TW475831U - subassembly apparatus - Google Patents
subassembly apparatusInfo
- Publication number
- TW475831U TW475831U TW88212545U TW88212545U TW475831U TW 475831 U TW475831 U TW 475831U TW 88212545 U TW88212545 U TW 88212545U TW 88212545 U TW88212545 U TW 88212545U TW 475831 U TW475831 U TW 475831U
- Authority
- TW
- Taiwan
- Prior art keywords
- subassembly apparatus
- subassembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12308498A | 1998-07-27 | 1998-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW475831U true TW475831U (en) | 2002-02-01 |
Family
ID=22406625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88212545U TW475831U (en) | 1998-07-27 | 1999-07-27 | subassembly apparatus |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1247450A (zh) |
GB (1) | GB2340312A (zh) |
TW (1) | TW475831U (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1981003734A1 (en) * | 1980-06-19 | 1981-12-24 | Digital Equipment Corp | Heat pin integrated circuit packaging |
FR2554980B1 (fr) * | 1983-11-10 | 1986-01-17 | Socapex | Connecteur a force d'insertion nulle pour support rectangulaire de circuit et pince de fermeture pour un tel connecteur |
FR2580137A1 (en) * | 1985-04-05 | 1986-10-10 | Omron Tateisi Electronics Co | Assembly of electronic components |
JP2809026B2 (ja) * | 1992-09-30 | 1998-10-08 | 三菱電機株式会社 | インバ−タ装置およびインバ−タ装置の使用方法 |
US5329426A (en) * | 1993-03-22 | 1994-07-12 | Digital Equipment Corporation | Clip-on heat sink |
US5654876A (en) * | 1996-01-05 | 1997-08-05 | International Business Machines Corporation | Demountable heat sink |
-
1999
- 1999-07-26 CN CN 99119788 patent/CN1247450A/zh active Pending
- 1999-07-27 GB GB9917648A patent/GB2340312A/en not_active Withdrawn
- 1999-07-27 TW TW88212545U patent/TW475831U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
GB9917648D0 (en) | 1999-09-29 |
GB2340312A (en) | 2000-02-16 |
CN1247450A (zh) | 2000-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |