TW491873B - Polyimide resin composition and molded articles thereof - Google Patents

Polyimide resin composition and molded articles thereof Download PDF

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Publication number
TW491873B
TW491873B TW87121600A TW87121600A TW491873B TW 491873 B TW491873 B TW 491873B TW 87121600 A TW87121600 A TW 87121600A TW 87121600 A TW87121600 A TW 87121600A TW 491873 B TW491873 B TW 491873B
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Taiwan
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polyimide
resin composition
molded article
item
polyimide resin
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TW87121600A
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Chinese (zh)
Inventor
Takaysu Yama
Masaji Yoshimura
Ikunori Yoshida
Kayako Yanagihara
Hideaki Oikawa
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Mitsui Chemicals Inc
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Priority claimed from JP19235397A external-priority patent/JP3688097B2/en
Priority claimed from JP19235297A external-priority patent/JP3667040B2/en
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Publication of TW491873B publication Critical patent/TW491873B/en

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Abstract

A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (l)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230 DEG C or more, for example, a temperature of 230 to 300 DEG C, or 230 to 250 DEG C.

Description

491873 五、發明說明(1) ^ -- !明背景_ 1發明領| m!關於一種適合製造模製物品之樹脂組 可表現出咼的抗熱性、高溫下優異的尺寸安定性^物,其 ”:!曲模組隸’以及藉由模製該樹脂組成物:溫下 模製物品。 切所得之 J_jj習知說明 、聚醯亞胺樹脂通常在抗熱性、機械性質與化學 普通一般用途的工程塑膠優異得多, =性上比 工程塑膠。 夕且其被“是1超 聚,亞胺樹脂可分成熱塑性塑膠 可輕易被模製,因此特別是近年來斜;之U與曰:前者 使用超工程塑膠之重要處在於其可,、增。 模製且具有大比重屬。 戈 σ無法輕易 求比傳統階段更高之ίΐ性:二:此一觀點而言,已要 彳熱生尺寸精確性與產量等效妒 亦已對此專效能表現上之改良有所期望。 b, 考慮具有化學式1所代表之重覆單元之聚醯亞胺(丨). ^有化學式1所代表之重覆單元之聚醯亞胺(1 )舉例而+491873 V. Description of the invention (1) ^-! Bright background _ 1 invention collar | m! About a resin group suitable for the manufacture of molded articles can exhibit heat resistance and excellent dimensional stability at high temperatures. ": Koji module 'and by molding the resin composition: molded article at temperature. The J_jj learned from the cutting, polyimide resin is usually used in heat resistance, mechanical properties and chemistry for general general purpose. Engineering plastics are much better, = in terms of performance than engineering plastics. Even if they are "super polymerized, imine resins can be divided into thermoplastics and can be easily molded, so especially in recent years; U and said: the former use The important point of super engineering plastics is that they can be, and increase. Molded and has a high specific gravity. Ge σ can't easily achieve higher characteristics than the traditional stage. Second: From this viewpoint, the dimensional accuracy and yield equivalent of thermal production are already jealous, and the improvement of this performance has been expected. b. Consider polyimide (丨) having a repeating unit represented by Chemical Formula 1. ^ Polyimide (1) having a repeating unit represented by Chemical Formula 1 and +

揭露於關專利第4, 847, 3 1 1號(日本專利巾請早期公開I 告唬23 6858/ 1 98 7 ),以及美國專利第4,847,349號(日本 利申請早期公開公告號6 88 1 7/ 1 9 87 )。 該聚醯亞胺(1 )為結晶態,因此該聚醯亞胺之玻 點(約245 t)與溶點(約3 88 t)均高,且其抗熱性在妖轉塑化卜生 塑膠間屬頂級。雖然為結晶態,但此聚醯亞胺⑴具有低Disclosed in Japanese Patent No. 4,847, 3 1 1 (Japanese Patent Gazette Please Early Publication I Report 23 6858/1 98 7), and US Patent No. 4,847,349 (Japanese Patent Application Early Public Publication No. 6 88 1 7 / 1 9 87). The polyimide (1) is crystalline, so the glass point (approximately 245 t) and the melting point (approximately 3 88 t) of the polyimide are high, and the heat resistance of the polyimide The rooms are top. Although crystalline, this polyimide has a low

第7頁 491873Page 7 491873

要一段長時間進行聚驗亞胺之结 例如約30至60秒之射出成型程^ 的結晶速度,換言之,需 晶。藉由一般模製程序, 所得之模製物品為非晶相 因此,只要此種模製物品在低於玻璃轉化點之溫度 用,則其尺寸精確性與彎曲模組係數之特性仍屬優異。 另一方面,當此種模製·物品在一高於該玻璃轉^點之⑺ 度下使用時’其彎曲模組係數明顯惡&,致使模製物品: 形狀無法維持,因此,難以繼續使用。 若企圖繼續於高於該玻璃轉化點之溫度下使用該等包括 水亞細(1 )之模製物品,該非晶相模製物品應進行熱處 理以使其結晶。然而,此結晶有時會造成如模製物品發生 明顯尺寸變化等問題。 考慮具有化學式2所代表之重覆單元之聚醯亞胺(2): 具有化學式2所代表之重覆單元之聚醯亞胺(2 )舉例而言 揭露於Macromolecules, Vol· 29,ρ· 135 至 142 " (1996) 〇 · 此聚醯亞胺(2 )為結晶態,且其破墦轉化點(約丨9 〇它)與 溶點(約3 9 5 C)間有很大的差值。此外,其具有很高的結 晶速度,換言之,所需要進行聚醯亞胺結晶之時間非常 短。關於此,在聚醯亞胺(丨)之例中,玻璃轉化點與熔點 間之差值約1 4 3 °C。 該聚驢亞胺(2 )為結晶態,且另外其如前述般具有很高 的結晶速度。因此,在藉由〆般模製程序,例如約3 〇至6 〇 秒之射出成型程序所得之模製物品中,在模製步驟中基本 491873 五、發明說明(3) 甚至當進行熱處理時’該等模製物品之尺 上已完成結晶 寸變化甚微。 一般而言,具有高結晶速度之樹脂擁有高的分 性,使得炫點與玻璃轉化點間之差值大十:m Ϊ因此^化點約19Gt,其比聚酸亞胺⑴者低約155 έ發生一問題,即在一 1 5 0至2 〇 〇 °c之中⑼下, ί 12,f胺(2)之模製物品之彎曲模組係數比包含基本 ^ ^阳相且具有高玻璃轉化點之聚醯亞胺(1)之模製物 發明概述 -傳;技術之問胃’本發明之一目的在於提供 ° σ孟,/、可利用到聚醯亞胺(1)與聚醯亞胺(2 )之 叙點,而減少聚醯亞胺(1)與聚醯亞胺(2)之缺點。 ^明之另一目的在於提供一聚醯亞胺樹脂組成物 ,、付致結晶態模製物品,即使藉由一平常的模製程 例如約3 0至6 0秒之射出成型程序。 =發明之又一目的在於提供一聚醯亞胺樹脂組成物, 自八得致具有優異尺寸精確性之模製物品,即使藉由一 ㊉的核製程序’例如約30至6G秒之射出成型程彳,舉而 言,在欲於23(TC或以上之高溫下,如23〇至3〇〇t或23〇 至2 5 0 t之溫度下,使用該等模製物品之例中。 本發明之更-目的在於提供一聚酿亞胺樹脂組成物,可 1其得致具有優異幫曲模組係數之模製物品,即使藉由一 平常的模製程序,例如約30至6〇秒之射出成型程序,舉例It takes a long period of time to perform the polyimide test, for example, the crystallization speed of the injection molding process of about 30 to 60 seconds, in other words, crystals are required. Through the general molding procedure, the obtained molded article is an amorphous phase. Therefore, as long as the molded article is used at a temperature lower than the glass transition point, its characteristics of dimensional accuracy and bending module coefficient are still excellent. On the other hand, when such a molded article is used at an angle higher than the glass transition point, its bending module coefficient is significantly worse, resulting in a molded article: the shape cannot be maintained, so it is difficult to continue use. If it is attempted to continue to use these molded articles including water submicron (1) at a temperature higher than the glass transition point, the amorphous phase molded article should be heat treated to crystallize it. However, this crystallization sometimes causes problems such as a significant dimensional change in a molded article. Consider polyimide (2) with a repeating unit represented by Chemical Formula 2: Polyimide (2) with a repeating unit represented by Chemical Formula 2 is disclosed, for example, in Macromolecules, Vol. 29, ρ. 135 To 142 " (1996) 〇 · This polyimide (2) is crystalline, and there is a large difference between its breaking point (about 丨 9 〇) and its melting point (about 395 C) value. In addition, it has a high crystallization rate, in other words, the time required for crystallization of polyfluorene is very short. In this regard, in the case of polyimide (丨), the difference between the glass transition point and the melting point is about 1 4 3 ° C. The polydonkey imine (2) is in a crystalline state, and in addition, it has a high crystallization rate as described above. Therefore, in a molded article obtained by a general molding process, such as an injection molding process of about 30 to 60 seconds, basically 491873 in the molding step. V. Description of the invention (3) Even when heat treatment is performed ' The size of the finished crystals on these molded articles varies little. Generally speaking, resins with high crystallization speed have high properties, so that the difference between the dazzle point and the glass transition point is ten: m Ϊ so the transformation point is about 19Gt, which is about 155 lower than that of polyimide ⑴ A problem occurred, that is, the bending modulus coefficient of a molded article of 12, f amine (2) in the range of 150 to 2000 ° C includes a basic phase and a high glass. Summary of the invention of the molded product of polyimide (1) at the transformation point-Biography; the question of technology "One of the objects of the present invention is to provide ° σ Meng, /, can be used polyimide (1) and polyfluorene The point of imine (2), while reducing the shortcomings of polyimide (1) and polyimide (2). Another object of Ming is to provide a polyimide resin composition, and to produce a crystalline molded article, even through an ordinary molding process such as an injection molding process of about 30 to 60 seconds. = Another object of the invention is to provide a polyimide resin composition, which has a molded article with excellent dimensional accuracy from Batu, even through a single shot of a nuclear process, such as about 30 to 6 G seconds injection molding Cheng Yi, for example, in the case of using such molded articles at a high temperature of 23 ° C or above, such as 230 to 300t or 230 to 250 t. This The invention is further-the object is to provide a polyimide resin composition, which can obtain a molded article having an excellent helper module coefficient, even through a usual molding process, such as about 30 to 60 seconds Injection molding process, for example

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1 491873 五、發明說明(4) --- 而a ’。在欲於230 C或以上之高溫下,如23〇至3〇〇。〇或23〇 至2 5 0 c之溫度下,使用該等模製物品之例中。 =案發明人已進行密集之研究,試圖解決前述問題,結 果=現,#由以特定比例混合兩種在燦化期間彼此可互溶 ^特定種類聚㈣胺所得,組成物可表現出優異的效能。 因此’本發明已根據此知識而完成。 換言之,本發明之特徵在以下幾方面。 1 ·本發明係關於一種聚醯亞胺樹脂紐成物,其勺括5至 m重量之具有化學式m代表之重覆單元之聚酿:胺[聚 亞胺⑴]’以及40至95%重量之具有化學式2所 覆單元之聚醯亞胺[聚醯亞胺(2 )]: 化學式11 491873 V. Description of the invention (4) --- and a ′. At a temperature of 230 C or higher, such as 230-300. Examples of using these molded articles at temperatures of 0 ° or 23 ° to 250 ° C. = The inventor of the case has conducted intensive research to try to solve the aforementioned problems, and the result = now, #is obtained by mixing two kinds of each other that are miscible with each other during the brightening period. . Therefore, the present invention has been completed based on this knowledge. In other words, the present invention is characterized by the following aspects. 1. The present invention relates to a polyimide resin neoprene, the spoon of which contains 5 to m by weight of a polymerization unit with repeating units represented by the chemical formula m: amine [polyimide] and 40 to 95% by weight Polyimide with units covered by Chemical Formula 2 [Polyimide (2)]: Chemical Formula 1

化學式2Chemical formula 2

第10頁 491873 五、發明說明(5) 2. 在上述之本發明之聚醯亞胺樹脂組成物中,結晶時間 的半周期較佳為0 · 5分鐘或更少。 3. 在上述之本發明之聚醯亞胺樹脂組成物中,包含相對 於1 0 0份重量之上述第1或2段所述之該聚醯亞胺樹脂組成 物而言1至1 0 0份重量之填料。 4 ·在上述之本發明之聚亞fe樹脂組成物中,包含相對 於1 0 0份重量之上述第1或2段所述之該聚醯亞胺樹脂組成 物而言5至7 0份重量之填料。 5 ·在上述第3或4段中,該填料較佳為選自包括碳纖維、 碳黑、雲母、滑石與玻璃纖維中至少之一者。 6 ·在上述第3或4段中,該填料較佳為碳纖維及/或碳 黑。 7 ·本發明亦關於模製物品,其包括上述第1至6段中你〜 段所述之該聚亞胺樹脂組成物。 8 ·上述模製物品之特徵在於當於2 〇至4 2 〇 °c之量測溫声 範圍内以10 °C/min之溫度上升速率下進行差分掃描計熱^ (differential scanning calorimetry (DSC))時,在 至3 0 0 °C下未觀察到任何結晶放熱峰。 9 ·上述模製物品之實例包括丨c盤、電與電子零件、八 没備零件、汽車零件、以及工業機械零件。 a 簡早圖式說明Page 10 491873 V. Description of the invention (5) 2. In the polyimide resin composition of the present invention described above, the half period of the crystallization time is preferably 0.5 minutes or less. 3. The polyimide resin composition of the present invention described above contains 1 to 100 based on 100 parts by weight of the polyimide resin composition described in paragraph 1 or 2 above. Parts by weight of filler. 4. The polyfe resin composition of the present invention described above contains 5 to 70 parts by weight based on 100 parts by weight of the polyimide resin composition described in the above paragraph 1 or 2. The filler. 5. In the above paragraph 3 or 4, the filler is preferably selected from the group consisting of carbon fiber, carbon black, mica, talc and glass fiber. 6. In the above paragraph 3 or 4, the filler is preferably carbon fiber and / or carbon black. 7. The present invention also relates to a molded article including the polyimide resin composition described in paragraphs 1 to 6 of the above paragraphs. 8 · The above-mentioned molded article is characterized in that differential scanning calorimetry (DSC) is performed at a temperature rising rate of 10 ° C / min within a measurement temperature range of 20 to 4 2 0 ° C ^ (differential scanning calorimetry (DSC) ), No exothermic peak of crystallization was observed up to 300 ° C. 9 · Examples of the above-mentioned molded articles include c disks, electrical and electronic parts, electronic parts, automotive parts, and industrial machinery parts. a Simple and early illustration

圖1顯不貫例與比較例中所得之Auruni組成物比例間之 係、於1 5 0 C下之彎曲模組係數、於丨5 〇。〇熱處理前後之j 寸變化、以及結晶時間之半周期。 KFig. 1 shows the relationship between the inconsistency example and the ratio of the Auruni composition obtained in the comparative example, the bending module coefficient at 150 ° C, and 50 °. 〇 j-inch change before and after heat treatment, and half cycle of crystallization time. K

第11頁 491873 五、發明說明(6) 較佳實施例之詳細說明 聚醯亞胺(1) 對於製備具有化學式1所代表之重覆單元之聚醯亞胺(i) 之方法並無特別限制。例如,該聚醯亞胺(1)可藉由使 4, 4’ -雙(3 -胺基苯氧基)二苯與苯均四酸二酸酐在有或無 有機溶劑存在下反應’然·後使所得之聚醯胺酸經化學或熱 醯亞胺化而製得。 此聚酸亞胺(1 )之黏度以對數黏度表示,較佳在〇 · 1至 3·〇 dl/g之範圍内,更佳為0·3至2〇di/g,最佳為0.5至 1·5 dl/g 。 若該對數黏度小於0 · 1 d 1 / g,有時機械性質會不夠,若 超過3· 0 dl/g,流動能力不佳且有時無法使用射出成型。 另外’此處所指之對數黏度意指於〇 5 g之該聚醯亞胺粉 末加入並溶解於1 〇 〇 m 1對氯盼/盼(重量比=9 / 1 )之混合溶 劑中後,於3 5 °C下所測得之值。 在一較佳實施例中,此聚醯亞胺(丨)具有約2 4 5。〇之玻璃 轉化點以及約38 8 °C之熔點。 此聚醯亞胺(1)在市面上可購得,商品名為Aurum (由 itsui化學品公司所製造)。 聚醯亞胺(2 ) =於製備具有化學式2所代表之重覆單元之聚醯亞胺(2) 法亚無特別限制。例如,該聚醯亞胺(1)可藉由使 在有右胺基—苯氧基)苯與3,3’,4,4’ —二苯四羧酸二酸酐 5 機溶劑存在下反應,然後使所得之聚醯胺酸經Page 11 491873 V. Description of the invention (6) Detailed description of the preferred embodiment Polyimide (1) The method for preparing polyimide (i) having a repeating unit represented by Chemical Formula 1 is not particularly limited . For example, the polyfluoreneimine (1) can be obtained by reacting 4,4'-bis (3-aminophenoxy) diphenyl with pyromellitic anhydride in the presence or absence of an organic solvent. The obtained polyamidic acid is chemically or thermally imidized to obtain it. The viscosity of this polyimide (1) is expressed in logarithmic viscosity, preferably in the range of 0.1 to 3.0 dl / g, more preferably 0.3 to 20 di / g, and most preferably 0.5 to 1 · 5 dl / g. If the logarithmic viscosity is less than 0 · 1 d 1 / g, the mechanical properties are sometimes insufficient. If it exceeds 3 · 0 dl / g, the flowability is poor and sometimes injection molding cannot be used. In addition, the logarithmic viscosity referred to here means that the polyfluorene imide powder at 0.05 g is added and dissolved in a mixed solvent of 100 m 1 parachloropan / pan (weight ratio = 9/1), and then 3 Measured at 5 ° C. In a preferred embodiment, the polyfluorene (I) has about 2 4 5. 〇The glass transition point and a melting point of about 38.8 ° C. This polyimide (1) is commercially available under the trade name Aurum (manufactured by itsui Chemical Company). Polyimide (2) = There is no particular limitation on the method for preparing polyimide (2) having a repeating unit represented by Chemical Formula 2. For example, the polyfluoreneimine (1) can be reacted in the presence of a 3,3 ', 4,4'-diphenyltetracarboxylic dianhydride 5 organic solvent by the presence of a right amine-phenoxy) benzene, The resulting polyamic acid was then subjected to

第12頁Page 12

化學或熱酸亞胺化而製得。 此聚醯亞胺(2 )之黏度以對數黏度表示,較佳在〇丄至 =·〇 =4之範圍内,更佳為〇.3至2.〇 dl/g,最佳為〇5至 1. b d 1 / g 〇 若該對數黏度小於u dl/g,有時機械性質合不 = 3.0 dl/g,流動能力不佳且有時無法使用ς 此處所指之對數黏度定義如上。 π ® ^ 結ί 一較佳實施例中’此聚醯亞胺⑺具有約190 〇C之玻璃 轉化點以及約3 9 5 °C之溶點。Prepared by chemical or thermal acid imidization. The viscosity of this polyimide (2) is expressed as a logarithmic viscosity, preferably in the range of 0 ° to = · 〇 = 4, more preferably 0.3 to 2.0 dl / g, and most preferably 0 to 5 1. bd 1 / g 〇 If the logarithmic viscosity is less than u dl / g, sometimes the mechanical properties are not equal to 3.0 dl / g, the flow ability is poor and sometimes it cannot be used. The logarithmic viscosity referred to here is defined as above. π ® ^ In a preferred embodiment, the polyimide has a glass transition point of about 190 ° C and a melting point of about 395 ° C.

该聚醯亞胺之組成物比例為: 本發明之重要特殊要求在於聚醯亞胺⑴與㈣亞胺⑺ 間之混合比率(以重量為基準)。 丄該聚醯亞胺(1)/聚醯亞胺(2)之混合比率以重量為基準 較佳在6 0 /40至5/95之範圍内,更佳為5〇/5〇至1〇/9〇,最 乜為40 / 6 0至20/ 80。若聚醯亞胺(2)之比率少於4〇%,則由 此組成物所得之模製物品有時無法在23〇它或以上之下使 用,而其若超過95%,則在丨50至2〇〇範圍内之彎曲模纽 係數有時無法獲得改善。The composition ratio of the polyfluorene imine is: An important special requirement of the present invention is the mixing ratio (based on weight) between the polyfluorene and the fluorene.混合 The mixing ratio of the polyimide (1) / polyimide (2) is preferably in the range of 60/40 to 5/95, and more preferably 50/50 to 10, based on the weight. / 9〇, the maximum value is 40/60 to 20/80. If the ratio of polyimide (2) is less than 40%, the molded article obtained from the composition sometimes cannot be used at 23 or below, and if it exceeds 95%, it is at 50%. The bending mode coefficient in the range from 2000 to 2000 sometimes cannot be improved.

關於本發明聚酸亞胺樹脂組成物之特點: 關於本务明聚酏亞胺樹脂組成物之特點將說明如下。 丄例如,在由此組成物所得之模製物品欲於1 5 〇至2 5 〇。〇之 =μ下使用之N形下,從維持模製物品形狀之觀點而言須 夕加留意彎曲模組係數。換言之,在f溫至高溫之溫度下 使彎曲模組係數維持在某種程度之平均水準,i藉以平衡Regarding the characteristics of the polyimide resin composition of the present invention: The characteristics of the polyimide resin composition of the present invention will be described below. For example, the molded article obtained from this composition is desired to be 150 to 250. In the case of N = used for μ, it is necessary to pay attention to the bending module coefficient from the viewpoint of maintaining the shape of the molded article. In other words, the bending module coefficient is maintained at a certain average level at a temperature of f to high temperature, and i is balanced

第13頁 491873 五、發明說明(8) 彎曲模組係數與尺寸精確性是很重要的。 關於聚醯亞胺(1 ),所需之結晶時間很長,即結晶速度 很慢’且在一般射出成型之情形下,基本上得到單獨的非 晶相模製物品。 此等聚醯亞胺(1 )之非晶相模製物品之可用溫度,即一 般的抗熱溫度,視其玻璃·轉化點而定,且其被限制在約 2 3 0 °C。 即使具有此抗熱溫度之模製物品已被視為相當優異,但 市面上的要求益增。因此,現在需要模製物品可於230 °C 或更南之咼溫下使用,例如於Mo至3〇〇。〇或230至250 °C :。若結晶係藉由熱處理完成,則可用之溫度視熔點而 疋,但皺縮會隨結晶而增加,致使尺寸精確性鉦法再獲得 滿足二從前述中可了解,一個優點伴隨著一個二點。 w方面,關於聚酿亞胺(2)’所需之結晶時間很短, J =從一開始的階段即得到結晶相模製物品。即使當這些 ^衣物品受到熱處理時,尺寸變化亦一 7 」ΐ Ϊ刀子鏈之移動性而定,且在某些種類的聚合物中, 之‘向玻Ϊ Ϊ化點與熔點間之溫差愈Λ,則結晶速度愈高 之熔點!· 了7貫上,與聚醯亞胺〇)比較之下,聚醯亞胺(2) 胺(^同 c,但玻璃轉化點低了甚至55它。在聚醯亞 附近的般的模製即足以進行結晶,但在玻璃轉化點 亞胺(1)皿差 如15°至2°° C,,曲模組係數反而比聚隨 組成物比率之嚴格定義:Page 13 491873 V. Description of the invention (8) The bending module coefficient and dimensional accuracy are very important. Regarding polyimide (1), the required crystallization time is very long, that is, the crystallization speed is very slow ', and in the case of general injection molding, a separate amorphous phase molded article is basically obtained. The usable temperature of the amorphous phase molded articles of polyimide (1), that is, the general heat-resistant temperature, depends on the glass transition point, and it is limited to about 230 ° C. Even though molded articles with this heat-resistant temperature have been considered to be quite excellent, the requirements on the market are increasing. Therefore, it is now required that molded articles can be used at temperatures of 230 ° C or lower, such as Mo to 300. 〇 or 230 to 250 ° C :. If the crystallization is completed by heat treatment, the available temperature depends on the melting point, but the shrinkage will increase with the crystallization, so that the dimensional accuracy can be obtained again. Satisfaction It can be understood from the foregoing that one advantage is accompanied by one two points. In terms of w, the crystallization time required for the polyimide (2) 'is short, and J = a crystalline phase molded article is obtained from the initial stage. Even when these clothing items are heat-treated, the size change is still determined by the movement of the knife chain. In some types of polymers, the temperature difference between the melting point and the melting point of the glass Λ, the higher the melting point of the crystallization rate! It is 7 times above. Compared with polyimide 0), polyimide (2) amine (^ same as c, but the glass transition point is lower or even 55). Molding near Polyurethane is sufficient for crystallization, but at the glass transition point, the imine (1) has a difference of 15 ° to 2 °° C. The coefficient of the curvature module is stricter than that of the polymer with the composition ratio. definition:

491873491873

成物之組成物比率具有嚴 的組成物比率下,本發明 成物之決定性功效之表現 案發明人之考量將說明如 關於本發明該聚醯亞胺樹 格定義。換士夕,口亡—, 且 ^ 佚&之,只有在此特別 之功能效果才可顯現出來。 關於本發明該聚醯亞胺樹脂組 機構並非一直有明顯定義,但本 問題可簡單藉由混合該結晶相聚 胺而獲解決。然而,此一假設為 可你又没本發明欲解決之 酸亞胺與該非晶相聚醯亞 錯誤的。 _ ^ 5 a,a $ =脂之細微晶體漂浮在非晶相樹脂之基質中之 月y 毛明之效果終究無法得到,且通常有害於結晶 相樹脂之結晶。 在本發明之實施例中,該組成物透過一加熱/熔化步驟 作為前提進行模製。然而,從差分掃描計熱法 differential Scanning cai〇rimetry (以下縮寫為 DSC )所測得之結果強烈暗示,關於本發明實施例之情況 與結晶相樹脂之細微晶體單純漂浮在非晶相樹脂之基質中 之情形不同。 換5之’當聚酿亞胺C1)之模製物品從常溫開始加熱 日π ’結aa之放熱峰出現在3 〇 〇。〇附近。當溫度進一步升高 時’溶化的吸熱峰出現,但此時之熱量約與結晶放熱相 同。換言之’可了解在初始階段,該等模製物品一點也沒 有結晶。 另一方面,在聚醯亞胺(2 )之模製物品中,未觀查到結Under the strict composition ratio of the products, the decisive performance of the products of the present invention will be considered by the inventors, and the definition of the polyimide tree according to the present invention will be explained. In the case of changing the priest, the mouth is dead—and ^ 佚 & only the special function effect can be shown here. There is not always a clear definition of the polyfluorene imine resin mechanism of the present invention, but this problem can be solved simply by mixing the crystalline phase polyamine. However, this assumption is wrong, but the acid imine and the amorphous phase which are not solved by the present invention are wrong. _ ^ 5 a, a $ = The effect of the fine crystals of lipids floating on the matrix of the amorphous phase resin, the effect of Mao Ming cannot be obtained, and it is usually harmful to the crystallization of the crystalline phase resin. In the embodiment of the present invention, the composition is molded through a heating / melting step as a premise. However, the results obtained from differential scanning calorimetry (hereinafter abbreviated as DSC) from the differential scanning calorimetry strongly suggest that the conditions of the embodiment of the present invention and the fine crystals of the crystalline phase resin simply float on the matrix of the amorphous phase resin. The situation is different. In other words, when the molded article of the polyimide C1) is heated from normal temperature, the exothermic peak of the π ′ junction aa appears at 300 °. 〇 Nearby. When the temperature is further increased, the endothermic peak of the 'melt appears, but the heat at this time is about the same as the exotherm of the crystal. In other words, it is understood that in the initial stage, the molded articles were not crystallized at all. On the other hand, in the molded article of polyimide (2), no results were observed.

第15頁 491873Page 15 491873

曰:曰之放熱峰,巾只出現熔化的吸熱。此外,此吸 $等於w述聚醯亞胺(丨)之例中者。易言 纟士曰 …、 在一開始的階段即已完成。 、、日日土上 在根據本發明樹脂組成物之模製物品中,結晶之放埶 未出現’只觀察到炫化的吸熱,且其熱量基本上等於g鱗 亞胺(1 )或1 亞fe ( 2 )之單獨物質之例中者。換古之— 組成物中之聚醯亞胺(1)與聚醯亞胺(2)兩者中,' 二晶均^ 行,且因此應否決是聚醯亞胺(2 )單獨結晶。 曰二 因此’可得到π晶體加晶體π性質, 性貝’而此專性吳被認為造成彎曲模 予該等模製物品彎曲模組係數與敵縮 而非π非晶質加晶體" 組係數之維持,並賦 度間之平衡。 兩種聚醯亞胺在一熔化/揉製步驟中均完全溶於彼此之 中,且其為透明者,但在一冷卻步驟中,其立即結晶變成 混濁狀。換s之,可假設藉由於該冷卻步驟中之一旋節線 (spi no dal)相分離以及聚醯亞胺(2)之結晶,將聚醯亞胺 (1)分子斥出’致使聚酿亞胺(1)之分子鏈序有一定之規 則,有助於晶核之產生或加速分子鏈進給灵一結晶成長表 面,藉此可加速聚醯亞胺(1)之結晶速度。 從前述中可了解,上述問題可藉由緒合結晶速度彼此不 同並在冷卻步驟中分離之特定聚^亞胺而獲解決。此組成 直至目前為止並未被預期到。 然而,若聚醯亞胺(1)之混合比率超過60%重量,則無法 發生任何結晶。換言之,若聚醯亞胺(2)以聚醯亞胺(1)過 度稀釋,則會喪失本發明的效果。在此情形下,該等聚醯Said: the exothermic peak, the towel only appeared melting endothermic. In addition, this absorption is equal to the one described in the example of polyimide (丨). In simple words, the warrior said ..., it was completed in the beginning. In the molded articles according to the resin composition of the present invention, the crystals did not appear on the soil. 'Only the dazzling endothermic heat was observed, and its heat was substantially equal to g squammine (1) or 1 fe (2) is an example of a separate substance. In other words, in both the polyimide (1) and the polyimide (2) in the composition, 'two crystals are OK, and therefore the polyimide (2) should be rejected alone. Therefore, “the π crystal plus the crystal π property can be obtained,” and this obligate Wu is considered to cause the bending mode to these molded articles. The bending module coefficient and the shrinkage are not the π amorphous and the crystal. The maintenance of the coefficient and the balance between the degree. Both polyimides were completely dissolved in each other in a melting / kneading step, and they were transparent, but in a cooling step, they immediately crystallized and became cloudy. In other words, it can be assumed that the polyimide (1) molecule is repelled due to the phase separation of a spino line (spi no dal) and the crystallization of the polyimide (2) in the cooling step, resulting in polymerization. The molecular chain order of the imine (1) has a certain rule, which helps the generation of crystal nuclei or accelerates the molecular chain feed to the surface of the crystal growth, thereby accelerating the crystallization speed of the polyfluorene (1). As can be understood from the foregoing, the above-mentioned problems can be solved by incorporating specific polyimines whose crystallization speeds are different from each other and separated in a cooling step. This composition has not been anticipated so far. However, if the blending ratio of polyimide (1) exceeds 60% by weight, no crystallization can occur. In other words, if the polyimide (2) is excessively diluted with the polyimide (1), the effect of the present invention is lost. In this case, the parties

491873 五、發明說明(11) " ~ -------- 】 = 態彼此溶解的同時固化’而該等模製物品則以 此混合比率之重要性亦 < 由η ς r %々ία: 文1力』由μ L所進仃之恆溫結晶測讀 所得之結晶時間之半周期加以了冑。此處所指之結晶時間 之半周期具有以下之意義,其為結晶速度測良上之一典型 因子。 八 加熱該組成物至充分熔化,然後淬火至一預定溫度,即 玻璃轉化點或更高以及熔點或更低之溫度。此點之時間^ t〇代表。此組成物被固定維持在此結晶開始之溫度下,而 於DSC上觀察到結晶之放熱峰。得到此放熱峰峰頂之時間 以、代表。 、 ’曰 因此’結晶時間之半周期th,可以下式等式代表。 th 二 t! - t〇 結晶時間之半周期之測量技術舉例而言說明於491873 V. Description of the invention (11) " ~ --------】 = states are dissolved with each other and cured at the same time ', and the importance of this mixing ratio of these molded articles is also from η ς r% 々Ία: Wen 1 Force ”The half period of the crystallization time obtained by reading the constant temperature crystallization measured in μL was added. The half cycle of the crystallization time referred to here has the following meaning, which is a typical factor in measuring the crystallization speed. Eight The composition is heated until it is sufficiently melted, and then quenched to a predetermined temperature, i.e., a glass transition point or higher and a melting point or lower. Time at this point ^ t〇 represents. This composition was fixed and maintained at the temperature at which the crystallization started, and an exothermic peak of crystallization was observed on DSC. The time to obtain this exothermic peak is represented by. Therefore, the half period th of the crystallization time can be represented by the following equation. The measurement technique of th two t!-t〇 half cycle of crystallization time is exemplified in

Macromolecules , V〇l. 29, ρ· 135 至142 (1996) 、TheMacromolecules, Vol. 29, p. 135 to 142 (1996), The

Society of Polymer Science (曰本)於1973 年所編輯之 丨,Polymer Measurement Method, the first volume (聚 合物測量方法,第一卷)n、以及nNetsu Sokutei',(熱量 測),V ο 1 · 2 2, p · 1 6 ( 1 9 9 5 )中。結晶時間之半周期值愈 小,結晶速度愈高。一般而言’此結晶時間之半周期視結 晶所需之溫度而定,且其於玻璃轉化點與熔點間之溫度下 取得一最小值。 聚醯亞胺(1 )之結晶時間之最小半周期可在3 2 0 °C附近得 到,其約1 5分鐘。另一方面,聚酸亞胺(2 )者可在3 1 0 °C附Edited by Society of Polymer Science (Japanese version) in 1973, Polymer Measurement Method, the first volume n, and nNetsu Sokutei ', (calorimetry), V ο 1 · 2 2, p · 1 6 (1 9 9 5). The smaller the half-cycle value of the crystallization time, the higher the crystallization speed. Generally speaking, the half period of this crystallization time depends on the temperature required for crystallization, and it takes a minimum value at the temperature between the glass transition point and the melting point. The minimum half-cycle of the crystallization time of polyimide (1) can be obtained around 320 ° C, which is about 15 minutes. On the other hand, polyimide (2) can be attached at 3 1 0 ° C.

第17頁 491873 五、發明說明(12)Page 17 491873 V. Description of the invention (12)

之一水準下 近得到 時間之 聚酸亞 位數, 甚至 為本發 約相同 然而, 間之半 由一般 接著 對可 無特別 片狀物 纖維 化石夕纖 其約0 · 2分鐘。在比此溫度 半周期太短而無法成功測得。無論如何,彳艮明顯 胺(2)之結晶時間之半周期比聚醯亞胺(1 )者約短兩 聚醯亞胺(2 )之結晶如此之快。 λ 在該包含少於60%重量聚驢亞胺(1)之組成物中,其 明之一實施例,仍.顯示出與聚醯亞胺(2)單獨物: 位數之結晶時間之半周期,其為〇 · 5分鐘或更短。 右聚酿亞胺(1 )之混合比率超過6 〇 %重量,則結晶日广 周期增加一位數或更多。換言之,結晶有時:^ 的射出成型或類似技術方便地達成,。 9 ’將說明本發明之一實施例。 加至關於本發明該聚醯亞胺樹脂組成物中之填料並 限制。典型之填料實例包括具有如纖維、針狀物、 與顆粒之無機強化物。 之實例包括碳纖維、玻璃纖維、金屬纖維、以及石户 維。 、反At one level, the polyacid sub-time of the time is nearly obtained, and even about the same as the present invention. However, half of the time is generally followed by no special sheet fiber, fossil fiber, which is about 0.2 minutes. At this temperature, the half cycle is too short to be measured successfully. In any case, it is obvious that the half-cycle of the crystallization time of the amine (2) is about two times shorter than that of the polyimide (1), and the crystallization of the polyimide (2) is so fast. λ In the composition containing less than 60% by weight polydonimine (1), one of the examples is still shown to be a half period of the crystallization time with polyimide (2) alone: the number of digits , Which is 0.5 minutes or less. When the mixing ratio of dextroimine (1) exceeds 60% by weight, the crystallization period increases by one digit or more. In other words, crystallization is sometimes easily achieved by injection molding or similar techniques. 9 'will explain one embodiment of the present invention. The filler added to the polyfluorene imide resin composition of the present invention is not limited. Examples of typical fillers include inorganic reinforcements such as fibers, needles, and particles. Examples include carbon fiber, glass fiber, metal fiber, and Ishido. ,anti

曰針狀物之實例包括鈦酸鉀結晶絲、硼酸鋁結晶絲、碳結 ,絲、碳酸鈣結晶絲、天然矽酸鈣、氧化鋅結晶絲、以及 氧化鈦結晶絲。 片狀物之實例包括雲母、玻璃片、滑石、絹雲母、高嶺 石、氮化石朋、石墨、以及金屬片。 顆粒之實例包括碳酸鎂、碳酸鈣、破璃珠、矽氧、榴酸 鎖、以及金屬粉末。 °亥無機強化物之其它實例包括抗磨損改良劑,如石英粉Examples of needles include potassium titanate crystal filaments, aluminum borate crystal filaments, carbon knots, filaments, calcium carbonate crystal filaments, natural calcium silicate, zinc oxide crystal filaments, and titanium oxide crystal filaments. Examples of flakes include mica, glass flakes, talc, sericite, kaolinite, nitrite, graphite, and metal flakes. Examples of the particles include magnesium carbonate, calcium carbonate, broken glass beads, silica, duuric acid lock, and metal powder. ° Other examples of inorganic reinforcements include anti-wear modifiers such as quartz powder

第18頁 491873 五、發明說明(13) 末與二硫化鉬、火 與氫氧化鎮、抗軌 矽酸鈣、另外還有 滑石、沸石、各種 不同特性之改良。 這些無機強化物 式使用,而欲使用 該聚醯亞胺樹脂組 較佳3至8 5份重量: 若該無機強化物 化的效果,而若超 能力可能有害。 燄延緩改良劑,如三氧化銻、氫氧化鋁 跡改良劑,如石棉、抗酸改良劑,如偏 矽藻土、鋁氧、白砂球、水合鋁氧、水 金屬氧化物以及碳黑,且其可用於各種 可選擇.單獨或以兩種或多種混合物之形 之該無機強化物量相對於1 0 0份重量之 成物而言,在1至100份重量之範圍内, 更佳5至70份重量。 之量少於1份重量,有時無法表現出強 過1 0 0份重量,有時對模製期間之流動 樹脂組成物 發明之目的 亞胺樹脂組 制。 作為第三 脂。亦可混 的。可混於 酸S旨、聚酉旨 縮醛、聚丙 猜、液晶聚 同架構之聚 可將一適當量之某一樹脂加至關於本發明之該聚醯亞胺 中作為第三種組分,以符合用途目的,只要本 不受妨害即可。對可加入關於本發明之該聚醯 成物中作為第三種組分之樹脂種類並無特別限 種組分 入一適 此之熱 、聚醯 稀酸醋 合物、 醯亞胺 之該樹脂之一典型實例為一熱塑性樹 當量之其它熱塑性樹脂,以符合用途目 塑性樹脂包括聚烯烴、聚苯乙烯、聚碳 胺、聚醯胺-醯亞胺、聚亞苯基醚、聚 、聚亞苯基硫、聚亞现、聚酮、聚醚 以及具有與本發明中所用之聚醯亞胺不Page 18 491873 V. Description of the invention (13) Molybdenum disulfide, fire and hydroxide ballast, anti-track calcium silicate, talc, zeolite, various improvements in various properties. These inorganic reinforcements are used, and the polyimide resin group is preferably used in an amount of 3 to 85 parts by weight: if the effect of the inorganic reinforcement is physical, but if it is supercapacity, it may be harmful. Flame retarding modifiers, such as antimony trioxide, aluminum hydroxide trace modifiers, such as asbestos, acid resistance modifiers, such as metadiatomite, alumina, white sand balls, hydrated alumina, water metal oxides, and carbon black, and It can be used for various options. The amount of the inorganic reinforcement, alone or in the form of a mixture of two or more, is in the range of 1 to 100 parts by weight, more preferably 5 to 70, relative to 100 parts by weight of the product. Parts by weight. The amount is less than 1 part by weight, and sometimes cannot be shown to be stronger than 100 parts by weight, and sometimes it is flowable during molding. As a third fat. Can also be mixed. A polymer that can be mixed with acid S, polyacetal, acetal, polyacrylamide, and a homopolymer of liquid crystal. An appropriate amount of a resin can be added to the polyimide of the present invention as a third component. In order to meet the purpose of use, as long as this is not hindered. There is no particular limitation on the kind of resin that can be added as the third component of the polyfluorinated product of the present invention. The resin can be a suitable heat, polyacrylic acid, acetonitrile, etc A typical example is a thermoplastic tree equivalent of other thermoplastic resins. According to the purpose, plastic resins include polyolefins, polystyrene, polycarbamines, polyamido-imino, polyphenylene ether, poly, polyimide. Phenylsulfide, polyimide, polyketone, polyether, and polyimide having the same properties as those used in the present invention

第19頁 491873 五、發明說明(14) 可二卜有生之如聚四氟乙稀等氟樹脂與侧"旨 此外成:之離模特性與磨損/磨擦特性。 選擇單猶t "醯胺纖維對於改善機械特性亦佳。其可 k擇早獨或以兩種或多種混合物之形式使用。 叫另二:可將著色劑、離模試劑、各種安定劑、塑化 以及油加至該聚醯亞胺樹脂組成物中,只要本發明之 目的不受妨害即可。 又 (1)本發Γ月Λ聚醯亞胺樹脂組成物可藉由均勻混合聚醯亞胺 ^製ιΓΛ亞2),其它所f之組☆,然後利用單螺旋 合滾於1二制Ϊ擠製為擠製該混合物而連續製造。使用混 行=*、柔衣器、布拉本德裝置或類似物之批式系統亦可 製本i: ΐ f脂組成物可主要藉由射出成型模 型、或轉移成型。模製方& ’如擠製成型、壓縮成 之以;;;:】聚”胺樹脂組成物在廣溫度範圍内 變化、 &吳’可控制在小範圍内之模製物品尺寸 高尺+二二ΐ二泛應用於23 0 °C或以上之高溫下使用且對 0寸精確度有所要求之模製物σ。 在半導體容器之領妁由 口口 长 可用於τ Γ U壯他域中’本發明之聚驢亞胺樹脂組成物 晶圓等中之盤、1c製程所用之^ 在電與電子零侔、 物可用以制、生連、7員域中,本發明之聚酿亞胺樹脂組成 衣仏接器、插座、線轴、以及用以製造如硬碟Page 19 491873 V. Description of the invention (14) It can be used as a fluororesin such as polytetrafluoroethylene and the side "Purpose" In addition, it has the characteristics of model separation and wear / friction. Choosing monoamine fibers is also good for improving mechanical properties. It can be used alone or in the form of a mixture of two or more. It is called the other two: colorants, release agents, various stabilizers, plasticizers, and oils can be added to the polyimide resin composition as long as the object of the present invention is not hindered. (1) In the present invention, the polyimide resin composition can be made by uniformly mixing polyimide ^ ΓΛ 2 2), and other groups f ☆, and then used a single spiral to roll on 1 2 Extrusion is continuously produced to extrude the mixture. Batches can also be made using a batch system using a hybrid = *, a softener, a Brabender device, or the like. The i: ΐ f lipid composition can be produced primarily by injection molding or transfer molding. Molding side & 'If extruded and compressed ;;]] Poly "amine resin composition changes over a wide temperature range, & Wu' can control the size of molded articles within a small range is high The ruler + 22 is used for moldings σ that are used at a high temperature of 23 0 ° C or above and require 0-inch accuracy. The collar of the semiconductor container can be used for τ Γ U In other domains, the disks of the polydonimide resin composition wafers of the present invention, and those used in the 1c process ^ In the field of electricity and electronics, materials can be used for manufacturing, production, and 7-member domains. The imine resin is used to make clothes connectors, sockets, spools, and used to make hard disks.

491873 五、發明說明(15) 載器、液晶顯示幕載器等之機床夾具、以及用於石英振盪 器之盤。 在辦公用品零件之領域中,本發明之聚醯亞胺樹脂組成 物可用以製造影印機之分頁夾、影印機之熱絕緣轴承、影 印機之齒輪等等。 在汽車零件之領域中,本發明之聚醯亞胺樹脂組成物可 用以製造推力墊圈、傳動環、活塞環、油封圈等等。 在工業機械零件之領域中,本發明之聚醯亞胺樹脂組成 物可用以製造滯阻定位器、泵齒輪、輸送鏈、延展機器用 之滑動套管等等。 接著,今根據實例更詳細說明本發明,但本發明之範圍 不應限制於這些實例。附帶說明者,實例與比較例中樹脂 物理性質之測量與評估係藉以下步驟為之。 (A )結晶時間之半周期 測量結晶時間之半周期之方法已於以上說明過。 換言之,結晶時間之半周期係以利用差分掃描計熱法 (DSC)所進行之恆溫結晶測試所測得。該組成物經加熱以 充分熔化,然後淬火至一預定溫度。此點之時間以tQ代 表。此組成物被固定維持在此結晶開始之溫度下,而於 DSC上觀察到結晶之放熱峰。得到此放熱峰峰頂之時間以 h代表。因此,結晶時間之半周期th,可以下式等式代 表。 th = L - t〇 結晶時間之半周期值愈小,結晶速度愈高。一般而言,491873 V. Description of the invention (15) Machine tool fixtures for carrier, LCD screen carrier, etc., and disk for quartz oscillator. In the field of parts for office supplies, the polyimide resin composition of the present invention can be used for manufacturing a folder of a photocopier, a thermally insulated bearing of a photocopier, a gear of a photocopier, and the like. In the field of automotive parts, the polyimide resin composition of the present invention can be used for manufacturing thrust washers, transmission rings, piston rings, oil seal rings, and the like. In the field of industrial machinery parts, the polyimide resin composition of the present invention can be used for manufacturing retardation positioners, pump gears, conveyor chains, sliding sleeves for extension machines, and the like. Next, the present invention will now be described in more detail based on examples, but the scope of the present invention should not be limited to these examples. Incidentally, the measurement and evaluation of the physical properties of resins in the examples and comparative examples are performed by the following steps. (A) Half cycle of crystallization time The method for measuring the half cycle of crystallization time has been described above. In other words, the half period of the crystallization time is measured by a constant temperature crystallization test using a differential scanning calorimetry (DSC). The composition is heated to be sufficiently melted, and then quenched to a predetermined temperature. The time at this point is represented by tQ. This composition was fixed and maintained at the temperature at which the crystallization started, and an exothermic peak of crystallization was observed on DSC. The time to obtain this exothermic peak is represented by h. Therefore, the half period th of the crystallization time can be represented by the following equation. th = L-t〇 The smaller the half-cycle value of the crystallization time, the higher the crystallization speed. Generally speaking,

第21頁 491873 五、發明說明(16) 此結晶時間之半周期視結晶所需之溫度而定,且其於玻璃 轉化點與熔點間之溫度下取得一最小值。因此,在此注意 溫度由1 9 0 C變化至3 2 0 °c下所測得最小結晶時間之半周期 值。在結晶時間之半周期短至少於0 · 2分鐘之例中,盔法 進行測量’因此以<〇· 2表示。 … (B)尺寸變化 使ASTMNo· 1 (ASTMD —6 3 8 )之啞鈴於3〇(Kc下進行熱處 理2小時,在處理前後以滑動卡鉗測量該啞鈴之平行部分 之寬度,以觀察尺寸變化。 (C )彎曲模組係數 對一在上述(B )段相同條件下受熱處理之試樣,根據 A S T M D - 7 9 0、交化溫度測量彎曲模組係數。測量溫度二 級,23 °C, 150t 及 2 5 0 °C。 · 一 聚醯亞胺(2 )之製備實例 在一配備有授拌為、迴流冷凝器、以及氮氣引入管之六 器中置入2 04·4 g (0.7 mol)之1,3-雙(4-胺基笨氧基)今 苯、199· 6 g (0· 6 79 mol)之3, 3,,4, 4,—二笨四竣酸"二酸 酐' 6· 22 g (〇· 06 mol)之酞酸酐、以及丨,48〇g之間^次 酚,然後於氮氣氣酚攪拌下將其加熱至2 0 0 °c。其後 應於2 0 0 Ό下進行4小時,此時,確認約9 m 1水流出 反 ml 應完全之後,將反應溶液冷卻至室溫,然後將約2 〇在反 之曱苯加至其中。之後,過濾收集所得之聚醯亞胺〇 末,接著乾燥。如此製得之聚醯亞胺(2 )之對數对& 2)粉 d1/g。 數點度為〇.Page 21 491873 V. Description of the invention (16) The half period of this crystallization time depends on the temperature required for crystallization, and it takes a minimum value at the temperature between the glass transition point and the melting point. Therefore, note here that the half-cycle value of the minimum crystallization time measured at a temperature change from 190 ° C to 320 ° C. In the case where the half period of the crystallization time is shorter than 0.2 minutes, the measurement by the helmet method 'is therefore expressed as < 0.2. … (B) Dimensional changes. The dumbbells of ASTM No. 1 (ASTMD-63.8) were heat-treated at 30 ° C for 2 hours, and the width of the parallel part of the dumbbells was measured with sliding calipers before and after treatment to observe the dimensional changes. (C) Bending module coefficient For a sample that has been heat-treated under the same conditions as in (B) above, the bending module coefficient is measured according to ASTMD-790, cross temperature. The measurement temperature is two degrees, 23 ° C, 150t And 250 ° C. · Example of the preparation of polyimide (2) Put 2 04 · 4 g (0.7 mol) in a six device equipped with a mixing device, a reflux condenser, and a nitrogen introduction tube. Of 1,3-bis (4-aminobenzyloxy) benzene, 199.6 g (0.679 mol) of 3, 3,4,4—dibenzyltetracarboxylic acid " diacid anhydride ' 6.22 g (0.06 mol) of phthalic anhydride, and phenol at between 48 and 80 g, and then heated to 200 ° C under stirring with nitrogen gas phenol. After that, it should be at 200 It was carried out for 4 hours, at this time, after confirming that about 9 m 1 of water had flowed out and the reaction solution was complete, the reaction solution was cooled to room temperature, and then about 20% of toluene was added thereto, and then collected by filtration. The end of the obtained polyimide square, followed by drying the thus obtained polyimide (2) for logarithm &. 2) powder d1 / g. The number of degrees is 0.

第22頁 491873 — 丨_ 五、發明說明(π) f例1至5 將聚醯亞胺(1 )(由M i t s u i化學品公司所製造,商品名為Page 22 491873 — 丨 _ V. Description of the invention (π) f Examples 1 to 5 Polyimide (1) (manufactured by M i t s u i Chemical Co., Ltd., trade name

Aurum PD450 ’對數黏度= 〇·45 dl/g)、於上述製備實例 中所得之聚Si亞胺(2 )、以及碳纖維(由T 〇 h 〇 R a y ο η公司所 製造’商品名為ΗΤ A-C6 )各自依表i中所示之比例加以混 合,接著利用一滾混機充分混合。該混合物經熔化、混 合、以及以3 7 mm螺旋直徑與L/D = 32之雙螺旋擠製器於42〇 °C ^ 8 0 rpm之螺轉速度下擠製,以製得小球。測量如此 製得之小球之結晶時間的半周期。另外,這些小球於4 2 〇 C之庄射溫度下與2 1 0它之模製溫度下,以3 〇秒之模製程 士射出成’然後對所得之試樣進行評估。結果示於表】 比較例1邀2 定在不 。結果 每一聚醯亞胺(1 )鱼取 谪者夕r鬥允 )”來酿亞胺(2 )間之混合比均設 示於表2中 一仏主ο A 員例1至3中之相同步驟進行評估 驟 比較例3 使用聚醯亞胺(1 進行評估。結果 比較例4 )_之單獨物質,以實例1至3中之相同步 示於表2中。Aurum PD450 'Log viscosity = 0.45 dl / g), polySiimine (2) obtained in the above preparation example, and carbon fiber (manufactured by T 〇h 〇 R ay ο η company) under the trade name ΗΤ A -C6) are each mixed in the proportions shown in Table i, and then thoroughly mixed using a tumble mixer. The mixture was melted, mixed, and extruded at a screw speed of 42 ° C ^ 80 rpm with a twin-screw extruder with a 37 mm screw diameter and L / D = 32 to obtain pellets. The half cycle of the crystallization time of the beads thus obtained was measured. In addition, these pellets were shot at a molding temperature of 4 200 C and a molding temperature of 210 at a molding process of 30 seconds, and the obtained samples were evaluated. The results are shown in the table. Results The mixing ratios between each polyimide (1) and fish extractor (Dongyun) were prepared as shown in Table 2 in Table 1-Master A. Examples 1 to 3 The same procedure was used for evaluation. Comparative Example 3 was evaluated using polyimide (1. Results of Comparative Example 4). The individual substances are shown in Table 2 together with the phases in Examples 1 to 3.

使用聚醯亞胺(1 。 驟進行評估。•果示於早表1 :質’以實例1至3中之相同步 間ί 於Li G與,例中所得之Aurum組成*比2 之彎曲模組係數、於1 5 0 °C熱處理财The evaluation was performed using polyimide (1. step). • Results are shown in the early table. The quality is synchronized with the phases in Examples 1 to 3. Li Li G and the Aurum composition obtained in the example * 2 bending mode. Group coefficient, heat treatment at 150 ° C

第23頁 491873 五、發明說明(18) 後之尺寸變化、以及結晶時間之半周期。 *_1 實 例 1 2 3 4 5 聚驢亞胺樹脂 (1) 5 10 30 50 60 組成物 (pt S. 聚醯亞胺樹脂 (2) 95 90 70 50 40 wt.) 碳纖維 30 30 30 30 30 半結晶時間 (min) <0. 2 <0· 2 <0· 2 0.4 0. 5 尺寸變化(% ) 彎曲模組係數 (MPa) 0. 55 0. 60 0. 62 0. 70 0. 70 2 3 °C 2 2 0 0 0 2 2 0 0 0 22 0 0 0 2 3 0 0 0 2 3 5 0 0 1 50 °C 1 6 5 0 0 1 70 0 0 1 8 0 0 0 1 8 0 0 0 1 8 0 0 0 2 5 0 °C 6 5 0 0 70 0 0 82 0 0 8 3 0 0 8 5 0 0Page 23 491873 V. Description of the invention after dimensional change (18) and half cycle of crystallization time. * _1 Example 1 2 3 4 5 Polydonimide resin (1) 5 10 30 50 60 Composition (pt S. Polyimide resin (2) 95 90 70 50 40 wt.) Carbon fiber 30 30 30 30 30 half Crystallization time (min) < 0. 2 < 0 · 2 < 0 · 2 0.4 0. 5 Dimensional change (%) Bending module coefficient (MPa) 0. 55 0. 60 0. 62 0. 70 0. 70 2 3 ° C 2 2 0 0 0 2 2 0 0 0 22 0 0 0 2 3 0 0 0 2 3 5 0 0 1 50 ° C 1 6 5 0 0 1 70 0 0 1 8 0 0 0 1 8 0 0 0 1 8 0 0 0 2 5 0 ° C 6 5 0 0 70 0 0 82 0 0 8 3 0 0 8 5 0 0

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491873 五、發明說明(19) 比 較 例 1 2 3 4 聚醯亞胺樹脂(1 ) 1 80 100 0 組成物 聚醯亞胺樹脂(2 ) 99 20 0 100 (pts.wt.) 碳纖維 30 30 30 30 半結晶時間(m i η ) <0. 2 14. 0 14. 2 <0· 2 尺寸變化(%) 0.12 1. 30 1.33 0. 1 0 彎曲模組係數 (MPa) 2 3 t 2 0 0 0 0 21000 21000 2 0 0 0 0 15(TC 1 0 0 0 0 1 80 0 0 1 8 0 0 0 1 0 0 0 0 2 5 0 °C 4 500 75 0 0 8 0 0 0 44 00 本發明之效果如下。 本發明之第一效果係提供一 種聚合物合金 ,其可利用到 聚酸亞胺(1)與聚醯亞胺(2)之優點,而減少聚醯亞胺(工) 與聚醯亞胺(2)之缺點。 本發明之第二效果係提供一種聚醯亞胺樹脂組成物,可 自其得致結晶態模製物品,即使藉由一平常的模製程序, 例如約3 0至6 0秒之射出成型程序。 本發明之第三效果係提供一種聚醯亞胺樹脂組成物,可 1其得致具有優異尺寸精確性之模製物品,即使藉由一平 常的模製程序,例如約3 〇至6〇秒之射出成型程序,舉例而 舌’在欲於2 3 0 °C或以上之高溫下,如23 0至3〇〇°c或230491873 V. Description of the invention (19) Comparative example 1 2 3 4 Polyimide resin (1) 1 80 100 0 Composition Polyimide resin (2) 99 20 0 100 (pts.wt.) Carbon fiber 30 30 30 30 Semi-crystallization time (mi η) < 0. 2 14. 0 14. 2 < 0 · 2 Dimensional change (%) 0.12 1. 30 1.33 0. 1 0 Bending module coefficient (MPa) 2 3 t 2 0 0 0 0 21000 21000 2 0 0 0 0 15 (TC 1 0 0 0 0 1 80 0 0 1 8 0 0 1 0 0 0 0 2 5 0 ° C 4 500 75 0 0 8 0 0 0 44 00 The present invention The effect is as follows. The first effect of the present invention is to provide a polymer alloy which can take advantage of polyimide (1) and polyimide (2), and reduce polyimide (work) and polymer. Disadvantages of fluorene imine (2). A second effect of the present invention is to provide a polyfluorene imine resin composition from which a crystalline molded article can be obtained, even through a usual molding procedure, such as about 3 0 to 60 seconds injection molding process. A third effect of the present invention is to provide a polyimide resin composition, which can obtain a molded article having excellent dimensional accuracy, even by using Often flat molding procedures, for example from about 3 billion 6〇 seconds to injection molding procedures, for example the tongue 'to be at or above the temperature at 2 3 0 ° C, such as 230 or 230 ° c to 3〇〇

第25頁 ^1873 五、發明說明(20) 至2 5 0 °C之溫度下,使用該等模製物品之例中。 本叙明之第四效果係提供一種聚醯亞胺樹脂組成物,可 自其付致具有優異%曲模組係數之模製物品,即使藉由一 平常的模製程序,例如約30至60秒之射出成型程序,舉例 而言,在欲於230 °C或以上之高溫下,如230至300 °C或230 至2 5 0。(:之溫度下,使用該等模製物品之例中。Page 25 ^ 1873 V. Description of the invention (20) to 250 ° C, the use of these molded articles in the example. The fourth effect of this description is to provide a polyimide resin composition, which can be used to produce a molded article having an excellent% curvature modulus, even through a usual molding process, such as about 30 to 60 seconds. The injection molding process, for example, at high temperatures of 230 ° C or higher, such as 230 to 300 ° C or 230 to 250. (: In the case where these molded articles are used at a temperature of (:).

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Claims (1)

Cl 本. 案號 87121600 Λ_η 曰 修正 9! Τ^ΓΤΠΠ 1. 一種聚酸亞胺樹脂組成物,其包括5至6 0 %重量之具有 化學式1所代表之重覆單元之聚醯亞胺[聚醯亞胺(1 )],以 及4 0至95%重量之具有化學式2所代表之重覆單元之聚醯亞 胺[聚醯亞胺(2 )],此百分比比例乃基於聚醯亞胺(1)加上 聚醯亞胺(2 )之總重量: 化學式1 〇II 0 ⑴ 化學式2 普 ο ★ οCl. Case No. 87121600 Λ_η Amendment 9! Τ ^ ΓΤΠΠ 1. A polyimide resin composition comprising 5 to 60% by weight of polyimide having a repeating unit represented by Chemical Formula 1 [Polyimide Peryleneimine (1)], and 40 to 95% by weight of polyimide [polyimide (2)] having repeating units represented by chemical formula 2, the percentage ratio is based on polyimide ( 1) Add the total weight of polyimide (2): Chemical formula 1 〇II 0 ⑴ Chemical formula 2 General ο ★ ο 其 物 成 組 脂。 樹少 胺更 亞或 醯鐘 聚分 之5 項 第 圍 範 利 專 請 中 如 2 為 期 周 半 的 間 時 晶 結 中 物 成: 組第 脂圍 樹範 胺利 亞專 醯請 聚申 之之 項量 11 義ί 份 圍 ο /r巳 ο I 1 專對 請相 申含 如包 • 5 3 中 其 之 述 所 中 項 言 而 CC 物第 成圍 ίι aA-巳 Au 免々庫-___ 匕曰人、、 樹專對 胺請相 亞申含 酿如包 聚4, 該 中 料 填 之 量 重 份 ο ο IX 至 物 成1 組第 脂圍 樹範 胺利 亞專 醯請 聚申 之之 項量 重 份 其 之 述 所 中 項Its substances form lipids. Tree oligoamine is more subordinary or 醯 Zhong Ju gathers the 5th paragraph Fan Li special request Zhongru 2 for the half-time period of time to crystallize the composition: Group Di Zhiwei tree Fan amine Lean special please ask to apply for The amount of 11 items is yi fen fen ο / r 巳 ο I 1 is specifically for the application, please include as described in the package • 5 3 of the narratives in the above description, and the CC property will be wai ί aA- 巳 Au 々々 库 -___ 匕Said people, and trees specifically for amines, please ask Yashen to brew such as poly-4, and the amount of the filling is ο ο to IX to Wucheng into a group of the first fat Wai tree amines The amount of the item is the same as that described in the item \\326\2d-\91-02\87121600.ptc 第28頁 491873\\ 326 \ 2d- \ 91-02 \ 87121600.ptc Page 28 491873 該聚酿亞胺樹脂組成物而言5至7 〇份重量之填料。 5 ·如申請專利範圍第3項之聚醯亞胺樹脂組成物,其 中,該填料為選自包括碳纖維、碳黑、雲母、滑石與玻璃 纖維中至少之一者。 6 ·如申請專利範圍第5項之聚醯亞胺樹脂組成物,其 中,該填料為碳纖維及/或碳黑。 7 · —種模製物品,其係由申請專利範圍第3項中所述之 聚醯亞胺樹脂組成物所製成,其中,當於2〇至420 °C之量 測溫度範圍内以1 〇 °C / m i η之溫度上升速率下進行差分掃描 計熱法(differential scanning calorimetry (DSC)) 時,在2 6 0至3 0 0 °C下未觀察到任何結晶放熱峰。 8 ·如申請專利範圍第7項之模製物品,其可用於丨盤。 9 ·如申請專利範圍第7項之模製物品,其可用於電器或 電子零件。 10.如申請專利範圍第7項之模製物品,其可用於辦公用 品零件。 1 1.如申請專利範圍第7項之模製物品,其可用於汽 件。 、12·如申請專利範圍第7項之模製物品,其可用於工業機The polyimide resin composition has a filler content of 5 to 70 parts by weight. 5. The polyimide resin composition according to item 3 of the application, wherein the filler is at least one selected from the group consisting of carbon fiber, carbon black, mica, talc and glass fiber. 6. The polyimide resin composition according to item 5 of the application, wherein the filler is carbon fiber and / or carbon black. 7-A molded article made of the polyimide resin composition described in item 3 of the scope of patent application, wherein when the measurement temperature range of 20 to 420 ° C is 1 When differential scanning calorimetry (DSC) was performed at a temperature rising rate of 0 ° C / mi η, no crystal exothermic peak was observed at 260 to 300 ° C. 8 · If the molded article in the scope of patent application No. 7, it can be used for trays. 9 · If the molded article in the scope of patent application item 7, it can be used for electrical or electronic parts. 10. If the molded article in the scope of patent application item 7 is used, it can be used for office parts. 1 1. If the molded article in the scope of patent application No. 7 is used, it can be used for auto parts. 12,12 If the molded article in the scope of patent application item 7 can be used in industrial machinery W326\2d-\91-02\87121600.ptc 第29頁W326 \ 2d- \ 91-02 \ 87121600.ptc Page 29
TW87121600A 1997-07-17 1998-12-24 Polyimide resin composition and molded articles thereof TW491873B (en)

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JP19235397A JP3688097B2 (en) 1997-07-17 1997-07-17 Crystalline resin composition
JP19235297A JP3667040B2 (en) 1997-07-17 1997-07-17 Resin composition

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