TW483039B - Wafer start order release system - Google Patents

Abstract

In the manufacturer factory for integrated circuit, a wafer start order release system is used to provide the lot release control model for achieving the maximum production output and the minimum machine cycle time. Thus, multiple kinds of products with different delivery dates and manufacturing processes could be manufactured. The system uses the lot release control and follows the linear program (LP) to reduce the bottleneck in the machines, in order to establish a suitable start order release schedule. Further, the order release system is provided with the contingency capability for minimizing the delayed orders.

Description

483039 A7 B7 V. Description of the invention (Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the Invention Field of the Invention The present invention relates to a scheduling system, especially to a wafer production scheduling system. Background of the Invention: 1C) The goal of manufacturing Weizhong is to assist customers to develop integrated circuits with faster speed and more functions. In order to achieve this goal, there must be a lie force and a σ mouth shell. When the integrated circuit changes It is getting smaller and smaller, and the process technology is getting more and more advanced. The customer's order quantity, delivery date, and delivery volume must be managed by a rule system. In the integrated circuit manufacturing factory, the traditional scheduling rules are first-in, first-out ( First-In First-Out (FIFO), Earliest Due Date (EDD), or Critical Ratio (CR), etc. Due to the complexity of today's integrated circuit processes (more than 300 process steps) ), And the limited resources within the industry are no longer able to meet the needs of integrated circuit production. Inappropriate scheduling rules will cause longer production cycles, reduce the use of the machine, and delay the shipping date and make customers Satisfaction is reduced. In short, improper scheduling will increase production investment costs. Purpose and summary of the invention: This paper size applies the Chinese National Standard (CNS) A4 specification (21 × X 297 mm) (Please read the notes on the back first Fill out this page again) i'line-483039

In the background of the invention described above, in the existing integrated circuit manufacturing plants, there is no suitable scheduling rule that can maximize the production volume and minimize the same production cycle time, and does not delay between m. Therefore, the present invention a; Provide an order release model to achieve this expectation. One of the main objects of the present invention is Sun Mao 1gub. Phantom is to reorder customer orders, first rely on orders that are time-critical, and minimize the number of delayed orders to meet the full-month customer's demand for timely delivery. Still another object of the present invention is to perform in-plant resource allocation, so that the machine can increase the rate and shorten the wafer production cycle time to achieve the maximum amount of production. Confirm the linear item performance (Confirm Line Item Performance; CLIP) Demand to minimize bottleneck conflicts in semiconductor manufacturing plants. According to the above-mentioned purpose, the present invention provides a wafer order release type, which can integrate semiconductor manufacturing process information and customer order requests on a real production line to achieve the best state of shipment rate. (Please read the precautions on the back before filling out this page.) Order · The wafer production scheduling system of the present invention printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is as follows: Calculate the X ratio value of the batch of wafers; Sort the X-scale values of the order; select the batches with X-scale values smaller than the standard X-scale value; confirm that the selected products meet the low range limit, select the above products, generate a production billing plan, and confirm that they meet the paper size Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 483039 Printed by A7 of the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ___ ^ B7 V. Description of the invention () Limited amount of bills to be purchased per day; Meet the high range limit; place an order according to the order plan. The wafer production scheduling system of the present invention is to control the order in which the products are manufactured by using the X-ratio value, the daily limited order quantity, and the maximum range limit and the minimum range limit. In the integrated circuit manufacturing plant, the use of the wafer production scheduling system of the present invention has the advantages of ensuring no delayed orders, high machine utilization, minimized cycle time, and high customer satisfaction. For integrated circuit manufacturers, An effective scheduling system. Brief description of the drawings: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, in which: Figure 1 illustrates the structure of the wafer production schedule of the present invention Illustration. FIG. 2 is a schematic diagram of the wafer production schedule system and the first flow of the present invention. Description of drawing number comparison: 100 scheduled shipments, 100 X ratio value This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page). • Line-483039 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () 104 Low range limit 108 Customer billing status 1 1 2 Number of wafers produced per hour Π 6 Machine scheduling use status 2 0 0 Processing Step 204 Procedure Step 2 08 Decision Step 2 1 2 Selection of Data Step 2 1 6 Procedure Step 220 Procedure Step 2 2 4 Procedure Step Invention Detailed Description: To improve the integration of 'customer billing and limited resources' in the integrated circuit factory, To achieve the optimal state of shipment, the present invention provides a wafer production scheduling system. By using the present invention, the goal of production optimization is achieved. Please refer to Figure 1. Figure 1 shows the schematic diagram of the wafer production scheduling structure of the present invention. The structure description is as follows: After receiving a customer order, 1 0 6 available processing time 1 10 available machines 1 1 4 High-range limit 118 Wafer production scheduling system 2 0 2 Program steps 2 06 Decision steps 2 1 〇. Data selection steps 2 1 4 Program steps 2 1 8 Decision steps 222 Decision steps 226 Processing steps can confirm their scheduled output The delivery date is 1 00, and the available process time is 〇〇6. The X-ratio value of each batch of wafers in the order is calculated as 102. The minimum daily order for Shandong and according to customers' requirements The low-range limit is derived from the amount of 丨 04. If this is the case, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling this page). Installation ·--· Line · 483039 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Ordering batches of orders according to the X-ratio value can obtain a customer's billing status 108. In addition, according to the wafer production scheduling system of the present invention, the number of available machines is 110, the number of wafers produced per hour (Wafer Per Hour; WPH) 112, and the high range limitation caused by the process technology is analyzed and analyzed. Planning, you can get the machine scheduling use status 11 6. Applying the analysis and scheduling of customer billing status 108 and machine scheduling usage status 1 16, and then integrating the order and hardware status to plan the wafer production scheduling system of the present invention. The process is smooth 'to achieve the purpose of production optimization. FIG. 2 is a flowchart of a wafer production scheduling system of the present invention.凊 Referring to FIG. 2, after receiving the wafer order, it starts from processing step 2000, and then proceeds to the next program step 202. The program step 202 indicates that the X proportion value of each batch of wafers is calculated from the scheduled delivery date of each batch of wafers and the available process time. Next, proceed to program step 204, sort each arriving wafer according to the X-ratio value, and list the sort list. Then, a decision step 206 is performed. In this step, according to the customized standard χ ratio value, it is compared with each batch of wafers to determine whether each batch of wafers is smaller than the standard X ratio value. If the judgment value is YES, skip directly to the program step 2 2 4 and perform production on a daily basis according to the production bill. In this way, the processing step 226 may be performed again to end the wafer production scheduling system of the present invention. If the judgment value in the decision step 206 is no, then a decision step 208 is performed to determine whether each batch of wafers is included in the low range limit. For example, 6 paper sizes are applicable to China National Standard (CNS) A4 (210 χ 297 public love) Γ Qing first read the v > i notice on the back before filling in this page} Packing II —J mni H ον · mm · ϋ n •• Line 483039 A7 B7 V. Description of the invention (). If the judgment value is YES, then the data selection step 2 丨 0 is performed, and the candidate batch is selected by the batch wafer that meets the low range limit. If the judgment value in the decision step is no, then the data selection step 2 1 2 is performed, and the candidate batch is selected from the X-scale value sorting list. Next, proceed to step 1 丨 4, and obtain candidate batches from the above-mentioned selection data steps 210 and 212, which can list the production billing days of the batch wafers, and the production billing days must meet the daily billing the amount. Next, step 216 is performed to obtain the high range limitation of the machine from the linearized mode. Then, a decision step 218 is performed to determine whether the production billing plan in the program step 214 meets the high-range limit. If the decision value of decision step 218 is YES, program step 224 is performed, and day-to-day billing can be counted according to the daily production bill. In this way, processing step 226 can be performed to end the wafer production scheduling system of the present invention. (Please read the notes on the back before filling this page) Order. The Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed Rugao's 220 in decision step 218, this step is to remove the production single wafer and batch by batch Wafer X is better than batch. Next, the judgment value of the production bill in the decision step is determined in step 2 2 2 is YES, the daily production bill is counted in the day bill, so the judgment value in the wafer production scheduling system of the present invention is again If not, repeat the batch to generate a production billing plan. If the judgement value is' No ', then the candidate list for the order of batch values that do not meet the high-range limit in the program step plan is selected. Candidate 2 2 2' Judgment the above-mentioned program step 2 2 〇 Can the high-range limit be met ^ If yes, proceed Step 2 2 4 of the program can be processed step by step 226, which ends. Conversely, if step 220 is performed in decision step 222 to select a candidate line, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 483039 A7 B7 V. Description of the invention () According to the above-mentioned architecture of the present invention With the process, the present invention details the χ scale and linear mode as follows: (Please read the notes on the back before filling this page) In this issue of the sun and moon towel, X t is an example of the basis for judging the order rush. The following formula is used to calculate the χ ratio value of each batch of wafers (usually 25 wafers per batch): X ratio value = (Ci-D) / Ti, where Ci is the order shipping order for each batch Said; D is the date of receiving the order, that is, the date of the order;

Ti is the theoretical manufacturing time for the i-th batch of the mother; and (Ci-D) is the process time available for the batch. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, using the scheduled shipping date Ci minus the received order date 0, which is the available granulation time (C i-D) 'divided by the theoretical manufacturing time τ 丨The χ ratio value of the invention. The smaller the X ratio value from the nose, it means that the delivery time is tight, and the time elasticity is small 'must be manufactured first. If the calculated X-scale value is larger ', it means that the manufacturing time of the batch of wafers is more flexible, the delivery time is late, and there can be a sufficient scheduling time. For example, there are four batches of wafers C41233, C31575, C31464, and C31576. The shipping date Ci, the billing date D, and the manufacturing time Ti are applicable to the Chinese National Standard (CNS) A4 specification (210 x 297 mm). (%) 483039 A7 B7 V. Description of the invention (

Time remaining (Ci-D) X ratio 41 days 43 days 63 days 67 days 3.3 • 6 • 0.2 C Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs according to the above table In order, the χ ratio of C4 1 233 is the smallest, which means that its manufacturing time is the fastest, so the batch should be manufactured first. In the present invention, the ideal and ratio is set to 3 · 8 according to the experience value of the integrated circuit factory, and the smaller than 3.8 represents the batch that needs to be processed urgently. It should be noted that the integrated circuit & can be used to determine the desired X ratio according to the actual manufacturing process, order and hardware equipment considerations. The present invention is not limited to this. According to the calculation and judgment of the X ratio according to the present invention, the priorities of the production of αα can be easily divided, and then the wafers are manufactured according to the order of the X ratio, which can define the minimum scope limit of the present invention (Bundund Constraint). This minimum range limit is based on the customer's requirements or the production speed is relatively fast. It is necessary to limit the time, such as the number of products that must be produced every day, in order to meet the customer's delivery requirements. This paper size applies to China National Standard (CNS) A4 specifications (210 χ 297 meals) 483039 A7 B7 V. Description of the invention () In addition, in addition to analyzing the urgency of ordering customer orders, the machine in the integrated circuit factory must also be tested. Evaluate the scheduling rate. The purpose is to ensure that the machine utilization rate reaches the maximum, and the waiting time for making wafers, that is, the cycle time is the minimum, so as to obtain the maximum productivity. The present invention uses a Linear Mode (hereinafter referred to as LP) to define an upper bound constraint (Upper Bound Constraint) for each technology to avoid a process bottleneck (Bottleneck). Among them, the linear mode of the present invention is described as follows: A target function value Y is set, which represents the total of the number of wafers manufactured by various process technologies on a daily basis, as shown in the following formula: Y = Xi + X2 + …… + Xj, where Y is the order quantity per day; and

Xj is the daily order quantity of the j-th technology. The purpose of the present invention is to maximize the daily billing amount ', that is, <1 optimized production. However, the load and scheduling of each machine must be taken into account. ”Yes, the following restrictions have been made according to the characteristics of each machine. • This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please first Read the notes on the back and fill in this page) -III! 1 I yaJ · nnnn I n-Line # · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 483039 A7 ____B7_____ 5. Description of the invention () The first type of machine restrictions: a 11X 1+ a 12X2 + ...... + a 1 jXj SS! * W 1 * A1 * 24, the second type of machine limitation: a2iXi + a22X2 + ... + a2jXj $ S2 * W2 * A2 * 24, i-th machine limitation: aiiXi + ai2X2 + ... + aijXj $ Si * Wi * Ai * 24 And, Xi ^ 0, XQ 0 where aij is the j-th technology of the i-th machine Manufacturing time; Xj is the number of orders per j-th technology; S i is the total number of i-th machines; Wi is the first! The number of wafers per hour for each machine type (please read the precautions on the back before filling this page) and

Ai is the manufacturing time of the first machine type

The Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs printed the above list of machine restrictions to the right, which indicates the first machine of the day <the maximum theoretical manufacturing time, and the left side of the column to the actual manufacturing time of the first machine value. Since the time spent in actual manufacturing cannot be large to the maximum load of the platform, the highest range limitation of the present invention is provided. In ^ 11 this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 483039 5. Description of the invention () Mingzhi: In the production schedule system of (Yueyuan), (manufacturing time Wi (mother-hour production wafer) The number is known to those skilled in the art, and depends on the actual manufacturing process, and a. If this 诹 σ characteristic is known and movable, the present invention is not limited to a specific value. What is more, the above-mentioned linear mode P 6 Define a number of maximum limit ranges, which limit the impact of I. / k-Limits the maximum negative impact of the machine and the process, which should be given priority in the early investment. Take the use of the linear mode 'select number The maximum range limitation, plus the use of xt example sorting, and the selection of several minimum range limitations, can clearly identify the products that are delivered quickly, and optimize the use of the machine. The following is an implementation of the present invention (1) Please refer to the table below. There are 12 batches in the example process of the present invention, and the X ratio is calculated separately, and its characteristics are listed according to the table. (Please read the precautions on the back before filling this page)

-I · I I I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

Technology required for batch X proportion products C31574 3.6 TM5068 25pcs 5 OLogic C31463 4.8 TM5799 2 5 pc s 5 0 L ogic C41232 5.0 TM3 757 25pcs SRAM C41272 3.3 TM3 8 3 6 25pcs SRAM C41572 5.1 TM61 82 25pcs SRAM C31575 3.6 TM6694 25pcs SRAM order --------- line, 12 paper sizes are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) 483039 A7 B7 V. Description of the invention (C3 1464 TM3 605 25pcs 3 5 L o 〇i ο C41233 C3 1576 TM5577 25pcs 3 5Logic TM6687 2 5 pcs 3 5 L o 2 ic C3 1465 TM7658 -λ _____ 2 5 pcs 2 5 L o 〇 * 1 p C41234 C41274 TM6836 2 5pcs 2 5 Logic TM98 89 25pcs 2 5Logic In addition Several restrictions are set at the same time. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs a. According to the present invention, 25L0gic products have a daily low production quantity limit, so $ 2 low The range limits are as follows: a low range limit of 25 Logic: 25L0gic ^ 50pcs; and a low range limit of 50L0glc: 50Logic-25pCS. B. The process technology and machine according to the present invention, wherein In addition to the general capacity limits, SRAM and 35Logic have special capacity limits, so three high-range limits are set as follows: High-range limits for SRAM: SRAMS 50pcs; High-range limits for 35LogiC: 35L0gic $ 75pcs; And restrictions on a single product: each batch of products ^ 50pcs. 13 This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public love) (Please read the precautions on the back before filling this page)

-n n u n n n n -eJ · I 1 I n I .Line · 3030, 5 A7 --- BZ ----- Explanation of the invention () c. In the present invention, the normal billing amount per day is set to 250pcs. (2) According to the order release system of the present invention, selection and sequencing are performed. a. Rule 1: Compare the X ratio of each batch to the standard X ratio. In the present invention, the standard X ratio is set to 3.8. If the X ratio is less than 3.8 and passes the high range limit, this batch is classified as a daily production billing plan. According to this rule, the above 12 batches are selected. Among them, the X ratio is less than 3.8 and the required technology is C3 1 574 (50Logic), C41272 (SRAM), C3 1 575 (SRAM), and C41233 (3 5Logic). The quantities are SRAM = 5Opes, 5OLogicW5pcs, and 3 5Logic = 25pcs. These products all meet the maximum range limit. Therefore, the order from small to large according to the X ratio is shown in the following table: (Please read the precautions on the back before filling this page)-Handwriting · Batch X ratio product quantity technology C41233 3.3 TM5577 25pcs 35Logic C41272 3.3 TM3 83 6 25pcs SRAM C3 1575 3.6 TM6694 2 5 pcs SRAM C31574 3.6 TM5068 25pcs 5 OLogic

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs b. Rule 2: Among the 12 batches, 4 products with an X ratio less than 3.8 are excluded, and the remaining 8 products are selected first with a smaller X ratio value and observed for compliance Minimum range limit as a candidate for the next manufactured product. Row 14 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 483039 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () A7 B7

The order X proportion is shown in the following table: Batch X proportion product quantity _ ^-a 2st _ C3 1465 4, 0 TM7658 2 5 pcs C41234 4.1 TM6836 25pcs C3 1463 4.8 TM5799 25pcs C31464 5.0 TM3605 -iLZ ---- 25pcs C41232 5.0 TM3 757 2 5 pcs C41572-5.1 TM6182 25pcs C31576 5.2 TM6687 2 5pcs C41274 5.8 TM98 89 25pcs It can be known from the minimum range limitation that 25Logic must produce more than 50pcs per day, and 50Logic must produce more than 25pcs per day, because C3 1 was chosen because of% 465 and C4 1 234 are the next candidates.

c. Rule 3: Sort the remaining batches that can pass the high range limit according to the X ratio as follows. Since the SRAM has reached the maximum load value, all 15 paper sizes are excluded from the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling this page). ¾ --- ----- Order -------! · Line one 483039 A7 B7 V. Description of the invention (the SRAM product 'that is, delete two products of 〇 4 1 232 and C4 1 572. Then, select the conditions of 3 5L 0gic, the maximum load of 35 L 0gic For 7 5pcs' and 25pcs has been selected in rule 1, so only 2 products can be selected. According to this rule, there are the following 4 types that meet the criteria, sorted by X proportion as follows: Batch ------ X proportion Number of products — one — technology m__ C31463 4.8 · TM5799 2 5 pcs 5 0 L 〇gl £ _ C31464 5.0 TM3605 2 5 pcs 5 OLogic C31576 5.2 TM6687 25pcs 5 OLogic_ C41275 5.8 TM9889 25pcs 50L〇iii_ d · Rule 4: Check compliance The daily order quantity is 250pcs. Since the batch number selected by g above is 250pcs, which is in line with the daily order quantity, we need to make supplements or reductions. (Please read the precautions on the back before filling this page. )

Customs · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs · Sort the batches selected by the aforementioned rules in order and sort the following batches in proportion to the number of X-scale products ---- 1 C41233 3.3 TM5577 2 5 pcs 4 and τι i —— ^ 1 ^ π ai C C41272 3.3 TM3 83 6 _25 pcs SRAM C3 1575 3.6 TM6694 __? 5pcs SRAM__ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 483039 A7 B7 V. Invention Description () C31574 3.6 TM5068 25 pcs 5 OLogic C3 1465 4.0 TM765 8 25pcs 25L〇Ric C41234 4.1 TM683 6 25pcs 25Logic C31463 4.8 TM5799 2 5 pcs 50Logic C31464 5.0 TM3605 25pcs 50Logic C31576 5.2 TM6687 25pcs 5 OLogic C41275 5.8 TM9889 25pcs 5 Ocs The order listed in this table is for wafer manufacturing. Products with tight delivery schedules can be processed in advance, and other processes can be performed under the schedule, so that production can be optimized. As will be understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below. --------- Γ ----- install --- (Please read the precautions on the back before filling out this page) 1 ^ ·---- Line-Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

483039 AS B8 C8 _ D8 &quot; '---------' ------ 6. Scope of patent application Patent scope 1 · A wafer production scheduling system, the wafer production scheduling system at least Including: calculating a plurality of X-ratio values of a plurality of batches of wafers; sorting according to the X-ratio values of each of the batches of wafers, and listing a sorting list; performing a first judgment step to judge the batches Whether the X ratio values of the wafers are less than a standard X ratio value; if not, a second judgment step is performed to determine whether the batches of wafers meet a low range limit; generate one of the daily order quantities A billing plan; performing a third judgment step to determine whether the billing plan meets a high range limit; and if so, producing according to the billing plan. 2 · The wafer production scheduling system as described in item 1 of the scope of patent application, wherein in the first judgment step, if the judgment result is yes, production is performed directly according to the day of the bill. 3. The wafer production scheduling system according to item 1 of the scope of patent application, wherein, in the second judgment step, if the judgment result is 'y', then the batches of wafers meeting the low-range limit are selected Standby batch. This paper size · Towel @National Standard (CNS_) A4 Specification (210 X 297 Public Love) (Please read the precautions on the back before filling this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs nnan ϋ nnn ϋ ϋ I nn —A I n ϋ n ϋ ϋ nnnnn ϋ ϋ I— nn ϋ 1-! Ϋ -ϋ 483039 A8 B8 C8 D8 VI. Application for Patent Scope 4. The wafer production schedule as described in the patent application No. 丨 顼The system, in the second determination step, if the determination result is negative, a candidate batch is selected from the sorted list. 5. The wafer production scheduling system according to item 1 of the patent application park, wherein in the third judgment step, if the judgment value is no, the batches of crystals that do not meet the high range limit are removed. Circle 'and select candidate batches from the sorted list to perform the third determination step. 6. The wafer production scheduling system as described in item 1 of the scope of patent application, wherein the X ratio of the above standard is 3.8. .-^ -------- ^ --------- line (Please read the notes on the back before filling this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 19 This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm)