TW465803U - Multi-chip stack structure - Google Patents

Multi-chip stack structure

Info

Publication number
TW465803U
TW465803U TW89218678U TW89218678U TW465803U TW 465803 U TW465803 U TW 465803U TW 89218678 U TW89218678 U TW 89218678U TW 89218678 U TW89218678 U TW 89218678U TW 465803 U TW465803 U TW 465803U
Authority
TW
Taiwan
Prior art keywords
stack structure
chip stack
chip
stack
Prior art date
Application number
TW89218678U
Other languages
Chinese (zh)
Inventor
Geng-Shin Shen
Ruenn-Bo Tsai
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89218678U priority Critical patent/TW465803U/en
Publication of TW465803U publication Critical patent/TW465803U/en

Links

TW89218678U 2000-10-25 2000-10-25 Multi-chip stack structure TW465803U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89218678U TW465803U (en) 2000-10-25 2000-10-25 Multi-chip stack structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89218678U TW465803U (en) 2000-10-25 2000-10-25 Multi-chip stack structure

Publications (1)

Publication Number Publication Date
TW465803U true TW465803U (en) 2001-11-21

Family

ID=21674327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89218678U TW465803U (en) 2000-10-25 2000-10-25 Multi-chip stack structure

Country Status (1)

Country Link
TW (1) TW465803U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921968B2 (en) 2003-05-02 2005-07-26 Advance Semiconductor Engineering, Inc. Stacked flip chip package
US8237249B2 (en) 2009-03-27 2012-08-07 Chipmos Technologies Inc. Stacked multichip package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921968B2 (en) 2003-05-02 2005-07-26 Advance Semiconductor Engineering, Inc. Stacked flip chip package
US8237249B2 (en) 2009-03-27 2012-08-07 Chipmos Technologies Inc. Stacked multichip package

Similar Documents

Publication Publication Date Title
AU9447701A (en) Package
AU2001234972A1 (en) Semiconductor structure
SG91352A1 (en) Semiconductor package
GB0024796D0 (en) Package
GB0130932D0 (en) Improved stack architecture
TW465803U (en) Multi-chip stack structure
PL112567U1 (en) Factory-protected package
TW497757U (en) Multi-chip packaging structure
TW426220U (en) Semiconductor stack structure
TW486151U (en) Semiconductor stack package structure
TW462536U (en) Chip package structure
TW428699U (en) Lampstand structure
TW478395U (en) Powder-particle separator
TW472952U (en) Stack structure for semiconductor
CA89059S (en) Package
CA89813S (en) Package
TW420381U (en) Flip chip stack structure
TW510351U (en) Improved structure for envelope
CA93565S (en) Stack chair
CA93566S (en) Stack chair
TW443582U (en) Stacked type chip-size package
PL338651A1 (en) Package
PL338971A3 (en) Package
AU147084S (en) Package
HU0400614D0 (en) Package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees