TW501722U - Capillary structure in the heat pipe - Google Patents

Capillary structure in the heat pipe

Info

Publication number
TW501722U
TW501722U TW89207165U TW89207165U TW501722U TW 501722 U TW501722 U TW 501722U TW 89207165 U TW89207165 U TW 89207165U TW 89207165 U TW89207165 U TW 89207165U TW 501722 U TW501722 U TW 501722U
Authority
TW
Taiwan
Prior art keywords
heat pipe
capillary structure
capillary
pipe
heat
Prior art date
Application number
TW89207165U
Other languages
Chinese (zh)
Inventor
Meng-Jeng Huang
Original Assignee
Chaun Choung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to TW89207165U priority Critical patent/TW501722U/en
Publication of TW501722U publication Critical patent/TW501722U/en

Links

TW89207165U 2000-05-01 2000-05-01 Capillary structure in the heat pipe TW501722U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89207165U TW501722U (en) 2000-05-01 2000-05-01 Capillary structure in the heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89207165U TW501722U (en) 2000-05-01 2000-05-01 Capillary structure in the heat pipe

Publications (1)

Publication Number Publication Date
TW501722U true TW501722U (en) 2002-09-01

Family

ID=21667239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89207165U TW501722U (en) 2000-05-01 2000-05-01 Capillary structure in the heat pipe

Country Status (1)

Country Link
TW (1) TW501722U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237337B2 (en) 2004-06-29 2007-07-03 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7237337B2 (en) 2004-06-29 2007-07-03 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same
US7578338B2 (en) 2004-06-29 2009-08-25 Industrial Technology Research Institute Heat dissipating apparatus having micro-structure layer and method of fabricating the same
US7730605B2 (en) 2004-06-29 2010-06-08 Industrial Technology Research Institute Method of fabricating heat dissipating apparatus

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees