TW468203B - Improved semiconductor manufacturing system - Google Patents

Abstract

An improved manufacturing system for processing semiconductor wafers which includes a (1) plurality of processing stations, (2) a sealed transport tunnel located directly over the processing stations, (3) a transport means to move wafers within the tunnel, (4) interconnection chambers joining the transport tunnel and the processing stations, (5) interface mechanisms in the interconnection chambers to move the wafers to and from the processing stations, and (6) a computer means to control the operations of the transport means, the interface mechanisms, and the processing equipment at the processing stations.

Description

d682〇3 Case number 89108804

V. Background of the Invention: (1) Technical Field of the Invention The present invention relates generally to the automated manufacturing of integrated circuit semiconductor components' and, more particularly, compared with the conventional multi-chip process, It relates to an automated system in which each wafer can be treated as a single device. (2) Explanation of learned skills

In the manufacture of semiconductor devices, most of a circular single crystal silicon semiconductor wafer typically formed of single crystals must undergo a large number of process steps, and those process steps include a surface for forming a silicon dioxide insulating layer. Oxidation, deposition of polycrystalline silicon and / or metal layers, diffusion and / or ion implantation doped into selected regions, lithography / masking / etching operations, multi-layer etching as mentioned above, heat treatment and familiarity with this In other steps of the technology, many ultra-small and complex circuits can be formed on semiconductor wafers by those steps. 'With the steady development of technology', the larger the wafer has been manufactured, it will greatly reduce the The characteristic size of circuit components on a round surface, this process will also lead to a gradually lack of speed of the circuit. As the size of circuits has been reduced, pollution in the air is a cause of serious yield issues. 'Since integrated circuits formed on silicon wafers have very small feature sizes similar to micron or submicron, this will only Short circuit of very small particles or openings in the formed circuits, and during important process steps, such particles will hinder the process chemistry so as not to affect every part of the circuit on the wafer, some contaminating particles will The gap between the lines causes unfinished etching and therefore leads to-redundant bridges, except

4 6 82 Ο 3 _Abandonment number 89108804 V. Inventive theory (2) In addition to this type of physical defect 'due to induced ionization in the gate dielectric layer or depression center, other pollution particles may cause electrical failure> The main sources of particulate contamination are from manufacturing line operators, equipment, or chemicals. Particles generated by the operator in the work area are transmitted through the environment and through physical contact or movement on the wafer surface, for example, through the skin. People who flake off are an important source of particles that are easily ionized and cause blemishes. 'It has been found that 6000 particles are emitted every minute, and one cubic foot of adjacent space is multiplied by a suitable operator. To overcome the early effects of pollution problems, semiconductor components are processed in a clean room with HEPA and suitable operators with an air filter (ULPA) recirculation air system. This step is quite responsible and not always effective. 'Especially in the modern sub-micron feature size, although clean room clothes can reduce the emission of particles', however, they do not completely include emission, and this is inconvenient and uncomfortable for operators to endure the entire work shift in their work . In integrated circuit components, semiconductor wafer movement through the manufacturing system has long used a cassette system to operate the wafer. The wafer is carried to the cassette to be transferred from the processing machinery to the processing machinery. Crystal box === Multi-wafer. The disadvantage of the crystal box system is that because the box system is used to store a lot of wafers, the wafer system is processed by multiple wafers. Therefore, each wafer has a cycle time of 100%. Very long, because more inventory has been placed, this will increase the cost ', and the response time to meet customer requirements will be' outside when wafers are loaded or unloaded, Friction between particles can cause this pollution to occur in a clean environment and stay

4 6 8203

____ Case No. 891Π rib cm 5. Description of the invention (3) There, in addition, the entire batch of wafer box or carrier handling caused the entire batch of wafers to be damaged due to seismic loading. There is an urgent need for 70 fully automated semiconductor manufacturing systems, which are transported between processing areas in a single wafer system without exposing them to particulate air. US Patent No. 4,540, 326 discloses a system for moving wafers in a processing section 'and maintains a clean environment. However, the wafers are loaded and unloaded to a crystal box provided on a trolley. However, this system is a multi-chip operation with the disadvantages described above. US Patent No. 3, 845, 286 discloses _ a kind of wafer processing system 'where a single wafer type is transferred to multiple processing areas with a handling device' When the concept of separate wafer processing is disclosed, it is not necessary to put forward contamination The problem. U.S. Patent No. 5,3 9 9, 5 31 discloses and claims a manufacturing system for processing individual standard cleaning (Sc) wafers, which includes a plurality of closed processing areas, a single standard cleaning (sc '' Wafer manufacturing system '' includes a plurality of channels that communicate with closed processing areas, a device that moves wafers between processing areas, and an interface device that moves wafers from the channel to the processing area. The system occupies most of the clean room area 'significantly increases wafer manufacturing costs. One of the important features of the present invention is to establish a wafer handling and wafer storage area on top of the processing device. The clean room area will be used more effectively. Summary of the present invention: One of the main objects of the present invention is to provide an improved integrated circuit (1C) semiconductor manufacturing system.

468203 __Case number_ 89108804 Che month day 绦 正 _________ V. Description of invention (4) column. Another object of the present invention is to provide an improved manufacturing system 'with better access to the processing area for maintenance. Another object of the present invention is to provide an improved manufacturing system. The clean room space will be more effectively used, and a wafer handling system is provided on the processing equipment so-called section. Another aspect of the present invention is to provide an improved manufacturing system for a conductor wafer according to the present invention. One processing area has a closed area, and one purpose is the above-mentioned purpose of the conveying system and has the proper way. It is suitable for multiple environments. The interconnected circular interface channel and one at least are used for maintaining the processing system, and the device processing device is provided in the through channel and the system directly above it. The 'provide system' includes the ability to maintain a controlled track in the enclosed area. Applicable to other closed circles of each room. 0 An improved manufacturing system. 〇—A kind of one for multiple, one controlled cleaning; and one sealed clean environment, to maintain the connection of an inner area, and semi-finished processing. Management area, every net environment 'Closed handling, with cleanliness of the part, moving figures in the closed area of the crystal Contrast description: 10 System 12 Low floor 14 Ceiling 16 Semiconductor processing area 18 Temporary storage area

8203 ----- Cable No. 89108804_Year 5. Description of the invention (5) 19 Output wafer 20 Closed area 22 Temporary storage area 24 Processing device 28 Closed conveyance channel 30 Interconnecting room 34 Interface device 40 Robotic arm device 42 Crystal Circular carrier 44 Track 46 Shoulder 48 Magnet a Correction better implementation pattern, Body circuit flower board 14 Only display area * is for manufacturing 20, system, implementation of each example _ Please refer to system 1 0 Semiconductor building Description of the capabilities of a single management area of a component can be closed: See Figure 1 for components, such as objects, including individual areas. The number 5 consists of steps required to maintain a suitable area. The Ming manufacturing system is a semiconductor crystal. One with a conductor processing can be controlled. The processing area package is processed in the first figure. There are multiple halves shown in Figure 1. However, the number of operations can be understood. Each combination processes semiconductor elements. The at least one processing device 24 system components must be rounded to make the low floor 12 and the sky area 16. Many of the operations provided in the figure include a closed area controlled clean ring that can be used on the wafer.

Page 8 46 820 3 __Case No. 89108804 _ Month _ Rev. V. Description of the Invention (6) A closed conveying channel 28 is installed in the building 'is a branch supported by the second floor' and is located in the processing area Directly above the enclosed area 20 of 16, the channel 28 is also capable of maintaining a controlled and clean environment within it. The interconnecting channel 30 can occupy the entire area of the roof and on the processing device. The interconnecting room 30 separately The channel 28 and the enclosed area 20 are connected. The interconnected room system is also capable of maintaining a controlled clean environment within f, and can provide a suitable interface device 34 within the interconnected 30 'as shown in FIG. 1. The interface device can be any suitable device, which can move the wafer between the channel 28 and the processing device 24. A typical device is a robotic arm device controlled by a computer program. The device also includes a processing area A temporary storage device for storing wafers before and after the wafers are processed by the processing device. A suitable device can be provided in the conveying channel 28 to move the wafer to be processed from one processing area to another. The device for moving the wafer will affect the interface device 34. The system 10 also includes a device. In order to maintain in the transport channel 28, enclosed area 20 and interconnecting room 30: an ultra-clean environment, these devices are well known in the art, and include an air pump, which can recirculate air through Suitable air filtration ^ »All the operations described above are best controlled by a host computer. 'The electricity can be programmed to track the wafers to be processed, and the operation moves the crystals between the processing areas a in the second pass. The round device is operated in the second interconnection room: Pei 34 'includes a register and can also control the operation of the processing device 24 in the enclosed area 20. A very important feature of the system of the present invention is that the position of the conveying aisle is directly above the processing area. This arrangement allows a large and ... floor space to be vacated on the low floor. These processing areas can be more easily maintained and handled.

46 820 3 Case No. Λ_Ά said Amendment V. Description of the invention (7) Road without interfering with the interconnection room. . A preferred interface device 34, as shown in Fig. I, has an a-circle staggered storage area located on the closed area 20. The closed area 20 is the factory temporary storage. It has a movable container and is used for supporting. Number 4;] the input wafer 19 to be processed, the movable container can enter a second temporary storage area 22 from the interior of the interconnection chamber ⑽ and also has a wafer container for supporting a plurality of processing devices 24 The wafer 19 that has been processed in the process, the temporary storage area L8 is used as a temporary register for placing the wafer to be processed, and the wafer has been processed in the processing device 24 and is waiting to be transferred to the next processing area. A suitable robot arm device 40, as shown in the figure, is located in the channel 28, and is used to provide a mobile wafer between the register and the processing device 24. In each known: for more than one robot arm device β For example, a robotic device may be used to carry an input wafer, and a second robotic device may be used to carry an output wafer. The wafer 19 is moved vertically through the interconnecting chamber 30 into and out of the registers 18, 22, to the processing device 24 in the enclosed area 20. The robot arm device 40 series is suitable for carrying wafers back and forth to the wafer carrier 42 and is supported on the track 44. The wafer carrier 42 series is provided for moving around the gates of the area, round, and located at In channel 28. In operation, the wafer carrier 42 ^ will lift a wafer to be processed in the wafer loading and unloading area, not shown, and carry it to the processing area, which performs the first processing operation, and the machinery in the processing area The arm device can move the wafer from the carrier 42 and place the wafer in the output register 18 or directly place the wafer on the processing device 24. The robotic device 40 can remove a wafer 19 from the temporary storage area 22 or a processing device for carrying to another processing area. A device is provided for inspecting the conveying to the processing area.

Page 10 46 8203 • Cable number 89108 诎 4__year ”_ Chromium__ V. Description of the invention (8) The nature and state of wafer I 9 and its removal. The operation of the entire processing system is controlled by a system computer, which can command the wafer carrier 4 2, a robot arm device 40, a device for checking the properties of the wafer, and a processing device 2 4 〇 In the second figure, This is a preferred embodiment of the wafer carrier 42. As shown, the wafer system provides a shoulder 46 for the wafer 19 along it.

The peripheral surface provides a splice. The carrier 42 is preferably supported on a magnetic track 44. The magnetic track 44 uses a magnet 48 and is provided on the bottom surface. The guideway 44 located in the enclosed room 28 has a cross track, enabling the vehicle to reach any processing area of the system. Any suitable device can be used to push the vehicle along the track 44 as a response to the computer instructions from the system . The manufacturing system of the present invention, which has the above-mentioned transport system and wafers, is located on the processing device depending on the device, resulting in a better passage for maintenance and monitoring.

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^ 处 ^ 装置。 The device. This arrangement can make the device arrangement more efficient, and make the storage space more efficient to use, because this improved channel reduces the maintenance cost of the system. Explanation Although the present invention has been particularly shown and referenced to its preferred embodiments, it should be understood by those skilled in the art that there are various forms. Changes in '1 can be made without departing from the spirit and scope of the invention

d6 82〇 3 Case No. 89108804 Month_Amendment Brief Description of Drawings Figure 1 is a front view of the manufacturing system of the present invention, which illustrates the components of the system and their positional relationships. Figure 2 is a front view of a preferred embodiment of a wafer carrier of the present invention.

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Claims (1)

46 820 3 Case number 89108804 Scope of patent application. A manufacturing system for managing and separately processing semiconductor wafers through a plurality of physical processing areas, the plurality of processing areas are operated on a semiconductor # to manufacture a usable integrated circuit semiconductor system. Including: 'the plurality of processing areas, each processing area has an enclosed area, the closed area is capable of maintaining a controlled clean environment, and has a small processing device disposed in each of the closed areas; ^ A closed handling channel is suitable for maintaining a controlled clean environment within it, the closed handling channel is located directly above the plurality of processing areas; several interconnecting rooms are suitable for maintaining a controlled clean environment within it, Each of the chambers is connected to the top of the seal of one of the processing areas and to the closed conveying channel; ^ -Interface device 'is located in each of the interconnected rooms to back and forth the processing in the closed area of the processing area. Wafer transfer between the device and the closed transfer; ^ a ;: a transfer channel to move the device to be processed between interface devices in the interconnection chamber; and One use = maintain the manufacturing system described in item 1 in (1) the closed area of the processing area, (2) the closed handling ^ 'and (3) the controlled clean environment in the interconnected room, where the processing ^ Jing 'put the low floor of the building' and the closed transport pass on the high floor of the building. 2 ^ 5 820 3 Case number 891fl8RfM 六 、 Applicable patent range garden 3 * If the patent application scope system 1 refers to the device for moving wafers by this system 4 · If the patent application scope interface device includes processed wafers among the wafers to be processed Moving in the conveying channel 5 * As the register of the wafer to be processed in the scope of the patent application is the manufacturing system described in item 1, it is used to track each wafer to be processed, and The robot is activated by the chain (2) the interface device, and (3) the processing device through the handling chamber. : The manufacturing system according to item 1, wherein each of the registers is stored in a processing area and (?) A register is used to store a processing device while waiting to be removed via the device to the closed wafer. The manufacturing system according to item 4, wherein the register storing the circle and the processed crystal are located in the interconnection chamber. 6. The manufacturing system according to item 5 of the scope of patent application, wherein the device for moving the crystal circle is a robot arm device. 7 · The manufacturing system according to item 5 of the scope of patent application, wherein the device for moving the wafer includes (1)-a first robot arm device for providing wafers moving in the closed transfer channel, To the register storing the wafer, to the processing device, and (2) a second robotic arm device is used to provide the device that moves the wafer to store the processed wafer after processing the processing device. Register, to the closed transfer channel 0 8 · The manufacturing system described in item 1 of the patent application range, wherein the device for moving the wafer includes a wafer carrier, a track in the closed transfer channel, and May be in all of the processing devices of the manufacturing system /! 6 82 0 3 Case No. 89108804 Amended on January 1st, the scope of patent application is in and out. 9 * The manufacturing system according to item 8 of the scope of the patent application, wherein the track is a magnetic track, and the wafer carrier has a plurality of magnets to support the carrier on the magnetic track. I 0 · The manufacturing system according to item 9 of the scope of patent application, wherein the wafer carrier has a shoulder to support a wafer along the surrounding area of the bottom • 〇II * As described in item 8 of the scope of patent application The manufacturing system further includes a system computer for controlling operations of the wafer carrier, the first and second robot arm devices, and the processing device. 12 • The manufacturing system described in item 11 of the scope of patent application, there is also provided a device for checking the characteristics of the wafer to be processed in the manufacturing system. Page 15