TW492025B - Manufacturing process and positioning method for the internal members of keyboard - Google Patents

Manufacturing process and positioning method for the internal members of keyboard Download PDF

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Publication number
TW492025B
TW492025B TW88114776A TW88114776A TW492025B TW 492025 B TW492025 B TW 492025B TW 88114776 A TW88114776 A TW 88114776A TW 88114776 A TW88114776 A TW 88114776A TW 492025 B TW492025 B TW 492025B
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Taiwan
Prior art keywords
film
layer
keyboard
adhesive
circuit board
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TW88114776A
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Chinese (zh)
Inventor
Jin-Wen Jou
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Jin-Wen Jou
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Priority to TW88114776A priority Critical patent/TW492025B/en
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Publication of TW492025B publication Critical patent/TW492025B/en

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Abstract

A manufacturing process and a positioning method for the internal members of keyboard are disclosed in the present invention, in which a process of gluing together the upper thin film layer, the lower thin film layer and the insulation layer is conducted on a thin film type PCB (printed circuit board). A channel, which is capable of allowing air to circulate mutually and preventing water from permeating, is formed at the position, which has no printed adhesive, in the contact points between the upper and the lower thin film layers. After a switching tray surface is cut by a cutting knife, a through hole is then opened on each set of cutting lines. A pivot connection portion capable of pivot connecting bridging is formed through the use of a pushing and pressing manner to push and press the sheet body, which is formed by the cutting lines. After gluing together the thin film type PCB, the switching tray and the base layer glue, the bridging assembly, rubber body and key cap are then assembled so as to reduce the entire keyboard thickness, decrease the weight and greatly decrease cost. In addition, the invention is provided with waterproof function such that the application efficiency and lifetime of keyboard can be increased.

Description

492025492025

本發明係有關一種鍵盤内部槿彼 指一種將鍵盤内部各構件與各構件之=程及定位方法,尤 改變,進而讓整體的鍵盤的厚度墙姑 式做王新之 幅度降低,同•,還具有防水之減輕及成本大 效率及使用壽命。 用’更提高鍵盤的使用 目前許多業者在製造筆記型電腦日4 ^ 电姆日守,除了筆記剞雷腦 的執行速度快,配備功能強之外,就是以尊二 仇疋U筆記裀雷腦啓體 外觀形狀輕、薄、短、小吸引消費者購買。但θ , 筆記型電腦朝輕、薄、短、小之製造時,除了 J弋型電腦 内部之零組件不得過大或過重之外’就連配置於筆記型電 腦殼體上之鍵盤也不例外。 但是’以目前所見之筆記型電腦上所使用之鍵盤如第 1 0圖所示’此種的鍵盤内部基層6之表面沖壓成型有複 數個槐接架橋(Link) 4之柩接部6 1,並於基卜晶放 一薄膜式印刷電路板7,再以前述之樞接部6丄搞接^橋 (Link) 4後,再組接橡膠體8及鍵帽5即完成鍵盤之 而在第1 1圖中所揭示之鍵盤内部之基層6 —上固接 有一轉接盤9,此轉接盤9係由塑膠射出成形,並於其上 成型有樞接架橋(Link)4之樞接部9 1 ,再於基層6 /及 _ 轉接盤9間配置有一薄膜式印刷電路板7,再以前述之樞 接部9 1樞接架橋(l i n k) 4後’再組接橡膠體8及鍵帽5 即完成另一鍵盤之組構。 由於上述前者及後者之基層6在沖壓有樞接架橋(LinThe present invention relates to a keyboard interior, which refers to a method and positioning method of the internal components and components of the keyboard, especially to change the thickness of the entire keyboard, which reduces the thickness of the wall. It is also waterproof. Reduction and cost efficiency and long service life. Improve the use of the keyboard with 'more now many manufacturers are making notebook computers. In addition to the fast execution speed and powerful functions of the notepad, Thunderbolt is the only way to make notebook computers. The appearance of the body is light, thin, short and small, which attracts consumers to buy. But θ, when a notebook computer is manufactured to be light, thin, short, and small, except that the internal components of the J 弋 type computer must not be too large or too heavy ', even the keyboard arranged on the notebook computer case is no exception. However, 'the keyboard used on the notebook computer currently seen is shown in Fig. 10', the surface of the internal base layer 6 of this type of keyboard is stamped with a plurality of joints 6 1 of the bridge 4 (Link) 4, And put a thin-film printed circuit board 7 on the base crystal, and then connect the ^ bridge (Link) 4 with the above-mentioned pivot joint 6, and then combine the rubber body 8 and the keycap 5 to complete the keyboard. The base layer 6 inside the keyboard disclosed in the figure 1 is fixedly connected with an adapter plate 9 which is formed by injection molding of plastic, and a pivot portion of a pivot bridge (Link) 4 is formed on it. 9 1, and then a thin film printed circuit board 7 is arranged between the base layer 6 and the _ adapter plate 9, and then the above-mentioned pivot joint 9 1 is pivotally connected to the bridge 4, and then the rubber body 8 and the key are assembled. The cap 5 completes the construction of another keyboard. Since the former and the latter base layer 6 are stamped with a pivot bridge (Lin

五、發明說明(2) k) 4之樞接部6 1及轉接盤9射出成型有樞接架橋(Link) 4之樞接部9 1都有一既定之高度,所以在鍵盤組裝後, 鍵盤之厚度亦增加。而且前者在長時間下壓鍵帽5之動作 下,讓架橋(Link) 4之軸部41、42與基層6之樞接部 6 1磨擦後,所產生鐵屑易掉落於基層6下方之電路板上 ,而導致電路板不正常動作或者電路板發生短路。 另外,上述前者及後者所使用之薄膜式印刷電路板7 係由上、下層薄膜及一絕緣層疊放而成,且三者之間並未 有任何黏劑膠合,以便橡膠體8下壓擠麼空氣時,能讓上 於::膜層之接觸點接觸。但是,使用者若不慎滴入水滴 料,起先尚不會讓薄膜式印刷電路板7產生短 允j碭,一旦在橡膠體被下壓至復原狀態時,所產生直 以,鍵盤内部之水氣吸入於薄膜式印刷電路 板7 ^而¥致相式印刷電路板7發生短路問題。 支疋,本發明之主要目的’在於 :構件與各構件之定位方式之i 度降低1時,還且有ΐ減、重置減輕及成本大幅 ί上以膜二刷i薄膜式印刷電路板製程及定位方 印刷黏劑,且在印刷黏=板:上、:層薄膜絕緣層 上、下薄以待:上述印刷黏劑後,進行 觸點間未印刷黏劑之^ B膠5 ,此時,上、下薄膜層之接 处P形成有一氣體相互流通及防水渗V. Description of the invention (2) k) The pivot portion 61 of the 4 and the adapter plate 9 are injection-molded with the pivot bridge 9 (Link) 4. The pivot portion 9 1 has a predetermined height, so after the keyboard is assembled, the keyboard The thickness is also increased. Moreover, under the action of pressing the keycap 5 for a long time, the shaft portions 41 and 42 of the bridge 4 and the pivot portion 61 of the base layer 6 are rubbed, and the iron filings are easily dropped below the base layer 6. Circuit board, which causes the circuit board to malfunction or short circuit. In addition, the film printed circuit board 7 used by the former and the latter is formed by laminating upper and lower films and an insulation layer, and there is no adhesive bonding between the three, so that the rubber body 8 is squeezed down. When in air, the contact points on the top of the film can be brought into contact. However, if a user inadvertently drips water droplets, the film printed circuit board 7 will not be allowed to produce a short-term error at first. Once the rubber body is pressed down to a restored state, the water generated by the keyboard will be directly exposed to water. Air is sucked into the thin-film type printed circuit board 7 and the phase-induced printed circuit board 7 has a short circuit problem. Support, the main purpose of the present invention is: when the i degree of the component and the positioning method of each component is reduced by 1, there is also a reduction, a reduction in replacement, and a significant cost. And positioning side to print the adhesive, and print the adhesive = board: top,: thin film insulation layer on the top and bottom to wait: after the above-mentioned printing adhesive, the adhesive ^ B glue 5 is not printed between the contacts, at this time At the junction P of the upper and lower film layers, a gas is circulated and waterproofed.

二何貝或聚脂薄膜(M y 1 a r)所製成 薄膜(membrane)式之印刷電路板膠 ,刀切割後,再於每一組裁切線上 壓方式將裁切線所形成之片體推擠 部。 入之通道;再 之薄膜式轉接 合前,該轉接 設有一穿孔, 形成可樞接架 本發明之 作後,於薄膜 切線間所形成 且可樞接架橋 本發明之 路可直接印刷 用一硬塑 盤,在與 盤會經過 再以推擠 橋之樞接 另一目的 式之印刷 之片體經 之柩接部 再一目的 ’在於薄膜式之印刷電路板完成製 電路板上可裁切複數裁切線,由裁 過推擠壓後,即可形成兩不同内徑 於轉接盤上 ’在於薄膜式之印刷電路板上之Membrane-type printed circuit board adhesive made of erhope or polyester film (My 1 ar). After cutting with a knife, the sheet formed by the cutting line is pushed on each group of cutting lines. Squeeze department. Before the film-type transfer and joining, the adapter is provided with a perforation to form a pivotable frame. After the invention works, it is formed between the film tangents and can be pivoted to bridge the road of the invention. It can be directly printed. A hard plastic disc, the purpose of which is to connect the disc to the other side of the printed sheet through a bridge that pushes the bridge, and the purpose is to lay on a thin-film printed circuit board. Cut a plurality of cutting lines. After being pushed and squeezed by cutting, two different inner diameters can be formed on the adapter plate.

本發明之又一目的,在於架橋若為塑鋼材質製成時, 1轉接盤係可以具有撓性之塑膠材質製成,在組裝架橋 時,可稍微彎動轉接盤後,即可將架橋之軸部 盤之樞接部上。 n^ 、以下係有關本發明之詳細說明及技術内容,現配合圖 式說明如下: 【圖式說明】 第1圖,係本發明之基層與薄膜(membrane)式之印刷電路 板膠合示意圖。 第2圖’係本發明之薄膜(membrane)式之印刷電路板膠合 後所形成之通道示意圖。 第3圖’係本發明之轉接盤表面裁切後之上視示意圖。 第4圖’係本發明之轉接盤表面進行穿孔及上膠之示意Another object of the present invention is that if the bridge is made of plastic steel, the 1 adapter plate can be made of flexible plastic material. When the bridge is assembled, the bridge can be slightly bent after the adapter plate is bent. On the pivot joint of the shaft part disk. The following are detailed descriptions and technical contents of the present invention, and are described below with reference to the drawings: [Schematic description] FIG. 1 is a schematic diagram of the bonding of a base layer and a membrane printed circuit board of the present invention. Fig. 2 'is a schematic view of a channel formed after the membrane printed circuit board of the present invention is glued. Fig. 3 'is a schematic top view of the surface of the adapter plate of the present invention after being cut. Fig. 4 'is a schematic diagram of perforating and gluing the surface of the adapter plate of the present invention

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第5圖,係本發明之 第6圖,係本菸的 得接盤表面與橡膠體膠合示意圖。 第7圖,係本發明轉接盤樞接部成型示意圖。 圖。 之轉接盤與架橋、鍵帽組接側視示意 第7-1〜圖 々 第8圖,係本發明"為第7圖之按鍵下壓動作示意圖。 第9圖,係本發明2一!施例示意圖。 第1 〇圖,習知鍵私ί —貫施例示意圖。 ^ Λ Λ m , m 鍵i内部構件示意圖。 弟1 1圖,鴒知另一 An.. 請參閱「第丄、? Γ 示意圖。 说士 •士找 Z、3、4、5、6圖所示」,如圖 緑^内邱t明之鍵盤内部構件製程及定位方法,主要是將 而Ϊ效體的^I與各構件之定位方式做一全新之改變,逕 —正、、w jm"的厚度縮減、重量減輕及成本大幅度降 低,時’還具有防水之作用,更提高鍵盤的使用效及 使用壽命。 本發明之鍵盤在製作時,先以一金屬或硬塑膠材質為 基層1 ’於6亥基層1上佈設膠有一薄膜式之 印刷電路板2,在該此印刷電路板2膠合於前述之基層工 上時’先製作一薄膜(membrane)式之印刷電路板2 ; 上述所提之一薄膜(membrane)式之印刷電路板2,包 括有一上層薄膜2 1、下層薄膜2 2及一膠於上、下層薄 膜2 1、2 2間之絕緣層2 3 (該絕緣層2 3係可為聚脂 薄膜印刷製成,或因接點回路之設計不同而可直接為膠合Fig. 5 is the sixth diagram of the present invention, and is a schematic diagram showing the bonding of the surface of the receiving plate and the rubber body of the present cigarette. FIG. 7 is a schematic diagram of forming a pivot joint of an adapter disc according to the present invention. Illustration. Side view of the connection between the adapter plate and the bridge and keycap assembly Figures 7-1 to 々 Figure 8 is a schematic view of the button pressing action of the present invention " Figure 9 is 21 of the present invention! Example schematic. Figure 10, the conventional key private ί-schematic diagram of the embodiment. ^ Λ Λ m, m key i internal diagram. Brother 1 1 picture, I do n’t know another An .. Please refer to the "diagram of 丄,? Γ. Sailor Shi Shi looks for Z, 3, 4, 5, 6", as shown in the green keyboard The internal component manufacturing process and positioning method are mainly a completely new change of the effective body and the positioning method of each component. The diameter-positive, w jm " thickness reduction, weight reduction and cost reduction, 'It also has a waterproof effect, which further improves the use efficiency and service life of the keyboard. When the keyboard of the present invention is manufactured, a metal or hard plastic material is used as the base layer 1 ′. A film-type printed circuit board 2 is glued on the base layer 1 of the 6H, and the printed circuit board 2 is glued to the aforementioned base layer tool. At the time of the first step, a membrane-type printed circuit board 2 is firstly produced; one of the above-mentioned membrane-type printed circuit boards 2 includes an upper film 21, a lower film 22, and an adhesive on the upper and lower layers. Insulating layer 2 3 between the lower film 2 1 and 2 2 (The insulating layer 2 3 can be made of polyester film printing, or it can be directly glued because of the different design of the contact circuit.

^2025 、下 11 2 2 上開 膠體 之接 觸點 在上 下薄 點2 層2 、2 2 2 橡膠 之空 、2 橡膠 印刷 2 2上皆印 絕緣層2 3 1 1、2 2 2 3 1,藉 ’讓上層薄 下層薄膜2 即可將按鍵 1、2 2 與 2之導通線 間不印刷任 緣層2 3膠 2 1 1、2 通道2 4 ( 時,此位於 道2 4而被 如此一來, 而將滴入鍵 ’而導致電 五、發明說明(5) 物舖設形成),在前述之上 刷有傳導訊號之導通線路2 董士應於上、下層薄膜2 1、 1之接觸點2 1 2、2 2 2 此貫穿孔2 3 1在按鍵之橡 膜2 1之導通線路2 1 1上 2之導通線路2 2 1上之接 被下壓之訊號傳輸出去。且 絕緣層2 3膠合時,該上、 路211、221上之接觸 何黏劑,因此在上、下薄膜 合時,該上、下薄膜層21 2 1上之接觸點2 1 2、2 如第2圖所示),當按鍵之 接觸點2 1 2、2 2 2内部 擠壓至另一接觸點2 1 2 > 可防止水的滲入,或避免因 盤内部之水氣吸入於薄膜式 路板短路之問題。 在上述之上、下薄膜層 後之薄膜(membrane)式之印 孔 2 5 ’ 讓薄膜(membrane) 產生之熱及其它構件所產生 待,上述之基層1與薄 層薄膜2 1 、 、2 2卜而 之導通線路2 設有一貫穿孔 3 6被按下時 觸點2 1 2與 2 2 2接觸, 下薄膜層2 膜層2 1、2 1 2、2 2 2 1、2 2及絕 2之導通線路 間即形成有一 體3 6被按下 氣即會透過通 2 2 >内部, 體3 6之作動 電路板2内部 21、22及絕緣層23膠合 刷電路板2上開設有複數散熱 式之印刷電路板2傳輸訊號所 之熱源能快速散去。 膜(membrane)式之印刷電路板^ 2025, the lower 11 2 2 the upper contact point of the upper gel is thinner on the upper and lower points 2 layers 2, 2 2 2 rubber voids, 2 rubber printing 2 2 are printed with an insulating layer 2 3 1 1, 2 2 2 3 1, borrow 'Let the upper layer and the lower layer film 2 not print any edge layer 2 between the conductive lines of the keys 1, 2 2 and 2 2 3 glue 2 1 1, 2 channel 2 4 (In this case, this is located on the channel 2 4 and it is so And the dripping of the key 'leads to the electric fifth, invention description (5) laying of the object), the conductive line 2 with a conductive signal brushed on the above 2 Tung Shi should be on the upper and lower films 2 1 and 1 contact points 2 1 2 , 2 2 2 This through hole 2 3 1 is connected to the conductive film 2 1 of the keypad 2 1 1 and the conductive line 2 2 1 of 2 is connected to the signal being depressed. And when the insulating layer 2 3 is glued, what adhesive is in contact with the upper and lower paths 211, 221, so when the upper and lower films are combined, the contact points 2 1 2, 2 on the upper and lower film layers 21 2 1, such as (Shown in Figure 2), when the contact point 2 1 2, 2 2 2 of the key is squeezed to the other contact point 2 1 2 > can prevent the infiltration of water, or avoid inhalation of water vapor inside the disc into the film type Short circuit board. The membrane-type printed holes 2 5 ′ above the upper and lower film layers allow the heat generated by the film and other components to be generated. The above-mentioned base layer 1 and the thin film 2 1, 2, 2 The conduction line 2 is provided with a through-hole 3 6 when the contact 2 2 is in contact with 2 2 2 and the lower film layer 2 is the film layer 2 1 2 1 2 2 2 1 2 2 and the insulation 2 An integrated 3 6 is formed between the conductive lines, and when the gas is pressed, it will pass through 2 2 > inside, the inner 21, 22 of the operating circuit board 2 of the body 3 6 and the insulating layer 23 are provided with a plurality of heat dissipation on the glue brush circuit board 2 The printed circuit board 2 can dissipate heat quickly. Membrane printed circuit board

492025 五、發明說明(6) 2膠合後’再將一硬塑膠材質或聚脂薄膜(Mylar)所製成 之薄膜式轉接盤3與薄膜(memt)rane)式之印刷電路板2膠 合d ’该轉接盤3會經過裁刀切割後,於轉接盤3表面上 即會形成有複數個裁切線3 線3 1、3 1 >上設有一穿 周緣上印刷有黏膠部3 5 一 接盤3送至治具(圖中未示 6置放於黏膠部35>上, 穿孔3 5周緣上定位(如第 定位方式另可於鍵帽5與橡 接合定位橡膠體3 6頂部之 式))。 待,上述橡膠體3 6與 3上由裁切線3 1、3 1 > 形成樞接部3 3、3 4 (如 之擠壓成型技術係可藉加熱 同等效果之技術製成樞接部 、3 4之内徑不相同,較小 而較大之内徑則樞接架橋之 滑動之空間; 又待,上述之轉接盤3 之軸部4 1、4 2樞接於轉 上(如第7圖所示),同時 k) 4之中央,然後,再於架 1 3 1 , 在 於 每 _ 一 組 裁 切 孔 3 5 可 於 每 一 穿 孔 3 5 之 ( 圖 第 4 圖 所 示 ) 5 再 將 此 轉 ) 上 治 具 會 將 所 有 橡 膠 體 3 讓 橡 膠 體 3 6 能 膠 合 於 前 述 之 5 圖 所 示 ) , ( 橡 膠 體 3 6 之 膠 體 3 6 之 頂 部 相 接 處 預 設 可 接 合 區 ( 可 為 黏 合 或 扣 接 等 方 轉 接 盤 3 膠 合 後 再 將 轉 接 盤 所 形 成 之 片 體 3 2 經 過 推 擠 壓 第 6 圖 所 示 ) 前 述 片 體 3 2 處 理 超 音 波 \ 油 壓 成 型 或 具 3 3 λ 3 4 且 兩 樞 接 部 3 3 之 内 徑 者 係 才區 接 架 橋 4 轴 部 9 另 軸 部 5 並 且 還 提 供 此 轴 部 製 作 完 成 後 將 架 橋(L ink) 4 接 盤 3 之 兩 槐 接 部 3 3 \ 3 4 5 橡 膠 體 3 6 並 位 於 架 橋(L in 橋(Lin k) 4 及 橡 膠 體 3 6 上 組492025 V. Description of the invention (6) 2 After gluing, 'glue a hard plastic material or polyester film (Mylar) made of film-type adapter plate 3 and film (memt) printed circuit board 2 glued d 'After the adapter plate 3 is cut by a cutter, a plurality of cutting lines 3 are formed on the surface of the adapter plate 3, and the lines 3 1, 3 1 > are provided with an adhesive portion printed on the periphery 3 5 A receiving plate 3 is sent to the jig (not shown in the figure, 6 is placed on the adhesive portion 35 >, the perforation 3 is positioned on the 5 periphery (if the positioning method is also used, the rubber cap 3 and 6 can be positioned on the top of the keycap 5 and rubber) Formula)). Wait, the above-mentioned rubber bodies 3 6 and 3 are formed by the cutting lines 3 1, 3 1 > to form the pivot portion 3 3, 3 4 (for example, the extrusion molding technology can be made by the technology of heating the same effect, the pivot portion, The inner diameter of 3 4 is not the same, the smaller and larger inner diameter is pivotally connected to the sliding space of the bridge; wait, the shaft parts 4 1 and 4 2 of the above-mentioned adapter plate 3 are pivotally connected to the rotation (such as the first (As shown in Figure 7), and at the same time k) 4 in the center, and then on the frame 1 3 1, in which each set of cutting holes 3 5 can be in each of the perforations 3 5 (as shown in Figure 4) 5 and then Turn this) The upper jig will glue all the rubber bodies 3 so that the rubber bodies 3 6 can be glued to the figure 5 above), (the top joint of the rubber bodies 3 6 and the rubber bodies 3 6 is preset with a jointable area (can be For bonding or buckling, etc., the adapter plate 3 is glued, and then the plate body 3 2 formed by the adapter plate is pushed and squeezed (see Figure 6). The aforementioned plate body 3 2 is processed by ultrasound \ 3 λ 3 4 and the inner diameter of the two pivot joints 3 3 The bridge 4 is the shaft part 9 and the other shaft part 5 is also provided. After the production of the shaft part is completed, the bridge (L ink) 4 is connected to the two locust joints 3 of the tray 3 and the rubber body 3 6 is located in the bridge (L in Bridge (Lin k) 4 and rubber body 3 6 upper set

492025 五、發明說明(7) 接一鍵帽(Key cap) 5。在該鍵帽(Key cap) 5被按下時, 橡膠體3 6内部之凸部3 6 1會穿過穿孔3 5 ,而壓掣於 上薄膜層2 1上,讓上薄膜層2 1之接觸點2 1 2與下薄 膜層2 2之接觸點2 2 2接觸後,即輸出此按鍵被下壓之 訊號;當手指離開鍵帽(Key cap) 5時,該橡膠體3 6即 會將架橋(Link) 4彈起’讓架橋(Link) 4及鍵帽(Key cap )5恢復起始狀態(如第7 — 1、7 — 2圖所示)。492025 V. Description of the invention (7) One key cap (Key cap) 5. When the key cap 5 is pressed, the convex portion 3 6 1 inside the rubber body 3 6 passes through the perforation 3 5, and is pressed on the upper film layer 2 1, so that the upper film layer 2 1 When the contact point 2 1 2 is in contact with the contact point 2 2 2 of the lower film layer 22, a signal that the key is pressed down is output; when the finger leaves the key cap 5, the rubber body 3 6 will Link 4 pops up to return Link 4 and Key Cap 5 to their original state (as shown in Figures 7-1, 7-2).

又,上述之架橋(Link) 4若為塑鋼材質製成時,該轉 接盤3係可以具有撓性之塑膠材質製成,在組裝架橋(Lin k) 4時’可稍微彎動轉接盤3後,即可將架橋(Link) 4之 轴部4 1、4 2樞接於轉接盤3之樞接部3 3、3 4上。 如此一來’藉上述之製成及各構件之定位法,讓整體 ▲作儿成後’整體之厚度較傳統鍵盤之厚度大幅縮小 °午夕,隨之整體鍵盤之重量也輕,更是在製作成本大幅降 原有傳統鍵盤製作成本的1/10,而且在架橋(Link)4 杯f接盤3之柩接部3 3、3 4作動磨擦時,也不會產生 象^ ^屑或屑粉,導致鍵盤内部線路有不正常或短路之現 A^再加上薄膜(membrane)式之印刷電路板2具有防 、用’讓整體之鍵盤使用率及使用壽命增長。In addition, if the above-mentioned bridge 4 (Link) 4 is made of plastic steel, the adapter plate 3 can be made of flexible plastic material. When the bridge (Lin k) 4 is assembled, the adapter plate can be slightly bent. After 3, the shaft parts 4 1 and 4 2 of the bridge 4 can be pivotally connected to the pivot parts 3 3 and 3 4 of the adapter plate 3. In this way, 'through the above-mentioned manufacturing and positioning of the components, the overall thickness of the entire keyboard is significantly smaller than the thickness of a traditional keyboard.' At midnight, the weight of the overall keyboard is also lighter. The production cost is greatly reduced by 1/10 of the original traditional keyboard production cost, and when the friction parts 3 3, 3 4 of the bridge 4 cup f adapter 3 3 are operated, friction will not occur. Powder, resulting in abnormal or short circuit in the internal circuit of the keyboard. In addition, the printed circuit board 2 with a membrane (membrane) type has the function of preventing and using to increase the overall keyboard usage and service life.

進一步(如第> 式之h ρ丨兩 圖所示)’在上述之薄膜(membrane) 刷電路;/ ?路板2完成製作後,於薄膜(membrane)式之印 形之K二ο ΐ可裁切複數裁切線2 a,由裁切線2 a間所 部2 c、- 2經過推擠壓後,即可形成兩不同内徑之樞接 d 且在上薄膜層21之表面並位於接觸點2Further (as shown in the above formula: h ρ 丨 as shown in the two figures) 'Brush circuit in the above-mentioned film (membrane); /? After the circuit board 2 is completed, it is printed in the film-shaped (membrane) type K2 ΐ ΐ Multiple cutting lines 2 a can be cut. After pushing between the cutting lines 2 a and 2 c,-2, two different inner diameter pivots d can be formed and located on the surface of the upper film layer 21 and in contact with each other. Point 2

第10頁 492025 五、發明說明(8) 12上方膠合有橡膠體36,在於兩樞接部、“樞 接架橋(Link)4及鍵帽(Key cap) 5後,為綠λ r # nr两你说 〜ϋ傻,在鍵帽(Key cap) 丁膠體3 6内部之凸部3 61壓掣於上薄膜 】i;=212上,而接觸點212即與下薄膜 \ Ξίί 2 2 2接觸,即輪出此按鍵被下壓之㈣ :如:-來:可讓整體鍵盤之厚度再度 隨之減輕:多’更是讓製作成本再降低。 里 之印:在於薄―)式 膠體“同樣也膠盤^上,該橡 鍵被下壓之訊號。觸到接觸點3 a,即輸出此按 減,相對重量也隨之減 ^可讓整體鍵盤之厚度再度縮 惟以上所述者,僅,更是讓製作成本再降低。 非用來限定本發明實施之#發明之一較佳實施例而已,並 圍所做的均等變化與修飾乾^。即凡依本發明申請專利範 【圖式之標號說明】 秦為本發明專利範圍所涵蓋。 基層.....· · · ·Page 10 492025 V. Description of the invention (8) The rubber body 36 is glued on the top, which is green λ r # nr two after the two pivot joints, "Pivot 4 (Link) 4 and Key cap (5)" You say ~ silly, the convex part 3 61 inside the key cap (Ding colloid 3 6 is pressed on the upper film) i; = 212, and the contact point 212 is in contact with the lower film \ Ξίί 2 2 2 That is to say, this key is pressed down by turn: such as: -come: the thickness of the overall keyboard can be reduced again: more 'reduces the production cost even more. The mark of the inside: lies in the thin-) type colloid "also also Signal that the rubber key is pressed down on the rubber disc ^. When the contact point 3 a is touched, the output will be reduced, and the relative weight will be reduced accordingly. ^ The thickness of the overall keyboard can be reduced again. However, the above only reduces the production cost. It is not intended to limit one of the preferred embodiments of the #invention implemented in the present invention, and it is intended to make equivalent changes and modifications. That is to say, the scope of application for patents according to the present invention [Symbols of the drawings] Qin is covered by the scope of the present invention patent. Grass-roots level ...

薄膜式印刷電路板 上層薄膜· · · · 下層薄膜· · · · 絕緣層· · · · · 導通線路· · · · 2 12 2 2 接觸點 492025Thin film printed circuit board Upper film · · · · Lower film · · · · Insulating layer · · · · · Conducting line

第12頁Page 12

Claims (1)

構件製程及定位方法 其該製程及定位 方法 一種鍵盤内部 包括: a ) 一絕緣層 通線路上 b ) 緣層之膠 處即形成 2、 如申 法,其中 觸點開設 3、 如申 法,其中 電路板開 4、 一種 方法包括 印刷黏劑,且 之接觸點間不 、待,上述印 合,此時上、 有一氣體相互 請專利範圍第 ,該絕緣層對 有一讓上、下 請專利範圍第 ,該薄膜式印 設有複數散熱 鍵盤内部構件 膜式印刷電 在印刷黏劑 印刷任何黏 刷黏劑後, 下薄膜層之 流通及防水 1項鍵盤内 應於上、下 薄膜層之接 1項鍵盤内 刷電路板製 孔。 製程及定位 路板之上、 時,上、下 劑; 進行上、下 接觸點間未 滲入之通道 部構件製程 薄膜層之導 觸點接觸之 部構件製程 成後,並於 下層薄 薄膜層 薄膜層 印刷黏 〇 及定位 通線路 穿孔。 及定位 薄膜式 膜及 之導 及絕 劑之 方 的接 方 印刷 方法,其該製程及定位 a 自无 將薄膜式印刷電路板之 、甬、=印刷黏劑,且在印刷黏劑時 ^、 b )之接觸點間不印刷任何黏劑 緣層之膠合待此=印:ί劑後,進行上、下薄膜層及絕 處即形成有一氣體溥膜層之接觸點間未印刷黏劑之 ’礼體相互流通及防水滲入之通 C J Ν 4寺 , V 、+、域 薄膜式之印刷電路;路板完成製作後,於 裁切複數裁切線,由裁切線間所 工 上 卜層溥膜及 下薄膜層之導Component manufacturing process and positioning method The manufacturing method and positioning method of a keyboard include: a) an insulation layer on the line b) the edge of the glue is formed 2, such as the application method, where the contact is opened 3, such as application method, where Circuit board opening 4. One method includes printing adhesive, and the contact points are not waiting. The above printing is performed. At this time, there is a gas on the top of the patent range, and the insulation layer is on the top and bottom. The film type is printed with a plurality of heat dissipation keyboard internal components. The film type printed electricity is printed with an adhesive. After printing any adhesive brush, the lower film layer shall be circulated and waterproof. One keyboard shall be connected to the upper and lower film layers. Brush the circuit board to make holes. The process and positioning of the upper and lower parts of the road board, the upper and lower agents; the process of making the part of the contact contact of the conductive film layer of the channel part member that does not infiltrate between the upper and lower contact points is completed, and then the thin film layer of the lower layer Layer printing adhesive 0 and positioning through-hole perforation. And positioning printing method for positioning film-type film and its guide and eliminator, the process and positioning of a film-type printed circuit board have no 甬, 甬, = printing adhesive, and when printing adhesive ^, b) No glue is printed between the contact points between the contact points. After printing: after the agent is applied, the upper and lower film layers and the insulation are formed, and no gas is printed between the contact points. Ceremony and body flow and waterproof infiltration through CJ Ν 4 temple, V, +, domain film-type printed circuit; After the road board is completed, the cutting line is cut at a plurality of lines, and the layer of film and film is cut by the cutting line. Guide of the lower film layer 六、申請專利範圍 過推擠壓後,即可形成兩不同内徑且可樞接架 i:ί!請專利範圍第4項鍵盤内部構件製程及定位方 呈同等嗖果ΐ ί ΐ係可藉加熱處理、超音波、油壓成型或 门4效果之推擠壓成型技術製成樞接部。 方法:Ξ鍵盤内部構件製程及定位方法,其該製程及定位 面上二接ί之表面經過裁刀切割後,於轉接盤表 開設有個裁切線,並於上述之每-裁切線間 _ 上由::線述橡膠體與轉接盤膠合後,再將轉接盤 接架橋之成之片體經過推擠壓後’讓此片體形成枢 U申Π利;Γ6項所述之鍵盤内部構件製程及定 (Mylar)所製成广#盤可為硬塑膠材質或聚脂薄膜 :方ΐ申^利匕第6項所述之鍵盤内部構件製程及定 係枢接架橋軸部m部之内徑不相同,較小之内徑者 侵:衍釉邛,而較大之内徑則除了樞 φ 部外,亚且還提供此軸部滑動之空間。 n :方t申:ί利範圍第6項所述之鍵盤内部構件製程及定 按鍵被按下德直接印刷電路之線路,在該 鍵被下壓之訊號膠體即會接觸到接觸點,即輪出此按 492025 -— ^、、申凊專利範園 二鍵盤内部構件製程及定位方法,其該製程及定 勘劑,板:上;:層薄膜及一絕緣 上之,7點間不印刷任何黏1‘;上下缚膜層之導通線路 緣層之膠4 :此時2、P :,劑^ ’進行上、下薄膜層及絕 處即形成有7氣體相互流通及防水滲入;=印刷黏劑之 c ) 待,上述薄臈式印刷電路板脒人制和从 膜式印刷電路板之下薄膜層上塗佈或印刷薄 薄膜式印刷電路板膠合於基層。 刷有黏劑,即可將 工工、如申請專利範圍第丄〇項所述之 及定位方法,其中,該基層可為一金屬材J 冓件製程 i 2、如申請專利範圍第i 〇 戬 及定位方法,其中,該基層可為-硬塑件製程 位方法包括: ^其该製程及定 a )、將薄膜式印刷電路板之上、下; 層印刷黏劑,且在印刷黏劑時,上、 二=、及一絕緣 上之接觸點間不印刷任何黏劑; / 、$之導通線路 b )、待,上述印刷黏劑後,進行上、 + 緣層之膠合’此時上、下薄膜層之接觸點間未=U絕 處即形成有一氣體相互流通及防水滲入之通道· *副之 c )、待’上述薄膜式印刷電路板膠合製程後,於薄 第15頁 492025 六、申請專利範圍 膜式印刷電路板之下薄膜層上塗佈或印刷有黏劑,即可將 薄膜式印刷電路板膠合於基層; d )、將轉接盤之表面經過裁刀切割後,於轉接盤表 =上即會形成有複數個裁切線,於上述之每_裁切線間開 設有一穿孔; 上由、」、待,上述橡膠體與轉接盤膠合後,再將轉接盤 垃裁切線所形成之片體經過推擠壓後,讓此片體形成樞 要采橋之樞接部;6. After the patent application scope is pushed and squeezed, two different inner diameters can be formed and can be pivoted. I: ί! Please use the same process and positioning method for the internal components of the keyboard in item 4 of the patent scope. Ί It can be borrowed. The pivot joint is made by heat treatment, ultrasonic, hydraulic molding or push-extrusion molding of the door 4 effect. Method: ΞThe manufacturing process and positioning method of the internal components of the keyboard. After the two surfaces of the manufacturing process and the positioning surface are cut by a cutter, a cutting line is set on the adapter table, and between each of the cutting lines. Above :: After the rubber body of the thread is glued to the adapter plate, the plate of the bridge plate connected to the adapter plate is pushed and squeezed to make the plate form a pivot; the keyboard described in Γ6 The internal component manufacturing process and the Mylar can be made of hard plastic material or polyester film: the keyboard internal component manufacturing process described in Fang Yishen ^ Li Dian item 6 and the fixed pivot bridge m The inner diameter is not the same, the smaller inner diameter invades: Yan glaze, and the larger inner diameter, in addition to the pivot φ, also provides space for the shaft to slide. n: Fang Tshen: The process of the internal components of the keyboard and the fixed keys as described in Item 6 of the scope are directly pressed on the circuit of the printed circuit. When the key is pressed down, the signal gel will contact the contact point, that is, the wheel. According to 492025, the process and positioning method of Shenyang Patent Fanyuan's second keyboard internal components, the process and positioning agent, board: top;: layer film and an insulation, no printing between 7 o'clock Adhesive 1 '; Adhesive 4 of the upper and lower binding film layers of the conductive line edge layer 4: At this time 2, P :, agent ^' When the upper and lower film layers and the insulation are formed, 7 gases are circulated and waterproof infiltration; = printing adhesive C) After the thin film type printed circuit board is manufactured, the thin film type printed circuit board is coated or printed on the film layer under the film type printed circuit board and glued to the base layer. With the adhesive applied, the worker and the positioning method as described in item No. 丄 0 of the patent application scope can be used. The base layer can be a metal material J. Process i 2. If the patent application is no. I 〇 戬And positioning method, wherein the base layer may be a hard plastic part manufacturing method including: ^ the manufacturing process and setting a), the film type printed circuit board is placed above and below; a layer of printing adhesive, and when printing adhesive No adhesive is printed between the contact points on the top, the second =, and the one on the insulation; /, the conduction line b of the $), wait, after the above-mentioned adhesive is printed, perform the upper and + edge layer gluing. At this time, Before the contact point of the lower film layer is equal to U, there is a channel for mutual gas flow and waterproof penetration. * Vice c) After the above-mentioned thin-film printed circuit board bonding process, thin page 15492025. The scope of the patent application: The thin film layer under the film printed circuit board is coated or printed with an adhesive, and the thin film printed circuit board can be glued to the base layer; d) After the surface of the adapter plate is cut by a cutter, the Receiving table = there will be multiple tailors Line, there is a perforation between each of the cutting lines; above, "", wait, after the rubber body is glued to the adapter plate, and then push the sheet formed by the cutting line of the adapter plate waste, Let this piece form the pivot joint of the pivotal mining bridge; 於薄f )、、又待,上述之轉接盤製程後,於轉接盤底部或 劑,,、式之印刷電路板之上薄膜層表面上塗佈或印刷有黏 1 ^得以讓轉盤與薄膜式之印刷電路板能膠合在一起。 ^ 如申睛專利範圍第1 3項所述之鍵盤内部構件製程 ^τΓ 、冬 盤係法,其中,該架橋若為塑鋼材質製成時,該轉接 時’,、1以具有撓性之塑膠材質製成,在組裝架橋(Link) 礙之4稍从專動轉接盤後’即可將架橋之軸部樞接於轉接 風之樞接部上。After thin f), wait until after the above-mentioned transfer plate process, the bottom of the transfer plate or agent, coating or printing on the surface of the film layer on the printed circuit board of the type, or printed with adhesive Thin-film printed circuit boards can be glued together. ^ The keyboard internal component manufacturing process as described in item 13 of the patent application scope, ^ τΓ, winter disk system method, in which, if the bridge is made of plastic steel, the transition time, '1, 1 should be flexible. It is made of plastic material. After assembling the bridge (Link), you can pivot the shaft of the bridge to the pivot of the transfer wind after slightly moving the special adapter plate. 第16頁Page 16
TW88114776A 1999-08-30 1999-08-30 Manufacturing process and positioning method for the internal members of keyboard TW492025B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615871B (en) * 2016-08-05 2018-02-21 致伸科技股份有限公司 Keyboard device
CN110660604A (en) * 2018-06-28 2020-01-07 群光电子(苏州)有限公司 Anti-ghost key membrane switch device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615871B (en) * 2016-08-05 2018-02-21 致伸科技股份有限公司 Keyboard device
CN110660604A (en) * 2018-06-28 2020-01-07 群光电子(苏州)有限公司 Anti-ghost key membrane switch device

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