or the direction of the applied electric field, and the second number refers to the direction of mechanical strain or stress; in addition, for a pressure In terms of electrical effects, there are four variables involved, two of which are mechanical elastic energy, that is, stress-6. This paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) (please read the back first) Please fill in this page for the matters needing attention) 1. Fill in the items again-Packing · Order 4 520574 A7 B7 V. Description of the invention () (Please read the notes on the back before filling out this page) T and S, and the other two As the dielectric quantity, namely the electric field E and the electric flux density D, the piezoelectric equation will have four different types, depending on the selected independent variable and strain number, the so-called d-type, g-type, e-type and h-type. In this embodiment, d-type is used for calculation. 5 Please refer to the fourth and fifth figures. In this way, according to the above method, the piezoelectric actuator 70 printed and manufactured by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is used to cause pressure When the displacement of the electric actuator is in 3 directions, that is, voltage is applied in 3 directions and displacement occurs in 1 direction (as shown in the fourth figure), and based on the basic principle of piezoelectric theory, if the voltage is driven (As shown in the fifth figure), the simple 10 equations Δχ = xd31V / z and z \ z = d33V can be used to represent the elongation of 1 direction and 3 directions under the action of a fixed voltage V, and Λχ 二 xd31V / The formula of z can be known that the amount of elongation in one direction is proportional to X (that is, the length in one direction), so the larger the value of X, the greater the amount of elongation in one direction; and from the formula Δζ = d3 3 V, The amount of elongation in 3 directions is proportional to the driving voltage by 15 and has nothing to do with z (thickness in 3 directions); so if you want to obtain a larger amount of elongation with the same voltage, you only have to lengthen it in 1 direction. The piezoelectric actuator 70 fixes both ends in one direction and uses the elongation in one direction. This can cause displacement in three directions. Not only can the lateral displacement of the piezoelectric actuator 70 be doubled, but it can also increase the amount of load 20, so that the piezoelectric actuator 70 made by this method can take into account It has high bearing capacity and high displacement. At the same time, by virtue of the high-temperature curing characteristics of the polymer glue 10, the bond between the piezoelectric wafer 30 and the composite substrate 20 is maintained, and the pressure can be obtained by controlling the time of electroforming. The arching height required for the electric actuator 70. In short, the present invention is an electroplated coating formed by electroforming, and its paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) 520574 Printed by A7 B7 of the Intellectual Property Office of the Ministry of Economic Affairs Explanation of the invention () The tensile stress generated by the coating itself increases the internal stress of the arc-shaped piezoelectric actuator; and then, by precisely controlling the time of electroforming, the arching required by the piezoelectric actuator is obtained Height and its internal stress to increase the carrying capacity. In addition, in the adhesive procedure of step a, the substrate 20 with 5 piezoelectric wafers 30 adhered thereto can be baked in a high-temperature furnace to thermally cure the polymer glue 10 to make the piezoelectric The structural strength between the wafer 30 and the substrate 20 can be revealed, and then the covering procedure of step (b) is performed. Furthermore, it is worth mentioning that the above-mentioned steps are only one of the preferred embodiments of the present invention. The method of manufacturing the piezoelectric actuator of the present invention can further meet the requirements of 10 and the function, Make a suitable choice on the adhesive, substrate, piezoelectric wafer and the casting bath used for electroforming. For example, in addition to the polymer AV-119 adhesive, the adhesive can also be replaced by a gas resin; and the type of the composite substrate material is also Choice of general metal materials or other elastic materials (such as stainless steel, bronze, brass, etc.); as for the casting bath solution used in electroforming, there are many choices such as full chloride bath, watt bath, hard nickel bath and gloss bath. . In summary, the present invention can effectively solve the lack of both the actuating displacement and bearing capacity of conventional electric actuators, and also effectively solve the problem of easy loss of bonding between the piezoelectric wafer and the substrate, making the present invention The invention meets the needs of the future-oriented science and technology era, so that the invention already has 20 requirements for invention patents, and the application is made according to law. (Please read the precautions on the back / before filling this page)
、1T 4. 本纸張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） 520574 A 7 B7 五、發明説明（） 圖式之簡單說明： 第一圖係習用壓電式致動器製法之結構示意圖。 (請先閲讀背面之注意事項再填寫本頁) 劉 第二習用壓電式致動器製法之結構示意圖。 第三本發明一較佳實施例之製程示意圖。 5 第四f本發明一較佳實施例之運作型態示意圖。 第五圖係本發明一較佳實施例之壓電晶片電壓驅動示 意圖。 主要元件之符號說明： 銀鈀膠10 複合基板20 10 側面21 側面22 預定區域23 壓電晶片30 導線40 絕緣膠帶50 鎳鎢膜層60 壓電式致動器70 15 壓電晶片90 結板92 石墨塊91 壓電晶片80 不銹鋼平板81 20 鋁板82 向溫黏著劑8 3 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）、 1T 4. The size of this paper is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) 520574 A 7 B7 V. Description of the invention () Brief description of the drawing: The first drawing is a conventional piezoelectric actuator Schematic diagram of the manufacturing method. (Please read the precautions on the back before filling out this page) Liu The schematic diagram of the second conventional piezoelectric actuator manufacturing method. A schematic process diagram of a third preferred embodiment of the present invention. 5 The fourth f is a schematic diagram of the operation mode of a preferred embodiment of the present invention. The fifth diagram is a schematic diagram of voltage driving of a piezoelectric chip according to a preferred embodiment of the present invention. Explanation of symbols of main components: silver-palladium glue 10 composite substrate 20 10 side 21 side 22 predetermined area 23 piezoelectric chip 30 wire 40 insulating tape 50 nickel-tungsten film layer 60 piezoelectric actuator 70 15 piezoelectric chip 90 junction plate 92 Graphite block 91 Piezoelectric chip 80 Stainless steel flat plate 81 20 Aluminum plate 82 Warm adhesive 8 3 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with Chinese National Standard (CNS) A4 (210X297 mm)