TW477447U - Improved structure for thin film keyboard - Google Patents
Improved structure for thin film keyboardInfo
- Publication number
- TW477447U TW477447U TW89212869U TW89212869U TW477447U TW 477447 U TW477447 U TW 477447U TW 89212869 U TW89212869 U TW 89212869U TW 89212869 U TW89212869 U TW 89212869U TW 477447 U TW477447 U TW 477447U
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- improved structure
- film keyboard
- keyboard
- improved
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89212869U TW477447U (en) | 2000-07-26 | 2000-07-26 | Improved structure for thin film keyboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89212869U TW477447U (en) | 2000-07-26 | 2000-07-26 | Improved structure for thin film keyboard |
Publications (1)
Publication Number | Publication Date |
---|---|
TW477447U true TW477447U (en) | 2002-02-21 |
Family
ID=21670841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89212869U TW477447U (en) | 2000-07-26 | 2000-07-26 | Improved structure for thin film keyboard |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW477447U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI740674B (en) * | 2020-08-27 | 2021-09-21 | 致伸科技股份有限公司 | Membrane circuit board and manufacturing method thereof |
-
2000
- 2000-07-26 TW TW89212869U patent/TW477447U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI740674B (en) * | 2020-08-27 | 2021-09-21 | 致伸科技股份有限公司 | Membrane circuit board and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |