TW475183B - Material for transient over-voltage protection device - Google Patents

Material for transient over-voltage protection device Download PDF

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Publication number
TW475183B
TW475183B TW90101338A TW90101338A TW475183B TW 475183 B TW475183 B TW 475183B TW 90101338 A TW90101338 A TW 90101338A TW 90101338 A TW90101338 A TW 90101338A TW 475183 B TW475183 B TW 475183B
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Taiwan
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powder
present
conductor
junction
protection device
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TW90101338A
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Chinese (zh)
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Jiun-Yuan Li
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Inpaq Technology Co Ltd
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Abstract

The present invention relates to a kind of material for transient over-voltage protection device, in which at least more than two kinds of powder materials are uniformly mixed to form the invented material. One of the powder materials has P-N junction, in which the junction is also known as the non-linear resistance junction. The other is the conductor powder. By spreading the conductor powder in between the powder material with P-N junction, the total number of P-N junctions between both electrodes is relatively decreased so as to relatively lower the breakdown voltage of device.

Description

475183 五、發明說明G) |發明之背景 <先4技藝之描述> 習見之氧化辞變阻器之材料 B、Bi、Ba、Si、Sr、pb、_ pF、及其結構,係以氧化辞與 |或其混合材料所構成,氧化姐等二Wn、讥或以等氧化物 一晶界層,此種材料之結構要求化鋅的粒子間形成 理論密度的結構,一般是在理;二2料密度製作成接近 商品化之產品,但此種元件卻呈二90%以上,是一種 丨變阻器⑧備較高之電容*,不適;::此這種材料所製成 種變阻器#_項重大的缺點 電路中,這是此 件之材料’乃屬粉體鬆散堆積心n態過電!保護元 材料組成及相同元件、 因此如果使用相同的 而具備較低的流也散堆積結構, |及天線中。 因此此適用於高頻的電路 丨詈右i化辞變阻器之崩潰電壓與兩電極間之氧介辟曰私叙 里有關,氧化鋅晶粒間存在_声曰=間^氧化鋅晶粒數 =氧化⑯,-般稱為富Μ區層;::二;”為氧化 Ε--· 另-难…表示氧化鋅半導士果Λ電極的-端到 I阻器的Ρ_Ν結構 ¥體m表不畐叙區,因此變475183 V. Description of the invention G) | Background of the invention < Description of the first 4 techniques > The materials of conventional oxidative rheostats B, Bi, Ba, Si, Sr, pb, _ pF, and their structures are based on oxidative terms And | or a mixture of materials, oxidized, such as Wn, osmium, or equivalent oxide-grain boundary layer, the structure of this material requires zinc oxide particles to form a theoretical density structure, generally in principle; 2 2 The material density is made into a commercial product, but this component is more than 90%. It is a varistor with a high capacitance *, not suitable; :: This kind of material is made of a varistor #_ Item major Disadvantages of the circuit, this is the material of this piece 'is a powder loosely stacked heart n-state overcharge! The protection element material composition and the same components, so if the same is used and has a low flow, it is also scattered and stacked, and in the antenna. Therefore, this circuit suitable for high frequency 丨 The breakdown voltage of the right rheological resistor is related to the oxygen between the two electrodes. The existence of zinc oxide grains exists. Hafnium oxide,-generally called the M-rich zone layer; :: two; "is oxide E-· Another-difficult ... represents the P_N structure of the zinc oxide semiconductor Λ electrode-end to I resistor ¥ body m surface No narrative zone, so change

-N-P-N-P-E j: Φ μ 进 mm ,、中’ E為導體電極,每個-N-P-N-P-E j: Φ μ into mm, where E is a conductor electrode, each

Vbl’假設電極間總共存在數:界面=在 r w P界面,崩潰電壓Vb可 第4頁 / J 丄OJ) 五、發明說明(2) 描述為Vbl的總和。 先前的發明,目前尚在申請 才田述為具備P-N界面之案中/、對材料的Vbl ’assumes that there are a total number of electrodes: interface = at r w P interface, the breakdown voltage Vb is available Page 4 / J 丄 OJ) 5. Description of the invention (2) It is described as the sum of Vbl. The previous invention is still in the application. Cai Tian described as having a P-N interface.

型半導體包覆P型半導所;^夕t L積的材枓結構,若以N p-m & β > μ 構成p—N界面之粉體為例,1 p,面之粉體可簡稱為PN粉體〗具 個PN粉體,以p表* p 70 =的兩電極間存在數 電極間的P-N結構可表示為 以N表示频半導體,因此 ^ t N p N ......-P-N-P-S-P-N-P-e :S可以是空氣或S3緣^\粉體與粉體間之間隔層 示,也可以因晶Λ晶粒接觸而Λ間之崩潰電壓以祕 存在—崩潰電壓;;曰曰粒接觸而使侍S不存在,每個Ρ_Ν_ρ 件之崩潰電壓Vb可表干電為極固晶粒所組成,因此元 過去發表的過電壓伴1 _的;和加上Vs的總和。 4,726,99 1發表_種材姿保護7〇件之材料,曾經在卟1^1 末被覆- I絕緣層,此喂後、/料結構為導體或半導體粉 Un帥。ms)的厚户;厚度小於數百原子徑 點,首先,絕緣層:厚=才f結構在實用上具備-些缺 制的製程的困難度極高X木=數百原子徑之内,此厚度控 造成元件之短路,卷:祕=被覆的絕緣層厚度太薄時,易 壓,這是使用絕緣;被=度猶厚’卻又會提高崩潰電 。 覆於導體或半導體粉末表面的缺點 同樣屬於被覆型牡袓TT〇 材料,其材料結構5,294,374發表一種 >篮勒末破覆一層絕緣層與沒有被覆Type semiconductor coated P-type semiconductor; ^ t t L product material structure, if N pm & β & μ powder constituting the p-N interface as an example, 1 p, surface powder can be abbreviated PN powder with a PN powder, p table * p 70 = PN structure between the two electrodes can be expressed as the frequency semiconductor with N, so ^ t N p N ...... -PNPSPNPe: S can be air or S3 edge ^ \ The interval between the powder and the powder is shown, or the breakdown voltage between Λ exists as a result of the contact of the crystal Λ grains-the breakdown voltage; In the absence of S, the breakdown voltage Vb of each P_N_ρ component can indicate that the dry electricity is composed of extremely solid grains, so the overvoltage accompanied by 1_ in the past; and the sum of Vs. 4,726,99 1 published_70 pieces of material posture protection material, once covered at the end of the porphyrin 1-I insulation layer, after feeding, the material structure is a conductor or semiconductor powder Un handsome. ms); the thickness is less than a few hundred atomic diameter points. First, the insulation layer: thick = only f structure is practically available-some unmanufactured processes are extremely difficult. X wood = within several hundred atomic diameters, this Thickness control causes a short circuit of the component. Volume: Secret = When the thickness of the covered insulation layer is too thin, it is easy to compress. This is the use of insulation; Disadvantages of coating on the surface of conductors or semiconductor powders are also coated TT〇 materials, the material structure of which is 5,294,374

r,J丄妃 五、發明說明(3) ,^ ^體的混合物,其被覆厚度介於70原子徑與1微米間 I絕緣Ϊ = Γ以用半導體,基本上,這些材料都是以 的,θ枓或丰導體材料阻絕電流之通過,而達高電阻之目 t破覆層的厚度直接影響元件之崩潰電壓,因 |的均勻性十分重要。 予度 |含右=種^體粉末、半導體粉末或非導體粉末均勻混合於 d:材料之可變電阻材料,已被發表多篇於美國 |4 ’ /、專利號碼分別為 3,685,026、3 685 028、 596及 si:; : = 8,634、5,26。,848、5,294,374、5,393, I性電阻的H,,這些材料的結構的粉末本身並無非線 丨具發明所敘述之内容,本發明的材料i構 I间J新穎性及實用性。 舟 I發明之說明 材料因ΐ i本發明即旨在提供一種暫態過電壓保護元件之 種二:r巧料,乃是混合;:: 以當:接著劑,使這些粉體以鬆散堆二; j f,因此電極間之P_N界面的總數 斤構成 因此降低元件的崩潰。 〜體存在而減少 於多m系統所製作之暫態過電魔保護元件,可、商用 [-種的-件結構;請參閱第一圖所示,係本發明R, J. Concubine V. Description of the invention (3), ^ ^ body mixture, its coating thickness is between 70 atomic diameter and 1 micron I insulation Ϊ = Γ to use semiconductors, basically, these materials are used, θ 枓 or abundant conductor materials block the passage of current, and the thickness of the t-coat layer to achieve high resistance will directly affect the breakdown voltage of the device, because the uniformity of | is very important.度 度 | Variable resistance material containing right = species bulk powder, semiconductor powder or non-conductor powder uniformly mixed with d: material, has been published in the United States | 4 '/, patent numbers are 3,685,026, 3 685 028 , 596 and si :;: = 8,634, 5,26. , 848, 5,294,374, 5,393, H of the resistance, the structure of these materials powder itself is not non-linear 丨 with the content described in the invention, the material of the present invention is novel and practical. The explanation material of the invention of the boat I is because the present invention aims to provide a kind of transient overvoltage protection element II: R material, but mixed; ::: When: Adhesive, make these powders loosely pile two jf, so the total amount of P_N interface between the electrodes constitutes thus reducing the breakdown of the device. The existence of the body and the reduction of the transient over-electric protection element made in the multi-m system, can be used commercially [-species-piece structure; please refer to the first figure, which is the present invention

第6頁 元件結構之實 極22及24形成 極間存在一間 ’再經 到一種 的元件 電壓保 料3 0為 再於材 件,即 施例,以 於基板上 隙28,將 加熱處理 構。 請參閱第 結構之另 主體,經燒結後 料下方形成另一 是另一種暫態過 及、發明說明(4) 暫態過電壓保護 體’先將導體電 平面上,且電 2 6填入此間隙中 秦散結構,即得 另一種可行 明之可行暫態過 本發明之粉體材 $形成電極3 4, —明治結構的元 絕緣性基板2 0為主 ,兩導體電極於同 本發明之粉體材料 使粉體材料堆積成 二圖所示,係本發 一實施例,仍是以 形成塊狀,材料上 電極32,所形成之 電壓保護元件結構 至於本發明之詳細構造、應用原理、 …列依附圖所作之說明即可得到完全的了解。放’則 〈具體實施例之一 &gt; 竭圖;:鋅=發明粉體材料之微觀結構, 型半導體,其組成可含B、Bi、為B_夂導體,被覆層42為p Mn、Sb或Cr等氧化物或i %人1 Sr、Pb、Pr、The actual poles 22 and 24 of the element structure form a gap between the poles, and then there is a kind of element voltage guarantee material 30, which is a material, that is, an example, with a gap 28 on the substrate. . Please refer to the other main body of the structure. After sintering, another is formed under the material. Another transient overcurrent, description of the invention. (4) Transient overvoltage protection body 'First put the conductor level surface and electricity 2 6 into this The Qin San structure in the gap can obtain another feasible and feasible transient powder material of the present invention to form the electrode 34, the elementary insulating substrate 20 of the Meiji structure is mainly used, and the two conductor electrodes are the same as the powder of the present invention. The bulk material makes the powder material pile up as shown in the second figure, which is an embodiment of the present invention. It is still formed by forming a block and the electrode 32 on the material. The voltage protection element structure formed is as far as the detailed structure, application principle of the present invention, ... The description given in the accompanying drawings can be fully understood. Let's use <One of the specific embodiments> Exhaust diagram: Zinc = microstructure of the powder material of the invention, a type semiconductor, whose composition can contain B and Bi, which is a B_ 夂 conductor, and the coating layer 42 is p Mn, Sb Or Cr and other oxides or i% human 1 Sr, Pb, Pr,

料簡稱為含氧化鉍粉體,此被;:::構成’此被覆層材 界面,此為具高電阻之絕二^,化鋅間形成一P~N ’呈現高電阻的狀況,當有;波工作電麗下 當達到P-N界面之崩潰雷厭B主從出現時,電壓迅速増加, 料電阻僅在數Ω _』間,允^大瞬間崩潰’此時之材 允许大電流通過,而將突波能量 475183 _案號 90101338 五、發明說明(6) 年月日_The material is referred to as bismuth oxide-containing powder, and this coating is ::: constitutes the interface of this coating layer, which is the second one with high resistance ^, a P ~ N is formed between zinc compounds, showing a high resistance condition. ; When the wave working electricity reaches the PN interface and the thunderbolt B master-slave appears, the voltage increases rapidly, and the resistance of the material is only between several Ω _ ″, allowing the instantaneous collapse. At this time, the material allows a large current to pass, and The surge energy 475183 _ Case No. 90101338 V. Description of the invention (6) Date

(Pt)、金(Au)、鎳(Ni)、銅(cu)、鎢(W)、慶丄££)、鐵 (Fe)、鋅(Zn)、鈦(Ti)、鈮(Nb)、鉬(Mo)、^7^u)、如 (Pb)、鉉(Ir)粉體中任一元素之合金粉體。 請參閱第四圖所示,係本發明之暫態過電壓保護材 製造方法流程示意圖’其各步驟的說明如下: ’ $驟1,2 :均勻混合氧化辞粉末與含氧化鉍粉末,其 中,氧化辞相對上是N型粉體,其適用之平均粒徑介於&gt;、 0 · 0 1 -1 0 0 // m,尤以平均粒徑介於〇 ·卜j 〇 〇 v m較佳,使用 粒,的大小會影響電極間的粉體數量,所以直接影響元件 之崩潰電壓,其重量百分比較佳是介於5〇 — 97%,含氧化鉍 粕末相對上是P型粉體,其重量百分比較佳為3 — 5 〇 %。 步驟3 :將步驟1,2之混合粉末,以8 〇 〇〜丨6 〇 〇 t的溫 度煆燒,煆燒的過程,含氧化鉍粉體將在高溫下形成液相 丄被覆於氧化鋅粉體表面上,而形成被覆層與氧化鋅間的 曰曰體界面,此界面是一種PN界面或稱為非線性電阻界面, 也可稱為蕭特基能障(Schottky Barrier)。 步驟4 :將步驟3所得的材料經研磨後,形成粉末狀, 此粉末仍保有PN界面的特性。 、步驟5 ··經過步驟4所得的粉體材料,加入習知之結合 劑或溶劑與導體粉體,習知之結合劑如乙基纖維素等高分 子,溶劑如有機醇、有機酯等,經充分均勻混合後,即得 到可以運用之糊狀材料狀態。 &lt;具體貫施例之二&gt;(Pt), gold (Au), nickel (Ni), copper (cu), tungsten (W),) 丄 £), iron (Fe), zinc (Zn), titanium (Ti), niobium (Nb), Alloy powder of molybdenum (Mo), ^ 7 ^ u), such as (Pb), erbium (Ir) powder. Please refer to the fourth figure, which is a schematic flow chart of the method for manufacturing a transient overvoltage protection material according to the present invention. The description of each step is as follows: $ 1,2: uniformly mixing the oxide powder and the bismuth oxide-containing powder, of which, The oxidation term is relatively N-type powder, and its applicable average particle size is between &gt;, 0 · 0 1 -1 0 0 // m, especially with an average particle size between 0 · b j 〇〇vm, The size of the particles will affect the amount of powder between the electrodes, so it directly affects the breakdown voltage of the component. The weight percentage is preferably between 50-97%. The powder containing bismuth oxide is relatively P-type powder. The weight percentage is preferably from 3 to 50%. Step 3: The process of calcining the mixed powder of steps 1,2 at a temperature of 8000 to 6,000 t, the powder containing bismuth oxide will form a liquid phase at a high temperature, and it will be covered with zinc oxide powder. On the surface of the body, a bulk interface between the coating layer and zinc oxide is formed. This interface is a PN interface or a non-linear resistance interface, and it can also be called a Schottky Barrier. Step 4: The material obtained in step 3 is ground to form a powder, and the powder still retains the characteristics of the PN interface. Step 5 ·· The powder material obtained in step 4 is added with a conventional binding agent or solvent and conductive powder, a conventional binding agent such as a polymer such as ethyl cellulose, and a solvent such as an organic alcohol or an organic ester. After uniform mixing, a paste-like material state is obtained. &lt; Specific implementation example 2 &gt;

第 9 頁 2001· 12· 03· 009 五、發明說明(7) 放電之電通本明之靜電放電之反應曲線,曲線1係靜電 圖所示, =70件之反應曲線,靜電來源為8kV,由該 許大量之電」:明顯地看出,材料崩潰後的狀況,此時允 線2所示之雷H過該元件,最大通過電流大於30A。如曲 3〇〇v以下, 線,而電壓峰值(Peak voltage)也僅在 的元件,即胳ί是說當一 8kV的靜電出現時,經過本發明 零組件的i ^電壓降至3〇〇V以下,因此能夠達到保護電子 的雜ί ί本發明的過電壓保護材料,具備過電壓保護材料 的過電壓;;: 此過電壓保護材料結構的改變,所得 、=全保濩兀件,更具有製造及特性穩定、漏電流較低 :小的優點,確實符合於專利之規定。 ,从而陳明者’以上所述者乃是本發明較佳具體的實施例 右依本創作之構想所作之改變,其產生之功能作用,仍 超出說明書與圖示所涵蓋之精神時,均應在本發明之範 圍内,合予陳明。 圖式中元件名稱與符號對照 20 22 24 26 28 : Φ 絕緣基板 導體電極 導體電極 過電壓保護材料 電極間距Page 9 2001 · 12 · 03 · 009 V. Description of the invention (7) Discharge electric current The reaction curve of electrostatic discharge of this invention, curve 1 is shown in the electrostatic chart, = 70 pieces of reaction curve, the source of static electricity is 8kV. "A lot of electricity": It is obvious that the condition of the material after the collapse. At this time, the lightning H shown in line 2 passes the element, and the maximum passing current is greater than 30A. For example, if the voltage is below 300 volts, the peak voltage (Peak voltage) is only in the component, that is, when an 8kV static electricity occurs, the voltage of the component passing through the present invention is reduced to 300. Below V, it is possible to achieve protection of electrons. The overvoltage protection material of the present invention is provided with overvoltage of the overvoltage protection material ;;: The structure of this overvoltage protection material is changed, and It has the advantages of stable manufacture and low leakage current: small, and indeed meets the requirements of patents. Therefore, Chen Mingzhe's above is the preferred and specific embodiment of the present invention. The changes made according to the concept of this creation, and the resulting functional effects are still beyond the spirit covered by the description and illustrations. Within the scope of the present invention, Chen Ming is here. Comparison of component names and symbols in the drawings 20 22 24 26 28: Φ Insulating substrate Conductor electrode Conductor electrode Overvoltage protection material Electrode spacing

第10頁 475183 五、 發明說明 (8) 30 過 電 壓 保 護材料 32 導 體 電 極 34 導 體 電 極 40 氧 化 鋅 42 被 覆 層 氧 化鉍之混合物 A 氧 化鋅 粉 體 B 氧 化 鋅 粉 體 C 氧 化 鋅 粉 體 D 空 間 E 導 體 粉 體 #Page 10 475183 V. Description of the invention (8) 30 Overvoltage protection material 32 Conductor electrode 34 Conductor electrode 40 Zinc oxide 42 Coating mixture of bismuth oxide A Zinc oxide powder B Zinc oxide powder C Zinc oxide powder D Space E Conductor powder #

475183 圖式簡單說明 第1圖為本發明之可行暫態過電壓保護元件結構之實施例 第2圖為本發明之可行暫態過電壓保護元件結構之另一實 施例 第3圖為本發明粉體材料之微觀結構 第4圖為本發明之暫態過電壓保護材料製造方法流程示意 圖 第5圖為本發明之靜電放電之反應曲線圖475183 Brief description of the drawings. Figure 1 is an embodiment of a structure of a feasible transient overvoltage protection element of the present invention. Figure 2 is another embodiment of a structure of a feasible transient overvoltage protection element of the present invention. Figure 3 is a powder of the present invention. The microstructure of the bulk material. Figure 4 is a schematic flow chart of the manufacturing method of the transient overvoltage protection material of the present invention. Figure 5 is a reaction curve of the electrostatic discharge of the present invention.

第12頁Page 12

Claims (1)

475183 六、申請專利範圍 料,其非金屬粉體為石墨粉體。 9.如申請專利範圍第3項所述之暫態過電壓保護元件之材 料,其非金屬粉體可為碳化鎢(WC )、碳化鈦(T i C )或碳化 鈮(NbC)等之碳化物粉體。475183 6. Scope of patent application The non-metal powder is graphite powder. 9. As the material of the transient overvoltage protection element described in item 3 of the scope of the patent application, the non-metal powder may be a carbide of tungsten carbide (WC), titanium carbide (TiC), or niobium carbide (NbC), etc.物 粉体。 Powder. 第14頁Page 14
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425531B (en) * 2009-11-26 2014-02-01 Sfi Electronics Technology Inc Low capacitance multilayer chip vaistor with differenct glass composition formed on ceramic body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425531B (en) * 2009-11-26 2014-02-01 Sfi Electronics Technology Inc Low capacitance multilayer chip vaistor with differenct glass composition formed on ceramic body

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