TW460611B - Process for cleaning showerhead for a chemical vapor deposition chamber - Google Patents

Process for cleaning showerhead for a chemical vapor deposition chamber Download PDF

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Publication number
TW460611B
TW460611B TW88108628A TW88108628A TW460611B TW 460611 B TW460611 B TW 460611B TW 88108628 A TW88108628 A TW 88108628A TW 88108628 A TW88108628 A TW 88108628A TW 460611 B TW460611 B TW 460611B
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Taiwan
Prior art keywords
gas
water
ammonia
item
distributor
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TW88108628A
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Chinese (zh)
Inventor
Neng-Huei Yang
Hung-Lin Shr
Tzan-Chi Ju
Jung-Jie Ruan
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Winbond Electronics Corp
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Publication of TW460611B publication Critical patent/TW460611B/en

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Abstract

The present invention provides a process for cleaning a showerhead for a chemical vapor deposition chamber. First, the showerhead is dipped into an alkaline reagent containing ammonium water so as to remove aluminum fluoride attached on the showerhead. Subsequently, the residual alkaline reagent remaining on the showerhead is removed. The showerhead is made of an aluminum-containing component, and the aluminum fluoride is obtained from the reaction of a plasma of a fluorine-containing gas used for cleaning the chamber and aluminum. By using the ammonia water-containing alkaline reagent, the showerhead for a chemical vapor deposition chamber can be effectively cleaned. Thus, the process stability can be increased and the life span of the showerhead can be lengthened.

Description

4606 1 1 五、發明說明(1) 本發明係有關於一種化學氣相沉積反應室之氣體分配 器的清洗方法,特別有關於使用含有氨水之鹼性藥劑來除 去氣體分配器上所附著之氟化鋁的清洗方法。 在積體電路製造過程中,通常須使用氧化矽作為金屬 導線間之介電層,主要因其介電係數小及導熱性佳之故。 由於金屬導線材質為鋁金屬或合金,其融點均小於500 °C,因此對於氧化矽介電層之沉積溫度需限制在4 5 0 °C以 下。 目前運用於沉積金屬層間之氧化矽製程主要為〇zone 丁£08〇又1(16(臭氧-四乙基矽酸(七61^&61:11〇乂78 114&七6)氧 化物)’ ΡΕ-Oxide(電漿辅助(plasma-enhanced)氧化物)等 等。由於晶圓面積逐漸變大,單一晶片之反應室因具備多 項優點而漸成趨勢。而此單一反應室共通之操作流程為 Ozone催化或電漿促進沉積及使用原地(In_Situ)電漿法清 除反應室中之氧化石夕交替進行。 晶片反應室中,擔任氣體流量平均分佈及 在單 一, ,— )·、ν* 肌玉! •^刀 Ί叩认- % 人為氣體分配器(showerhead)。氣體分配器之材質 =銘金因製程需要或有表面進行陽極化處理者。當使 反;^法以清洗反應室中之氧化石夕肖,所使用之 原ΐ而斑Ϊ氟化物,其反應機制為,於電漿作用下產生氟 出,而;氧ΐ矽作用生成揮發性氟矽化合物而被幫浦抽 清洗氧化石夕的S的。 分配器大,於電漿之辅助之下’其易與氧體 口“或氣化鋁作用而生成高沸點之氟化鋁,附4606 1 1 V. Description of the invention (1) The present invention relates to a method for cleaning a gas distributor of a chemical vapor deposition reaction chamber, and particularly to the use of an alkaline agent containing ammonia to remove fluorine attached to the gas distributor. How to clean aluminum. In the manufacture of integrated circuits, silicon oxide is usually used as the dielectric layer between the metal wires, mainly due to its small dielectric constant and good thermal conductivity. Since the metal wire is made of aluminum metal or alloy, and its melting point is less than 500 ° C, the deposition temperature of the silicon oxide dielectric layer needs to be limited to below 450 ° C. At present, the silicon oxide process used for depositing metal layers is mainly zonezone 08 0800 and 1 (16 (ozone-tetraethylsilicic acid (seven 61 ^ & 61: 11〇 乂 78 114 & seven 6) oxide) 'ΡΕ-Oxide (plasma-enhanced oxide) etc. As the wafer area becomes larger, the reaction chamber of a single wafer is becoming more and more popular due to its many advantages. The common operation flow of this single reaction chamber For Ozone catalysis or plasma to promote deposition and use in-situ plasma method to remove oxidized stones in the reaction chamber alternately. In the wafer reaction chamber, the gas flow is evenly distributed and in a single,-) ·, ν * Muscle Jade! • ^ Knife Recognition-% artificial gas dispenser (showerhead). Material of gas distributor = Ming Jin needs to be anodized due to the process or has a surface. When the reaction is reversed, the method is to clean the oxidized stone in the reaction chamber, and the original fluoride is used. The reaction mechanism is that fluorine is generated under the action of plasma. The fluorinated silicon compound is pumped to clean the oxidized stone. The distributor is large, with the aid of plasma, it ’s easy to interact with oxygen gas mouth or vaporize aluminum to produce high boiling aluminum fluoride.

4606 1 14606 1 1

著於氣體分配器表面及其供氣體進入反應室之孔洞内,而 造成後續沉積氧化矽薄膜之沉積速率、應力及蝕刻率等特 性改變,使維持製程穩定相當困難,同時氣體分配器之壽 命將縮短’且高頻率之預防維護(PM; preventive ^ maintenance)將無法避免。因此,有必要對於氣體分配器 定時清洗。 現今清洗氣體分配器之方法,多僅採用D.〗.水(去離 子水)加超音波震盪後烘乾。由於此方法無法有效去除氟 化紹附著物,因而逐漸累積,造成電漿及氣體流動模式變 易’增加參數調動頻率及縮短氣體分配器壽命。Focusing on the surface of the gas distributor and the holes for the gas to enter the reaction chamber, the subsequent changes in the deposition rate, stress, and etch rate of the silicon oxide film are deposited, making it difficult to maintain the stability of the process. Shortening 'and high frequency preventive maintenance (PM; preventive ^ maintenance) will be unavoidable. Therefore, it is necessary to clean the gas distributor regularly. The current method of cleaning gas distributors only uses D.〗. Water (deionized water) plus ultrasonic vibration and drying. Because this method cannot effectively remove the attachments of fluoride, it gradually accumulates, resulting in a change in the plasma and gas flow patterns. It increases the frequency of parameter adjustment and shortens the life of the gas distributor.

因此’本發明之目的即為解決上述問題,而提供—種 化f蒸氣沈積反應室之氣體分配器的清洗方法,可清洗氣 體分配器上所附著之氟化鋁’增加製程穩定度及延長, 分配器的壽命’且無金屬污染之虞。 ^達成本發明之目的’本發明提供一種化學氣相沉積 反應室之氣體分配器的清洗方法,包括以下步驟: 、(a)將該氣體分配器浸泡於含有氨水之鹼性藥劑中, 以除去氣體分配器上所附著之氟化鋁;以及 (b)去除殘留於該氣體分配器上的殘鹼。Therefore, 'the purpose of the present invention is to provide a method for cleaning a gas distributor of a chemical vapor deposition reaction chamber, which can clean the aluminum fluoride attached to the gas distributor' in order to solve the above problems, to increase process stability and prolong, The life of the distributor 'is free of metal contamination. ^ Achieving the Purpose of the Invention 'The present invention provides a method for cleaning a gas distributor of a chemical vapor deposition reaction chamber, including the following steps: (a) immersing the gas distributor in an alkaline agent containing ammonia to remove Aluminum fluoride attached to the gas distributor; and (b) removing residual alkali remaining on the gas distributor.

而該氣體分配器是由含鋁成份製得,上述之氟化銘係 由用以清洗反應室之含氟電漿清洗氣體與鋁反應而得。’、 如前所述,當清洗CVD反應室是採用含氟電漿清洗氣 體’且反應室内之氣體分配器是由含鋁成份所製得時, I電聚清洗氣體會與氣體分配器之鋁作用’生成高鄉點The gas distributor is made of an aluminum-containing component, and the above-mentioned fluorination inscription is obtained by reacting a fluorine-containing plasma cleaning gas used to clean the reaction chamber with aluminum. 'As mentioned before, when cleaning the CVD reaction chamber using a fluorine-containing plasma to clean the gas' and the gas distributor in the reaction chamber is made of aluminum-containing components, the I-poly cleaning gas will be mixed with the aluminum of the gas distributor. Effect 'Generates Gao Xiangdian

第5頁 4 606 1 1 五、發明說明(3) 分配器表面及其供氣體進入反應室 水之鹼性 於氨水可 效除去氟 反應室之 分配器的 最好為氟 '六氟化 化鋁所製 清洗氣體 於含有氨 氟化鋁。 '與水的 除操作流 劑和氟化 洗氣體分配器表 反應’生成可溶 ,以本發明之方 器,可增加製程 如三氟化氮 等。氣體分配器 新穎方法。首 藥劑中,以除去 水之驗性藥劑最 。雙氧水除幫助 招致之有機物污 如下之反應: 藥劑來清 與氟化鋁 化銘。故 氣體分配 壽命。 化物,例 二碳(c2F6) 得。 分配器之 水之鹼性 此含有氨 混合溶液 程所可能 鋁可進行 的氟化銘’附著於氣體 之孔洞内。 本發明使用含有氨 面所附著的氟化鋁,由 於水的產物,因此可有 法來清洗化學氣相沉積 穩定度’並可延長氣體 含I電製清洗氣體 (nf3)、四氟化碳(cf4) 可為銘、紹合金、或氧 本發明係提供一種 先,將氣體分配器浸泡 氣體分配器上所附著之 好是包括氨水、雙氧水 反應進行之外,並可去 染。含有氨水之鹼性藥 3NH4OH + AIF2 —i^-^3NH4F + Al(〇H)3 反應所得之氟化銨和氫氧化鋁都是可溶於水的,因此,在 浸泡於鹼性藥劑後,只要去除殘留於氣體分配器上之殘鹼 即可除去氟化銨和氫氧化鋁。去除殘鹼通常是以水沖洗氣 體分配器,可以在一般之快速沖洗槽(quick rinse tank)Page 5 4 606 1 1 V. Description of the invention (3) The surface of the distributor and the basicity of the water that feeds the gas into the reaction chamber is more alkaline than ammonia. The distributor of fluorine reaction chamber is preferably fluorine 'aluminum hexafluoride. The cleaning gas is made of aluminum fluoride. 'Reaction with water removal fluid and fluorinated scrubbing gas distributor table reaction' to produce soluble, with the apparatus of the present invention, the process such as nitrogen trifluoride can be increased. Gas Dispensers Novel Method. Among the first potions, the most potent ones are water-removing potions. The removal of hydrogen peroxide helps to cause the organic pollution caused by the following reactions: Pharmacy to clear and aluminum fluoride. Therefore, the gas distribution life. Compounds, such as two carbon (c2F6). The basicity of the water in the dispenser. This solution containing ammonia is possible. Fluorinated aluminum, which can be processed by aluminum, is stuck in the holes of the gas. The present invention uses aluminum fluoride attached to the ammonia surface. Because of the product of water, it can be used to clean the chemical vapor deposition stability. It can also extend the gas containing I electric cleaning gas (nf3), carbon tetrafluoride ( cf4) The invention can provide a method for immersion, alloying, or oxygen. First, the gas distributor is immersed in the gas distributor. The adhesion of the gas distributor includes ammonia and hydrogen peroxide, and the dyeing can be performed. The ammonium fluoride and aluminum hydroxide obtained from the reaction of the alkaline medicine 3NH4OH + AIF2 —i ^-^ 3NH4F + Al (〇H) 3 containing ammonia are soluble in water. Therefore, after soaking in the alkaline medicine, As long as the residual alkali remaining on the gas distributor is removed, ammonium fluoride and aluminum hydroxide can be removed. Residual alkali is usually removed by flushing the gas distributor with water, which can be washed in a general quick rinse tank.

第6頁 4606 1 1 五、發明說明(4) ' 一" 中進行沖洗。 為了達到更佳的效果’在去除殘鹼之後’最好是將氣 ,分配器浸泡於酸性藥劑中,接著再去除殘留於氣體分配 器上的殘酸,最後再烘乾氣體分配器。 —浸泡於酸性藥劑中的主要目的是,用來除去前段浸泡 於^水後在氣體分配器表面上所生成之鋁氨化合物薄膜, 同時亦可清除操作過程中可能產生之金屬污染。 、、同樣地’去除殘酸通常可以水沖洗氣體分配器。以水 冲洗有助於清除鈉、鉀等人為污染。烘乾的方式可使用自 然陰乾’或置於烤箱中加熱烘乾。 、 上述去除殘驗或去除殘酸的方法,除了可以直接以水 冲法外,亦可將氣體分配器浸泡於水中,以超音波震盪, 以達到更好的效果。 依據本發明,含有氨水之鹼性藥劑中,氨水、雙氧 水、和水的體積混合比例可為i〜5 :卜5 : 5〜丨〇,較佳的混合 比例為為2〜3 : 3〜5 : 7〜9。一般所稱氨水的濃度為29%,雙氧 水的濃度為100%(重量百分比)。 體分配器浸泡於含有氨水之鹼性藥劑的時間和溫度 並沒有一定的限制,較佳之時間可為40分鐘至1小時,較 佳之溫度可為20 °C〜lOOt:,較佳者為4〇 〇c。 適用於本發明之酸性藥劑可為硝酸、鹽酸、硫酸等。 J用:濃度範圍可為1M~5M ’較佳者為2 M。同樣地,氣體 二配器浸泡於該酸性藥劑的時間和溫度並沒有一定的限 制’較佳之時間可為15至20分鐘,較佳之溫度可為2〇tPage 6 4606 1 1 V. Description of the invention (4) 'I " In order to achieve a better effect, after removing the residual alkali, it is better to immerse the gas in the acidic medicament, then remove the residual acid remaining on the gas distributor, and finally dry the gas distributor. —The main purpose of immersion in acidic medicament is to remove the aluminum-ammonia compound film formed on the surface of the gas distributor after immersion in water at the previous stage, and also to remove metal pollution that may occur during operation. Similarly, to remove residual acid, the gas distributor can usually be flushed with water. Rinsing with water can help remove man-made contamination such as sodium and potassium. The drying method can use natural shade drying 'or heat and dry in the oven. In addition to the method for removing residual inspection or residual acid, in addition to the direct water flushing method, the gas distributor can be immersed in water and oscillated with ultrasonic waves to achieve better results. According to the present invention, in the alkaline medicine containing ammonia, the volume mixing ratio of ammonia, hydrogen peroxide, and water may be i ~ 5: Bu 5: 5 ~ 丨 〇, and the preferred mixing ratio is 2 ~ 3: 3 ~ 5. : 7 ~ 9. Generally, the concentration of ammonia is 29%, and the concentration of hydrogen peroxide is 100% by weight. The time and temperature of the body dispenser immersed in the alkaline medicine containing ammonia is not limited. The preferred time may be 40 minutes to 1 hour, and the preferred temperature may be 20 ° C ~ 100t :, preferably 4 °. 〇c. The acidic medicament suitable for the present invention may be nitric acid, hydrochloric acid, sulfuric acid and the like. For J: the concentration range can be 1M ~ 5M ', preferably 2M. Similarly, the time and temperature for immersing the gas dispenser in the acidic agent is not limited. The preferred time may be 15 to 20 minutes, and the preferred temperature may be 20 t.

第7頁 46061Ί 五、發明說明(5) 1 0 0 〇C。 ,以下特舉數個實施例以更詳細說明本發明之方法、特 徵及優點纟並非用以限制本發明’本發明之範圍應以所 附之申請專利範圍為準。 。以下實施例中所進行之化學氣相沉積,條件為:溫度 400 C壓力5 Torr,RF功率為55〇 w,反應氣體為TE〇s和 實施例1 在美商應用Centura-Dxz之反應室中(屬於單—晶片反 應室’内含新的氣體分配器),卩化學氣相“法(c:)於V 矽晶片上沈積氧化矽薄膜13〇〇〇埃。累積沉積片數達3〇〇〇、 片後,將反應器内之氣體分配器取出,進行本發明之生 將此氣 8 (體積混合 化合物。接 去除殘驗, rinse) ° 接 鐘,以去除 鋁氨化合物 污染。再進 泡於去離子 實施例2 體分配器浸泡於氨水:雙氧水:水=2· 5 : 4 比例)之鹼性藥劑中約6 〇分鐘,以去除氟化鋁 著,以去離子水沖洗氣體分配器約5分鐘,以 此步驟稱快速下沖(QDR; quick down =,浸泡於稀釋之硝酸或鹽酸(2 M)中約〗5分 前段氨水浸泡後於氣體分配器表面上所刀 薄膜,同時亦可清除操作過程可能產生Page 7 46061Ί V. Description of the invention (5) 100 0 ° C. In the following, several examples are given to explain the method, features and advantages of the present invention in more detail. It is not intended to limit the present invention. The scope of the present invention shall be subject to the scope of the attached patent application. . The chemical vapor deposition performed in the following examples was performed under the following conditions: a temperature of 400 C, a pressure of 5 Torr, an RF power of 55 watts, and a reaction gas of TE 〇s. Example 1 (Belonging to the single-wafer reaction chamber 'containing a new gas distributor), the "chemical vapor phase" method (c :) deposits 13,000 angstroms of silicon oxide film on the V silicon wafer. 〇 After the tablets, take out the gas distributor in the reactor, carry out the invention of the gas 8 (volume mixed compounds. Then remove the residual test, rinse) ° Connect the bell to remove the aluminum ammonia compound pollution. Then bubble Immerse the body dispenser in deionized example 2 in ammonia: hydrogen peroxide: water = 2 · 5: 4 ratio) alkaline agent for about 60 minutes to remove aluminum fluoride, and rinse the gas dispenser with deionized water. 5 minutes, this step is called quick down (QDR; quick down =, immersed in diluted nitric acid or hydrochloric acid (2 M) for about 5 minutes before the first paragraph of ammonia water soaked on the surface of the gas distributor knife film, but also can Clear operation process may produce

^分鐘的快速下沖。最後’將氣體分配写浸 水中,施加超音波震盪,再烘乾。 D 4 606 1 1 五、發明說明(6) 將以實施例1方法清洗過之氣體分配 應室中’以化學氣相沉積法成長1〇〇〇埃^裝配回上述反 析所沉積之氧化矽薄膜之金屬污染情形。=矽’然後分 示。由表一之分析結果得知,氧化石夕薄“ft f 一所 慮,其不純物含量遠低於—般CVD介電所+,,、金屬π染之 atom/cm2。 疋之規袼 1E12 實施例3 使用新的未使用過之氣體分配器裝配 Centura-Dxz之反應室中,以 —;美商應用 沈積约1 3000埃之氧化矽薄膜。二後八^積法於矽晶片上 薄膜的薄膜特性,測蝕刻率所使、用刀、j斤所沉積之氧化矽 H20 = 30 ..6:64(體積比)。結果如表二二液組成為NH4F:HF: f施例4 一所不。 使用新的未使用過之氣^ Minute fast undershoot. Finally, the gas is distributed and immersed in water, ultrasonic vibration is applied, and then dried. D 4 606 1 1 V. Description of the invention (6) The gas cleaned in the chamber according to the method of Example 1 was grown by chemical vapor deposition to 1000 angstroms ^ assembled back to the silicon oxide deposited by the above-mentioned inversion analysis. Metal contamination of the film. = Si ’and then show. From the analysis results in Table 1, it is known that the oxidized stone is thin and the content of impurities is much lower than that of ordinary CVD dielectrics +, and atom / cm2 of metal π dye. 疋 的 袼 1E12 Implementation Example 3 A new unused gas distributor was used to assemble a Centura-Dxz reaction chamber with-; the US commercial application deposited a silicon oxide film of about 13,000 angstroms. The film was formed on a silicon wafer by two-to-eight method. Characteristics, measured by the etching rate, silicon oxide H20 deposited with a knife, j kg = 30 .. 6: 64 (volume ratio). The results are shown in Table II. The two-liquid composition is NH4F: HF: f. Example 4 Use new unused gas

CeW-Dxz之反應室中配1美商應用 沈積1 3000埃之氧化矽薄〃子氣相阢積法於矽晶片上 取出氣體分配器,進杆如珠此積片數達3000片晶圓後, 洗法卜清洗後將洗(即本發明之新清 出氣體分配器進行第二Λ 再沉積300 0片,再取 片、及清洗的步驟 …先’再重覆裝回、沉積3_ 將此以實施例1之、生、生+ 再度裝回反應室中,洗過三次的氣體分配器 膜,進行各項薄膜特ΐ:;上;1=°°°埃之cvD氧化梦 會施例5 行r生“斤。結果如表二所示。 460611 五、發明說明(7) 步驟同實施例4,但改變清洗氣體分配器的方法。本 實施例中清洗的方法爲習知的舊法,將氣體分配器浸泡在 去離子水中,以超音波震盪30分鐘,然後烘乾。 將以此舊法清洗過三次的氣體分配器再度裝回反應室、 中’在晶圓上成長約1 3000埃之CVD氧化矽膜,進行各^ 膜特性分析。結果如表二所示。 ' 由表二之結果可知,以舊清洗法清洗氣體分配器後, 所沉積之CVD氧化矽的均勻度明顯偏差,應力值則偏低。 而使用新清洗法清洗後之氣體分配器或是新品的氣體分配 器,兩者沉積之CVD氧化矽的薄膜特性相當。因此可證明 本發明確實可完全清除附著之氟化鋁化合物·,使得舊的氣 體分配器可回復新品品質。 .實施例fi 使用新的未使用過之氣體分配器裝配於美商應用 Centura-Dxz之反應室中,以化學氣相沉積法於矽晶片上 沈積約1 3000埃之氧化矽薄膜。重覆沉積單一晶片,直至 累叶沉積片數達300 0片為止。然後分析最後一次所沉積之 氧化矽薄膜的薄膜特性。結果如表三所示。 、將實施例4中累計沉積片數900 0片、以實施例!之新清 洗方法清洗過三次的氣體分配器再度裝中,在 圓上成長約13_埃之CVD氧化㈣。重覆沉積單一晶片, ^至累計沉積片數達30 00片、或4〇〇〇片為止。然後分析最 後一次所沉積之氧化矽薄膜的薄膜特性。結果如表三所The reaction chamber of CeW-Dxz is equipped with a US company applying a silicon oxide thin layer vapor deposition method that deposits 1 3000 angstroms. The gas distributor is taken out from the silicon wafer. After washing, the washing method will be followed by washing (that is, the newly-cleared gas distributor of the present invention performs the second Λ and then deposits 300,000 tablets, and then takes the tablets, and the cleaning steps ... first, then repeats the reinstallation and deposition 3_ Regenerate, regenerate, regenerate + back to the reaction chamber in Example 1, and wash the gas distributor membrane three times to perform various thin film characteristics:; upper; 1 = °°° Angstrom cvD oxidation dream meeting Example 5 The results are shown in Table 2. 460611 V. Description of the invention (7) The steps are the same as in Example 4, but the method of cleaning the gas distributor is changed. The cleaning method in this embodiment is a conventional method. The gas distributor was immersed in deionized water, ultrasonically shaken for 30 minutes, and then dried. The gas distributor cleaned three times in this old method was reinstalled in the reaction chamber, and the growth was about 1 3000 angstroms on the wafer. The CVD silicon oxide film was analyzed for the characteristics of each film. The results are shown in Table 2. ′ From the results in Table 2 It is known that after the gas distributor is cleaned by the old cleaning method, the uniformity of the deposited CVD silicon oxide is significantly deviated, and the stress value is low. However, the gas distributor cleaned by the new cleaning method or a new gas distributor, two The characteristics of the deposited CVD silicon oxide film are equivalent. Therefore, it can be proved that the present invention can completely remove the attached aluminum fluoride compound, so that the old gas distributor can restore the quality of the new product. Example fi Use a new, unused one The gas distributor is installed in a US-based Centura-Dxz reaction chamber, and a silicon oxide film of about 1 3000 angstroms is deposited on a silicon wafer by chemical vapor deposition. The single wafer is repeatedly deposited until the number of leaves deposited on the leaf reaches 300 The film characteristics of the silicon oxide thin film deposited last time are analyzed. The results are shown in Table 3. The cumulative number of deposited sheets in Example 4 was 900,000, and the cleaning method was repeated three times in Example! The gas distributor was re-installed, and a CVD dysprosium oxide of about 13 mm was grown on the circle. A single wafer was repeatedly deposited until the cumulative number of deposited wafers reached 30,000 or 4,000. Analysis of silicon oxide film is then the best film properties after the first deposited. The results are shown in Table three

460611460611

將實施例5中累計、v蚀,, 一'. 坍一 Α ΛΑ么Μ Y 卞積片數900 0片、以,習4:鏟i生、Φ 過二次的氣體分配器再度裝回反 ^、.知—舊, >月洗 1 30 00埃之CVD氧化矽膜。 兹曰在晶圓上成長約 積片數達1 0 0 〇片為止。(A '儿積皁曰曰片,直至累計沉 分配器,在沉積1 000片曰:使用舊清洗法清洗過之氣體 膜的特性太差,已失= ί的氧化石夕之後,氧化石夕薄 後分析最後一次所沉積之^卟=^,因此不再累計。)然 表三所示。 積之氧化石夕薄膜的薄膜特性。結果如 坩衣 經過本發 之後’氧 體分配器 方面,使 於 〇. 3 // m 清洗法清 化矽薄膜 由此 僅可增加 更可延長 三可知 明之新 化矽薄 所得之 用新清 之微塵 洗之氣 的特性 可知, 製程穩 氣體分 ,對於 賴清洗 膜的各 氧化石夕 洗法、 仍在40 體分配 即不佳 以本發 定度及 配器壽 匕沉積900 0 法清洗過之 項特性仍然 薄膜之特性 經4〇〇〇片沉 顆以内,符 器’僅沉積 ’如均勻度 曰月之清洗法 延長氣體分 命。 片之舊 後,在 不錯, 差不多 積之氧 合標準 1 000 片 差及應 來清洗 配器之 氣體分配器,再 經40 00片的沉積 和使用新品的氣 °而微塵增加量 化矽薄膜,其大 。至於使用以舊 單一晶圓後,氧 力偏低。 氣體分配器,不 定期保養片數, 雖然本發明已以較佳實 I5B ^ , 只死*例揭露如上,缺盆廿非ra 、, 艮弋本發明,任何熟習此項蓺 ......並非用以 呷和犯圍内’當可作更動鱼 雕+知月之精 ^潤飾因此本發明之保護範圍The accumulation, v-etching in Example 5 was performed. The number of collapsed A Λ ΑΑΜΜ Y 9900 pieces was used, and Exercise 4: The gas distributor that was shoveled and Φ was re-installed again. ^ ,. Know—old, > CVD silicon oxide film with a monthly wash of 1 300 Angstroms. It is said that the number of accumulated wafers on the wafer has reached 1000. (A 'Erji Soap tablets, until the cumulative sink distributor, after depositing 1,000 tablets, said: the characteristics of the gas film cleaned by the old cleaning method is too poor, lost = = oxidized stone, oxidized stone After the thin analysis, the last deposited porphyrin = ^, so it is no longer accumulated.) Table 3 shows. The thin film characteristics of the product of oxidized stone oxide film. As a result, after the crucible has passed through the hair, in terms of the oxygen distributor, the silicon film can be cleaned by 0.3 / m cleaning method, which can only increase the length of the new silicon film. It can be known from the characteristics of the dust-washing gas that the process stabilizes the gas content. For the oxidized stone washing method that depends on the cleaning membrane, the volume distribution is still not good at the volume of 40. The item that has been cleaned by the method of the hair and the deposition of the container life 900 method The characteristics are still the characteristics of the film. After the sinking of 4,000 pieces, the amulet 'only deposits', such as the uniformity and the cleaning method of the moon, to extend the gas division. After the film is old, it is not bad. It is almost 1 000 pieces of oxygen standard, and the gas distributor of the dispenser should be cleaned. After the deposition of 400,000 pieces and the use of new products, the dust increases the quantified silicon film. . After using a single wafer, the oxygen level is low. Gas distributor, the number of irregular maintenance, although the present invention has been better to I5B ^, only dead * example is disclosed as above, lack of basin 廿 non-ra, uggs, according to the present invention, anyone familiar with this 蓺 ..... .It is not used to sacrifice and guilty confines when you can make changes to the fish sculpture + the essence of Zhiyue ^ retouching so the scope of protection of the present invention

4606 1 1 五、發明說明(9) 當視後附之申請專利範圍所界定者為準。 表一以本發明新清洗法處理之氛體分配器,在沉積氣化矽溥膜 後,分析薄膜中佥屬污染的情形 分析元素 A1 Na Fe Cu Cr Ni (atom/cm2) (atcni/cm2) (atom/cm2) (atom/cm^ (atom/cm^ (atom/cm^) 偵測下艰 2E10 4E9 4E9 2E9 4E8 7E9 樣品一 N.D. N.D. 7E10 4.7E9 2E2 N.D. 樣品 N.D. 1.7E10 N.D. 5.4E9 N.D. N.D. N.D.表来核測到(not detected)4606 1 1 V. Description of the invention (9) Subject to the scope of the appended patent application. Table 1. Analysis of the contamination of tritium in the thin film of the diffuser treated with the new cleaning method of the present invention. Analysis of the elemental contamination in the thin film. Analysis element A1 Na Fe Cu Cr Ni (atom / cm2) (atcni / cm2) (atom / cm2) (atom / cm ^ (atom / cm ^ (atom / cm ^)) 2E10 4E9 4E9 2E9 4E8 7E9 Sample 1 NDND 7E10 4.7E9 2E2 ND Sample ND 1.7E10 ND 5.4E9 NDNDND Detected (not detected)

第12頁 460611 五、發明說明(ίο) 表二清洗後氣體分配器與新氣锻分配器在同一反應室之測機結果比較 mmtn 速率 C^riin) 厚度均勻忠 肋 (dyne^cm2) 猶網 (1000^ 微塵^曼 (>0.3μη) 姓刻率 (βύ^ύη) 新品 (實施例3) 6871 1.1 -10.15E8 1.465 7 2210 新清洗法 (賞施例4) 6926 1.2 -12.56E8 1.463 9 2105 舊清洗法 (實施例5) 73G7 2.9 -8.04E8 1.461 0 2393 •=均勾度之計算方式為[(最大值-最小值)/2]x乎均值xlOO% 1111 第13頁 4606 1 1 五、發明說明(11) 表三清洗後氣镀分配器與新氣嗷分配器在同一反應室之測機結果比較 細扮ΰ己器 ¢53¾速率 厚度均勾度* 應力 祈射南艮1) 麵增加查 蚀flj率 (Ahiin) (%) fdvnes/cm?) (>0.3μτη) (kcmn) 舊清洗法 7076 4.1 -6.80E8 1.458 12 2351 (1000 片) 新品 6937 3.5 -8.11E8 1.460 4 2302 (3000 片) 新清洗法 7013 1.9 -10.95E8 1.463 2110 (3000 片) 新清洗法 7045 2.2 -10.88E8 1.463 18 2113 (4000 片) *均勻度之計算方式為[(最大值-最小值)/2]χ乎均值xlOO%Page 12 460611 V. Description of the invention (Table 2) Comparison of the test results of the gas distributor and the new gas forging distributor in the same reaction chamber after cleaning. Mmtn rate C ^ riin) Thick uniform ribs (dyne ^ cm2) (1000 ^ Dust ^ Man (&0.3; η) Surname engraving rate (βύ ^ ύη) New product (Example 3) 6871 1.1 -10.15E8 1.465 7 2210 New cleaning method (Reward Example 4) 6926 1.2 -12.56E8 1.463 9 2105 Old cleaning method (Example 5) 73G7 2.9 -8.04E8 1.461 0 2393 • = The calculation method of the average hook degree is [(maximum value-minimum value) / 2] x almost the average value x 100% 1111 Page 13 4606 1 1 5 Description of the invention (11) Table 3. Comparison of the test results of the gas-plated distributor and the new gas radon distributor after cleaning in the same reaction chamber. Increased flj rate (Ahiin) (%) fdvnes / cm?) (≫ 0.3μτη) (kcmn) Old cleaning method 7076 4.1 -6.80E8 1.458 12 2351 (1000 pieces) New product 6937 3.5 -8.11E8 1.460 4 2302 ( 3000 tablets) new cleaning method 7013 1.9 -10.95E8 1.463 2110 (3000 tablets) new cleaning method 7045 2.2 -10.88E8 1.463 18 2113 (4 (000 pieces) * The calculation method of uniformity is [(maximum value-minimum value) / 2] χ almost the average value x100%

第14頁Page 14

Claims (1)

声號 六、申歸專利範 Μ 速1鎗# 4·月 曰 修正本 1. 一種化 法,包 將 去氣體 去 將 j 去 烘 其 係由用 其中該 溶液, 5 〜1 0 。2. 步驟係 3. 步驟係 4. 步驟為 5. 水之驗 括以下 該氣體 分配器 除殘留 該氣體 除殘留 乾該氣 中該氣 以清洗 含有氨 氨水、 如申請 使用水 如申請 使用水 如申請 將氣體 如申請 性藥劑 2~3:3~5:7~9 6. 水之驗 5:4:8 如申請 性藥劑 學氣相沉 步驟: 分配器浸 上所附著 於該氣體 分配器浸 於該氣體 體分配器 體分配器 反應室之 水之驗性 雙氧水、 專利範圍 沖洗該氣 專利範圍 沖洗該氣 專利範圍 分配器浸 專利範圍 中氨水、 專利範圍 中氨水、 積反應室之氣體分配器的清洗方 泡於含有氨水之鹼性藥劑中,以除 之氟化鋁; 分配器上的殘驗; 泡於酸性藥劑中; 分配器上的殘酸;以及 是由含鋁成份製得,上述之氟化鋁 含氟電漿清洗氣體與鋇反應而得, 藥劑為氨水、雙氧水、與水的混合 和水的體積混合比例為1〜5 : 1 ~ 5 : 第1項所述之方法,其中去除殘鹼 體分配器。 第1項所述之方法,其中去除殘酸 體分配器。 第1項所述之方法,其中去除殘酸 泡於水中,以超音波震盪。 第1項所述之方法,其中該含有氨 雙氧水、和水的體積混合比例為 第5項所述之方法,其中該含有氨 雙氧水、和水的體積混合比例為2.Sound No. 6. Shengui Patent Model 速速 枪 # 4 · Month Revision 1. A chemical method, including degassing and j drying, using the solution, 5 ~ 10. 2. Steps 3. Steps 4. Steps 5. The test of water includes the following: the gas distributor removes the remaining gas and removes the remaining dry gas from the gas to clean the ammonia-containing water. Apply for the gas such as the application agent 2 ~ 3: 3 ~ 5: 7 ~ 9 6. Water test 5: 4: 8 As the application for pharmacological vapor deposition steps: The test of hydrogen peroxide in the reaction chamber of the gas distributor, the patent scope flushes the gas, the patent scope flushes the gas, the patent scope distributor immerses the ammonia in the patent scope, the ammonia in the patent scope, and the gas distributor in the reaction chamber. The cleaning square is soaked in an alkaline agent containing ammonia to remove aluminum fluoride; the residual test on the dispenser; the acidic agent is soaked; the residual acid on the dispenser; and it is made of aluminum-containing ingredients, as described above It is obtained by reacting the cleaning gas of aluminum fluoride fluorine-containing plasma with barium. The medicament is ammonia water, hydrogen peroxide water, the mixture with water and the volume mixing ratio of water is 1 ~ 5: 1 ~ 5: The method according to item 1, wherein Removal of residual alkalinity Orchestration. The method according to item 1, wherein the residual acid body distributor is removed. The method according to item 1, wherein the residual acid is removed, soaked in water, and oscillated with ultrasonic waves. The method according to item 1, wherein the volume mixing ratio of the ammonia-containing hydrogen peroxide and water is the method according to item 5, wherein the volume-mixing ratio of the ammonia-containing hydrogen peroxide and water is 2. 0492-4407TW修ll.ptc 第16頁 4 β Ο 6 1 1 ___案號 88108628_年月日__ 六、申請專利範圍 7. 如申請專利範圍第1項所述之方法,其中該氣體分 配器浸泡於該含有氨水之鹼性藥劑的時間為40分鐘至1小 時。 8. 如申請專利範圍第1項所述之方法,其中該氣體分 配器浸泡於該含有氨水之鹼性藥劑的溫度為0 °C〜1 0 0 °C。 9. 如申請專利範圍第1項所述之方法,其中該酸性藥 劑為擇自由硝酸、鹽酸、硫酸所組成之族群中。 1 0.如申請專利範圍第9項所述之方法,其中該酸.性藥 劑之濃度為1M〜5M。 11.如申請專利範圍第1項所述之方法,其中該氣體分 配器浸泡於該酸性藥劑的時間為15至20分鐘。 1 2.如申請專利範圍第1項所述之方法,其中該氣體分 配器浸泡於該酸性藥劑的溫度為2 0 °C〜1 0 0 °C。0492-4407TW Rev.ll.ptc Page 16 4 β Ο 6 1 1 ___Case No. 88108628_Year Month Day__ VI. Application for Patent Scope 7. The method described in item 1 of the scope of patent application, wherein the gas is distributed The device is immersed in the alkaline medicine containing ammonia for a time of 40 minutes to 1 hour. 8. The method according to item 1 of the scope of patent application, wherein the temperature of the gas distributor soaked in the alkaline agent containing ammonia is 0 ° C ~ 100 ° C. 9. The method according to item 1 of the scope of patent application, wherein the acidic agent is selected from the group consisting of nitric acid, hydrochloric acid, and sulfuric acid. 10. The method according to item 9 of the scope of patent application, wherein the concentration of the acidic drug is 1M to 5M. 11. The method according to item 1 of the scope of patent application, wherein the acid dispenser is immersed in the acidic agent for 15 to 20 minutes. 1 2. The method according to item 1 of the scope of patent application, wherein the temperature of the gas distributor soaked in the acidic agent is 20 ° C ~ 100 ° C. 0492-4407娜 ll.pt c 第17頁0492-4407na ll.pt c page 17 .. 輋丨产月β B #^;£8ΐΰ862ΐ 發明專利說明書 石學氣相沉積反應室域體分Si H的清 發明名稱 發明人 中文 英文 $[ocess for Cleaning Showerhead for a Chemical Vapor Deposition Chamber 尹名 (中文) 1. 楊能輝 2. 施泓林 }朱贊錡 4.阮仲杰 ___— 妗名 (英文) 辦:雛 3. T. C. Chu _4. C. C. Juan ---- 國籍 民國2.中華民國3.中華民國4.中華民國______— 住、居所 嘱· -- ϋ爷縣高樹鄉新南村社北路22-11號 Ηί哼市金山里光復路一段W巷2號5樓 5. #5市文華里14鄰田美三街22巷6弄1號 ^雨雄縣苓雅區福德二拉抑號六捸之一______ 夢名 ---- 德 三 申請人.. 輋 丨 产 月 β B # ^; £ 8ΐΰ862ΐ Invention Patent Specification Petrology Vapor Deposition Chamber Fraction Si H Name of Inventor Chinese and English $ [ocess for Cleaning Showerhead for a Chemical Vapor Deposition Chamber Yin Ming (Chinese) 1. Yang Nenghui 2. Shi Honglin} Zhu Zanxi 4. Ruan Zhongjie ___— Anonymous (English) Office: Chu 3. TC Chu _4. CC Juan ---- National Republic of China 2. Republic of China 3. Republic of China 4. China Republic of China ______ — Residence and residence order — 5th floor, No. 2, Lane W, Section 1, Guangfu Road, Jinshanli, No. 22-11 Xinnan Village, Shebei Road, Gaoshu Township, Yeye County 5. # 5 市 文 华里 14 Neighborhood 田 美No. 1, Lane 6, Lane 22, Sanjie ^ ^ One of the six members of Fuer Erlayi, Lingya District, Yuxiong County ______ Dream Name ---- Desan Applicant I、居所 (事務所) 1.柳竹科學JL·區喃三路四號I. Residence (Office) 1. Willow Bamboo Science JL · Quansan Road No.4 代表人 姓名 (中文)Representative Name (Chinese) 第1頁 2001.04.17.001 ->v ;,Page 1 2001.04.17.001->v;, 声號 六、申歸專利範 Μ 速1鎗# 4·月 曰 修正本 1. 一種化 法,包 將 去氣體 去 將 j 去 烘 其 係由用 其中該 溶液, 5 〜1 0 。2. 步驟係 3. 步驟係 4. 步驟為 5. 水之驗 括以下 該氣體 分配器 除殘留 該氣體 除殘留 乾該氣 中該氣 以清洗 含有氨 氨水、 如申請 使用水 如申請 使用水 如申請 將氣體 如申請 性藥劑 2~3:3~5:7~9 6. 水之驗 5:4:8 如申請 性藥劑 學氣相沉 步驟: 分配器浸 上所附著 於該氣體 分配器浸 於該氣體 體分配器 體分配器 反應室之 水之驗性 雙氧水、 專利範圍 沖洗該氣 專利範圍 沖洗該氣 專利範圍 分配器浸 專利範圍 中氨水、 專利範圍 中氨水、 積反應室之氣體分配器的清洗方 泡於含有氨水之鹼性藥劑中,以除 之氟化鋁; 分配器上的殘驗; 泡於酸性藥劑中; 分配器上的殘酸;以及 是由含鋁成份製得,上述之氟化鋁 含氟電漿清洗氣體與鋇反應而得, 藥劑為氨水、雙氧水、與水的混合 和水的體積混合比例為1〜5 : 1 ~ 5 : 第1項所述之方法,其中去除殘鹼 體分配器。 第1項所述之方法,其中去除殘酸 體分配器。 第1項所述之方法,其中去除殘酸 泡於水中,以超音波震盪。 第1項所述之方法,其中該含有氨 雙氧水、和水的體積混合比例為 第5項所述之方法,其中該含有氨 雙氧水、和水的體積混合比例為2.Sound No. 6. Shengui Patent Model 速速 枪 # 4 · Month Revision 1. A chemical method, including degassing and j drying, using the solution, 5 ~ 10. 2. Steps 3. Steps 4. Steps 5. The test of water includes the following: the gas distributor removes the remaining gas and removes the remaining dry gas from the gas to clean the ammonia-containing water. Apply for the gas such as the application agent 2 ~ 3: 3 ~ 5: 7 ~ 9 6. Water test 5: 4: 8 As the application for pharmacological vapor deposition steps: The test of hydrogen peroxide in the reaction chamber of the gas distributor, the patent scope flushes the gas, the patent scope flushes the gas, the patent scope distributor immerses the ammonia in the patent scope, the ammonia in the patent scope, and the gas distributor in the reaction chamber. The cleaning square is soaked in an alkaline agent containing ammonia to remove aluminum fluoride; the residual test on the dispenser; the acidic agent is soaked; the residual acid on the dispenser; and it is made of aluminum-containing ingredients, as described above It is obtained by reacting the cleaning gas of aluminum fluoride fluorine-containing plasma with barium. The medicament is ammonia water, hydrogen peroxide water, the mixture with water and the volume mixing ratio of water is 1 ~ 5: 1 ~ 5: The method according to item 1, wherein Removal of residual alkalinity Orchestration. The method according to item 1, wherein the residual acid body distributor is removed. The method according to item 1, wherein the residual acid is removed, soaked in water, and oscillated with ultrasonic waves. The method according to item 1, wherein the volume mixing ratio of the ammonia-containing hydrogen peroxide and water is the method according to item 5, wherein the volume-mixing ratio of the ammonia-containing hydrogen peroxide and water is 2. 0492-4407TW修ll.ptc 第16頁0492-4407TW Repair ll.ptc Page 16
TW88108628A 1999-05-26 1999-05-26 Process for cleaning showerhead for a chemical vapor deposition chamber TW460611B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7754609B1 (en) 2003-10-28 2010-07-13 Applied Materials, Inc. Cleaning processes for silicon carbide materials
CN112226742A (en) * 2020-07-29 2021-01-15 安徽富乐德科技发展股份有限公司 Method for cleaning holes of gas distribution aluminum component in CVD (chemical vapor deposition) equipment
CN112404022A (en) * 2020-11-20 2021-02-26 苏州镓港半导体有限公司 Method for cleaning graphite disc for MOCVD equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7754609B1 (en) 2003-10-28 2010-07-13 Applied Materials, Inc. Cleaning processes for silicon carbide materials
CN112226742A (en) * 2020-07-29 2021-01-15 安徽富乐德科技发展股份有限公司 Method for cleaning holes of gas distribution aluminum component in CVD (chemical vapor deposition) equipment
CN112404022A (en) * 2020-11-20 2021-02-26 苏州镓港半导体有限公司 Method for cleaning graphite disc for MOCVD equipment
CN112404022B (en) * 2020-11-20 2022-09-09 苏州镓港半导体有限公司 Method for cleaning graphite disc for MOCVD equipment

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