TW513491B - Cleaning apparatus and method of residual acid on pincers - Google Patents

Abstract

This invention provides a cleaning apparatus and a cleaning method of residual acid on pincers, which are applicable to an etcher, a wafer carrier boat transportation apparatus adjacent to the etcher through a partition plate and a wafer transportation apparatus capable of moving between the etcher and the wafer carrier boat transportation apparatus, in which the wafer transportation apparatus has pincers and the wafer carrier boat transportation apparatus has a platform. The cleaning apparatus consists of: a first tray installed on the partition plate capable of rotating between a first position and a second position, in which the first tray is at the first position and contacts the partition plate when the pincers are at the area of the etcher; and a second tray installed on the platform, in which the first tray is at the second position and contacts the second tray when the pincers are at the area of the wafer carrier boat transportation apparatus. Therefore, residual acid solution on the pincers will not cause any damage to the mechanism of the wafer carrier boat transportation apparatus when the pincers enter the area of the wafer carrier boat transportation apparatus.

Description

(B) Twenty-five (5) Description of the invention (1) The present invention relates to a method for removing residues on the claws, and in particular to a method that can be used for transporting: "except the device and the platform to avoid the residual acid rot On the claw; The device and method for removing acid from work grave == The chemical reaction between the specific solution and the film is used to remove the part of the film that is not covered by the photoresist, and the remaining method is also called wet = = Pure, simple equipment, low cost, high productivity :, = Excellent etching selectivity. Wet etching can be roughly divided into three steps. 〇) The reaction material diffuses to the surface of the engraved material; (2) the reactant reacts with the etched film; (3) the product after diffusion from the etched surface to the solution As the solution is evacuated, the type of engraving is usually carried out. Usually, an oxidant, such as Shi Xi and nitric acid in the last moment of engraving, is used to oxidize the etched material to form an oxide (for example, Si02, A " 〇3), and then use another solvent, such as hydrofluoric acid (HF) in silicon etching, phosphoric acid (H3p〇4) in aluminum etching, to dissolve this oxide layer, and with the solution, then the new oxide layer It is formed again, so that the effect of etching can be achieved. As shown in FIG. 1, a general #lithography machine 10 and its peripheral equipment are provided with several chemical baths 11, 12 and 12 in the etching machine 10. Several cleaning baths (0: 16 & 1 ^ 1 ^ &1; 11) 13, 14; The chemical baths 11, 12 are filled with an acidic solution as described above for etching, and the cleaning bath 13 , 14 is equipped with deionized water (water) for cleaning.

0503.6276TW; TSMC2001.〇〇65; tungming.ptd Page 4 513491 V. Description of the invention (2) Set 20 adjacent, the moving frame 2 1 can be installed in the boat with a small number for the rear wafer boat to carry a loading robot 42 The process shown in the figure is determined by another unprocessed process and the chemical tank 11 and process of the present invention. When the wafer enters, the surface of the claw 41 is to be etched from the wafer. The surface of the claw 41 needs to be etched. The machine 10 is transported by a baffle 30 and a wafer boat. The wafer boat transfer device 20 has a moving frame 21 With a platform 22, a wafer boat (not shown) is transferred along the partition plate 30 to the platform 22, and the wafer is wafered. The wafer transfer device 40, which has sufficient openings formed in the partition plate 30, passes through. A wafer handling device 40 can be used to transfer wafers between the etching machine 10 and the set 20. The wafer handling device 40 has a robot arm 42, and a claw 41 which is perpendicular to the robot arm 42 is provided thereon. The wafer is picked up in the boat, and the wafer can be immersed in the chemical tank 丨, Qing, and chemical tank 12 in sequence according to the predetermined flow machine 10 according to the predetermined flow machine 10. It should be noted that in the general etching machine 丨 0, a transport device is provided to carry the wafer. For example, after the chemical tank 丨 2, the illustrated wafer transfer device is used to carry the wafer. The features are irrelevant, and descriptions thereof are omitted here. In addition, it is not necessary to set a cleaning tank 3 between 2 and 2, depending on the system described above. Since the claw 41 needs to follow the learning tanks 11 and 12 held by it, when the claw 41 leaves In the chemical tanks 11 and 12, the acidic solution in the chemical tanks 11, 12 remains, so the engraving machine 10 enters the boat transfer device 20 to pick another group to immerse the claw 41 in the cleaning tank 14. To remove the remaining acidic solution. It should be noted that the above-mentioned cleaning tank 14 may not necessarily be cleaned by overflowing deionized water.

