a 6 B 3 ^ A7 B7 五、發明説明（！） 本申請案主張於1996年5月16日所提案號為US 08/648, 543之美國專利申請案之利益，該案係依照 37 C.P_R. §l,53(b)(2)(ii)申請將於1997年4月18日提出之「非臨 時申請案改為臨時申請案」。 技術範晡： 本發明一般係相關於須藉冷卻以有效發揮功能之裝置 所需之冷卻糸統，尤其相閱於操作期間可放出熱量之電子 系铳、裝置、狼路板及線路卡所需之冷卻系統。 發明背景： 由於微晶片、線路板、鏟路卡、多晶片棋组、電源供 ·. » 應器/轉換器及電力放大器以及其他放熱零__注 （K下稱作 「分件」）之急速大量使用而衍生的問題之一是：該等電 子分件所放熱量必需予以消除。為使該等分件操作發揮最 高功效並減低故陣風險，該等電子分件必須維持在某預期 (請先鬩讀背面之注意事項再填寫本頁) 、τ 冷 決 解 中 其 〇 fi 種 多 很 有 法 方 之 用 常 件 分 子 。電 內卻 園冷 範前 度目 溫. 之 1 同 置不 内 ， 殻間 謭期 之作 件操 分在 子 ， 電是 有但 容 。 :件 是分 法等 方該 種過 一 通 之氣 用空 常使 最迫 題並 問扇 卻風 •1 經濟部中央標準局員工消費合作社印袈 。輸 點率 熱7 多件 許分 現子 出電 致， 導是 而但 因 〇 ，器 同热 不受 亦過 量用 熱使 之曾 生題 產問 件點 分熱 子決 電解 之為a 6 B 3 ^ A7 B7 V. Description of the Invention (!) This application claims the benefit of the US Patent Application No. US 08/648, 543, which was proposed on May 16, 1996. This case is based on 37 C. P_R. §L, 53 (b) (2) (ii) The application will be changed from "non-provisional application to provisional application" on April 18, 1997. Technical specifications: The present invention is generally related to the cooling system required for devices that must be cooled to function effectively, especially in relation to electronic systems, devices, circuit boards, and line cards that can release heat during operation. Cooling system. Background of the invention: Because of microchips, circuit boards, shovels, multi-chip chess sets, power supplies, etc. »Reactors / converters and power amplifiers and other exothermic zero __Notes (hereinafter referred to as" parts ") One of the problems arising from the rapid use is that the heat generated by these electronic components must be eliminated. In order to maximize the effectiveness of these component operations and reduce the risk of failure, these electronic components must be maintained at a certain expectations (please read the precautions on the back before filling out this page), τ cold solution in the 0fi Many are often used in French law. The electricity is cool in the garden, and the front temperature is not the same as the one in the same. The work of the inter-shell period is divided into two parts, and the electricity is there. : The case is that the French and other parties should have a pass through the air to make the most urgent questions and ask the fans. • 1 The Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. The output point rate is more than 7 pieces of heat caused by electricity. The reason is, but because of 0, the same heat is not affected, and the heat is used too much to cause problems.
所遒 ,熱 果之 效聚 卻積 冷部 期内 預除 成消 達圖 為試 -為 M〇 所大 丨常 加非 增得 續變 持已 在業 數器 特熱 瓦受 之4之 ώ 0 雜管 複卻 較冷 在之 ΑΒΚ 0 0 片液 鰭卻 热冷 散有 Μ含 装以 側缡 外園 殼外 護件 之分 件子 分霣 子於 1Β係 有， 容内 於统 曾系 *之 3 本紙張尺度適用令國國家標準（CNS ) Α4規格（210Χ297公釐） r. 8 3 δ 7 a? B7 五、發明説明（2 ) ,以便將熱量傅導至一外熱交換器。但是，躭本發明而言 ,該等冷卻管及熱交換器所需之空間太密集、太昂貴。 某些電子硬體製造商曾引介若干複雜系統，使分件護 殻內之液體冷卻劑直接環繞並接觸地流經電子分件而再流 回護殼中。之後，將冷卻液體收集起來输送至一熱交換器 /冷凝器（通常位於電子分件護毅之外側）。該等系統比較 E3貴而且屬於空間密集型。此外，該等系統僅涉及單相冷 卻，所Μ效率不高。 經濟部中央標準局員工消費合作社印製 (請β先閲讀背面之注意事項再填寫本頁) 電子分件及其他放熱零件液體冷卻系铳之許多商業性 研發工作曾集中在液體冷卻劑嗔氣流衝擊之相關範晒内， 包括：高速、狹窄的單一或多重液髖嗔氣流直接衝擊在待 冷卻之表面上。噴氣流衡擊可能與嗔冷作用栢混淆，尤其 在該兩種方法中，液體冷卻劑均係從一孔口排出並流向受 冷卻之表面；.就流體墜氣流衝擊與一徹底分散及霧 化之液趙微滴衝擊在一特別大之面積上而言，在潦體力學 及熱傳機構方面則具有許多基本及重大差異。噴氣流衝擊 冷卻具有若干缺黏，以致不如噴冷作用。因其對表面之冷 卻效果不夠均匀，需要較高之流速以獲致一相當之平均熱 通量，且焼$ (過渡至蒸氣薄膜，隨著Μ後表面溫度之上 昇而沸騰）$臨界科浦最較晦作-^為低〇 Μ嗔氣流冷卻 時，由於热傳係數較低，在熱通量較低之情況下，某一地 區之外側部分則通渡成為沸騰之薄膜（因此，該處發生臨 界熱通量）。此一現象不僅減低該等地區之热移除量，而 旦增加局部表面之溫度。此一現象瞬間將一增量較大之除 -4 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） β 8 36 T a? 87 五、發明説明（3 ) 熱負荷置於内部地區，但由於熱傳容量方面沒有對應之增 量増加，該等内部地區無法承擔該負荷。因此薄膜沸賸現 象迅速沿徑向内移。 、 為使啧氣流衝擊達成較佳冷卻效果，曾多次試鼴增加 噴氣流之數目，因而減小每一噴氣流冷卻之面積。但是. 整齊而有糸統地送遞及移除大董流體甚為困難，遂而迅速 抵消了該等優點，因此，嗔氣流衝擊無法朦臟地簏罩廣大 的面積。下列說明將可加以澄清：本發明無該等缺點。許 多有醆單相兩氣潦衝_擊冷卻之專利業經公告，其中包含美 國專利 US-4,108,242; 4.912,600; 4,838,041 及 3,844, 3 43 〇 為達成更有效之冷卻作用，曾作過許多有闕噴冷作用 效能之研究及嚯試。作用具有另一優點：蒸發性之相 受化 〇 美國專利 US-4,643,250 ; 4,7 90,37 0 ； 4,643,250; 4,352,392及4,967,829等均曾葑蒸發性冷卻作用之先前技 術作過深入研究。一般而言，先前技術並未成功f蓋因傳 统箝化器不適於實用之噴冷作用或因噴灑距>1 @铳容槙 過大而導致效率不彰。 經濟部中央標準局員工消費合作社印製 (I先閲讀背面之注意事項再填寫本頁) 美國專利US-5,220,804曾揭示一種霧化液髏，經廣泛 地分布嗔灑，衡擊待冷卻電子分件之表面，藉蒸發相變化 法將熱傳至冷卻劑。蒸氣及液體係聚集及移入於一外側冷 凝器。雖然該糸統具有蒸發相變化ίϋ作用之I點，但蒸胃 發及冷凝程序並非在放熱分件之護殺內進行,%體冷卻劑 及蒸氣係箱外側邦浦及冷凝器予以再循環章。在許多應用 -5 * 本纸張尺度適用中围國家橾準（CNS } Α4規格（210Χ 297公釐） 8 367 A7 B7 五、發明説明（4 經濟部中央標隼局員工消费合作社印裝 該系之能 5 器分題係统 將，充熱， 之 件 Μ 式擾功S-應 r 問統系 内器粒放發 底 分 期含干之 U 供作卻系在 殺化噴在蒸 徹 子 常自磁器利 源稱冷該布 護霧 \ 布M更 電 非等電化專 電下及，分 封一滴分加 一 有 ,該免霧國Do、(>^布豸量 密含微狀膜 有 含 途。避之美IP姐丨分系熱 ！包\膜薄 明 内 ί 頃 用統可 ο 該 模件量溫該 在明霧薄劑 發 殼 事系且,8但 Μ 片零熱等將 劑發雲呈卻 本 護 軍側而20*, 晶熱要一並 卻本之係冷 對 該 2 有 及外利,2器 Μ 多放重係源 冷，劑劑體。 可 - 學何有-5化 、他之明點 體散卻卻液去 將 圄 子任為US霧 卡其術發熱 液分冷冷分出 ， 視 電無極利之 路及技本之。之以該體部送 明 透 空而統專術_ 線 Μ 前。出除化加使液一傳 說 解 肮置系國技 、器先决放消霧量並之少量 细：分；、裝之美前丨 板大铳解所以經熱劑化至熱 詳括之統並 訊式限然先— 路放糸 Μ作予用之卻霧將之：Μ包般系器電含局雖於b 線力卻予操地利出冷經賴面明加圖護熱 含自到-優M、電冷可件效係放體。。表說圃附一散 δ 包有受外面 U :片及用均分有明所液内面件要附等係之 ，能間此方 4 要晶器所明子而發件化殼表分摘考該一明 中備空 c多80提微換丨發電進本分篇護之熱之參。圖發 合設對題許0,明 轉 J 本取， 等.以在件放式 解 本 場等統問在22發 / 件，吸内 該用塞分使画瞭 及 (請先閣讀背面之注意事項再填寫本頁) 本紙朵尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 6 8 367 A7 B7 五、發明説明（ 圖二係一護殻之端視斷面圖，該護毅內含有電子分件 及圖一之敢熱系統； 画三馀該護般之前視斷面圖，該護殺内含有罨子分件 及圖一之散热系統； 經濟部中央標準局員工消費合作社印褽 圖三 面圖； 圖四 圖五 H-L-/、 圖t 圈八 詳细說明 所有 圖一所示 件30係安 件盤32内 含霧化器 如圖 護殻20含 31上）及 境内、達 時所放出 40將熱量 熱量有效 A係圔一散熱糸统嗔灌室及嘖灑板之部分前視斷 係圖一散熱糸铳嗔瀟板之側視斷面圖； 係匾四唄灑板之部分俯視圖； 係本發明散熱系統之第二個具體實施例； 係本發明敗熱系統之第三個具體實施例； 係本發明散熱系統之第四個具體實施例。 * # 附圖中之參考編號均係代表相同或類似零件。如 ，密封之護殻20係用以容納電子分件30,電子分 裝在分件卡31上，而分件卡31則係置於一典型分 。圖中並顳示出液體冷卻劑噴灝板100 ,其中包 50及冷卻鰭片22。 二、三及三A所示，係密封護殺20之斷面圖，該 有電子分件30 (該等電子分件30係安裝在分件卡 本發明之散熱系統10。本發明係一位於一封閉環 到等溫平衡之糸統，該糸統吸取電子分件30操作 之點熱源，並透遇護毅20内之液體及氣體冷卻劑 加Μ分散，再經由護骹20及外側冷卻韓片22可將 地消除。 -7 本紙張尺度適用中國國家標準（CNS > Λ4規格（2丨ΟΧ 297公釐） 請- 先 閱 讀 背 意 事 項 再 填 寫 本 頁 Λ68 367 經濟部中央標準局員工消費合作社印裝 Α7 B7五、發明説明（6 ) 在第一涸具體實施例中，散熱器系統10所產生之冷卻 劑40霧化液體微滴，係嗔瀰在待冷卻之電子分件30之表面 上。在操作時.經霧化之液體冷卻劑40雲霧/微滴/噴粒 將與密封護殼20内所含電子分件30相吻合及直接接觸。懕 瞭解的是：此處所用之「霧化」及「經霧化的」係包含具 有微细及/或粗大微滴尺寸之雲霧/微滴/唄粒。應更進 一步瞭解的是：此處所用之「霧化器J ,包含一種裝置， 該裝置可產生具有激细及/或粗大微滴尺寸之雲菝/微滴 /噴粒。在一薄膜蒸發相變化程序中，將熱量傳送給冷卻 劑40。經霉化之液體40可能是「FC 72」冷卻劑，例如 Fluorinert™,係3M公司出品之一種介電冷卻液。 本發明需要較少或完全不需要使用受热器及複雜、昂 貴之管式冷卻系統即可達成預期之冷郤效果。在第一個具 體實56例中（請參閲圖一、二及三），本發明係自含式者。 在許多應用場合，包含電訊、肮空電子學及軍事用途，非 常期望該等設備能有自含式装置而無外側冷卻系統。該等 密封糸统可使電磁干擾問題減至最少。因本發明可缓和受 熱器之空間密集使用並將系統周圍熱點所生之熱量予以分 散，所Μ同樣大小之護殺將可容納更多之電子分件。此乃 軍事用途、肮空電子學及電訊等應用場合之最顯著優點。 因液體冷卻劑40係分散在護殺20内之荽霧/微滴/嗔 粒中，本發明之另一優點是：所需液體冷卻劑40之體積最 小。因該等系統内之液雅冷卻劑係保持在純液體狀態，並 非本發明之雲霧/微滴/唄粒狀態，所以，正如「發明背 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210Χ 297公釐） B 3 6 7 Α7 Β7 經濟部中央標準局員工消費合作社印装 五、發明説明（7 ) 景」一節中所討論者，循環液體系統可使冷卻系統之重量 增加許多。該等糸統内冷卻劑之密度通常大於水，因而對 整個糸統之重量增加許多。此一額外重量在肮空電子學及 許多軍事應用場合非常令人厭惡。 如圖二、三、三A及五所示，許多排成訂製花式之霧 化器50係位於噴漏板100。該嗔漏板100係適當地固定在護 殻20之第一端，因而若干排S化器50係位於分件卡31之各 排間，該等分件卡偽用以支撐待冷卻之電子分件30者。如 圖三Α所示，嗔濶板100係嗔灑室80之第一個分件，該噴 灑室80包含一支持分件81。 如圈二及三所示：經容化之液涠冷卻劑40及蒸發熱量 傳送程序之後冷凝之液體係收集在位於護毅20第二端之儲 榷60内。經由供應管線72,邦浦70將所收集之冷卻劑40再 循環至噴瀰室80,類似典型無電刷汽車燃枓邦浦，邦浦70 最好是一自含式直流無電刷邦浦，其輸出壓力至少為20磅 /平方时。該等邦浦市場可購得。在合意之具體實施例中 ，邦浦70、邦浦馬達及馬達控制器係自含於謅殼20内。 應瞭解的是，在不違背本發明精神之原則下.嗔瀰板 100可能有許多棰煸排及零件與元件代用品。此外，並非 藉K設限，該等霧化器50可K不同之花式編排以符合放熱 分件之钃排（圖二）。 再如圖二及三所示，在操作期間，供應給噴《室80之 液體冷卻劑40,偽供應給每個霧化器50,而於一漩渦室内 產生一冷卻劑40漩渦，當該冷卻劑40離開霧化器50時即予 -9 - (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） 經濟部中央標隼扃員工消費合作社印策 Α7 B7五、發明説明（8 ) 以羅化。 本發明散熱系統之第二個具艚實施例如圖六所示。為 達成更進一步之冷卻效果，在冷卻劑供應管線72上邦浦70 與噴灑室80之間可裝一外側冷卻器1000。由於電子分件瓦 特數增加而使熱負荷繼攮增加時，利用本發明之散熱系统 ,K風扇93迫使空氣通過護殻20及/或外側冷卻鰭片22之 外面。 本發明散熱系統之第三涸具體實施例如圖七所示。圖 七係說明本發明如何使用其他方法Μ產生一液體冷卻劑雲 霧/微滴/嗔粒。經位於護殼20内之櫬械式搅拌器或漿式 授拌器90將液體冷卻劑40加Μ攪伴，收集於儲槽60内，並 將其分散於放熱分件30上。若需進一步冷卻，可再用一護 殼29將冷卻鳍片22包圍起來。並使一冷卻劑400循環穿過 冷卻鳍片22。將熱量傳送至冷卻劑400並將其自放熱分件 護殼傳導出去。 如圖八所示，係說明本發明之第四届具體實跑例。用 一超音波攪拌器92Μ產生液體冷卻劑之雲霧/澉滴/噴粒 ，再將其分敗通過該等放熱分件。若需進一步冷卻效果， 密封護殷20內可包含若干熱交換器管2 00 。經由热交換器 管200將第二®液體或氣髖冷卻劑300加Μ循環。將熱量傅 送至冷郤劑300並陳後將其自放熱分件護般傳導出去。熱 交換器管200之另一優點是：可提供更多冷卻表面，經蒸 發之冷卻劑40可在該等冷卻表面上冷凝並加Μ再循環。 雖然本發明之合意及其他具體實施例業於附圖中予以 -10 _ (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標孪（CNS ) Α4規格（2i〇X297公釐）Therefore, the effect of the hot fruit is accumulated and the pre-division in the cold period is a trial. It is for the trial. It is large for M0. 0 Miscellaneous tube regains colder ΑΒΚ 0 0 Liquid fins dissipate hot and cold. There are sub-assemblies containing sub-spherical outer shell outer casings. The sub-stems are available in 1B, and are included in the system. No. 3 This paper size applies the national standard (CNS) A4 specification (210 × 297 mm) r. 8 3 δ 7 a? B7 5. Description of the invention (2), in order to guide the heat to an external heat exchanger. However, according to the present invention, the space required for such cooling pipes and heat exchangers is too dense and expensive. Some electronic hardware manufacturers have introduced complex systems that allow liquid coolant in the component case to flow directly around and in contact with the electronic component and back into the case. The cooling liquid is then collected and sent to a heat exchanger / condenser (usually located outside the electronic component guard). These systems are more expensive than E3 and are space-intensive. In addition, these systems involve only single-phase cooling and are not efficient. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (Please read the precautions on the back before filling in this page) Many commercial R & D work on liquid cooling of electronic components and other exothermic parts has been focused on liquid coolants and airflow impacts The relevant range of sun exposure includes: high-speed, narrow single or multiple liquid hip iliac crests directly hit the surface to be cooled. Jet flow balancing may be confused with cold cooling, especially in these two methods, the liquid coolant is discharged from an orifice and flows to the cooled surface; on the impact of the fluid falling air flow and a complete dispersion and atomization In terms of the impact of the liquid Zhao microdrop on a particularly large area, there are many basic and significant differences in the body mechanics and heat transfer mechanism. Jet stream impingement cooling has a number of deficiencies that make it less effective than jet cooling. Because its cooling effect on the surface is not uniform, a higher flow rate is required to obtain a comparable average heat flux, and 焼 $ (transition to a vapor film, which boils with the increase in surface temperature after M). The more obscure-^ is a low 0M 嗔 air cooling, because the heat transfer coefficient is low, in the case of low heat flux, the outer part of a certain area passes through to become a boiling film (thus, Critical heat flux). This phenomenon not only reduces heat removal in these areas, but also increases local surface temperatures. This phenomenon instantly divides a larger increment of -4-this paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) β 8 36 T a? 87 V. Description of the invention (3) The heat load is placed on Internal areas, but because there is no corresponding increase in heat transfer capacity, these internal areas cannot bear the load. Therefore, the phenomenon of thin film boiling quickly moves inward in the radial direction. In order to achieve a better cooling effect with radon air impact, it has been tried several times to increase the number of air jets, thereby reducing the area of cooling of each air jet. However, it is very difficult to deliver and remove Da Dong fluid neatly and systematically, and these advantages are quickly offset. Therefore, the radon air impact cannot cover the vast area in a dirty way. The following description will clarify: the present invention does not have these disadvantages. Many patents with single-phase, two-gas impulse cooling have been published, including US patents US-4,108,242; 4.912,600; 4,838,041 and 3,844, 3 43. In order to achieve more effective cooling, many effective Research and test of spray cooling effect. The effect has another advantage: the acceptance of the evaporative phase. 0 US patents US-4,643,250; 4,7 90,37 0; 4,643,250; 4,352,392 and 4,967,829 have previously studied in depth the previous technology of evaporative cooling. In general, the previous technology was not successful. Gein ’s traditional clamp is not suitable for practical spray cooling or the spray distance is too large, resulting in inefficiency. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (I read the precautions on the back and then fill out this page) U.S. Patent US-5,220,804 has disclosed an atomized liquid skull, which has been widely distributed and sprinkled against the electronic components to be cooled On the surface, heat is transferred to the coolant by the evaporative phase change method. Vapor and liquid systems accumulate and move into an external condenser. Although this system has the point I of the role of evaporation phase change, the steaming process and condensation process are not performed in the protection of exothermic components. The% body coolant and steam are recycled on the outside of Bangpu and the condenser. . In many applications-5 * This paper size is applicable to the standard of the central government (CNS) Α4 size (210 × 297 mm) 8 367 A7 B7 V. Description of the invention (4 Printed by the Department of Economic Cooperation The energy 5 device sub-system will be recharged and heated. The M-type disturbance work S-response system is the inner part of the device, and the bottom stage of the device contains dry U. It is used for killing and spraying in the steamer. Liyuan claims that the cloth protects the fog, and the cloth M is more electrified and non-electrical, and the encapsulation is one drop at a time, plus one, the fog-free country Do, (> ^ cloth volume contains a micro-membrane, there is a way. Avoid Zhimei IP sister 丨 Hot! It can be used in the package, thin film and thin film. The module should be used in the case of bright mist thin film, and 8 tablets of zero heat, etc. The side of the army is 20 *, the crystal heat must be cold, but the system is good for the two, and the two devices are more heavy, the source is cold, and the agent. Can-learn how to have -5, other Ming Dian San San, but the liquid to separate the Xunzi as the US mist khaki fever liquid, cold and separate, depending on the path of electricity and technology. The body is clear and transparent. Specialization _ Before the line M. Remove the chemical solution and add the legendary solution to the national technology, the device must first reduce the amount of fog and a small amount of fine: points ;, before the beauty of the installation, the board is large, so it is heated to The detailed and unified information system of heat is limited to the first-Lu Fang M is used for the purpose, but it is fogged: the M package is like the electric device, which is in the b-line force, but the situation is clear. The heat protection includes self-excellent M, electric cooling, and the effect of the cooling system. It is said that the garden is attached with a scattered δ, which is covered by the outer U: film and the inner surface of the liquid with the uniformly divided solution must be attached to the system. This side 4 is based on the crystal case, and the case of the case is divided and tested. This is a backup of the empty c more than 80, and it is replaced by the heat of the power generation into this chapter. Take the Ming J transfer, etc. Take the in-person solution to the field and answer the question at 22 rounds / piece. If you draw it, you should use the plug to draw the picture (please read the precautions on the back before filling this page). The dimensions are applicable to China National Standard (CNS) A4 specifications (210X 297 mm) 6 8 367 A7 B7 V. Description of the invention (Figure 2 is a sectional view of the end of a case, which contains electronic components and Figure 1. Dare to Hot ; Draw three cross-sections of the front view of the nurse, which contains the cricket parts and the heat dissipation system of Figure 1. The three-side view of the seal printed by the employee consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs; , Figure t circle eight detailed description of all the pieces shown in Figure 1 30 series mounting plate 32 contains the atomizer (see Figure 20 and 31 on the cover) and the domestic and local release of 40 heat and effective A series of heat Part of the front view of the cooling system, the irrigation chamber and the sprinkler board is a side sectional view of the heat sink; the top view of the part of the four sprinkler board; is the second heat sink system of the present invention Specific embodiment; It is the third specific embodiment of the heat failure system of the present invention; It is the fourth specific embodiment of the heat dissipation system of the present invention. * # The reference numbers in the drawings represent the same or similar parts. For example, the sealed case 20 is used to receive the electronic component 30, and the electronic component is mounted on the component card 31, and the component card 31 is placed in a typical component. In the figure, the liquid coolant spraying plate 100 is shown temporally, including a package 50 and a cooling fin 22. The two, three and three A are sectional views of the sealed protection and killer 20, which has the electronic sub-component 30 (these electronic sub-components 30 are installed in the sub-card heat dissipation system 10 of the present invention. The present invention is a A closed loop to an isothermally balanced system, this system draws the point heat source of the operation of the electronic component 30, and penetrates the liquid and gas coolant in Huyi 20 and disperses it, and then cools it through Hu20 and outside The piece 22 can be eliminated. -7 This paper size applies to Chinese national standards (CNS > Λ4 specification (2 丨 〇 × 297 mm) Please read the intent and then fill out this page Λ68 367 Staff Consumption of Central Standards Bureau, Ministry of Economic Affairs Cooperative printed A7 B7 V. Description of the invention (6) In the first embodiment, the coolant 40 atomized liquid droplets generated by the radiator system 10 are deposited on the surface of the electronic component 30 to be cooled. During operation, the atomized liquid coolant 40 cloud / droplets / spray particles will coincide with and come into direct contact with the electronic component 30 contained in the sealed casing 20. What I understand is: "" "Atomization" and "atomized" include fine and / or coarse Droplet-sized cloud / droplet / particulate. It should be further understood that the "atomizer J" used herein includes a device that can produce a cloud with a fine and / or coarse droplet size / Droplets / granules. In a thin film evaporation phase change process, heat is transferred to the coolant 40. The moldy liquid 40 may be an "FC 72" coolant, such as Fluorinert ™, a medium produced by 3M Corporation. Electric coolant. The present invention requires less or no heat sink and complicated and expensive tube cooling system to achieve the desired cooling effect. In the first 56 examples (see Figure 1, 2 and 3), the present invention is self-contained. In many applications, including telecommunications, airborne electronics, and military applications, it is highly desirable that these devices have self-contained devices without external cooling systems. These seals The system can minimize the problem of electromagnetic interference. Because the invention can alleviate the space intensive use of the heat sink and disperse the heat generated by the hot spots around the system, the same size of protection can accommodate more electronic components. This is The most significant advantages in applications such as industrial applications, dirty electronics, telecommunications, etc. Because the liquid coolant 40 is dispersed in the mist / droplets / particulates within the guard 20, another advantage of the present invention is: required The liquid coolant 40 has the smallest volume. Because the liquid coolant in these systems is maintained in a pure liquid state, not the mist / droplet / particulate state of the present invention, so, as the "invention back (please read the back Please fill in this page for the matters needing attention) This paper size is in accordance with Chinese National Standard (CNS) Λ4 specification (210 × 297 mm) B 3 6 7 Α7 Β7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of Invention (7) Scenery " As discussed in the section, circulating liquid systems can add significant weight to the cooling system. The density of the coolant in these systems is usually greater than that of water, which adds a lot to the weight of the entire system. This extra weight is very annoying in dirty electronics and many military applications. As shown in FIGS. 2, 3, 3 A and 5, many atomizers 50 arranged in a custom pattern are located on the leakage plate 100. The leakage plate 100 is properly fixed at the first end of the protective case 20, so several rows of adapters 50 are located between the rows of the component cards 31. The component cards are used to support the electronic components to be cooled. 30 people. As shown in FIG. 3A, the fascia plate 100 is the first component of the spraying chamber 80, and the spraying chamber 80 includes a supporting component 81. As shown in circles 2 and 3, the condensed liquid system after the volumetric liquid-liquid coolant 40 and the evaporation heat transfer process is collected in a storage 60 located at the second end of Huyi 20. Through the supply line 72, Bangpu 70 recirculates the collected coolant 40 to the spray chamber 80, similar to a typical brushless car burning Bangpu. Bangpu 70 is preferably a self-contained DC brushless Bangpu. When the output pressure is at least 20 psi. These Bangpu markets are available. In a preferred embodiment, Bangpu 70, Bangpu motor and motor controller are self-contained in the housing 20. It should be understood that, without departing from the principles of the present invention, the microplate 100 may have many rows and substitutes for parts and components. In addition, instead of setting limits by K, the atomizers 50 can be arranged in different patterns to conform to the rows of exothermic components (Figure 2). As shown in FIGS. 2 and 3, during operation, the liquid coolant 40 in the spray chamber 80 is supplied to each atomizer 50, and a coolant 40 vortex is generated in a vortex chamber. Agent -9 is given when leaving the atomizer 50-(Please read the precautions on the back before filling this page) This paper size applies the Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm) Central Standard of the Ministry of Economic Affairs隼 扃 Industrial Consumer Cooperative Cooperative A7 B7 V. Description of the invention (8) In Luohua. A second embodiment of the heat dissipation system of the present invention is shown in FIG. In order to achieve further cooling effect, an external cooler 1000 may be installed between the Bangpu 70 and the spraying chamber 80 on the coolant supply line 72. When the thermal load increases due to the increase in the wattage of the electronic component, using the heat dissipation system of the present invention, the K fan 93 forces air through the outer shell 20 and / or the outer cooling fins 22. A third embodiment of the heat dissipation system of the present invention is shown in FIG. Figure 7 illustrates how the present invention uses other methods M to generate a liquid coolant cloud / droplet / particulate. The liquid coolant 40 plus M is stirred with a mechanical stirrer or a paddle stirrer 90 located in the casing 20, collected in a storage tank 60, and dispersed on the exothermic sub-component 30. If further cooling is required, the cooling fins 22 can be surrounded by a housing 29 again. A coolant 400 is circulated through the cooling fins 22. Heat is transferred to the coolant 400 and conducted away from the exothermic component case. As shown in FIG. 8, it illustrates the fourth specific running example of the present invention. An ultrasonic stirrer 92M was used to generate the mists, droplets, and particles of the liquid coolant, and then it was passed through the exothermic components. If further cooling effect is needed, the heat shield tube 20 may include a number of heat exchanger tubes 200. The second® liquid or pneumo hip coolant 300 plus M is circulated via the heat exchanger tube 200. The heat flux is sent to the coolant 300 and is then conducted out as a self-exothermic component. Another advantage of the heat exchanger tube 200 is that more cooling surfaces can be provided, and the evaporated coolant 40 can be condensed on these cooling surfaces and recirculated. Although the agreement of the present invention and other specific embodiments are given in the drawings -10 _ (Please read the precautions on the back before filling this page) This paper size is applicable to China National Standards (CNS) A4 specifications (2i × 297 Mm)
468 36T Λ7 B7 五、發明説明（9 ) 本明 : 發 是本 的背 解違 瞭不 須在 必 ， 但限 *為 及例 述施 中實 J體 明具 說之 细示 詳揭 Γ 所 上以 K 僅 在不 並並 釋明 闡發 用 代 及 khr 编 新 IA 9 之 件 元 及 件 零 多 許 有 .E-· i 可 , 下 則 原 之 神。 精品 件 分 子 Is 有 含 内 毅0 該 圖 視 透 解 分 之 殻 :護 明一 說像 單一 單画 式 圖 件 分 子 轚 有 含 内 般 該 圖 面 斷 視 ;端 統之 系殻 热護 散一 之係 明二 發圏 本 及 件 分 子 霣 有 含 内 殼 護 該 _ 面 斷 視 前 •’之 铳般 系護 熱該 散係 之三 一 圃 圖 及 斷 視 前 分 部 之 板 瀟 噴 及 室 漏 唄 統 系 熱 ;散 統一 系圖 熱係 敗 A 之三 一 _ 圓 及 圖 面 圈 面 斷 視 測 之 板 瀾 唄 統 糸 熱 散 1 圖 係 四 圖 例 施 實0 ;具 圖個 視二 俯第 分之 部铳 之系 板热 灑散 嗔明 四發 圖本 係係 五六 圖圖 <請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 例例 施施 實實 M5 S 顥遞 具具 個涸 三四 第第 之之 統统 系系 熱熱 散散 發發 本本 係係 七八 圖圃 標 件 元10 要 主 號 統 系 片 器 鰭 熱殻卻 散護冷 本纸張尺度適用中國國家標準（CNS ) A4洗格（2!0X297公釐） Δ 6 8 飞 A7 B7五、發明説明（10) 29 護殼 30 電子分件 31 分件卡 32 分件盤 4 0 冷卻劑 50 霧化器 60 儲槽 70 邦浦 72 供應管線 80 嗔灑室 81 支持分件 90 授拌器 92 超音波攪拌器 100 噴瀰板 20 0 熱交換器管 300 冷卻劑 40 0 冷卻劑 1 0 0 0 冷卻器 (請先間讀背面之注意事項再填寫本頁) 經濟部中夬標準局男工消費合作社印袈 -12 - 本紙伕尺度適用中國國家揉準（CNS ) A4規格（2丨OX297公釐）468 36T Λ7 B7 V. Description of the invention (9) Benming: It is not necessary to explain the deduction of the book, but it is limited to * Explaining the details of Shi Zhongshi ’s J-specific instructions With K, it is only necessary to explain and explain that there are many elements and parts of the new IA 9 compiled by generation and khr. E- · i can, the next god. The high-quality molecular Is contains the inner Yi 0. The shell of this picture is transparent: Hu Mingyi said that the molecule is broken like a single single-painted graph molecule, and the view is broken; The system and the molecule of the Ming Erfa series include the inner shell to protect the surface. _ The face is viewed from the front. • The general system is to protect the heat. Leakage system is heat; Divergent system is heat loss A of Trinity _ Circle and graph circle surface cross-section visual inspection of the Panlan system heat dissipation 1 Figure system four legends implementation 0; The first part of the department's board is hot and scattered. The picture of the four shots is the picture of the fifty-six. ≪ Please read the notes on the back before filling out this page.) Shi Shishi M5 S Haotui has a system of thirty-fourth first system of heat and heat emission. This system is the standard element of the seven or eight figure garden. The main system is the fin hot shell, but it is cold. This paper size applies to Chinese national standards CNS) A4 washing grid (2! 0X297 mm) Δ 6 8 Flying A7 B7 V. Invention description (10) 29 Housing 30 Electronic parts 31 Part card 32 Part tray 4 0 Coolant 50 Atomizer 60 Storage Tank 70 Bangpu 72 Supply line 80 Sprinkler chamber 81 Support parts 90 Blender 92 Ultrasonic stirrer 100 Spray plate 20 0 Heat exchanger tube 300 Coolant 40 0 Coolant 1 0 0 0 Cooler (please first Note on the back of the occasional reading, please fill out this page again)) 袈 袈 12-The standard of this paper is applicable to China National Standard (CNS) A4 (2 丨 OX297mm)