TW511875U - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus

Info

Publication number
TW511875U
TW511875U TW090209503U TW90209503U TW511875U TW 511875 U TW511875 U TW 511875U TW 090209503 U TW090209503 U TW 090209503U TW 90209503 U TW90209503 U TW 90209503U TW 511875 U TW511875 U TW 511875U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation apparatus
heat
dissipation
Prior art date
Application number
TW090209503U
Other languages
English (en)
Inventor
Sheng-Jie Lin
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW090209503U priority Critical patent/TW511875U/zh
Priority to US09/933,216 priority patent/US6515863B2/en
Publication of TW511875U publication Critical patent/TW511875U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW090209503U 2001-06-07 2001-06-07 Heat dissipation apparatus TW511875U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090209503U TW511875U (en) 2001-06-07 2001-06-07 Heat dissipation apparatus
US09/933,216 US6515863B2 (en) 2001-06-07 2001-08-20 Heat-dissipating device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090209503U TW511875U (en) 2001-06-07 2001-06-07 Heat dissipation apparatus

Publications (1)

Publication Number Publication Date
TW511875U true TW511875U (en) 2002-11-21

Family

ID=21684411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090209503U TW511875U (en) 2001-06-07 2001-06-07 Heat dissipation apparatus

Country Status (2)

Country Link
US (1) US6515863B2 (zh)
TW (1) TW511875U (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6862181B1 (en) * 2003-03-17 2005-03-01 Unisys Corporation Apparatus and method for shielding a circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031028A (en) * 1990-04-30 1991-07-09 Motorola, Inc. Heat sink assembly

Also Published As

Publication number Publication date
US20020186541A1 (en) 2002-12-12
US6515863B2 (en) 2003-02-04

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model