TW491802B - Automated material handling method basing on adaptability control - Google Patents

Automated material handling method basing on adaptability control Download PDF

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Publication number
TW491802B
TW491802B TW90112068A TW90112068A TW491802B TW 491802 B TW491802 B TW 491802B TW 90112068 A TW90112068 A TW 90112068A TW 90112068 A TW90112068 A TW 90112068A TW 491802 B TW491802 B TW 491802B
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Taiwan
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transportation
point
manufacturing
item
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TW90112068A
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Chinese (zh)
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Ming-Hsun Chung
Hung-I Chen
Wen-Cheng Chin
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Taiwan Semiconductor Mfg
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Abstract

The invention is used to elevate the efficiency of automated handling of material basing on the adaptability control in the semiconductor factory. The method in the invention includes: continuously recording the automated material handling data in the factory; analyzing the data within a specified period of time at each specified interval to create a probability table about the delivery destinations of the material; inputting the probability table about the delivery destinations of the material to the material distribution table in the automated material handling system (AMHS); and determining the following delivery destinations of the material by the AMHS after the AMHS references the renewed material distribution table. The method in the invention increases the accuracy in delivering the material to the destinations, so the frequencies occurred in the erroneous delivery and the jammed stock flow can be reduced to effectively raise up the delivery efficiency of the material in the field and further the production efficiency of the material.

Description

491802491802

五、發明說明(1) 發明說明 效率的方 體廠中之物 本發明係有關於一種改良物料自動化運送 法’特別適用於一種基於適應性控制改良半導 料自動化運送效率的方法。 發明背景 S知的半導體製造廠的物料搬運是採手推 輸,但隨著晶圓片尺寸增大為12对,加上產口: t工運 淨度等因素的考量,使得自動化物料搬運:的良率及潔 Material + 逆糸統(AutomatedV. Description of the invention (1) Description of the invention The things in the plant of efficiency The present invention relates to a method for improving the automatic transportation of materials', which is particularly suitable for a method for improving the automatic transportation efficiency of semiconductors based on adaptive control. BACKGROUND OF THE INVENTION The material handling of semiconductor manufacturing plants known by S is by hand, but as the size of the wafer increases to 12 pairs, plus the consideration of factors such as the cleanliness of work and transportation, automated material handling: Yield and Material + Automated

Ml Handling Systera,以下簡稱AMHs)在近 成為曰曰回廠必要的配備之一。在廠房中建來已 薇内物料的自動化運輸,物料經由自/提供 上運送儲存,a量減少人工搬運物料= = 同貨架 與時間。 1尸汀而耗費的額外勞力 AMHS 點,運輸 預測的運 必須將物 原使用者 理,同時 進度。然 糸統並沒 物料分配 一般 table)來 的要求是 的正確性 送點不正 料利用人 輸出的存 也延遲了 而,在一 有與AMHS 規則常隨 的AMHS中 管理物料 將物料在最正確的時 旦{鄉益、富认士 了间运至敢適當的地 :者運輸時間與物料處 ==運送到錯誤的位置,此; ;;輸:方式’從錯誤的存貨處回運至 : Μ處^ ’而必箱立主^ ^ 物料處理的時間,乂外的人力進行處 般半導體廠中,而影響產品製造的 緊密的連結,主I ^的物料製造的分配 著多種接產-t要疋因為半導體廠中的 者:J接產早產品而快速變化。 的分配,而靜ΐϊϋ分配表(static 匕、物料分配表中的物料分Ml Handling Systera (hereinafter referred to as AMHs) has recently become one of the necessary equipment for returning to the factory. The automated transportation of materials in the factory has been built in the factory. The materials are transported and stored on the self / provider, and the amount of a is reduced by manually moving the materials = = same shelf and time. For the extra labor and AMHS points consumed by the corpse, the transportation of the forecasted transportation must take care of the original user and progress at the same time. However, the system does not have a general table for material allocation. The requirement is correctness. Sending points is not expected. The storage output by the user is also delayed. And in an AMHS that often follows the AMHS rules, the material is managed to place the material in the most correct Shi Dan {Xiangyi, Fuzhengshi transported to the appropriate place: the transportation time and materials = = transported to the wrong location, this; ;; lose: way 'return from the wrong inventory to: Μ Processing ^ 'and must set up the main ^ ^ material processing time, external personnel to carry out the general semiconductor factory, and affect the close connection of product manufacturing, the main I ^ material manufacturing distribution of a variety of production -t 要疋 Because of those in the semiconductor factory: J receives early products and changes rapidly. The static allocation table (static dagger, material allocation table

491802 五、發明說明(2) 配的g f條律(rules)通常為預設值,無法即時更新以對 應生產、、’ Ji的作業模式變化,也因此無法快速因應現場生 產的變化,缺乏彈性變動的能力。因此在半導體製造廠 ^,AMHS產生錯誤運送的機會也隨著製造產品的複雜化與 多樣化而增高。 μ由製,管理層面來看,半導體廠的生產製造一般有一 :i:5朿2 ί持設備的產能滿載運作’但是實際運作的 ::ί:Γ夺跟著製造的產品的不同需求而快速改變。 化,、制二ί = ί導體廠而言’由於接單生產的產品多樣 ΑΜίί’ς所隨著產品不肖而快速變冑’因此廠房中的 廳=订的物料運送也要因應配合製造上的快速變化。 i?值样不同的線上工作人員,其分配物料可能有特定 或偏好的處理模式,跟AMHS的預設的分配方式不一定一 體工廠生產為例,一般AMHS中只有指定將物料 或黃光區,然而在該區域中的機台化: ’說明一半導體廠中-區域的配 列,一黃光區ι〇中可能有多個機台“, 設置物料的貨架(stocker)16刀^^塊(bay)12,其上會 可能有所差ί f :上工 至於定夕至上r 作 吕,AMHS雖然將物料送 但未必剛好將物料運送至線上人員預期 2貨架上,此時即產生錯誤的運輸,線上::艾 “以人工方式將該批物料從錯誤的貨架上運輸至 mm 0503-6148TW;tsmc20〇〇.〇9i9;peggy~p^ m 第5頁 ^1802 五、發明說明(3) 存貨架上。此外,一般A〇s也無法預測特定貨架上的 ΐ,因此可能造成某些貨架的物料過多,形成塞貨狀 而某些貨架可能完全沒有物料入架,造成設備資源上 率^ ^或分配不均,而塞貨的情況更可能導致產品製造效 發明簡述 問顳為了解決上述一般的AMHS在半導體製造廠中所遇到的 物粗ό ί發明的一個目的在提出一種基於適應性控制改良 的ΞΠϊ運送之方法’可模擬出半導體廠内線上工作者 為ι炀以預測物料的運送落點。 料自ί =的另一個目的提出一種基於適應性控制改良物 的準確_ ,,,法,可提尚半導體廠内自動化物料運輸 +確度,減少物料回送的情況產生。 導體ίΐΐϋ再—個目的提出—種基㈣應性控制改良半 自動化\ 運送方 可平衡半導體廠内物料 化運輸的分配,並免塞貨的情況發生。 適用i ί=i:ϊ應ί控制改良物料自動化運送之方法, 每隔-固定ϊ間分析自動化物料運送之資料; 運送落點機座本ϊ ^ r時 上述資料以產生一物料 中;以及ϋ ^料運送落點機率表匯入amhs系統 最新之物料的運送位置新之物料運达洛點機率表決定 料之運中二:^化?送之資料可以包含:每批物 、曰母;斗的落點區域(area)、物料製造階 〇5〇3.6l48TW;tsm^^:491802 V. Description of the invention (2) The gf rules are usually preset values, and cannot be updated in real time to correspond to changes in production and operation modes of Ji. Therefore, they cannot quickly respond to changes in on-site production and lack flexibility. Ability. Therefore, in semiconductor manufacturing plants, the chance of AMHS erroneous shipping also increases with the complexity and diversification of manufactured products. μ From the perspective of management, from the perspective of management, the production of semiconductor factories generally has one: i: 5 朿 2 ί holds the capacity of the equipment to operate at full load ', but the actual operation: ί: Γ is quickly changing according to the different needs of the manufactured products . In the case of the conductor factory, 'Because of the diversified products produced by the order, the production is rapidly changing as the product is not good'. Therefore, the hall in the factory building must also be shipped in accordance with the manufacturing requirements. Change fast. i? Online workers with different values may have specific or preferred processing modes for the distribution of materials. The AMHS preset distribution method may not be integrated with factory production as an example. Generally, only materials or yellow light areas are designated in AMHS. However, the machine in this area is: 'Indicate the arrangement of a semiconductor factory in the region, there may be multiple machines in a yellow light area, and there are 16 knives (bays) for setting materials. ) 12, there may be a difference. F: As for the work, Ding Xi Zhi Shang Zuo Lu, although AMHS will deliver the material, it may not just deliver the material to the online personnel expected 2 shelves, at this time, the wrong transportation occurs. Online: Ai "Manually transport this batch of materials from the wrong shelf to mm 0503-6148TW; tsmc20〇〇.〇9i9; peggy ~ p ^ m page 5 ^ 1802 V. Description of the invention (3) Stored on the shelf on. In addition, in general, Aos cannot predict the plutonium on a specific shelf, so it may cause too much material on some shelves, forming a congestion situation, and some shelves may not have any materials on the shelf at all, resulting in equipment resource upload rate ^ ^ or unallocated The situation of congestion is more likely to lead to product manufacturing efficiency. Brief description of the invention In order to solve the above-mentioned general AMHS encountered in semiconductor manufacturing plants, an object of the invention is to propose an improved control based on adaptive control. ΞΠϊShipping method 'can simulate the online workers in a semiconductor factory to predict the delivery point of the material. The other purpose of material from ί = is to propose an accurate improvement method based on adaptive control, which can improve the automation of material transportation in the semiconductor factory + accuracy and reduce the occurrence of material return. The conductor is re-introduced for a purpose—improving semi-automated and adaptive control based on adaptive control. The carrier can balance the distribution of materialized transportation in the semiconductor factory and avoid congestion. Applicable i ί = i: ϊ Should ί control the improved method of automatic material transportation, analyze the data of automatic material transportation every-fixed time; transport the above-mentioned data to produce a material when the landing point base ^ r; and ϋ ^ Import material drop point probability table is imported into the latest material delivery position of amhs system. The new material drop dal point probability table determines the material transportation. The information to be sent can include: each batch, the mother; the area of the bucket (material area), and the material manufacturing stage 〇〇〇〇3.6l48TW; tsm ^^:

Peggy.ptd 第6頁 491802 五、發明說明(4) ' 段(stage)、製造能力(capabiiity)、下階段製造能力 (next capability)、及/或指定之輸送終點 (destination)等資料。 本發明之基於適應性控制改良物料自動化運送之方法 的優點,在於可以增加AMHS系統對物料運輸預測的準確 性,減少物料誤送的機率,減少物料回送的時間,同時平 衡各存貨處的負載,避免積貨狀況產生。另外,本發明之 方法可以自動更新AMHS系統中的分配物料運輸的物料分配 表(jtatic table),使得該物料分配表中的物料分配條律 更符合產品多樣化的半導體製造廠内部的物料運輸需求。 ▲為了讓本發明之上述目的、特徵、及優點能更明顯易 懂,以下配合所附圖式,以具體實施例作詳細 圖式簡單說明 一立第1圖所不為半導體製造廠中一製造區中之位置分佈 示意圖。 第2圖所示為依據本發明實施例之基於 良半導體薇内物料自動化運送之系統架構示意控制 =3圖所不為依據本發明實施例之基於適應性控制改 良半導體廠内物料自動化運送之方法流程圖。 圖所示為本發明實施例之物料運送資料分析圖。 ?示疏祝明 101420 育光區 機台 AMHS主機 121622 分隔區塊 貨架 儲存裝置Peggy.ptd Page 6 491802 V. Description of the invention (4) 'Stage, manufacturing capability, next capability, and / or designated destination. The advantage of the method for improving the automatic material transportation based on adaptive control of the present invention is that it can increase the accuracy of AMHS system's prediction of material transportation, reduce the probability of material misfeed, reduce the time of material return, and balance the load of each inventory. Avoid stockpiles. In addition, the method of the present invention can automatically update the jtatic table of the assigned material transportation in the AMHS system, so that the material distribution rules in the material distribution table are more in line with the material transportation requirements of the semiconductor manufacturing plant with product diversification. . ▲ In order to make the above-mentioned objects, features, and advantages of the present invention more obvious and easy to understand, the following is a detailed description of specific embodiments in conjunction with the accompanying drawings, which are briefly described in the first figure. Schematic diagram of location distribution in the zone. Figure 2 shows the schematic control of a system architecture based on the automated transportation of materials in a good semiconductor according to an embodiment of the present invention. = 3. Figure 3 does not show a method for improving the automated transportation of materials in a semiconductor factory based on adaptive control according to an embodiment of the present invention. flow chart. The figure shows the material transportation data analysis diagram of the embodiment of the present invention. Zhu Shuming 101420 Yuguang District Machine AMHS Host 121622 Separated Block Shelf Storage Device

第7頁 491802 五、發明說明(5) 24 :資料分析主機 28 :貨架 C1至C3 :製造能力 S1至S3 :製造階段 實施例 26 : AMHS 系統Page 7 491802 V. Description of the invention (5) 24: Data analysis host 28: Shelf C1 to C3: Manufacturing capacity S1 to S3: Manufacturing stage Example 26: AMHS system

Ml與M2 :分析模式 C’ 1至C’ 5 :下一製造能力 P1至P9 :機率Ml and M2: Analysis mode C ’1 to C’ 5: Next manufacturing capability P1 to P9: Probability

以下以一半導體廠之AMHS系統作詳細實施例說明。參 見第2圖’ 一半導體廠之amhs系統26之運作通常以一AMHS 主機20作為控制,在該AMHS主機20中存有一落點分配表以 分配物料運輸的條律。 本發明 AMHS主機中 為,但不限 一般在 如:每批物 (area),例 力(capabi 1 洗或曝光顯 些物料的處 例如:預清 造步驟才是 於黃光區, 合,主要由 以進行之步 耩者定義物 之實施例可利用一儲存裝置22,持續記錄該 所進行的物料運送資料。該儲存裝置2 2可以 於,一資料庫,以進行上述資料的紀錄儲存。 半導體廠中’物料運送時可能產生多種資料, 料之進行運送之時間;該物料運送的落點區域 如由CVD區送至黃光區;落點處機台的製造能 ^y) 機口可能具備多種製造能力,如:清 下階段製造能力(next capabiiity),某 理步驟可能僅為預處理(pre-process)步驟, 洗(pre-cleaning),因此接下來的主要進行製 重要的資料;物料製造階段(stage),特別用 此=段可能為數個步驟的一個特定順序的集 ::光區機台的製造能力均為曝光顯影,因此 圾制、特疋集合來代表該批物料的製造過程, 造階段來區分該物料在此區域中的特殊In the following, an AMHS system of a semiconductor factory is used for detailed description. See FIG. 2 'The operation of the amhs system 26 of a semiconductor factory is usually controlled by an AMHS mainframe 20, and an AMHS mainframe 20 is stored in the AMHS mainframe 20 to distribute material transportation rules. The AMHS mainframe of the present invention is, but is not limited to, generally, such as: each batch (area), example (capabi 1 washing or exposure of some materials), such as: the pre-cleaning step is in the yellow light area, and is mainly caused by In the embodiment of the step-by-step definition, a storage device 22 can be used to continuously record the material transportation data. The storage device 22 can be stored in a database to record the above data. Semiconductor factory Various materials may be generated during the transportation of materials, and the time of material transportation; if the landing area of the material transportation is from the CVD area to the yellow light area; the manufacturing capability of the machine at the landing location ^ y) There may be multiple types of machine ports Manufacturing capabilities, such as: next capabiiity, a certain processing step may only be a pre-process step, pre-cleaning, so the next major process is to produce important data; material manufacturing Stage (stage), especially this = stage may be a set of several steps in a specific order :: The manufacturing capabilities of the machine in the light zone are all exposed and developed, so the waste and special collections represent the batch. Manufacturing process making the material to distinguish particular stage in this area

491802 五、發明說明(6) 性;另外,物料運送的資料可包括指 (destination) ^ ^ a,,, , 曰又::到特定,置,因此產生指定的輸送終點。工4者 時所產生的相關資才斗,可經由一資:二到的物料輸送 以分析,以產生一物料運送落點;::析;機24定時地加 不出各貨架在各種條件下的落點分佈^ 此機率表中顯 物料運送落點機率表則載入職主機=物Π::的 的輸送流程。 +刀配表为配物料 參照第2圖之本發 圖詳細說明本發明之方法的進行。承首4架^,接下來以第3 自動化物料運送之資料。為了分析 二步驟32,紀錄 模式’則需要持續的收集關於物料自動=送的最適 料。因此,可利用一儲存裝置22;時:相關資 進行運送之時間、運送兩端的區域:每批物料 (capability)、下階段之製造能力( 製造旎力 物料製造階段(stage)、另外,亦可=apabl、lity)、 (destination)。所記錄的資料可二二=之輸送終點 程特性來加以選擇記錄,以做二以製造廠的製造過 的資料基礎,並不僅限於析物料在場内運輸模式 接著進行步驟34 :每隔一固定 上述資料以產生一物料運送落點機^ ^刀析一定時間内之 點機率表。經過持續收集491802 V. Description of the invention (6); In addition, the material transportation information may include (destination) ^ ^ a ,,,, and again :: to a specific location, so that the designated transportation end point is generated. Relevant talents generated when working for 4 people can be analyzed by one source: two to the material transport to produce a material transport landing point :: analysis; the machine 24 can not add the shelves regularly under various conditions Distribution of landing points ^ The probability table of the material transportation landing points shown in this probability table is loaded into the transportation process of the job host = 物 Π ::. + Knife allocation table is the material to be prepared. The method of the present invention will be described in detail with reference to the present drawing in FIG. 2. Carry the first 4 ^, and then use the 3rd automated material transportation data. In order to analyze the second step 32, the recording mode ′ needs to continuously collect the best material about the material automatic = sending. Therefore, a storage device 22 can be used. Hours: the time when the related materials are transported, the areas at both ends of the transport: each batch of material (capability), the next stage of manufacturing capacity (manufacturing power material manufacturing stage (stage), and also, = apabl, lity), (destination). The recorded data can be selected and recorded according to the characteristics of the end-of-conveyance of 22 =, which is based on the manufactured data of the manufacturing plant, and is not limited to the analysis of the material in the field transportation mode. Then proceed to step 34: fix the above every other The data is used to generate a material transport drop point machine ^ ^ knife analysis point probability table within a certain time. After continuous collection

491802491802

五、發明說明(7) AMHS系統中所產生的資料後 時間中的該等資料。例如: 時間的資料。但本發明並不 隔與所欲進行分析的分析時 造流程的變化情況而定。 上述步驟可藉由一資料 並分析該儲存裝置2 2某段時 析的主要產生一物料落點機 率。 ’則每經過一定時間分析某段 每隔6小時分析目前至前1 2小 以此為限,進行分析的時間間 間範圍’可依照該製造廠的製 分析主機24進行,以定時啟動 間中的資料模式。而資料的分 率表,預估物料落點位置的機 接著參見第4圖,所示為根據本發明之一實施例中, 進打物料運送資料分析的示意圖。一般半導體廠中 運送的資料分析可以㈣兩種模_她。在⑴ 抖 主要分析物料欲進行的製造能力(capability,c)盥下一 製造能力(next CaPability,(:,)的分佈情況 ^ 率(possibiiity,P)。而在M2模式中,主要在半的機 的黃光區’機台本身的製造能力均相同,若以製造 (capabUHy,C)進行分析,則顯現不出線上工 刀 變化,因此以物料製造階段(stage,s)作為資料分析&的 據,以產生有意義的物料落點機率表。在此機率顯一又 ^在各種條件下,物料運送到各貨架所產生的落點分佈^ 限於第四圖所示之方式 段(stage)等資料分 進行各種特定物料運 然而上述步驟之資料分析非僅 中製造能力(capability)或製造階 析,更可依據各製造廠之製造特性V. Description of the invention (7) The data in the time after the data generated in the AMHS system. For example: Time data. However, the present invention does not depend on the change of the manufacturing process of the analysis to be performed. The above steps can be based on a data and analysis of a certain period of time in the storage device 2 2 to produce a material drop point probability. 'The analysis will be performed every 6 hours after a certain period of time, and the analysis is currently limited to the first 12 hours. The time range for the analysis can be performed according to the manufacturing analysis host 24 of the manufacturer to periodically start the interval. Data mode. The data score table, the machine for estimating the location of the falling point of materials, and then referring to FIG. 4, is a schematic diagram showing the analysis of the material transportation data in an embodiment according to the present invention. The analysis of the data transmitted in a general semiconductor factory can be divided into two modes. The main analysis of the manufacturing capability (capability, c) of the material is to analyze the distribution of the next manufacturing capability (next CaPability, (:,) ^ rate (possibiiity, P). In the M2 mode, it is mainly in the half The yellow light area of the machine's machine has the same manufacturing capabilities. If it is analyzed by manufacturing (capabUHy, C), it will not show the change of the online knife. Therefore, the material manufacturing stage (s) is used as the data analysis & In order to produce a meaningful table of the probability of falling points of materials. Here the probability is displayed again and again ^ Under various conditions, the distribution of the falling points generated by the materials delivered to each shelf ^ is limited to the stage shown in the fourth figure, etc. The data is divided into various specific materials. However, the data analysis of the above steps is not only about manufacturing capability (capability) or manufacturing analysis, but also according to the manufacturing characteristics of each manufacturer.

491802 五、發明說明(8) 送參數資料的 料運送落點機 接著進行 主機中。當資 後,所得到的 新其中的分配 AMHS主機中的 料分析主機24 此落點分配表 近目前線上的 最後則為 機率表決定最 落點機率表後 參考更新後的 藉由本發 持續跟著製造 況。本發明可 點位置,如特 存架落點的預 度提向,因此 會,進而提高 本發明雖 發明,任何熟 内’均可作適 分析’藉以得到最 率表。 步驟36 :將該物料 料分析主機分析完 物料運送落點機率 物料運輸的落點分 落點分配表乃決定 將分析完成的機率 的條律則可參考該 生產狀態。 步驟38 : AMHS系統 新之物料的運送落 ,AMHS主機24在進 落點分配表進行物 明,使得AMHS系統 流程進行更新,因 根據物料製造程序 定機台與儲存架, 測準確度。同時, 廠内操作效率也可 製造廠内整體的效 以較佳實施例揭露 習此技藝者,在不 當之更動或潤飾, 接近線上工作者期望的物 運送落點機率表匯入AMHS 刖1 2小時的物料運送資料 表傳回AMHS主機2〇中,更 配表(static table)。 物料運送的條律,因此資 表匯入該落點分配K貝 落點機率表,更新為最接 參考更新之 點。當載入 行物料的運 料的自動化 中一般的落 而更接近廠 預測物料最 因而提高每 由於預測運 提升,減少 率 〇 如上,然並 脫離本發明 因此本發明 物料運 新的物 送控制 運送分 點分配 内運作 可能運 一區域 送落點 了誤送 送落點 料運送 時,則 配。表,可 的現 送的落 中的儲 的準確 的的機 非用以限茨 之精神和襄 之保護範屋491802 V. Description of the invention (8) Material delivery landing point machine for sending parameter data Then proceed to the main machine. After the fund is acquired, the newly allocated material among the AMHS mainframes is analyzed. The main analysis unit is 24. This point allocation table is near the current line. The last is the probability table. After determining the maximum point probability table, the updated reference is used to continue to follow the manufacturing. condition. The present invention can point the position, such as the advancement of the landing point of the special storage rack, so it will, and further improve. Although the present invention is invented, any skilled person can 'appropriate analysis' to obtain the most efficient table. Step 36: After the material is analyzed by the material analysis host, the probability of drop point of material transportation, and the drop point allocation table of material transportation is to determine the probability of completion of the analysis. Step 38: AMHS system When new materials are delivered, the AMHS host 24 specifies the entry and exit point allocation table, so that the AMHS system process is updated, because the machine and storage rack are determined according to the material manufacturing process, and the accuracy is measured. At the same time, the operating efficiency in the factory can also be used to make the overall effect in the factory. It is disclosed in the preferred embodiment that those skilled in the art are improperly altered or retouched, and the table of near-workers' expectations for the drop-off point is imported into AMHS 刖 1 2 The hourly material delivery data table is returned to the AMHS host 20, with a static table. The rules of material transportation, so the data table is imported into the drop point allocation table. The drop point probability table is updated to the point closest to the reference update. When the automation of loading and unloading of materials is generally dropped, it is closer to the factory's predicted materials. Therefore, the increase is due to the predicted shipping. The reduction rate is as above. However, it does not depart from the present invention. The operation within the sub-point distribution may be carried out when an area is delivered to the landing point by mistake. Table, the exact mechanism of the current storage and storage is not used to limit the spirit of the spirit and protect the fan house

0503.6148TW;tsmc2000-0919;peggy.ptd 第11頁 491802 五、發明說明(9) 視後附之申請專利範圍所界定者為準。 (nil 第12頁 0503-6148TWF;t smc2000-0919;peggy.p t d0503.6148TW; tsmc2000-0919; peggy.ptd Page 11 491802 V. Description of the invention (9) Subject to the scope of the attached patent application. (nil p. 12 0503-6148TWF; t smc2000-0919; peggy.p t d

Claims (1)

1 · 一種基於適應性控制 適用於一半導體製造廠中之 法係包括: 改良物料自動化運送之方法 一物料自動化運送系統,該 方 系統產生之運送資料; 間内之上述資料並產生一 入該物料自動化控制系統 持續紀錄該物料自動化運送 每隔一固定時間分析一定時 物料運送落點機率表; 將該物料運送落點機率表匯 中;以及 < 定後ί: Ξ二Ξ :b ί制系統參考該物料運送落點機率表決 俊物枓的運运落點位置。 括·2·根據申請專利範圍第1項所述之方法,其中更包 將該物料運送落點 中之一落點分配表中, 該物料自動化運送 決定後續物料的運送落 3 ·根據申請專利範 資料為每批物料之運送 4 ·根據申請專利範 落點區域為離子植入區 5·根據申請專利範 資料為每批物料之運送 —6·根據申請專利範 落點區域為離子植入區 獨平录匯 、_ 以更新該落點分配表;以及 系統參考更新後的該落點分配表, 點位置。 圍第1項所述之方法,其中該運送 落點區域之機台製造能力。 圍第3項所述之方法,其中該運送 、化學氣相沈積區與黃光區之一。 圍第1項所述之方法,其中該運送 落點區域之物料製造階段。 圍第5項所述之方法,其中該運送 、化學氣相沈積區與黃光區之一。1 · A law system based on adaptive control applicable to a semiconductor manufacturing plant includes: a method for improving the automated transportation of materials-an automated transportation system for materials, the transportation data generated by the party's system; The automatic control system continuously records the material transportation drop point probability table at a fixed time and analyzes the material transportation at a fixed time; the material transportation drop point probability table is compiled; and < after the determination: ί 二 Ξ: b ί system Refer to the material drop point of the material to vote for the location of the drop. Including · 2 · According to the method described in item 1 of the scope of patent application, which includes one of the drop points in the drop point allocation table of the drop point of the material, the automatic transfer of the material determines the drop point of the subsequent material 3 · According to the patent application The data is the transportation of each batch of materials 4 · The area of the landing area according to the patent application is the ion implantation area 5 · The area of the delivery of each batch of material is based on the patent application-6 · The area of the landing area is the ion implantation area according to the patent application Record the exchange, _ to update the point allocation table; and the system refers to the updated point allocation table, point position. The method described in item 1, wherein the machine manufacturing capacity of the transportation landing area. The method according to item 3, wherein the transport, the chemical vapor deposition zone, and the yellow light zone are one of. The method described in item 1, wherein the material manufacturing stage of the transportation landing area. The method according to item 5, wherein the transport, the chemical vapor deposition region, and the yellow light region are one of. i〇yj^ 申請專利範圍 ^ t根據申請專利範圍第5項所述之方法,其中物料製 白又為複數個製造步驟之特定·組合0 次料炎t據申請專利範圍第1項所述之方法,其中該運送 i域i11物料之進行運送之時間、運送落點區域、落點 力、—機口製造能力、落點區域之機台的下階段製造能 9 ^機台之製造階段與指定輸送終點之任意組合。 製造階範圍第8項所述之方法,,中該物料 马硬數個製造步驟之特定組合。 落點區域根為據離V奢始專利範圍第8項所述之方法,其中該運送 為離子植入區、化學氣相沈積區與黃光區之一。i〇yj ^ Scope of patent application ^ t According to the method described in item 5 of the scope of patent application, where the material is white and is a specific number of manufacturing steps. Combination 0 times Method, in which the time for the transportation of the material in the domain i11, the landing point area, the landing point force, the manufacturing capacity of the gate, and the next stage manufacturing capability of the machine in the landing point area 9 ^ The manufacturing stage and designation of the machine Any combination of end points. The method described in item 8 of the manufacturing stage, wherein the material is a specific combination of several manufacturing steps. The landing point area is based on the method described in item 8 of the patent scope of V Sheshi, wherein the transport is one of an ion implantation area, a chemical vapor deposition area, and a yellow light area. 0503 -6148TW; t smc2000 -0919; peggy. p t d 第14頁0503 -6148TW; t smc2000 -0919; peggy. P t d p. 14
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Publication number Priority date Publication date Assignee Title
TWI749256B (en) * 2017-09-08 2021-12-11 日商村田機械股份有限公司 Storage system and purification method of storage system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI749256B (en) * 2017-09-08 2021-12-11 日商村田機械股份有限公司 Storage system and purification method of storage system
US11608229B2 (en) 2017-09-08 2023-03-21 Murata Machinery, Ltd. Storage system and purge method in storage system

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