513491 V. Description of the invention (3) However, the above-mentioned cleaning tank has the following disadvantages: 1 Because the transfer time of the claw 41 between the 14 rotations of the cleaning tank needs to be extended by about 60 seconds, wafer production 1 (WPH, wafer per hour) ) < 2 Due to the extra cleaning tank 丨 4 more space is required for cleaning. 3 The mechanism in the boat transfer device may still remain on the surface of the claws, and may suffer corrosion. In view of this, the object of the present invention is a device for removing residual acid on the claws, and the method is short and can ensure that the adjacent machine is free from residual acid rot. In the present invention, a claw is suitable for an etching machine, The partition plate and the etching device can be transported and mounted on the etching machine and the wafer boat. 'The wafer handling device has a claw platform.' The cleaning device includes: a first holder which can be arranged on the partition plate in a rotatable manner. ' When the area of the machine is engraved, the first tray is located at the first and the second tray provided on the platform. When the device is in the area, the first tray is located at the second. In the present invention, the cleaning device includes a moving mechanism for driving. The first tray is rotated; the cleaning is performed, and therefore the adjacent wafers are lowered by the jaws 41 per hour, so that the entire machine has an acid solution dripping from the jaws to solve the upper method, which is redundant. The position of the residual acid is moved between adjacent positions, and one position of the crystal boat and the plate, one of which is the position of the claws and the other is included: it is set in the liquid barrier, so the acid solution under the crystal provides a solution to the problem. The transport time shrinking and removing device has a wafer boat transfer wafer transfer device having a second position when the pawl is located on the abutment of the money and the partition plate; Turn on the board

513491

And a shaft communicating with the second tray for the first pan to be provided thereon with a drain pipe. Also in the present invention, a cleaning method for a cleaning device is provided, including: a rack for carrying a wafer boat platform carrying a wafer, at this time, after the first tray is positioned on the open platform, the first tray is rotated to Take the wafer tray from the engraving machine to the wafer boat and rotate it to the first position. (A) The boat transfer device with the residual acid on the claws has the function of moving the wafer boat to the first flat position when the moving rack is moved; (b) the second position is moved from the moving rack; and (c) the claw And after moving through the partition, the first

Hereinafter, an embodiment of a device and method for removing residual acid on a claw of the present invention will be described with reference to the drawings. Brief Description of the Drawings Figure 1 is a schematic diagram showing a conventional surname carving machine and its peripheral equipment; Figure 2 is a schematic diagram showing a device for removing residual acid on the claws of the present invention; Figure 3a is a diagram showing the present invention Schematic diagram of the narrative engraving machine and its peripheral equipment for the remaining acid on the claws of the invention, and the first and second positions; and Fig. 3b shows the device for removing the residual acid on the claws of the sun and the moon. Schematic diagram of the silver engraving machine and its peripheral equipment, where the first tray [one position. , 罘 [Symbol description]

V. Description of the invention (5) 1 0 etching machine, 1 3, 1 4 cleaning tank, 21 moving rack, 2 2 1 positioning block, 4 0 wafer handling device 4 2 robot arm, 51 first tray, 5 3 drive Mechanism, 55 axis of rotation. 11, 1 2 chemical tank, 20 boat transfer device, 22 platform, 30 partitions, 41 claws, 50 claws residual acid removal device 5 2 second tray, 54 drain pipe, refer to section 2, Figures 3a and 3b. The device 50 for removing residual acid on the claws of the present invention is suitable for the remaining machine 10, the wafer boat 20, and the wafer transfer device 40 as shown in FIG. The transfer device 20 is adjacent to the etching machine 10 via the partition plate 30 as described above, and the wafer transfer device 40 moves between the wafer platform 10 and the wafer transfer device 20 to transfer the wafer, and ==. It has 挟 pure, and the crystal boat transfer 搬 set 2. It has a movable moving shaft 55 1 -tray 51 to be rotatable: 5 squares 3 3 guan 54 and -turning claw 4! Area = up, when connected (hereinafter referred to as the first position, as shown by the "plate 30"), even if the-tray 51: the dashed line in the figure and the 31st) 1 is parallel to the partition 30; and when the claw 41 is located in the area of the β-boat transfer device 20, the first tray 51 and the second tray ㈣ page 8 0503-6276T1VF; TSMC2001.〇〇65; tungming.ptd 513491 6. Description of the invention (6) This is referred to as the second position, as shown by the solid line in Figure 2 and Figure 3a), even if the first tray 51 is perpendicular to the partition 30. The second tray 52 is provided on the platform 22 of the wafer boat conveying device 20, and a plurality of positioning blocks 221 (as shown in FIG. 2) are provided on the flat plate 22. The second tray 52 is provided with an opening corresponding to the positioning block 221. Therefore, the wafer boat 61 (as shown in FIG. 3a) carried by the moving frame 21 can pass through the second tray 52 and be placed on the positioning block 2 2 1 'the wafer boat 6 1 carries a plurality of wafers 6 2. The driving mechanism 5 3 is not placed on the partition plate 30 and is used to drive the first tray 5 1 to rotate. It is preferably a motor; the rotating shaft 55 is also provided on the partition plate 30 for the first The tray 51 is disposed on the tray 51 and can be used as a pivot for the first tray 51. The drain pipe 54 is in communication with the opening in the second tray 52 to remove the acidic solution dripped from the claw 41 onto the second tray 52.

On the platform 22; in the second position (for example, the boat 61 is still located in the second partition 30, the transport device 20 can be completely isolated on the structure, and

With reference to Figures 3a and 3b, the method for removing the residual device using the narrow claw described above is described. When the moving rack 22 carries the wafer boat 61 to it, 'the first tray 51 is located at the first position as shown in Figure 3b. After the rack 22 leaves the platform 21, the first tray 51 is rotated to the solid line shown in FIG. 2); when the claw 41 is from the etching machine 10 to the wafer 62 (as shown in FIG. 3a), At this time, the position of the first tray 52 ′ is finally the claw 41 after the wafer 62 is picked up and moved through the first tray 51 to rotate to the first position (as shown in FIG. 3b). It should be noted that when the wafer handling device 40 enters the wafer handling area, the first tray 51 is located at the second position, that is, the residual acid on the claw 41 drops on the wafer of the wafer handling device 20 When the conveying device 40 leaves the area of the wafer boat conveying device 20

Fifth Description of the Invention (7) Leave the MS in the first position 'At this time, the residual dripping from the claw 41 on the first tray 51 slides into the area of the remaining machine 10, and the unillustrated volume 3a II ^- The travel path of the claw 41 is as it is known, and it will not pass through the first wafer: ί said the boat 6 1 directly above, so no residual acid will drop out but will be passed by the second The apparatus and method of the present invention received by the tray 52 can obtain the following effects:-Short transfer time of the claws, which can increase about 10%, and save the π washing process of the claws, which can shorten the processing time. ; 1 90 * 2 9 0__ save the clever washing tank, which can save about 3 of the space occupied by the machine as a whole, which can ensure that the acidic solution of the mechanism in the wafer boat transport device causes corrosion. Further filling-dripping from the claws. Although the present invention has been disclosed to limit the present invention with a preferred embodiment, anyone who learns this is not going to ^ ..., it is not used to: and range 0, when you can make some changes and Retouching, because: the scope of the moon's fine compliance shall be determined by the scope of the patent attached to the attached towel. Warranty 0503-6276TW; TSMC2001-0065; tungming.ptd Page 10

Claims (1)

51349 · ^ ^ l A device for removing residual acid on a claw, which is suitable for an etching machine port and a wafer transfer device adjacent to the etching machine through a partition plate: to transport and install the touch etching machine and the wafer boat. Move between ❾—wafer handling 2 'wherein the wafer handling device has a claw, i the wafer handling device has a platform, and the above-mentioned removal device includes a first tray so that it can be placed in a first position And the second position is arranged on the partition plate, wherein when the claw is located in the area of the etching machine, the first pan is located in the first position and abuts the partition plate; A pallet is placed on the platform, and when the claw is located in the area of the boat transfer device, the first pallet is located at the second position and abuts against the first pallet. 2 · The device for removing residual acid on the claws according to item 1 of the scope of patent application, further comprising: a driving mechanism provided on the partition plate for driving the first tray to rotate; and a rotating shaft, provided The partition is used for the first tray to be set thereon. 3. The device for removing residual acid on the claws according to item 1 or 2 of the scope of patent application, further comprising: 4 a drain pipe, which is in communication with the second tray. 4. A method for removing residual acid on the claws as described in item 1 of the scope of patent application, comprising: (a) the wafer boat transfer device has a moving frame for carrying a load crystal 0503-6276TO7; TSMC2001-0065; tungming.ptd Page 11 513491 VI. A wafer boat with a round scope of patent application, when the mobile rack transfers the wafer boat to the platform, at this time, the first tray is located at the A first position; (b) rotating the first tray to the second position after the moving frame leaves the platform; and (c) taking a wafer from the etching machine to the wafer boat in the claw and After moving through the partition, the first tray is rotated to the first position. 0503-6276TWF; TSMC2001-0065; t ungm i ng.p t d p. 12