TW465059B - Image chip packaging structure - Google Patents

Image chip packaging structure Download PDF

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Publication number
TW465059B
TW465059B TW089121413A TW89121413A TW465059B TW 465059 B TW465059 B TW 465059B TW 089121413 A TW089121413 A TW 089121413A TW 89121413 A TW89121413 A TW 89121413A TW 465059 B TW465059 B TW 465059B
Authority
TW
Taiwan
Prior art keywords
cover
image chip
open end
lens
circuit board
Prior art date
Application number
TW089121413A
Other languages
Chinese (zh)
Inventor
Wen-Wen Chiou
Original Assignee
Wen-Wen Chiou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wen-Wen Chiou filed Critical Wen-Wen Chiou
Priority to TW089121413A priority Critical patent/TW465059B/en
Application granted granted Critical
Publication of TW465059B publication Critical patent/TW465059B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Packaging Frangible Articles (AREA)

Abstract

The present invention relates to an image chip packaging structure, which comprises a carrier plate, an image chip, a cover and at least a lens. The image chip is electrically connected to the functioning surface of the carrier plate. The cover has a chamber and a first opening end and a second opening end connected to the chamber. The cover is fixed to the carrier plate in the fashion that the first opening end is sealed and engaged to the functioning surface, so that the image chip can be located inside the cover chamber. The lens comprises a tube body and at least a lens fixed inside the tube body, which is fixed to the cover in the fashion to seal the second opening end, whereby, an image chip packaging structure with simpler structure, lower cost can be provided.

Description

465059 經濟部智慧財產局員工消費合作社印製 .A8 ll 99年04月26日更正替換 D8 --- 室之周壁上具有一階環部; 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者;以及 一透明保護板,係固設於該蓋體容室中,且位於該鏡 片與該晶片之間者,及其一表面外緣係固接於該容室之階 環部上。 3. —種影像晶片模組構裝結構,包含有: 一電路板,具有一作用面,該作用面上至少電性連接 有一電子元件.; 一影像晶片,係與該電路板電性連接地承置於該電路 板作用面上; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 面上之方式固接於該電路板上,使該影像晶.片得位於該蓋 體容室·中,但不包含電子元件位於該蓋體外部; 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者;以及 一透明保護板,係固設於該蓋體容室中,且位於該鏡 片與該晶片之間者,保護板之周側嵌置固接於該蓋體容室 之周壁上。 4. 一種影像晶片模組構裝結構,包含有: 一電路板,具有一作用面,該作用面上至少電性連接 有一電子元件; 一影像晶片,係與該電路板電性連接地承置於該電路 板作用面上; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 -13 - (請先閱讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4C格(210X297公嫠) 465059 經濟部智慧財產局員工消費合作社印製 .A8 ll 99年04月26日更正替換 D8 ___ 面上之方式固接於該電路板上,使該影像晶片得位於該蓋 體容室中,但不包含電子元件位於該蓋體外部; 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者;以及 一透明保護板,其具有防光線反射之效果,且固設於 該蓋體容室中,並位於該鏡片與該晶片之間。 5. —種影像晶片模組構裝結構,包含有: 一電路板,具有一作用面,該作用面上至少電性連接 有一電子元件.; 一影像晶片,係與該電路板電性連接地承置於該電路 板作用面上; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 面上之方式固接於該電路板上,使該影像晶.片得位於該蓋 體容室·中,但不包含電子元件位於該蓋體外部; 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者;以及 一透明保護板,其具有阻隔紅外線之效果,且固設於 該蓋體容室中,並位於該鏡片與該晶片之間。 6. —種影像晶片模組構裝結構,包含有: 一電路板,具有二作用面,該作用面上至少電性連接 有一電子元件; 一影像晶片,係以覆片技術與該電路板電性連接地承 置於該電路板作用面上; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 面上之方式固接於該電路择上,使該影像晶片得位於該蓋 -14- (請先閱讀背面之注意事項再填寫本頁)465059 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A8 ll April 26, 1999 Corrected and replaced D8 --- The peripheral wall of the room has a first-order ring; at least one lens is used to seal the second open end And a transparent protective plate, which is fixedly disposed in the cover housing chamber and is located between the lens and the wafer, and a surface outer edge thereof is fixedly connected to the The step ring of the chamber. 3. —An image chip module structure including: a circuit board having an active surface, and at least one electronic component is electrically connected to the active surface. An image chip is electrically connected to the circuit board. The cover body has a receiving chamber and a first open end and a second open end which communicate with the receiving chamber; the cover system is sealed against the first opening end; The active surface is fixed to the circuit board so that the image crystal is located in the cover container, but does not include electronic components outside the cover; at least one lens is used to seal the The method of the second open end is fixed to the cover; and a transparent protective plate is fixed in the cover container and is located between the lens and the wafer, and the protective plate is embedded on the peripheral side. It is fixed on the peripheral wall of the cover body compartment. 4. An image chip module structure, comprising: a circuit board having an active surface, at least one electronic component is electrically connected to the active surface; and an image chip is electrically connected to the circuit board. On the active surface of the circuit board; a cover having a receiving chamber and a first open end and a second open end in communication with the receiving chamber, the cover system is sealed against the action with the first open end- 13-(Please read the notes on the back before filling out this page) The size of the paper used for this edition is applicable to the Chinese National Standard (CNS) A4C (210X297). 465059 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A8 ll 99 04 On June 26th, the method of replacing the D8 ___ face was fixed to the circuit board so that the image chip must be located in the cover body compartment, but not including the electronic components outside the cover body; at least one lens, which can be A method of sealing the second open end and being fixedly connected to the cover; and a transparent protective plate which has an effect of preventing light reflection and is fixed in the cover housing chamber and located between the lens and the wafer between. 5. —An image chip module structure including: a circuit board having an active surface, at least one electronic component is electrically connected to the active surface; and an image chip is electrically connected to the circuit board. The cover body has a receiving chamber and a first open end and a second open end which communicate with the receiving chamber; the cover system is sealed against the first opening end; The active surface is fixed to the circuit board so that the image crystal is located in the cover container, but does not include electronic components outside the cover; at least one lens is used to seal the The method of the second open end is connected with the cover body; and a transparent protective plate which has the effect of blocking infrared rays and is fixed in the cover body chamber and located between the lens and the chip. 6. —An image chip module structure including: a circuit board with two active surfaces, at least one electronic component is electrically connected to the active surface; an image chip, which is electrically connected to the circuit board by a lamination technology. The cover body has a receiving body and a first open end and a second open end communicating with the receiving room; the cover system is sealed with the first open end; It is fixed to the circuit selection by way of resisting the active surface, so that the image chip must be located on the cover-14- (Please read the precautions on the back before filling this page)

本紙張尺度逋用中國國家標準(CNS ) A4規格(210Χ297公釐) 465059This paper uses Chinese National Standard (CNS) A4 size (210 × 297 mm) 465059

ABCD 99年04月26日更正替換 經濟部智慧財A局員工消費合作社印製 體容室中,但不包含電子元件位於該蓋體外部;以及 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者。 7,—種影像晶片模組構裝結構·,包含有: 一電路板,具有一作用面,該作用面上具有一凹陷, • 及至少電性連接有一電子元件; 一影像晶片,係與該電路板電性連接地承置於該電路 板作用面上,並位於該凹陷内; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 面上之方式固接於該電路板上,使該影像晶片得位於該蓋 :體容室中,但不包含電子元件位於該蓋體外部;以及 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者。 | 8.·—種影像晶片模組構裝結構,包含有: i 一電路板,具有一作用面,該作用面上至少電性連接 有一電子元件; 一承載板,係電性連接地固設於該電路板作用面上; ;· 一影像晶片,係固設於該承載板,且與該承載板電性 連接; 一蓋體,具有一容室及與該容室連通之一第一開口端 及一第二開口端,該蓋體係以該第一開口端封抵於該作用 面上之方式固接於該電路板上,使該影像晶片得位於該蓋 體容室中,但不包含電子元件位於該·蓋體外部;以及 至少一鏡片,係以可封住該第二開口端之方式,與該 蓋體固接者。 -15- 本紙張尺度適用中國國家標準(CNS)A4^格(210X297公釐) (諳先閲讀背面之注意事項再填寫本頁)ABCD April 26, 1999 Corrected the replacement of the printed body room of the Employee Cooperative of the Intellectual Property A Bureau of the Ministry of Economic Affairs, but excluding the electronic components located outside the cover; and at least one lens to seal the second opening End way, who is fixedly connected with the cover. 7, an image chip module structure structure, comprising: a circuit board having an active surface, the active surface has a depression, and at least an electronic component is electrically connected; an image chip is connected with the The circuit board is electrically connected to the circuit board's active surface and is located in the depression. A cover has a receiving chamber and a first open end and a second open end which communicate with the receiving chamber. The cover system is fixed to the circuit board in such a manner that the first open end is sealed against the active surface, so that the image chip is located in the cover: body chamber, but does not include electronic components outside the cover body; And at least one lens is fixed to the cover body in such a manner as to seal the second open end. 8. · —An image chip module structure including: i a circuit board with an active surface, at least one electronic component is electrically connected to the active surface; a carrier board is fixedly connected electrically On the active surface of the circuit board; · an image chip fastened to the carrier board and electrically connected to the carrier board; a cover having a receiving chamber and a first opening communicating with the receiving chamber End and a second open end, the cover system is fixed to the circuit board in such a way that the first open end is sealed against the active surface, so that the image chip is located in the cover body compartment, but does not include The electronic component is located outside the cover; and at least one lens is fixed to the cover in such a manner as to seal the second open end. -15- This paper size applies to Chinese National Standard (CNS) A4 ^ (210X297 mm) (谙 Please read the notes on the back before filling in this page)

•1T• 1T

TW089121413A 2000-10-13 2000-10-13 Image chip packaging structure TW465059B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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