TW460560B - Electric conductive past and method for hardening for electric conductive past and method for forming antenna for contactless receiving-transmitting data device using electric-conductivity past and contactless receiving-transmitting data device - Google Patents

Abstract

There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m OMEGA/sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 mu m, a specific surface area of 0.5-5.0 m<SP>2</SP>/g, and the scaly conductive powder having a mean particle size of 1.0-10.0 mu m and a specific surface area of 0.5-5.0 m<SP>2</SP>/g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 to 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.

Description

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 60 5 60 A7 5319twf.doc / 008 B7 V. Description of the invention (丨) The present invention relates to a conductive coating and a method for curing conductive coatings' and the use of conductive coatings Method for forming antenna of non-contact data transmitting and receiving device 'and non-contact data transmitting and receiving device. In recent years, so-called contactless IC cards, that is, tags, name tags, ID cards, etc., have been developed to read or write data at a distance of 4, 5 meters from the reading / writing device. Such a non-contact type 1C card has been disclosed in Japanese Patent Application Laid-Open No. 5-166018 and Japanese Patent Application Laid-Open No. 8-216570. This non-contact type 1C card is composed of a base material and a covering member, and is formed by combining an antenna and a 1C chip. The antenna is used to send and receive data using electromagnetic waves as a communication medium. The 1C chip is used to store data. Write, save, modify, and erase functions. Next, the non-contact type data transmitting and receiving device represented by the non-contact type 1C card or the like must make the above-mentioned antenna connected to the 1C chip into a sheet shape. The method for forming the antenna is a vapor deposition method in which metal evaporation is directly performed on the above-mentioned base material, or an etching method in which a metal thin film is formed on the base material in advance and then etched thereon. A coil bonding method of a coil formed thereon, a printing method in which a conductive paint is printed on a base material into an antenna shape to form an antenna. In the above-mentioned method for forming an antenna, the antenna formed by metal evaporation has high sensitivity. However, when metal is vapor-deposited on the surface of a base material, if there is unevenness on the surface of the base material, the metal vapor-deposited surface will be directly affected by the surface state, and unevenness will be formed. Therefore, the disorder of the electromagnetic field distribution will be increased, and the sensitivity of the antenna will be reduced. However, the engraving method is easy to form antennas of antennas of any shape. 4 ^ The paper size is applicable to the national standard (CNS) A4 specification (210X297 mm ". _ 11 I n 1 ^ (Please read the note on the back first Then fill in this I) 460560 5319twf.doc / 008 A7 B7 i, the invention description (&gt;) method. However, it is necessary to carry out a number of manufacturing processes such as coating a resistor, defining a resistor, etching with an etchant, etc., and also requiring high prices The operating environment of the equipment will increase the production cost. In addition, a large amount of waste liquid generated during etching must be safely processed. The antenna formed by the coil bonding method has good sensitivity. However, it is directly adhered to the surface of the base material. Therefore, the metal coil is poor in workability. However, there is a lot of difficulty in bonding the metal coil to the base material, and it has the disadvantage of poor productivity. In this regard, the printing method described above uses a printing method to easily form the antenna into any shape. And its workability is good. That is, screen printing of conductive paint, the combination of 1C chip and antenna 'on the bonding of upper paper (or the stack of film) The productivity of various manufacturing processes, such as boards, can also be improved by the performance of the printing machine itself. Now, the conductive films for antennas and the like are often formed by thermosetting conductive coatings, which are cured by heat. Such heat The curable conductive paint generally contains a solvent, and its properties are exerted by the volatilization of the solvent or the volatilization of the solvent and the hardening of the binder resin. The binder resin is a phenol formaldehyde resin or polyester. When forming a conductive film with a thermosetting conductive coating, 'heating at 150 ° C or higher and a processing time of several tens of minutes are required. Therefore,' the operation time for forming a conductive film, such as an antenna, is prolonged. In addition, there is no way to avoid installing a conductive film. The problem of deterioration of the base material. In addition, photo-curable conductive coatings are also used to form conductive films. When using this photo-curable conductive coating, in order to improve the conductivity of the antenna 'and 5 national paper standards ( CNS) A4 size U1 〇X 297 mm) (Please read the precautions on the back before filling out this page) Order the employee consumption contract of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the company ^ 60560 A7 · 5319twf.doc / 008 B7 -----— V. Description of the invention (that is, after the photochemical treatment, organic matter must be removed by sintering. Therefore, once the substrate material is irradiated by light, it is cured by photocuring. After conducting conductive coatings, it will be conductive by heating and decomposing organic matter after 50 ° C or more to remove electricity. The above-mentioned post-heating mainly uses an electric furnace. However, as mentioned above, the post-heating is heated to 50 ° C or more, so it is conductive by photocuring. The base material of the conductive coating for the conductive coating is limited to heat-resistant materials such as ceramics. Therefore, there is a problem that paper or other materials with poor heat resistance cannot be applied to the base material. In addition, when a photocurable conductive paint is used, if a harder solid is formed, it is brittle and has poor bending resistance. In addition, although the monomer has high reactivity, the bleeding after coating is obvious, and its oligomers can soften the cured product. However, it is difficult to set the coating on the coating because the coating has a high viscosity and is difficult to penetrate through the plate. The problem of balance. Therefore, the purpose of the present invention is to provide a conductive coating and a method for curing the conductive coating, and a method for forming a non-stomach_stomach data transmitting and receiving device using the conductive coating, and a non-contact data transmitting and receiving device. When manufacturing a non-contact data transmitting and receiving device, it is not deteriorated due to the heat of the base material, and a low heat resistance material can be used as the base material 'and the productivity of the non-contact plastic data transmitting and receiving device can be improved' to solve the above problems. A first object of the present invention is to provide a photo-curable conductive paint, which has a surface resistance of 200 mΩ / sq. Or less by curing by light irradiation, and contains a conductive powder and a photo-curable resin composition. The weight ratio of these is: 50 / 50-95 / 5, the above-mentioned conductive powder is a fully conductive powder containing more than 80% of gastric dendritic conductive powder and scaly conductive powder. The dendritic conductive powder is an average particle diameter of 0.05-1.0 &quot; m0, surface coefficient is 0.5-5.0 6 This paper size is applicable to Chinese national standard) A4 size (210X297 mm) (Please read the precautions on the back before filling in this tribute.) Order-Bureau of Intellectual Property, Ministry of Economic Affairs Printed by the employee's consumer cooperative, printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the employee's consumer cooperative, α 60 5 60 Α7 '5319twf.doc / 008 B7 V. Description of the invention (t) m2 / g, the scale-like conductive powder system has an average particle size of io-io.o &quot; m, the surface coefficient is 0.5-5.0 iri / g, and the weight ratio of the dendritic conductive powder to the scaly conductive powder is 60 / 40-95 / 5. In the above conductive coating, the photocurable resin composition contains a group consisting of thioxanthone, a thiobenzophenone derivative, an anthraquinone derivative, and a fluorenyl sulfuric acid derivative. At least one item is selected, and at least one item is selected from the group consisting of acrylates and methacrylates, and the compound is prepared by weight ratio of 0.01 / 100-10 / 100. In addition, it is preferable that the conductive paint contains at least one of a coating property and a flexing property selected from the group consisting of silicon oxide, a saturated polyether resin, a polyvinyl ether resin, and a phenoxy resin. Regulating agent, the surface coefficient of the oxidized sand is above 100 πί / g, the apparent specific gravity is below 50 g / l, the average primary particle size is below 30 nm, and the softening point of the saturated polyester is 100 ° C Below, the molecular weight is 1000-50000, the glass transition point (Tg) of the polyvinyl ether resin is -3CTC or less, and the softening point of the phenoxy resin is more than 1000 ° C. It is a second object of the present invention to provide a photocurable conductive coating containing at least one compound selected from the group consisting of silver powder, a photoreactive resin, a photocuring initiator, and a photosensitizer. A wavelength region of -450 nm has maximum optical absorption. In the above-mentioned conductive coating, the photoreactive resin is preferably a compound D 7 selected from the group consisting of an acrylate compound and a methacrylate compound. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) &quot; (Please read the precautions on the back before filling out this page) Λ 60560 Α7 5319twf.doc / 008 Β7 V. Description of the invention (() Moreover, the above photoreactive resin is preferably made of alicyclic ring A compound selected from the group consisting of an oxide, an oxetane compound, an alkene oxyalkylene compound, a glycidyl ether compound, and a vinyl ether compound. At least one of them is preferably [4- (methylphenylthio) ) Phenyl] benzyl alcohol, ethyl anthraquinone, 2,4-diethylanthracene phenol, 2-chloroanthracene phenol, 2 benzyl-2-dimethylamine (4-morpholinylphenyl) ) -Bubutanone, 2,4-trichloromethyl (4'-methoxynaphthalene) -6-triazine, 2,4-trichloromethyl (4'-methoxystyryl) -6 -At least one selected from the group consisting of triazine, isoamyl p-dimethylaminobenzoate, and perylene anthracene, as the above-mentioned photocuring initiation Or a photosensitizer. A third object of the present invention is to provide a conductive coating containing a binder resin solid content of 0.2-5% with a glass transition point (Tg) of 0 ° C or lower. The above-mentioned binder resin is preferably, At least one selected from the group consisting of polyvinyl ether resin and polybutadiene, the above-mentioned conductive coating preferably contains a volatile solvent. Furthermore, a fourth object of the present invention is to provide a method for curing a conductive coating, which The ultraviolet radiation lamp for infrared radiation is a light source, and the conductive paint is cured by light irradiation from the light source. The ultraviolet radiation lamp is preferably at least one selected from a metal halide lamp, a high-pressure mercury lamp, and a xenon lamp. A fifth object of the present invention is to provide a method for forming an antenna of a non-contact data transmitting / receiving device, which is an antenna forming method of a non-contact data transmitting / receiving device including a 14.IC chip and an antenna. The step of printing the thermosetting conductive paint on the base material in the pattern of the antenna shape, and the printing surface of the thermosetting conductive paint ___ 8 _ This paper size is applicable to China National Standards (CNS) A4 (2) 0 × 297 mm (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs® Industrial and Consumer Cooperatives Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Industry and Economics 4605 60 a? __5319twf .doc / 008 ____ V. Description of the invention (6) The step of curing the thermosetting conductive coating by emitting infrared rays. In addition, the sixth object of the present invention is to provide a method for forming an antenna of a non-contact data transmitting and receiving device, which is an antenna forming method of a non-contact data transmitting and receiving device having a 1C chip and an antenna. The step of printing a conductive paint on the base material provided with the 1C chip in the above antenna shape pattern, and the step of curing the conductive paint. Furthermore, a seventh object of the present invention is to provide a method for forming an antenna of a non-contact data transmitting and receiving device, which is an antenna forming method of a non-contact data transmitting and receiving device including a 1C chip and an antenna. The swirling antenna main body and the antenna formed by a cross line connected to one end of the antenna main body and crossing the antenna main body, the method includes the steps of forming the antenna main body by printing on any of the above-mentioned conductive paint on a base material for configuring a 1C chip. And a step of curing the conductive paint, and a printing step of an insulating material composed of an epoxy-based ultraviolet curable resin and insulating inorganic fine particles at a predetermined arrangement position of the above-mentioned cross line, and the ultraviolet ray is used to make the The step of curing the insulating material, and the step of printing and forming the crossover line connected to one end of the antenna body on the cured insulating material by the above-mentioned arbitrary conductive paint, and the step of curing the conductive paint. An eighth object of the present invention is to provide a method for forming a multi-layer circuit of a non-contact data transmitting and receiving device, which is a method for forming a multi-layer circuit of a non-contact data transmitting and receiving device having an IC chip and an antenna. Steps of stacking circuits and printing an insulating layer to form a multilayer circuit. It is best to print at least one of the above circuits and insulation layers with light-curable coatings. ________9 This paper size applies to Chinese national standard {CNS) A4 specification (2! Ox297) (Please read the precautions on the back before filling in this page} Order 4 60 5 60 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5319twf.doc / 008 B7 V. Item (0) of the Invention. Moreover, the above multilayer circuit is preferably equipped with an antenna function. Furthermore, the ninth object of the present invention is A non-contact data transmitting and receiving device is provided, and a 1C chip is mounted on a multilayer circuit formed using any of the above methods. Furthermore, a tenth object of the present invention is to provide a method for forming an antenna of a non-contact data transmitting and receiving device. Method for forming antenna of non-contact type data transmitting and receiving device of 1C chip and antenna 'An antenna return line formed by printing on one side of a sheet-like base material to form any of the above-mentioned conductive coatings is set in a fold line of the base material Steps of symmetrical patterns at line-symmetrical positions, steps of applying paint on the loop-forming surface of the antenna on at least one side, and self-folding lines The step of folding the base material so that the antenna return line becomes the inside and bonding the antenna return line. Furthermore, an eleventh object of the present invention is to provide a method for mounting a 1C chip, which is a method for mounting a 1C chip on a base material circuit. In the base material equipped with a 1C chip, the steps of applying a conductive coating to form a circuit by applying any of the patent application items 丨 to 12 and the step of curing the conductive coating and using a conductive adhesive substance The step of forming and printing the part connected to the terminal device of the 1C chip on the base material, a step of arranging the 1C chip at a mounting position, and a step of mounting by thermal compression bonding from above the 1C chip. The above and other purposes, features, and advantages can be more clearly understood. The following questions highlight the preferred embodiment and the accompanying illustrations' for detailed explanations as follows: Brief description of the drawings: ____ 10 ____ This paper scale is applicable to China National Slope (CNS) A4 specification (210X297 male thin) (Please read the precautions on the back before filling this page)

Printed by 'tT Consumer Property Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 460560 A7 5319twf.doc / 008 β7 V. Description of the Invention (2) The graph in Figure 1 is a graph illustrating the reflectance of each wavelength of the silver evaporation deposition surface. The graph in Figure 2 shows the absorptivity curve of each band of the conductive paint compared with the superior quality. Figure 3 shows the surface resistance 値 curve of the power consumption per unit area of the conductive paint after curing when infrared radiation lamps and ultraviolet radiation lamps are used as light sources. Figure 4 illustrates the base material supporting the antenna. Figures 5 (A), 5 (B), 5 (C), 5 (D), 5 (E), 5 (F) are diagrams illustrating the method of forming the antenna. Figures 6 (A) and 6 (B) are explanatory diagrams for printing plates of conductive coatings and insulating coatings. FIG. 7 illustrates an example of an antenna forming method. FIG. 8 is a diagram illustrating a state where the antenna is formed. FIG. 9 illustrates a partial cross-sectional explanatory view of the antenna. Fig. 10 is an explanatory drawing of a cross section of a bent portion. Figs. 11 (A), 11 (B), 11 (C), 11 (D), and 11 (E) are explanatory diagrams of an example of a 1C chip mounting. . Figures 12 (A), 12 (B), 12 (C), 12 (D), 12 (E), and 12 (F) are diagrams showing the mounting sequence as a cross section of the 1C chip mounting position. Description of figure labels: 1: Base material 2: Antenna body (please read the notes on the back before filling in this page) Order-line paper scale is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) I 60 5 60 A7 5319twf.doc / 008 B7 V. Explanation of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3: The planned configuration of the crossover line 4: Insulation material 5: The crossover part 11: Paper 12, 12, 12, 12 ": Circuit 13,135: Non-printed part 14.14 ': Insulation film 15: Printed circuit 16: Version 21: Circuit 22: Base material 23: 1C wafer 24: Terminal device 25: Insulation bonding part 26: Terminal bonding part 31: Antenna 32 : Base material 33: Antenna loop 34: Polyline 35: Antenna loop forming surface 36: Coating 37: Crack 55: Spray adhesive d: Height (please read the precautions on the back before filling this page) Applicable to China National Standard (CMS) A4 specification (21 Ox297 mm) Printed by the Consumer Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs 460560 A7 5319twf.doc / 008 B7 V. Description of the invention (丨 〇) Examples "Conductive paint" 1st preferred embodiment The first embodiment of the conductive paint of the present invention is a photocurable conductive paint containing conductive powder (A1) and a photocurable resin composition (B1) as essential components. The conductive powder (A1) is preferably a metal powder, especially a silver powder. In addition, in order to control resistance 値 or welding corrosion, conductive metals other than silver may be added, such as gold, platinum 'palladium (Pd), rhodium (Ph) and other powders. These conductive powders (A1) can be mixed with two or more kinds in order to effectively control the printability, and have various shapes such as average particle diameter, surface coefficient, tap density and other powders. Necessary The composition is preferably (1) a tree shape having a dendritic shape (also called an undefined shape), an average particle diameter of 0.05-1.0 μm, a surface coefficient of 0.5-5.0 m2 / g, and a tap density of 0.3-1.0 g / cm3. Conductive powders (A1-1) and (2) have scaly or flake conductive powders, with an average particle diameter of 1.0-1.0 μm, surface coefficient of 0.5-5.0 m2 / g, and tap density of 1.0-5.0 g / cm3 conductive powder (A1-2). Then, the dendritic conductive powder (AM) and scaly or flake conductive End (A1-2) of 60 / 40-95 / 5 by weight ratio of the situation, it is preferable to use the total conductive powder contains electrically conductive powder of more than 80% of the formulation. In addition, in order to improve the affinity of the organic composition in the paint containing the conductive powder (A1), and to improve the dispersibility of the conductive powder in the coating, it is also best to use it in the manufacturing process of the conductive powder or after manufacturing. The powder surface is modified. Surfactants or other organic compounds can be used as modification 13 The paper size is applicable to the Chinese National Standard (CNS) A4 Regulations 〇〇297mmΪ &quot; ---------- 、 ------ ΪΓ ------ ^ (Please read the notes on the back before filling in this education) 4 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs e〇56〇at 5319twf.doc / 008 B7 V. Description of the invention ((丨). The composition of the photocurable resin composition (B1) is a photocuring initiator containing ((1) free-radical active species or cationic active species generated by light irradiation ( BM), a photoreactive resin (Bh2) which has functional groups that react with these active species (Bh2) is an essential component that is blended at a weight ratio of om / ioo-10 / 100. A well-known photocuring initiator can be used (B1-1) 'Best benzophenone derivatives' thia anthrone derivatives, anthraquinone derivatives, trichloromethyl triazine derivatives, phosphonium oxide phosphine derivatives, hydroxy ketones Derivatives, α-aminoketone derivatives, benzoin derivatives, benzophenone ketal derivatives, acridine derivatives, carbazoles A phenol derivative, or a combination of these, produces a radically active species, preferably an aromatic chloro compound, an aromatic iodonium salt chloride compound, or a combination of these to produce a cationic active species. A well-known photoreactive starting can be used. Agent (Bb 2) 'Respondents with free radicals, preferably acrylates or methacrylate compounds' Respondents with cations, preferably alicyclic epoxides, oxetane compounds, chains An oxyalkylene compound, a glycidyl ether compound, or a vinyl ether compound. In any case, a mixture of two or more kinds may be used. The overall viscosity of these photoreactive resins (B1-2) is to maintain and conduct conductive powder. For kneading and printing characteristics of coatings, it is better to be 1-5000mPa · (cps) at 25 ° C, and more preferably 10-20⑻mPa · (cps). Furthermore, in order to control reactivity, phenothiazine derivatives and Photosensitive polycyclic aromatic compounds, such as xanthone derivatives, thia anthrone derivatives, thioanthrone derivatives, anthranilic acid, anthracene, phenanthrene, perylene, or a combination thereof 14 This paper is in accordance with Chinese national standards (CNS) A4 specifications (2! 0X29 · / Mm) (Read the precautions on the back before you fill out this page.) Printed by Dibei Intellectual Property Bureau, printed by M Industrial Consumer Cooperative, 4 60560 53l9twf. Doc / 008 B7 V. Description of the Invention (&v; v) Agent, Or hydroxy compounds, amine-based compounds, etc. The added amount at this time is preferably 0.01 to 100% based on the weight of the photocuring initiator (B1-1). The conductive powder (A1) and the photocurable resin are composed The weight ratio of the substance (B1) is preferably 50 / 50-95 / 5, and more preferably 55 / 45-90 / 10. In addition, the well-known silica, alumina, mica, toner, pigment, dye, polymerization inhibitor, and thickener can be added within a range that does not impair the photocurability of the photocurable conductive coating of the first embodiment of the present invention. Agents, thixotropic agents, precipitation inhibitors, oxidation inhibitors, dispersants, various resins, various organic solvents, and the like. The total of these additives is preferably 35% or less of the conductive powder (A1) and the photocurable resin composition (B1). It can be added to the purpose of the photocurable conductive paint of the first embodiment of the present invention (hereinafter referred to as resin (C)), and a well-known substance can be used. For example, phenolic resin, epoxy resin, melamine, urea resin, xylene resin, alkyd resin, unsaturated polyester resin, acrylic resin, polyimide resin, furan resin, polyurethane resin and other thermosetting resins, polyethylene, Polypropylene 'polystyrene, ABS resin, polymethyl methacrylate (PMMA), polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyvinyl alcohol, polyformaldehyde, polycarbonate, polyparaphenylene terephthalate Polyethylene glycol formate, polybutylene terephthalate, poly2,3-dihydroxyoxoline, polymaple, polyimide, polyether maple, polypropylene ester, polyether hexyl ether ketone, polytetramethylene Fluoroethylene 'silicone and so on. It is also possible to use one or a combination of two or more of these. A solvent (hereinafter referred to simply as a solvent (D)) that can be added to the photocurable conductive coating material of the first embodiment of the present invention can be used. Just to avoid remaining in the system after curing reaction, the boiling point should be below 250 ° C. For example, make this paper size suitable for towels_Home Standard (CNS) A4 · (21Qx297). In I ^ I—, 1— Order I—II line (Please read the precautions on the back before filling this page) 60560 5319twf · doc / 008 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (p) For use in toluene, cyclohexane, methylcyclohexane, η-hexane, pentane and other hydrocarbon solvents, isopropyl Alcohols such as alcohol and butanol, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, isophorone and other ketones, ethyl acetate, propyl acetate, butyl acetate, etc. Glycol alcohol ethers such as esters, methoxyethylene glycol, ethoxypropanol, .methoxydiethylene glycol, 3-methoxy-3-methylbutyl acetate, and acetic acid of these Esters, and two or more of these mixed solvents. Although the production of the photocurable conductive paint of the first embodiment of the present invention is not limited to this, the mixture can be mixed by agitating the mixer with a homogenizer or the like, and then mixed with a kneader such as 3 rollers or a kneader. The method of uniform sentence dispersion. The viscosity of the photocurable conductive paint of the first embodiment of the present invention is preferably 10 to 1 million mPa · (cps) so as to have appropriate coatability and print thickness after coating. 10,000-500,000 mPa · (cps) is better. In the photocurable conductive coating according to the first embodiment of the present invention, a base material (hereinafter referred to as a base material (E)) for forming a pattern by a well-known method using screen printing, offset printing, or a coater can be used. Ceramics can be used. And leather, non-woven fabrics of inorganic or organic fibers, paper, these composite materials with thermosetting resins or thermoplastic resins, polyethylene, polypropylene, polyolefins, polyterephthalic acid Polyesters such as ethylene glycol esters, polybutylene terephthalate, polyvinyl naphthalate, and polypropylene esters, polyimide, polyimide, polyethylenimide, polyimide, and polyformamide Xing, polyether maple, polyacetic acid hexanoate, polymaple, acrylics-Ding ^ __ suspect-Benyi suspect_ copolymers, polyvinyl chloride, silicone rubber, natural rubber, synthetic rubber and other plastic substitutes And so on. And in order to improve the coatability or fixability, it can also be used on the surface of these base materials ______ —_ 1 6 This paper is suitable for size ^ 5 &quot; ^ standard (CNS) Α4 size (21DX297mm) '---- ---------------- IT ------ ^ (Please read the notes on the back before filling out this page) ^ ^ 0 5 60 Employee Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing A7 5 3 1 9 tw f.dQc / 〇〇8 ____-5._ Description of the invention (丨 4) Chemical treatment such as coupling agent treatment or primer coating treatment, or corona discharge treatment, plasma Physical treatment such as treatment, ultraviolet treatment, honing treatment. In order to obtain a sheet type using a photocurable conductive coating material according to the first embodiment of the present invention as a pattern of a conductive layer on a base material, it is generally coated by a screen printing method or the like. The thickness of the printing can be freely controlled by adjusting the screen material (polyester, polyamide, or stainless steel), mesh and tension, and the viscosity of the coating. The printing thickness is preferably 5-100 / zm. The better printing thickness is 丨 0-80 # The light source system for curing the photo-curable conductive coating of the first embodiment of the present invention. High-pressure mercury lamps, ultra-high-pressure mercury lamps, and no electrodes can be used. Discharge lamps, excimer lamps, metal halide mercury lamps, gas lamps, various lasers, and semiconductor lasers are well known. Especially high-pressure mercury lamps and metal halide mercury lamps with more energy intensity distribution in the 300-500nm band. The intensity of the light source lamp is preferably above 40W / cm, more preferably above 80W / cm. The amount of light required for photocuring is preferably 100-5000mJ / cm2 in the 300-500nm band, and more preferably 500-10000mJ / cm2. In addition, in order to remove volatile components during irradiation, it is better to set up exhaust or harm removal facilities. In order to improve the properties after curing, before the light irradiation, the light irradiation, or the light P irradiation, as long as the base material does not significantly deteriorate, such as coloration, heat shrinkage, softening, embrittlement, and carbonization, it can also be heated and blown in the furnace. Hot air, infrared, or microwave irradiation, etc., and then heat treatment. In order to prevent deterioration of the base material, the heating temperature is preferably below 150 ° C, and the heating time is preferably within 15 minutes. The following is a description of the production of the photocurable conductive paint in the first embodiment and the examples of photocuring using these printed patterns. 17 This paper uses the Chinese national standard (CNS) A4 size (210X297 mm) '(Read the precautions on the back before filling this page) Order 460560 A7 5319twf.doc / 008 B7 V. Description of the invention (丨 g ) Production of photocurable conductive coatings Example 1 to Example 18 (Production of photocurable resin composition) Prepare and mix as shown in Table 1 and Table 2, and stir for 30 minutes or more under light-shielding room temperature. , Make it uniform, and obtain the photocurable resin composition prepared by the photocurable conductive coating of the present invention. (Please read the precautions on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Economy Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 4 60560 A7 5319twf.doc / 008 B7 V. Description of the invention (（例 1 2 3 4 5 6 7 8 9 M-9.40 100 100 100 100 100 100 100 M-360 100 Μ-11Ω 100 RMS 5 5 5 9.-F.AO 5 Di '唪 R 0,5 Di- 啳 PMS 0.5 KT046 1 I.ucirin TPO Ί, T-819 DMRT 2 2 2 2 _ " Position, part by weight "[Photoreactive resin] M-240: Aromx M-240 (polyethylene glycol malonate) manufactured by Toa Synthesis Co., Ltd., M-360: Aromx M-360 manufactured by Toa Synthesis Co., Ltd. (Trimethylol (please read the precautions on the back before filling this page) &gt; • = 1 ° Printed propylene oxide ethylene triacrylate modified by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs), M110: East Asia Synthetic Aronix M-110 (p-isophenylphenol alcohol ethylene oxide denatured triacrylate) manufactured by K.K. Co., Ltd., [light initiator (light curing initiator)] BMS: BMS manufactured by Nippon Kayaku Co., Ltd. ([ 4- (methylphenylthio)] benzyl alcohol), 19 This paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm) — a bJ 5 60 A7 5319twf, doc / 008 B7 V. Description of the invention ( η) 2-EAQ: 2-EAQ (ethylanthraquinone) manufactured by Nippon Kayaku Co., Ltd., and triazine A: TRIAZINE B (2,4-trichloromethyl (4, -methoxynaphthalene)) manufactured by PANCHIM SA -6-Triamidine), Triazine PMS: TRIAZINE PMS (2,4-trichloromethyl (4 '· styryl) -6-triazine) manufactured by PANCHIM SA, KT046: ESACU manufactured by Lambeni RE KTO 46 (2,4,6-trimethylphenylpropanidine diphenyl phosphate with low [2-hydroxy-2-methyl1- [4- (1-methylpropene) phenyl] propane] and A mixture of benzophenol derivatives),

Lucirin TP〇: Lucirin TPO (2,4,6-trimethylbenzidine diphenyl phosphoric acid) manufactured by BASF, 1-819: Cirg Specialty Chemical [rgacure819 (bis (2,4,6-trimethyl) Phenylbenzyl) phenyl phosphate)] [Photosensitizer] DMBI: DMBI (p-dimethoxyamino benzoate isoamyl ester) manufactured by Nippon Kayaku Co., Ltd. (Please read the precautions on the back before filling this page )-&quot; Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economy 20 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 public broadcasting)-! 60 5 60 A7 5319twf, doc / 〇〇8 B7 Description of the invention (丨 name) ____ 恚 7 Example _ 10 π 12 Π 14 IS 16 17] 8 KS-800 100 100 100 100 KS-871 __ 100 UVR-6105 _ _ 100 Limonene dioxide 1 — — — — 100 — w -inn — 100 χηπ — 1 ^ SP-170 λ λ 1 CP-66 __ 1 9, 氤 M ____ 0,5 phenol 唪 0,, 5 [Photoreactive resin] (Please read the precautions on the back before filling in this Page) Printed by Intellectual Property of the Ministry of Economic Affairs &quot; Employee Consumer Cooperatives K S-800: ADEKA OPTMER KS-800 (mixture of epoxy resin and aromatic chloro compounds) manufactured by Asahi Chemical Industry Co., Ltd., KS-871: ADEKA OPTMER KS-87U epoxy resin made by Asahi Chemical Industry Co., Ltd. and Mixture of aromatic chloro compounds), UVR-6105: CYRACURE UVR-6105 (3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate) manufactured by Union Carbide, biphenyl dioxide (Limonene dioxide): Biphenyl dioxide (1-methyl-4- (2-methylhydroxylanil) -7-oxabicyclo [4,1,0] heptane) manufactured by Elf Atochem , 21 This paper size applies to China's National Standards (CNS) A4 specifications 210X297 mm 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5U560 A7 5 3 1 9twf .doc / 〇 〇 8 B7 _ V. Description of the invention (called ) W-100: W-100 (1,6-hexanedione diglycidyl ether) manufactured by New Japan Physical and Chemical Co., Ltd., XD0: XDO (1,4-bis [(3-ethyl Methyl-3-oxetanylmethoxy) methyl] benzene), [photo initiator (photocuring initiator)] SP-170: ADEKA OPT manufactured by Asahi Denka Kogyo Co., Ltd. MER SP-170 (aromatic chloro compound), CP-66: ADEKA OPTMER CP-66 (aromatic chloro compound) manufactured by Asahi Denka Kogyo Co., Ltd. 19th to 50th examples Store-made silver powder Sylvest E-20 and the same company (Sylvest TCG-7 with 80/20 (wt / wt), 90/10 (wt / wt), 85/15 (wt / wt), 75/25 (wt / wt) mixing to prepare A, B, C, and D.

Sylvest E-20 is mixed with silver powder (Sylvest TCG-1 at 75/25 (wt / wt)) produced by Deli Co., Ltd. to prepare E. The resin composition obtained in the first to eighteenth embodiments is electrically conductive. Powders and various solvents were prepared in Tables 3 and 4 and mixed with a mixer, and then kneaded with a high-shear kneader to obtain a photocurable conductive paint. The above-mentioned photocurable conductive paint was used to borrow 18 ° mesh. An emulsion thickness of 15 μm was screen-printed on a base material with a pattern of 1 mm wide and 1 lm long to obtain a thin sheet. The printing thickness of the printed layer was about 15 A ΙΏ. As a base material, Japan-made paper Co., Ltd. NPI-55. Polyethylene terephthalate film uses Toray Co., Ltd. 22 This paper size is applicable to China National Standards (CNS) A4 specifications (2 丨 0X297 mm) ----- -, ----.: ------ Order ------ line (please read the notes on the back before filling this page) 30560 A7 5319twf.doc / 008 B7 V. Description of the invention ( π) Lumiler S. made by the company. In the curing reaction, the 19th to 31st embodiments are high-pressure mercury lamps with 4kw output at 80w / cm The 32nd to the 50th embodiments use a metal halide with an output of 4kw at 80w / cm as a light source and irradiate it with a coveyer-type irradiation device for 6 seconds. The integrated light quantity in the 300-500nm band under this condition is a high-pressure mercury lamp About 2500m / cm2 is equivalent to a metal halide mercury lamp 5000mJ / cm2. Regarding the use of a solvent system, the base material on which the pattern is printed is placed in a ventilated furnace at 100 ° C for 5 minutes before light irradiation. Any situation The substrate materials used below did not show significant deterioration such as coloration, heat shrinkage, softening, embrittlement, charring, etc. Surface resistance was measured from the resistance between the ends of the pattern after curing. The results are shown in Tables 3 and 4. ----------..------ tT ------ 0 (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Recording standards are applicable to Zhongguan Jiazheng Standard (CNS) A4 specifications (2iQX297 mm) ^ 0560 A7 5319twf, doc / 008 B7 V. Description of the invention Surface resistance 19th embodiment 20th embodiment 21st embodiment 22nd implementation 23rd embodiment 24th embodiment 25th embodiment 26th embodiment 27th embodiment 28th implementation simulation 29th implementation / Hff 30th implementation m \ 31st implementation m \ 篦 1 眚 施 倾 35 20 35 -m- JSL · 箆 2 眚 Example — — — 40 — — — — IU. Example 1 — — — — 40 _ — — 4th window example — — — — 40 20 — — # 5_ .. Embodiments — One — — — 45 — First _6th embodiment — 45 — 7th window application — 4S? 0 8th example — — — — — — — — — 9 embodiments ”— — 45 modulation A 65 70 — _ _ — 70 _ — One 70-Modulation _ — 65 60 60 60 — 55 55 55-55 55 Fuhr _ — — — One — — J alcohol 7, acid ester '_ — 2 — —— —— 2 — — — 1 Monoethylene glycol di-butyric acid __ — 3 —— —— — — 3 — — 3 _ — 5 — — — — 5 — — — 5 _ Paper base materials m Ω / sq. 150 112 127 100 186 167 95 156 119 110 75 137 123 PET based Material m Ω / sn. 180 133 one-one — 191 132 —--190 one — (Please read the notes on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Note: The light source is used by 80W / cm high pressure mercury lamp (containing ozone). The photocurable resin composition, the conductive powder, and the solvent unit are parts by weight. 24 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 460560 A7 5319twf.doc / 008 B7 V. Description of invention (π) Table 4Π / 2) 32 33 34 35 36 37 38 39 40 41 42 43 Implementing the application of the application of the application of the application of the application 1 〇 眚 例 例 40 40 40 40 40 20 20 25 —Gu Di Fu Rich Example — — — — — — — 45 — — — 化 笛 1 9. 眚 施 bias 45 Sex flute Π 眚 Example 1 — 45 — The 1st 4th embodiment of the tree — — — — — — — — — — — 45 Fat Flute 1〗 眚 Example — — — Group 筮 1 fS Meeting Example — One — — — 成 Π 音 例 — 物The 1st example of pilot tuning A 60 — — — 70 70 70 — — — — Electrical modulation R — 60 Sex modulation Γ — — 60 — — One. — — — — One powder modulation D — — — 60 — — — — One — — — Final modulation F. — — — — 60 One — — 55 55 55 55 Soluble _ 2 agent carbitol 7, ether ester — — — — — — 5 — — — — — Z diol di T Ether 3 5 — — — — Acetic acid flux_ — — — — 5 5 — — — — — — Surface paper base material mQ / sq. 73 105 81 103 86 55 49 40 81 80 129 80 Surface electric PET base material ιΩ / sq. 130 190 165 — One 95 90 101 168 152-125 (Please read the notes on the back before filling out this page) Bureau of Intellectual Property of the Ministry of Economic Affairs: Yibeigong Cooperative Co., Ltd. Printed photocurable resin composition, conductive The powder and solvent unit are parts by weight. 25 This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 460560 A7 5319twf, doc / 008 B7 V. Description of invention (w) 恚 4 (2/2) 44th embodiment 45th implementation M- 46th Implementation M- 47th Implementation M- 48th Implementation JL 49th Implementation M- 50th Implementation JL Guanggu Ping 1 η 眚 Example — Chemical Rod 1 1 Sound Example — — — — — — — Resin Rod 1 9. 眚 例-Composition Π 施 Example-Wu Ping〗 4 眚 Applicant 40 — One--One 筚 1 6 眚 Tonic — 35 40 20 20 — — 1 1 7 眚Example — — — — — 40 — 荦 1 S 眚 Structuring — 40 conductive mm h —— 65 60 70 70 60 60 Sexual powder solid R R — — — — — — — Last solid Γ — — 60 -— — — LiM η — —— — 60 — — IS® f. — — — — 60 —-'Roller Rivier 酾 — — — — 2 Carbitol 7, 酴 Cool — — — — 5 — 7, -Glycol Dibutyl Ether—— — · ~-— —— — 3 7. — One on one 5 5 — Surface paper base material ιηΩ / sq. 73 105 81 103 86 55 49 Resistive PET base material ιΩ / sq. 130 190 165 — — 95 90 --- i ------ i --- --- Order ------ line (please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Note: The light source is an 80W / cm high-pressure mercury lamp (including ozone). The photocurable resin composition, the conductive powder, and the solvent unit are parts by weight. With the present invention, it is not necessary to know the sintering process necessary for conductive coatings after photo-curing, and it is necessary to form a conductive pattern with a surface resistance of less than 200 m Ω / sq. Only by photo-curing. In addition, since the working time can be shortened to several seconds to several minutes by light irradiation, it has excellent mass productivity and low cost. The second preferred embodiment This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) α60560 A7 5319twf.doc / 008 B7 V. Description of the invention (7 叼 (Please read the notes on the back first) (Please fill in this page again) In the second embodiment of the present invention, the conductive paint contains at least one kind of coating and flexion adjuster (F2) as an essential component. Furthermore, the conductive paint of the second embodiment of the present invention is preferred. It is a photocurable conductive paint and contains conductive powder (A2), a photocurable resin composition (B2), and a coating property and a flexibility adjuster (F2) as essential components. As this photocuring The conductive powder (A2) and the photocurable resin of the conductive paint can be the same as those of the example of the conductive powder (A1) and the photocurable resin composition (B1). A large surface coefficient and a specific gravity can be used. High molecular compounds with a small average particle size or low glass transition point. Specifically, the surface coefficient is higher than 100m2 / g, the apparent specific gravity is lower than 50g / l, and the average primary particle diameter is lower than 30nm. Silicon oxide (e.g. AEROSIL 200CF made by the company, the same as 300CF), (ii) a saturated polyester with a softening point below 100t and a molecular weight of 1,000-50000 (for example, Byron500 manufactured by Toyobo Co., Ltd., the same as 130), line (iii) the glass transition point (Tg) Polyvinyl ether below -30 ° C (for example, Rutonal M40 manufactured by BASF, the same as A25), printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, (iv) benzene with a softened electricity higher than 〇〇〇〇t Oxyresin (meaning an oligomer or polymer derived from a bisphenol compound and epichlorohydrin) (e.g., Yuka-Shell (^ (: Epikot, manufactured by Sun Yat-sen Corporation), and 4010? Same), these individual '⑴ cohesive force and feathery structure to form a pseudo-bridge structure' (π) and (ni) to increase the viscosity of the whole ink to reduce the film's Tg, (1V) by the terminal bridge to substantially promote the polymer quantification, and It can be adjusted to coatability and flexion. These can be used alone or at the same time. _ ^ _____ 27 This paper size applies to China National Standard (CNS) A4 (_21〇χ 297 mm) ~ ~ &quot; Λ60560 B319twf.doc / 008 ΰ / ----------__ Explanation (%) The ratio of the weight of the conductive powder (A2) to the weight of the photocurable resin composition (B2) and the coatability and flexibility modifier (F2) is preferably 50/50, 95/5, 55 / 45-90 / 10 is more preferable. Also, within this range, the weight ratio of the photocurable resin composition (B2) to the coatability and flexion adjuster (F2) is preferably 1-99 / 1, 3 / 1-80 / 1 is better. In addition, in the conductive coating according to the second embodiment of the present invention, well-known silica, alumina, mica, toner, pigment, fuel, polymerization inhibitor, thickener, Thixotropic agents, precipitation inhibitors, oxidation inhibitors, dispersants, various resins, various organic solvents, etc. It is also possible to add a known resin to the conductive coating of the second embodiment of the present invention. This example is not included in the resin (C). It is also possible to add a known solvent to the conductive coating material of the second embodiment of the present invention. However, in order to avoid remaining in the system after the curing reaction, the boiling point is preferably 250 ° C or lower. An example is disclosed in the above-mentioned solvent (D). The total amount of these additives is preferably 35% or less with respect to the weight sum of the conductive powder (A2), the photocurable resin composition (B2), and the coatability and flexibility modifier (F2). The manufacturing method of the conductive paint of the second embodiment of the present invention is the same as that of the above-mentioned example. The viscosity of the photocurable conductive coating of the first embodiment of the present invention is preferably 10-100 million mPa. S (cpoise), 10,000- 50mPa's is better. In the conductive coating material according to the second embodiment of the present invention, a base material (hereinafter referred to as base material (E)) for forming a pattern by a well-known method using screen printing, offset printing, or a coater can be used. E). ______ 28 f Please read the notes on the back before filling in this page}

.1T Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China's National Standard (CNS) A4 specification (210X297 mm) &quot;

A 6〇5 60 A7 5319twf.doc / 008 W Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (The method for forming a pattern on a base material using the conductive coating of the second embodiment of the present invention can be implemented according to the examples The light source for curing the photocurable conductive coating of the second embodiment of the present invention can also be implemented according to the examples. Next, the production of the conductive coating of the second embodiment of the present invention, the use of these printed patterns, and the implementation of photocuring will be described. Example 51 to Example 63 are prepared as shown in Table 5. First, a photocurable resin composition and a coating property 'flexibility adjuster are mixed, and they are stirred at room temperature for 30 minutes or more in a light-shielding state to make them uniform. If necessary, reheat and dissolve. After returning to normal temperature, add a light curing initiator and stir until homogeneous. Then, mix the silver powder, mix with a blender, and knead with a high-shear kneader to obtain the photocurability of the present invention. Conductive paint: Using the above-mentioned photocurable conductive paint, a 1mm wide X lm long screen is screen-printed on a base material by a 180 mesh emulsion plate with a thickness of 15 on a base material. The printing thickness of the printed layer is about 15 mm. As the base material, NPI-55 made by Nippon Paper Co., Ltd. The polyethylene terephthalate film is lutmler S made by Toray Co., Ltd. Curing reaction system A metal halide of 160w / cm is irradiated 5 times with a conveyance type irradiation device under the condition of 110mW / cm2 (measured by UVR-T35 manufactured by Co., Ltd.). The base material used in any case has no significant color. , Heat shrinkage, softening, embrittlement, charring, etc. Surface resistance is obtained by measuring the resistance between the two ends of the pattern after curing. 29 (Please read the precautions on the back before filling this page) -s ί This paper Standards apply to China National Standards (CNS) Λ4 specifications (210 X 297 mm) a 60560 A7 5319twf, doc / 008 B7 V. Description of the invention (': 〇) The results are shown in Table 1. Coating properties, ink The overall viewpoints of stretching, plate transmission, fine line peaks, and real-time properties are judged from very good = ◎ good = 〇 problematic = △ not coatable = χ. Flexibility test system uses a cylinder with a cross-sectional area of about 20 cm 2 and 2 kg. Shaped copper at 25 ° C The following steps are performed in sequence in a tight state, placing the weight in a zigzag direction inward for 30 seconds-30 seconds after removing the weight-folding and placing the weight for 30 seconds-removing the weight for 1 minute-measuring the resistance 値 (〇 hmic value) ° The change of resistance 値 is judged as less than + 5% = ◎, more than + 5% less than + 10% = 〇, more than + 10% less than + 20% = △, more than + 20% or = x. (Please read the notes of vg first and then fill in the {clever page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the employee consumer cooperatives 30 This paper size is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) 460560 5319twf. doc / 〇〇8 A7 B7 V. Description of the invention (4 Agricultural and 5th Society Examples Silver light curable tree m light start M F.-9.0 ΤΓΠ-7

Limonene djxiiids—— nv ^-^ ms | KS-snn RF.n-priceΠΚ xnn SP-170 CP-66

VI 52 13 34 0.35 0.35 Λ2_ 56 14 29 0.30 Α3_ 52 13 30 0.35 0.30 0.35 54 52 52 13 13 30 30 0.35 0.35 0.35 0.35 Coating flexion adjuster

Aerosil200C F

Byron500

RutonalM40 0

Epicote 4010P Coating Surface Electricity m Paper base material m Ω / s q. PET base material Μ m Ω / sa. Flexibility test o 〇_ (〇)

O 48 82 © 49 49 56 43 90 © 103 111 81 © © 13 IT; 0.35 0.35 ((48 90 57 18 ήη 61 (S? Λλ 52 52 52 52 52 52 52 13 13 13 13 13 13 13 — — 8.5 7.5 —-30 — — — — _ — 34 30 —— — One — One — — 35.5 22.5 One — — — — — 34 30). 35-— 0.35 0.35 0.35 0.35). 35 — — 0.35 0.35 0.35 0.35 — 1 One 1 One. 5 — 5 — 5 — 5 — — — — — — One one — — — — 〇〇〇〇〇〇〇〇50 52 51 47 31 79 78 95 101 112 122 130 140 133 IX ◎ 0 〇0 〇 〇 (Please read the notes on the back before filling this page)

1T printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, silver powder, photocurable resin, photoinitiator, conductive powder, coatability, and flexibility regulator. Units are parts by weight. [Silver powder] E-20: Silver powder Syivest dagger 20, TCG-7: Deli powder, Sylvest TCG-7 '[Photoreactive resin] This paper is used in China National Standard (CNS) A4 specification (2! 0 × 297 mm) A7 B7 at 60H. One or five, the invention description (4) KS-800: ADEKA OPTMER KS-800 (Epoxy resin and aromatic混合物 Chlorine compound mixture), UVR-6105: CYRACURE UVR-6105 (3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate), biphenyl dioxide by Union Carbide: Biphenyl dioxide produced by Elf Atochem: (1-methyl-4- (2-methylhydroxylanil) -7-oxabicyclo [4,1,0] heptane), BEO-60E: BEO-60E (ethylene oxide denatured bisphenol A type epoxy) manufactured by Shinnippon Physico Chemical Co., Ltd., XDO: XDO (l, 4-bis [(3-ethyl-3-oxa Cyclobutylmethoxy) methyl] benzene), [Photocuring Initiator] SP-170: ADEKA OPTMER SP-170 (aromatic sulfonium chloride compound) manufactured by Asahi Denka Kogyo Co., Ltd., CP-66: Asahi Chemical Co., Ltd. Limited manufactured by ADEKA OPTMER CP-66 (aromatic sulfonium chloride compound) [coatability, modifiers buckling]

Aerosil200CF: oxidized sand Aerosil 200CF made by Aerosil Co., Ltd.,

Byron 500 (surface coefficient 200m2 / g, apparent specific gravity 30g / l, average primary particle diameter 12nm): Byron 500 (softening point 20-10 ° C, molecular weight 5000-25000) manufactured by Toyo Textile Co., Ltd.,

Rutonal M40: Ether polyvinyl methyl Rutonal M40 (glass transition point -49 ° C), manufactured by BASF, Epcot 4010P: Epika Epico, manufactured by Yuka-Shell Epoxy Co 丄 td. 32. Chinese National Standard (CNS) A4 specification {2] 0 × 297 mm) (Please read the precautions on the back before filling out this page) Printed by the employee's consumer cooperative in the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee's consumer cooperative in the Intellectual Property Bureau of the Ministry of Economic Affairs &gt; 4 60 5 60 A? 5319twf .doc / 0 0 8 B7_______ V. Description of the invention (eg) Special 4010P (softening point 135 ° C), Comparative Examples 1 to 6 are modulated as shown in Table 6, and are the same as those in the 51st embodiment Up to the 63rd example, a photocurable conductive coating was prepared, and evaluated after printing and curing °

Table 6 fh m 1 Ύ 3 4 5 β silver powder Ε-20 S9. 59. so S7. TCG-7 Π 14 Π n π-13 photocurable resin Limonene dioxide 8.7S UVR-6105 KS-800 π BEO-60E XD 〇Light initiator SP-170 0.3S mo fMS η.is n., S CP-66 0 ^ n.sn n. ^ Ο.ν η Coating property Λ Λ 〇Λ Λ Surface resistance paper base material m Ω / sq. ss 46 si 7Π Ή 7Q PET base material ιΩ / sq. 1 07 QQ 131 Π4 ηη ΊΠ1 Flexibility test XXXX Λ X (Please read the precautions on the back before filling this page) Order silver powder, photocurable resin, Photoinitiator units are parts by weight. From the comparison between Table 5 and Table 6, to the first comparative example to the sixth comparative example, it can be judged that the 51st to 63rd embodiments of the present invention are very good. The light-curable conductive coating of the second embodiment of the present invention shows that the light-cured conductive coating not only has the advantage of early curing, but also the coating of this light-curable conductive coating __ 33 This paper is suitable for China National Standard (CNS) Λ4 specification (210X297 mm) 4 60560 A7 5 319twf. Doc / 0 0 8 B7 V. Description of the invention (W) The cloth properties and yield resistance can also be greatly improved. Then, it can also be used to form fine peak circuits below 0.20 # m, or plastics with a thickness of 50 m and below. It is also very easy to form circuits with paper-based materials or to form circuits on substrates such as plastic and paper. Third Preferred Embodiment The third embodiment of the conductive coating of the present invention is a photocurable conductive coating, which uses silver powder and a photoreactive resin (B3-2) in a wavelength range of 270 to 700 nm in 300-450nm has the composition of the light-curing initiator (B3-1) or photosensitizer (B3-3) with the maximum optical absorption as the main component. In this case, in order to effectively control the printability of the above-mentioned silver powder, two or more kinds of powders having various shapes, such as an average particle diameter, a surface coefficient, and a tap density, may be used. In addition, in order to improve the affinity of the powder coating with the organic composition and the dispersibility of the powder in the coating, the surface of the powder can also be treated in the powder manufacturing process or after manufacturing. As the surface treatment agent, a known one can be used. The above-mentioned photoreactive resin (B3-2) is a reactive resin having a functional group that reacts with the generated radical-active species or cationic-active species. The compounds exemplified can be used as the above-mentioned photoreactive resin (B1-2 ). If fast curing is required, the more the average number of reactive groups per molecule is, the better, but the excessive polyfunctionalization makes the curing shrinkage obvious and wrinkles on the coating film. Therefore, it is best to use an average of 4 as the upper limit per molecule. Furthermore, a mixture of two or more kinds can be used in any case. In order to maintain the viscosity of the above-mentioned photoreactive resin (BS3-2) as a whole, in order to maintain the kneading with silver powder or the printability of the coating, it is preferably 5000mPa. S (cpoise) at 25t, 10-2000mPa (cpoise) · s more good. This paper size applies the Chinese National Standard {CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) -a Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs d 6050 60 a? 5319twf, cioc / 008 B7 V. Description of the invention (91) In this embodiment, a light curing initiator (B3-1) or a photosensitizer with the maximum optical absorption in the band of 300-450nm in the band of 270 to 700 is used. Agent (B3-3). The reflectance of silver is described in the Science Chronology (1986 Perfection Co., Ltd.), p. 551, etc., and is expressed at 300-320nm and has a reflectance of less than 20% (see section丨 diagram). Silver in this band absorbs light and causes transfer of energy to excite other similar substances. At this time, because the energy supplied is lower than the energy excited by silver itself, it is not only 300-320ηηι, but also on the long wavelength side. Materials that perform optical absorption can also receive excitation energy. Therefore, the use of initiators or activators that meet this condition can cause light curing due to metal reflection or light shielding. However, too far away from the absorption wavelength, it is easy to reduce the energy transfer rate Poor, so long wavelength side It is also well below 450 nm. As the photocuring initiator (B3-1) or photosensitizer (B3-3) used in the third embodiment of the present invention, well-known ones can be used. For example, the photocuring initiator such as [ 4- (methylphenylthio) benzyl alcohol] (for example, BMS manufactured by Nippon Kayaku Co., Ltd., with a maximum absorption of 315 nm), ethyl anthraquinone (for example, manufactured by Nippon Kayaku Co., Ltd. under the trade name 2- ^ (^, Maximum absorption 32511111), 2,4-ethyl anthracene phenol (for example, DETX-S manufactured by Japan Chemical Co., Ltd., maximum absorption 385 nm), 2-chlorooxyanthracene (for example, Japan Trade name of CTX, manufactured by Chemical Pharmaceuticals Co., Ltd., maximum absorption: 385 nm), 2-benzyl-2-dimethylamine-1- (4-morpholinolbenzene) -1-butanone (for example, manufactured by Ciba Specialty Chemicals) Name Irgacure369, maximum absorption 320nm), 2,4-trichloromethyl (4, -methoxynaphthalene) -6-triazine (for example, trade name TRIAZINE B manufactured by PANTIM SA, maximum absorption 380nm), 2,4- 3.35 This paper size applies to Chinese national standard (CNS) A4 size (210X297 mm) (please read the note on the back before filling this page). Property Bureau: Printed by Yibeigong Cooperative Cooperative 4 60 5 60 5319twf.doc / 008 A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention ο) Chloromethyl (4'-styryl) -6 -Triazine (for example, trade name TRIAZINE PMS manufactured by PANTIM SA, maximum absorption 375NM), etc., photosensitizer, for example, (isoamyl p-dimethylaminobenzoate (for example, DMBI manufactured by Nippon Kayaku Co., Ltd., the largest Absorption 315nm), perylene (maximum absorption 430NM) and so on. It is also possible to use a mixture of two of the above. In addition, the maximum absorption wavelength can be easily confirmed by measuring ultraviolet and visible light absorption spectra. For reactivity, a catalyst such as a hydroxyl compound or an amine compound may be added. The added amount at this time is preferably 0.01-200% relative to the weight of the photocuring initiator (B3-3) or the photosensitizer (b3-3). Although the weight ratio of the silver powder to the photoreactive resin (B3-2) is not particularly limited, it is preferably 10 / 90-95 / 5, and more preferably 30 / 70-90 / 10. Moreover, as long as the effect of the present invention is not impaired, well-known silica, alumina, mica, toner, pigment, dye, polymerization inhibitor, thickener, thixotropic agent, precipitation inhibitor, and oxidation inhibitor can be added. Agents, dispersants, various resins, various organic solvents, etc. The total of these additives is preferably 50% or less based on the weight of the silver powder and the photoreactive resin (b3-2). The resin added to the conductive paint of the present invention can be used. For example, a resin exemplified for the resin (c) can be used. Solvents that are well-known to be added to the conductive paint of the present invention can be used. Just to avoid remaining in the system after the curing reaction, the boiling point is preferably below 25 ° C. For example, the solvent (D) is exemplified. The viscosity of the photo-curable conductive coating of the third embodiment of the present invention is 'to make it have appropriate coatability and the printed thickness after coating' is preferably 10-30 n. Order I n (Please read the note on the back first Please fill in this page again for this matter) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 4 β〇560 5319twf.doc / 008 V. Description of invention Uu〇1 million mPa. S (cpoise) ° 1000 -30 million mPa · s is better. In the photocurable conductive coating according to the third embodiment of the present invention, a substrate material (hereinafter referred to as a substrate material (E)) that is patterned by a well-known method using screen printing, offset printing, or a coater is used. The substance held on the base material (E). The light source system for curing the photocurable conductive paint of the present invention can be used in the same manner as in the above examples. The following is a description of the production of a photocurable conductive paint in the third embodiment and an example of photocuring using these prints. Production of photocurable conductive paint (silver paint) The 64th embodiment to the 75th embodiment were prepared and mixed as shown in Table 7, and mixed with a kneader, and then uniformed by a roller at a predetermined position 3 of the cross line. , That is, the photocurable conductive paint of the present invention. Using the photo-curable conductive coating material described above, the above-mentioned photo-curable conductive coating material was used to screen-print a pattern having a width of 1 mm and a length of 1 lm by using a screen plate of 180 mesh emulsion thickness 15 on a base material to obtain a sheet. The printing thickness of the printed layer is about 15 # m. As the base paper, NPI-55 made by Japan Paper Co., Ltd., and polyethylene terephthalate film was made by Lumiler S made by Toray Co., Ltd. The curing reaction uses a high-pressure mercury lamp with an output of 4kw at 80w / cm or a metal halide with an output of 4kw at 80w / cm as a light source, and the light is irradiated with a transmission type irradiation device. The light energy required for curing is shown in Table _ 37. The paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) '~ (Please read the precautions on the back first Fill out this page} &quot; Λ- ι ^ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

60 560 5319twf.doc / 008 Λ7 B7 V. Description of the invention Table 67 Example 67 67 7Π 71 72 74 75 Resin Μ-9.4Π Μ- ^ ήΠ Μ-4Π ×

KS-SOO

ITVR- ^ IOS

Limonene riioxide 50 50 50 50 50 50 50 50 40 40 40 20 20 20

M a one one n

M p Huang Feng. P D

F

X ΓΤχ 1-369 SP-170 rv-ββ activated silver powder (please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the light-curing energy is DMBI P.- 70_ G-19. ΤΓΓτ-1_ Μ_ (mJ / cm2) (paper and paper material) (mJ / cm2) (PE T and paper material 1 pencil hardness (TiSK5400) 37.5 37.5 12.5 Hg 1000 12.5 Hg 1500 1000 1500 0.8 0.8 0.2 0.6 0.6 0.2 Order 45 45 37.5 37.5 37.5 37.5 37.5 45 45 IS H £ 1500 15 Hg 500 12.5 Hg 1000 12,5 Hg 500 12.5 Hg 1000 12.5 Hg 1500 12,5 Hg 500 15 Hg 1000 15 Hg 500 37.5 12.5 Hr 250 line 500 500 500 1000 1000 1500 500 1000 500 250 Η Η Η Η Η Η Η Η Η Η Η Η Η Resin, initiator, activator, silver powder unit weight parts. [Photoreactive resin] M-240: East Asia Synthetic Co., Ltd.'s Aronix M-240 (polyethylene glycol malonate), 38 paper sizes are applicable to China National Standards (CNS) A4 specifications (210X297 mm) 4 ^ 0560 5319twf.doc / 008 A7 B7 V. Description of the invention (From) M-360 · Aronix M-360 (trimethylolpropane ethylene oxide) Denatured tripropionate), M-408 Aronix M-408 (two-three-diameter methylpropane tetraacrylate) manufactured by Toa Synthesis Co., Ltd., KS-800: ADEKA OPTMER KS-800 (made by Asahi Denka Kogyo Co., Ltd. Mixture of epoxy resin and aromatic chlorine compound), UVR-6105: CYRACURE UVR-6105 (3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate) manufactured by Union Carbide,

Limonene dioxide: Limonene dioxide U-methyl-4- (2-methylhydroxylanil) -7-oxabicyclo [4,1,0] heptane) produced by Elf Atochem, [Photo initiator (light Curing initiator)] BMS: BMS ([4- (methylphenylthio)] benzyl alcohol) manufactured by Nippon Kayaku Co., Ltd., 2-EAQ: 2-EAQ (ethyl anthracene) manufactured by Nippon Kayaku Co., Ltd. Quinone), Triazine A: TRIAZINE B (2,4-trichloromethyl (4'-methoxynaphthalene &gt; 6-triazine)) manufactured by PANCHIM SA, Triazine PMS: TRIAZINE PMS (2,4 manufactured by PANCHIM SA) -Trichloromethyl (4'-styryl) -6-triazine), DETX-S: DETX-S (2,4-dihexyloxyanthracene) manufactured by Nippon Kayaku Co., Ltd., CTX: Japan CTX (2-chlorooxyanthracene) manufactured by Chemical Pharmaceutical Co., Ltd., 1-369: manufactured by Ciba Specialty Chemical (rgacure819 (2-fluorenyl 39) This paper uses Chinese National Standard (CNS) A4 specifications (2lOX297 mm) 〉 (Please read the precautions for back rain before filling out this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperatives of the Ministry of Economic Affairs Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economics, printed d 60 560 A7 5319twf.doc / 008 B7 β) -2-dimethylamine-1- (4-morpholinolbenzene) -1-butanone)) SP-170: ADEKA OPTMER SP-170 (aromatic fluorinated chlorine compound) manufactured by Asahi Denka Kogyo Co., Ltd. , CP-66: ADEKA OPTMER CP-66 (aromatic chloro compound) manufactured by Asahi Denka Kogyo Co., Ltd., [Photosensitizer] DMBI: DMBI (P-dimethylamino Benzoate Isoamyl) manufactured by Nippon Kayaku Co., Ltd. ) E-20: Sylvest E-20 manufactured by Deli Co., Ltd., E-20: Sylvest E-20 manufactured by Deli Co., Ltd., G-12: G-12 manufactured by Tonghe Mining Co., Ltd. TCG-1: Sylvest TCG-1 manufactured by Deli Co., Ltd., [Light source] Hg: High pressure mercury lamp with 4kw output at 80w / cm, MH: Metal halide mercury lamp with 4kw output at 80w / cm, [Curing energy] The light irradiation energy required for the coating film to become tack-free and fixed to the base material was measured at 320-390 nm 'using an EIT Instrumentation Equipments company UV POWER PUCK. Comparative Examples 7 to 11 are comparative examples using a light curing initiator or photosensitizer which does not have the maximum optical absorption in the 300-450 nm band in the 270-700 nm band. As shown in Table 8, the same coating materials as those in the 64th to 75th embodiments were obtained, and screen printing was performed on the same base material. And 40 paper sizes are applicable to China National Standard (CNS) A4 specifications (21〇 × 297 公 ϋ &quot; I ~ &quot; Order 11 I line (please read the note ^ a ^ on the back before filling this page) B0560 5319twf .doc / 008 A7 B7 V. Description of the invention () ¾) The photocuring reaction was performed using the same device as the 64th to 75th embodiments. The light energy required for curing and the pencil strength on the cured surface are shown in Table 8. Not all of them are not sticky, and the pencil strength cannot be measured. The maximum absorption of the phenol used as the initiator is 255 nm. tPlease read the precautions on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs® Printed by the Industrial and Consumer Cooperatives 41 This paper size applies to the Chinese National Standard (CNS) A4 size (210X297 mm) Λ60560 5 319twf. do c / 0 0 8 A7 B7 V. Description of the invention (β) BU l · Age side 7 8 Q 10 11 Resin M-240 50 50 40 KS-S00 — — ___ 50 — TIVR-filO4; — — .__ 40 Start Agent mm_ 2.5 2.5 2.5 — — SP-170 — one — — 0.6 ΓΡ-66 — one —-0.6 silver powder F .-? N 37.5-45 37.5 45 Γτ-19.-37.5 — — _ ΤΓΠ-1 12.5] 12.5 15 12.5 15 half MW Hg h2 Hs MH MH curing energy (mJ / cm2) (paper substrate. Material) &gt; 5000 &gt; 5000 &gt; 5000 &gt; 5000 &gt; 5000 (mJ / cm2) (PET even material) _ &gt; 5000 &gt; 5000 &gt; 5000 &gt; 5000 &gt; 5000 Pencil Poison Degree (_I1S K54QQ)-cannot be measured cannot be measured most cannot be measured cannot be measured cannot be measured (please read the notes on the back before filling this page) The unit of printing resin, starter, and silver powder of the Consumer Cooperative of the Property Bureau employees are parts by weight. According to the present invention described above, a coating material using silver, which is indispensable for conventional heat curing, as a filler can be cured only by light irradiation. Then, the processing time required to be more than 100 ° C and more than several minutes, which is required for heat curing, can be shortened by light irradiation to a few seconds to minutes. Fourth Preferred Embodiment Although the above-mentioned conductive paint is a photo-curable material, it is possible to obtain not only an antenna for a non-contact data transmitting / receiving device ', but also other solvent-dried materials as the conductive paint. That is, "the fourth embodiment of the conductive coating material of the present invention is" a binder resin solid having a glass transition point (τ§) below 0.2 to 5% by weight. If the above conductive coating is used, it can not only be used on flexible substrates. 42 This paper size is applicable to China National Standard (CNS) A4 (210 X 2W mm). 4 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 60560 A7 5319twf. doc / 008 B7 V. Description of the invention (l | &gt;) Or the antenna is formed by a tortuous base material, and the sustainable volatile solvent has the advantages of short-term curing, low resistance, and can obtain a tortuous coating by conductive coating . The solvent-drying conductive paint is at least one selected from a polyvinyl ether resin, a polybutadiene resin, an acrylic resin, an epoxy resin, and a urethane resin. Compared with general conductive inks, When added, the binder resin with a glass transition point (Tg) below 0 ° C is 0.2-5% by weight, preferably 1-2% by weight. Therefore, maintaining short-term curing and low conductivity improves the folding resistance. The binder resin is preferably a polyvinyl ether resin or a polybutadiene resin. By adding a small amount of binder resin, the glass transition point (Tg) of the binder is reduced, and it is not easy to crack. Moreover, only a small amount of these binder resin components need to be added to achieve the effect of maintaining the adhesion of the silver powder. Then, when an excessive amount of the binder resin component is added (more than 10% by weight), the electric resistance 値 increases. In addition, if only the adhesive resin is used as the adhesive component of the conductive ink, a low-resistance resin cannot be obtained. Next, for the evaluation test, LS415CM manufactured by Asahi Chemical, TS5202 manufactured by Tanaka Precious Metals, and DW351 manufactured by Toyobo were used as conductive inks. When adding 1-2% solid weight of polyvinyl ether resin and polybutadiene, When added, measure the coating strength (fold resistance test) and surface resistance after curing. The results are shown in Table 9. In the table, A100 represents polyethylene ether M40 represents ether polyvinylmethyl, and% 値 represents the weight percent of solids added. The folding endurance test is on the upper side of the conductive paint coating that is folded inward, and the metal pillar is rotated about 1kg back and forth, and then the metal pillar 43 is folded back and forth (please read the precautions on the back before filling this page). The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) p 460560 A7 5319twf.doc / Q08 B7 V. Description of the invention (mountain) A trip is hereby counted as one time to confirm the durability of the bending Sex. Table 9 Surface resistance (m Ω · cm'1) mmr »End of resistance test (min) π snr. Ί Asahi LS415CM No addition _? .N 1 9.S Ainn-i% 76 S DI h 9 .S Μ4Π-1% 95 ^ Di l · 9 * 5 Μ4Ω-9.% 7R S Di l · 7S Tanaka precious metal TS5202 Polybutadiene --- 悌 9 8 f DI l · 9 /; Addition _ 1R 1 90 Toyobo DW351 A 1% 24 5 to h 90 without addition 1 70 a mo-ι% S DI h 9n Μ4Π-1% SW 90 90 40-40% 5 to h 90 ί Threading · (Please read the precautions on the back first (Fill in this page again.) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in Table 9. It can be confirmed that the strength of the coating has been greatly improved due to the addition of 1-2% of the solid content of polyvinyl ether resin and polybutadiene. . In addition, when a polyvinyl ether resin is added to a thermosetting conductive paint, the coating strength can be increased, but the increase rate of resistance 値 is also increased. From the above-mentioned conductive coating, it can only add 0.2-5% solid resin with a weight of adhesive resin, that is, maintain the characteristics of low resistance and short-term curing of volatile solvent conductive ink, and improve its volatile solvent conductivity. Low coating strength due to weak points of inks. ____44 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm ^ &quot; A7 B7 ^ 60560 V. Description of the invention (d &gt;) "Curing method of conductive coatings" The inventors and others focused on the The ultraviolet radiation lamp used for the curing of ultraviolet curable resin is irradiated with more infrared rays than the infrared radiation lamp, and the energy absorption of the conductive coating involves the ultraviolet part. Therefore, the present invention provides a curing method of the eastern coating to irradiate with infrared rays. The ultraviolet radiation lamp is a light source, and the conductive coating material is irradiated with light from the light source to cure it. The above-mentioned ultraviolet radiation lamp used as the light source is, for example, a high-pressure mercury lamp or a metal halide mercury lamp. Because these systems use ultraviolet rays for mercury evaporation discharge Tube, so the light energy radiated from its discharge tube contains 14.6% UV, 11.3% visible light, 45.5% infrared, 28.7% other heat. In addition to the UV and visible light, 74% of the energy input to the light source is converted into heat. Moreover, UV radiation The same is true for xenon lamps. In comparison, the near-infrared halogen is nearly red The external line lamp uses the filament to illuminate the light. Therefore, the input of 1 to 2KW in the high output lamp is the largest, the input per unit length is 70W / cm, and the infrared radiation rate is 86%. In addition, the ultraviolet radiation lamp is the largest class (class 280W / cm. In addition, the infrared irradiation rate is about 45% as described above. However, if the input per unit length is integrated, the amount of infrared rays to be irradiated is double that of the above-mentioned halogen near-infrared irradiation lamp. It can be efficient from this point. Heat is transferred to the conductive coating to dry it and solidify. Figure 2 shows the absorptivity of each band of the conductive coating compared to the upper paper. Obviously, the absorption of the conductive coating also involves the ultraviolet field. Therefore, it will be used as the energy of the ultraviolet radiation lamp (except (please read the precautions on the back before filling in this page),? Τ line · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption Cooperative, this paper is suitable for China &quot; ϊ 家 &gt; Almost all of the light energy from the record (210x297 ^ 4 60560 A7 5319twf.doc / 0 0 8 ____ ^ _____ 5. Description of the invention () other than the above heat 28.7%) is used in The measurement conditions are based on the use of NPI55 made of Nippon Paper's conductive paper and the Asahi Chemical Research Institute LS-415-CM for conductive coatings. An integrating sphere was installed in the Hitachi spectrophotometer U-3500, and the reflection concentration was measured. In addition, when the infrared radiation lamp is used as a light source, the surface resistance 固化 after the above-mentioned conductive coating is cured when the ultraviolet radiation lamp is used is measured. Figure 3 shows the change in the surface resistance with respect to the power consumption per unit area. Figure 3 clearly confirms that after comparing the power consumption per unit, it is learned that when using high-pressure mercury lamps for curing, it is less than when using near-infrared radiation lamps, and it can effectively cure the conductive paint green. Each symbol in the figure indicates the following conditions. ◊: When using infrared radiation lamp (condition: iGrafx Co., Ltd. transmission type 1KW &gt; &lt; 3 lamp infrared radiation device, lamp QIR200 / 200V1000W / G 1000WX3 lamp irradiation distance 4cm transmission speed 5m / min): use ultraviolet radiation lamp (Condition: TOSHIBA LIGHTING &amp; TECHNOLOGY Co., Ltd. Toshiba UV irradiation device, lamp M8400L / A output 240W / OI1 irradiation distance 7cm transmission speed 12m / min) △: When using ultraviolet radiation lamp (Condition: TOSHIBA LIGHTING &amp; TECHNOLOGY Toshiba's UV irradiation device, lamp M8400L / A output 280W / cm, 280W / cm irradiation distance 7cm, transmission speed 12m / min) Compared with the conventional thermal drying oven and infrared radiation used for curing conductive coatings, it can be used in The conductive coating is cured in a shorter time. "Formation method of antenna for non-contact data transmitting and receiving device" _______ 46 This paper size is applicable to Chinese National Standard (CNS) Λ4 specification (2 丨 0X297). (Please read the precautions on the back before filling this page) * ^ τ Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 460560 5319twf.doc / 008 A7 B7 Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the Invention (4) The first preferred embodiment goes on to explain 'the present invention A first embodiment of a method for forming a non-contact data transmitting / receiving credit antenna using an electrically conductive coating to form an antenna. In this embodiment, first, where a base material for a 1C wafer is provided, a pattern of an antenna-shaped device is printed on a thermosetting conductive paint using, for example, a screen printing method. Then, a thermosetting conductive coating material is printed on the base material in the shape of an antenna, and then the printed surface is irradiated with infrared rays to cure the thermosetting conductive coating material. In the step of curing the thermosetting conductive paint, the antenna is formed on the base material. The antenna was tested by irradiating infrared rays with a thermosetting conductive paint. The evaluation criteria, the type of conductive paint, and the type of infrared light source are as follows. (Evaluation Criteria) If the conductive coating is cured under the conditions recommended by the manufacturer (15 (TC 30 points), the surface resistance 値 will be about 25 ώΩ / ν. (The antenna resistance 値 for a width of 1mm and a length of lm is 250Ω). If you can get 25mQ / sq. Resistance 値, it can be considered as complete. (Type of conductive paint) 415CM manufactured by Asahi Chemical Co., Ltd., and FA333 manufactured by Fujikura Kasei. And the same result can be obtained from both. (Type of light source) Near-infrared radiation lamp (USHIO motor QIR100V-1000W / D) Far-infrared radiation lamp (Ibid. QIR100V-1000YD) The distance from the light source to the conductive coating is 20cm 47 (Please read the note on the back of the paper before filling this page) Order-line paper size is applicable to China National Standard (CNS) A4 specification (210X m). 460560 Λ7 5319twf.doc / 〇〇8 B7 V. Description of the invention (closed) (Test result) Surface resistance obtained ( Unit: mQ / sq.) The results are shown in Table 10 below. Table 10 Yi infrared radiation squeezing reads 5 appearances of the infrared radiation lamp. 42 mm r fk_ 33 眧 射〗 〇 _ 9.6 Zhao 15 _ 1R mm wlL 18 26 18 9.6 Zhao She 4〇JL · Zhao 60 seconds shot Q0 seconds _ _ 昭 射 2Q_M_ ---- __ When the near-infrared radiation lamp is used to irradiate near-infrared rays, it reaches 25mQ / sq. In 10-15 seconds. When the far-infrared radiation lamp is used to irradiate far infrared rays, It reached 25mQ / sq. In 30-40 seconds. From the above results, it can be seen that when irradiated by near-infrared radiation lamp and far-infrared radiation lamp, it can obviously obtain the predetermined performance in a shorter time than the conventional hot air blowing method. In this way, because the use of hot air at 150 ° C can obtain 35mQ / sq, resistance 値, if considering the conventional method requires a minimum curing time of 20 minutes, it can be judged that it has sufficient effect. The solvent contained in the conductive coating volatilizes It can be found by thermal curing with resin ____ 48 This paper size is suitable for storage ^^^ 丨 匚 以 ^^^ mm) (Please read the precautions on the back before filling in this page) Order economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau 460560 53l9twf.doc / 008 ΚΙ B7 V. Description of the invention (iL6) Its performance. That is, from the above results, it can be inferred that it efficiently imparts large-scale heat to conductive coatings, so Available in a short time That is, after irradiating the near-infrared radiation lamp for 10 seconds, the temperature of the paper surface on the opposite side of the conductive coating reaches Π0Ό. Therefore, "consideration of" heat loss transmitted to the opposite side "and" (because the opposite side is in contact with the stand) Therefore, the temperature is reduced due to the stand. "It can be inferred that the temperature of the conductive coating itself has reached a relatively high temperature. As shown in the above description, because the conductive coating is cured by infrared radiation, it can be cured in a shorter time than the conventional hot air curing method. Because the curing time of this conductive coating is shortened, the non-contact property can be improved. Productivity of data transceivers. Second Preferred Embodiment The second embodiment of a method for forming an antenna for a non-contact data transmitting / receiving device according to the present invention will be described with reference to the drawings. The antenna forming method of this embodiment uses a base material 1 for arranging a 1C chip as a paper material. As shown in FIG. 4, first, an antenna body 2 arranged in a swirl shape is formed in the antenna of the base material 1 by printing with conductive paint. This antenna main body 2 is formed by printing, and when the cross lines are formed by printing as described later, for example, a screen printing method can be used. Then, after the antenna body 2 is cured, an insulating material 4 is formed at a predetermined arrangement position 3 of the crossover wire. Next, on the insulating material 4, the intersection portion 5 connected to the antenna body 2 at one end is printed by a conductive paint in the same manner as the antenna body 2 described above. It is cured to obtain an antenna. 49 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) Ding Consumer Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs Printed Employee Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs Printed 460560 A7 53l9twf.doc / 0〇8 B7 V. Description of the Invention (Clever) The above-mentioned insulating material 4 is a mixture of epoxy ultraviolet curing resin and insulating inorganic fine particles such as silicon oxide, talc, and alumina. This mixture is printed and cured by irradiation with ultraviolet rays. This insulating material 4 can be coated, for example, with a coating thickness of about 15 μm, and can be cured by 4 kw of ultraviolet radiation for a time of about 1 second. In this way, a small amount of ultraviolet rays are irradiated to form an insulating material, so the overall efficiency of the formation process of the non-contact data transmitting and receiving device is also improved. The epoxy-based ultraviolet curable resin alone can make the above-mentioned insulating material have a high viscosity (more than 1000 mPa), and can be used immediately if it is a base material without penetrability (penetration) such as PET. When paper is used as the base material, silicon oxide is added here to increase its viscosity, which can prevent penetration into the base material. Therefore, using silicon oxide as an insulating inorganic fine particle in an insulating material, an insulation evaluation test is performed by changing the amount of silicon oxide added. The test was performed by adding 2 to 8 parts of silicon oxide to 100 parts of the epoxy-based ultraviolet curable resin as described below. The materials used are epoxy-based UV-curable resins, ADEKA OPTMER KS830 and ADEKA OPTMER KS871 manufactured by Asahi Chemical Industry Co., Ltd., and oxidized sand systems, and Aerosil 200 (average particle size 0.015 μm) manufactured by Japan Aerosil Co., Ltd. After forming the antenna body, apply the above-mentioned insulating material 10-20 // m thick on the upper side of the antenna body portion, and cure by irradiating with ultraviolet rays (output 4kw, irradiation time is about 1 second). Then, a cross line is printed on it to cure it, and then an antenna is formed to connect the wires. Make 10 sheets in this way and measure the electricity individually_ 50 This paper is suitable for If® National Standard (CNS) A4 size (210X297 mm) '---, -------: ----, 1T ------ ^ (Please read the precautions on the back before filling in this page) A 60560 A7 53l9twf.doc / 008 B7 V. Description of the invention (required) Resistance status. At the stage of judging the resistance state ', as shown in the table, if the insulation status of all 10 sheets is good, it is ◎, if S-9 is judged to be insulated, it is 0, if 5-7 is judged to be insulated, it is △, and it is less than 4 sheets. It was judged to be 乂 for insulation. Table η Epoxy-based UV-curable resin _ Silica resin / Silica insulation state KS-871 Aerosil200 100 / R ©) 100/5 η 1 ΠΠ /? X KS-830 Aerosil200 100/8 (δ) _ -100 / 5 (δ) ___ 100/3 _ Λ It has been confirmed by tests that an insulating material composed of a mixture of an epoxy-based ultraviolet curable resin and silicon oxide can be used as an insulating material for non-contact ic component crossover wires. Then, 'when the insulating material is coated with a base material formed of a paper material', as shown in the results of Table 1 above, it is known that 3 to 8 silicon oxides are formed with respect to 100 parts of the epoxy ultraviolet curable resin. Formation of insulation parts. It can also be judged that Aerosil 200 is particularly effective as silicon oxide, especially very small silicon oxide. That is, it can be confirmed by judgement that the above is not expressed as a material, but the thickening effect of large silica larger than 1 // m is better, because it cannot enter the fiber of the paper material to improve the fixing effect. small. _________51 This paper size applies Chinese national standards (CNS> Eight Regulations 4§ · (2! 〇χ: 297 public love) (Please read the precautions on the back before filling out this page), 8T Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 460560 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy ^ 5319twf.doc / 〇〇8 B7 V. Description of the Invention (Ming) 3rd Preferred Embodiment Next, the non-contact data transmitting and receiving device of the present invention will be described. Embodiments of a multilayer circuit. The multilayer circuit of the present invention is preferably one having an antenna function. The method of forming a multilayer circuit using an antenna as an example will be described below. The specific antenna system is, for example, a base material formed of paper and interacts with each other. It is obtained by printing a conductive layer and an insulating layer. Paper is preferred as a material for forming circuits in the form of a multilayer paper, and paper may be a well-known material. In addition, a synthetic paper made of a polymer or a surface thereof is coated with an organic material or an inorganic material. The cloth can also be used. The antenna is formed by screen printing the above-mentioned arbitrary conductive paint on the base material. However, the printing method is not limited to screen printing. For the formation of the edge layer, screen printing is a well-known insulating coating containing insulating particles and binders, and various additives. However, the printing method is not limited to this. For the insulating particles in the above insulating coating, silicon oxide and oxidation can be used. Aluminum, talc, etc. In particular, silicon oxide particles with an average particle size of less than 1 ^ m are more suitable for ink thickening and maintaining the shape of the coating film. However, if the insulating property can be ensured without insulating particles, it is not necessary As the insulating coating, any one of well-known materials such as penetration drying, solvent volatility, and thermosetting properties can be used. Then, the photocurable resin is included in the binder, which can shorten the curing time and further improve the photocurable insulating coating. The photo-curable resin and photo-initiator that can be contained in this insulating coating can also be the same as the conductive coating. Among them, it is better to have excellent ______52______ This paper size applies the Chinese national standard ( CNS) A4 rule (1) 〇 &gt; ^ 97 mm) — (Please read the precautions on the back before filling this page)

Line 1T-460560 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 5319twf> cioc / 〇〇8 _B7_____________ 5. Description of the invention (b) Insulating epoxy resin and photocation. Figures 5 (A) to 5 (F), which show the circuit stacking method. 'First, prepare 11 as the base material (Figure 5 (A)), and print a circuit 12 with conductive paint on it. (Figure 5 (B)). After drying and curing, the part that is connected to the circuit on the upper layer side, for example, as shown in the figure, the end portion of the circuit 12 is used as a non-printed part 13 to print on other areas to form an insulating coating to provide an insulating film 14 (Section 5 (C) Figure). After the insulating film 14 is dried and cured, it is connected to the non-printed portion 13 and a circuit 12 is formed by printing on the insulating film 14. Then, the circuit 12 is dried and cured (Fig. 5 (D)). The above-mentioned circuit 12, the end portion (the portion connected to the upper-layer circuit) is made as the non-printed portion 13, and an insulating film 14 'is formed on the remaining area to dry and solidify it (Fig. 5 (E)). Furthermore, it is connected to the above-mentioned print section 13 'and printed to form an insulating film 14, a circuit 12 "on it, and this circuit 12" is dried and cured (Fig. 5 (F)). In this order, the circuit 12 and the insulating film 14 are alternately printed and printed to obtain a printed circuit 15 having an antenna connected to a multilayer circuit. Then, a printed circuit 15 is added to this post-processing to obtain a non-contact data transmitting and receiving device. The multi-layer circuit is electrically connected to each other. Here, a part of the non-printed parts is formed and connected, and the other parts are fully insulated. However, the present invention is not limited to the method shown in the examples. The insulation layer may also be partially used for connection by the non-printed portion, or may be overlapped and printed with the non-printed portion again. Moreover, the order may not be shown in the drawings. Moreover, it can be used in the installation of various equipment such as 1C wafers of multilayer circuits formed by the method of the present invention, such as using wire bonding (WB), non-isotropic _____ 53_______ This paper standard is applicable to China National Standard (CNS) A4. UlOXW (Mm) (Please read the notes on the back first and fill out this search)

1T line 460560 5319twf.doc / 008 A7 B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by Consumer Cooperatives V. Description of the invention (w) Conductive conductive layer (ACF), conductive coating (ACP), insulating resin (NCP), solder ball Things connected. If necessary, the well-known underfUl or potting can be used to protect and reinforce the connecting part. Furthermore, in order to protect the entire multilayer mounting circuit from external factors, a coating material or various film coatings may be used. Next, examples of forming a multilayer circuit in the present invention will be described below. However, these are not intended to limit the scope of the invention. (Preparation of Photocurable Conductive Coatings) Silver powder made by Deli Head Store Co., Ltd., a mixture (F) of Sylvest E-20 and Sylvest TCG-7 (weight ratio 8: 2), and epoxy made by Elf Atochem , Biphenyl Dioxide and Asahi Chemical Industry Co., Ltd. Starter, ADEKA OPTMER SP-170 and ADEKA 〇PTMER CP-66 (mixing ratio 100: 3: 3) mixture (G), and Toyo Textile Co., Ltd. 500 (H) manufactured by the company, mixed with (F), (G), and (H) weight ratios of 65:30:53, and then kneaded with 3 rollers to obtain a photocurable conductive coating (used in the present invention) I). (Preparation of Photocurable Insulating Coatings) As a photocurable resin composition, ADEKA OPTMER KS-871 manufactured by Asahi Denka Kogyo Co., Ltd. and Aerosil200CF manufactured by Japan Aerosil Co., Ltd. as fine-grained oxidized sand. Mixing 92: 8 and kneading with a kneader to obtain a photocurable insulating coating (J) used in the present invention. The 76th embodiment uses NPI-55 made by Japan Paper Co., Ltd. as a paper substrate -------- 54 national standards (CNS) A4 specifications (21〇297297 feet V '-(Please read first Note on the back page, please fill in this page again), 1T-line ^ 60 560 A7 5319twf.doc / 008 B7 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (y) materials. The produced LS-415-M is used as a conductive coating. In order to make it 180 mesh emulsion made by Tetorone with a thickness of 15 #, as shown in Figure 6 (A), it is screen-printed with plate 16. The 150t hot air is used. It took 30 minutes for the oven to dry and solidify. Thereafter, in order to use CR44B manufactured by Asahi Chemical Research Co., Ltd. as an insulating coating, it became a 180 mesh emulsion made by Tetorone with a thickness of 15 // m. Figure 6 (B) shows the printed pattern twice with 17 and dried and cured under the same conditions. Then, after "borrowing 16 to print and dry the conductive layer"-"borrowing 17 to print and dry the insulating layer"-"borrowing the plate "16 Printing and drying conductive layer" project, so that the conductive layer (circuit) forms a three-layer circuit pattern. In the examples, NPI-55 made by Japan Paper Co., Ltd. was used as the paper base material. The photocurable conductive paint (I) adjusted as described above was used as the conductive paint. In order to make it a 180 mesh emulsion made by Tetorone, the thickness was 15 μm, screen printing with plate 16 as shown in Figure 6 (A). Using a 160W / cm metal halide mercury lamp, light irradiation was performed with a cumulative light amount of 5000mJ / cm2 (measured at the 300-500nm band) to make After curing, in order to use the above-mentioned photocurable insulating coating material used as an insulating coating material, it was made into a 180 mesh emulsion made by Tetorone with a thickness of 15 &quot; m, and as shown in FIG. 6 (B), it was set at 17 Print the pattern once, and use the same light irradiation device to illuminate it with the accumulated light amount of 500m: T / cin2 (measured in the 300-500nm band) to cure it. Then, "Dry Plate 16 Dry and Cures the Conductive Layer"- "Borrow 17 to dry and cure the insulation layer"-&gt; "Borrow 16 to dry and cure the conductive layer" project, so that the conductive layer (circuit) forms a three-layer circuit pattern. 55 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) IIIII ar y. I ϋ I n ^ innn ^ (Please read the precautions on the back before filling in this page)! 160 560 5319twf-d〇c / 〇〇8 A7 B7 V. Description of the Invention Example: In the twelfth comparative example, NPI-55 manufactured by Nippon Paper Co., Ltd. was used as a paper base material. As a conductive coating, LS-415C-M manufactured by Asahi Chemical Research Co., Ltd. was used. In order to make it a 180 mesh emulsion made by Tetorone with a thickness of I5 # m, screen printing was performed on a plate 16 as shown in FIG. 6 (A). It took 30 minutes for i5 (rci hot air oven to dry and cure. The 13th comparative example used NPI-55 made by Nippon Paper Co., Ltd. as the paper base material. The photocurable conductive paint (I) as described above was used as the conductivity. Coating. In order to make it a 180 mesh emulsion made by Tetorone with a thickness of 15 # m, screen printing is performed on plate 16 as shown in Figure 6 (A). A metal halide mercury lamp of i60 watt / cm is used at 5000 mJ / cm (Measured in the 300-500 nm band) The integrated light amount is irradiated with light to cure it. In the aforementioned 76th embodiment, 77th embodiment, I2 comparison example, and 13th comparison example, the surface resistance of the circuit end was measured. The results are shown in Table 12. As shown in Table 12, compared with the twelfth embodiment and the thirteenth embodiment, the 76th embodiment and the 77th embodiment can obtain better results. Moreover, the version of FIG. 6 16. The middle slash area is the part containing the paint 56 (please read the notes on the back before filling in this tile) Order. Printed by WK Industrial and Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics and Paper This paper applies Chinese national standards (CNS) Λ4 Specifications (210X297 mm) 6 0560 A7 5319tw f.doc / 008 B7 V. Description of the invention) _ Table] 2 Surface resistance rmn / sq .. at the end of the circuit 箆 76 Example 7 筚 77 tube Example 14 12th comparative example 19 13th comparative example 40 Ministry of Economic Affairs Printed by the Intellectual Property Bureau Staff Consumer Cooperative

Only the above methods can be used in parallel, series circuits in a confined space, or to store a large amount of information, thereby realizing a non-contact data transmitting and receiving device using a paper as a base material installed with a 1C chip. Fourth Preferred Embodiment Next, the fourth preferred embodiment will be described with reference to FIGS. 7 to 10 to eliminate the increase in manufacturing cost or the necessary manufacturing procedures to increase the thickness of the conductive layer and reduce the resistance 値. In the figure, the 31-series thin-film antenna is provided with a pair of antenna return lines 33 on one side of a sheet-like base material 32 made of paper or film. This antenna return line 33 is composed of the conductive layer of the above-mentioned conductive paint by screen printing. Then, the antenna return line 33 is provided in a symmetrical pattern such that the fold line 34 provided at a position where the base material 32 is bisected is located at a symmetrical position therebetween. Next, a coating material composed of a bonding agent, an adhesive, or the like is uniformly applied to one antenna loop forming surface 35. Then, the base material 32 is folded from the fold line 34 so that the antenna return line 33 is placed inside. By this folding, the opposing antenna return line 33 is overlapped with the coating material 36. Thereafter, the 57 paper sizes required by the application are applicable to the Chinese National Standard (CNS) A4 ^ format (2 丨 0X 297 male H (please read the precautions on the back before filling this page) 60 560 A7 5319twf.doc / 008 B7 V. Description of the invention (β) The pressure makes the antenna return line 33 bonded to obtain the antenna 31. Fig. 9 shows a partial cross-sectional view of the antenna 31 obtained by the above method. The opposite antenna return line 33 is obtained by The coating 36 is laminated, and the opposite antenna return line 33 is directly connected to a small part to form a conductive state. The antenna return line 33 is formed by integrating the opposite pair of antenna return lines 33 and the conductive layer is thickened. Antenna 31 with reduced resistance 値 In addition, in order to clarify the requirements of the invention shown in the figure, the mounting portion of the 1C chip or the connection portion across a part of the return line is provided without illustration. Spray glue 55 made by Sumitomo3M Co., Ltd. As the coating material mentioned above, the remaining coating materials can be applied to the antenna loop forming surface by spraying, screen printing, or gravure coating. In addition, the coating can also be applied to the antenna. Full face side of the base material with the loops. In addition to the coating of planar and outside points may be (DOT), the pattern-based coating or fine synthetic resin latex (Latex)

YJ2301D made by Mitsubishi Chemical BASF Co., Ltd. AE200, AE517 made by Japan Synthetic Rubber Co., Ltd. 270 made by Shinshin Chemical Industry Co., Ltd. Superflex SF110 natural rubber latex made by Daiichi Industries Pharmaceutical Co., Ltd. Polybutadiene 'polyvinyl ether, Polyvinyl alcohol 'styrene, maleic acid, solvent-soluble substances. When bonding, if the coating 36 is too thin (to 3g / cm2), just apply light pressure (to 2Kg / cm2). However, if the paint 36 is thicker, only 58 paper sizes are required to comply with the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page). Printed by the cooperative A7 B7 460560 3l9twf.doc / 008 5. Description of the invention (4) Heating and pressure (for example, 5Kg / cm2, 130 ° C for 30 seconds). Then, the shape of the antenna return line was obtained from the comb-shaped pattern of lmmx1000mni by the above-mentioned laminating method to obtain a sheet antenna. Measure the resistance 値 of the laminated sheet antenna that is lightly pressed (simple bonding) during bonding, and the laminated sheet antenna when heated and pressed, and the antenna loops (antenna 1, antenna 2) before bonding, and the results are shown.于 表 13。 In Table 13. The coating application forms are divided into thin coating, thick coating, and pattern coating. Conductive Ink Co., Ltd. Asahi Chemical Research Institute LS4150 CM, screen printing emulsion thickness of 15 # m to form a loop meter for antennas. 13 Materials • Thin coatings • Roadmaps Figure 1 Coating wireless 1 70 20 70 antenna? , 20 20 20 Simple bonding 10 20 10 Heating / additive in 10 10 (unit Ω) As shown in Table 13 above, the resistance can be reduced by bonding. Especially when heating and pressure, the resistance 値 is half of the resistance 全部 of all antenna loop units. Its 値 conforms to the Ohm's law in the case of parallel resistance, and it can be confirmed that it has the effect of reducing the resistance of the thin-film antenna. In addition, after the coating and thick coating were applied, the two antenna circuits were not conducted, and the antenna circuit resistance 値 of one antenna was measured. The two antennas are superimposed with a self-folding line and a coating on the circuit so that the low-resistance and thin-film antenna can be obtained. In addition, it is possible to ensure that the two antenna loops do not overlap with each other without causing a position correction error. Therefore, no special steps are required to obtain a thin-film antenna. _ 59 This paper size applies to China National Standards (CNS &gt; α · 4 size (2 丨 OX 297 mm) (please read note # ^ on the back before filling this page) Ding of the Ministry of Economic Affairs Intellectual Property Bureau Η Consumer Cooperative Printed 460560 5319twf. Doc / 008 A7 B7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (θ) Then, it is obtained by attaching the same resistance and heating to the pressure of the two antenna circuits. 1/2 Resistive / thin-sheet antenna. Therefore, even if a low-cost and high-resistance material is used to form the antenna's loop sheet antenna, the resistance is only 1/2. Then, using high-priced and low-resistance material can make it have a single antenna. Same characteristics ° Moreover, the resistance of each antenna return line is made to be specific. In this way, the resistance of the antenna can be set according to Ohm's law when the resistance is connected in parallel. Therefore, it is easy to prepare multiple conductive materials for the return line of antennas. The resistance 薄片 of the thin-film antenna is set according to the purpose. Moreover, as described above, two thin-plate-shaped base materials are overlapped, and individual antenna loops for the above-mentioned base materials are bonded. Improve the resistance to the antenna fold line. This point can be clearly seen from the illustration. This 10th coating is shown as the bent part when the antenna 31 is folded. As shown in the figure, the antenna return line 33 is broken at the fold. 37. However, since the opposing antenna return lines 33 are directly bonded as described above, the antenna return line 33 which has been broken 37 can also be conducted by the opposite antenna return line 33. Therefore, it is possible to ensure that the antenna is properly conducted. 31. "1C chip mounting method" The following is a list of the 1C chip mounting methods for antennas formed by the various antenna formation methods described above. The 1C chip is mounted on the base material at the mounting position on the base material forming the antenna. The terminal portion corresponding to the 1C wafer side has a conductive adhesive substance (K) overflow printing method to form an adhesive portion. In addition, an insulating adhesive substance (L) in the non-terminal portion is formed by the printing method. The adhesive part is adhered by thermocompression bonding the 1C wafer with the base material thereon, thereby fixing the wafer 60 _ This paper size is applicable to China National Standard (CNS) Λ4 specification (2) 〇 &gt; &lt; 297 PCT) (Please read the notes and then fill in the back of this page)

’1T line_ 4 ^^ 560 A7 5319twf.doc / 〇 ^^ B7 Intellectual Property Bureau of the Ministry of Economic Affairs: Printed by β Industry Consumer Cooperatives 5. Description of invention) Location and reliability of connection. As the base material, the above-mentioned base materials (E) can be used. The formation of the antenna 'on the base material can be performed by a well-known method such as printing using the above-mentioned conductive paints. The conductive adhesive substance (K) and the insulating adhesive substance (L) used in the method of the present invention are preferably selected to have almost no volatile components during thermal compression bonding. Moreover, adhesion to the 1C wafer can often be found after heat treatment. Adhesive material, which can maintain the reliability after installation (such as impact resistance, water resistance, humidity resistance, heat resistance, etc.). Furthermore, from the viewpoint of continuously and surely maintaining the state where the 1C chip is fixed to the circuit, it is preferable to have an adhesive substance having a bridge structure and capable of forming a bridge structure by heat treatment. Since the conductive adhesive substance (K) mentioned above can ensure the conductive connectivity with the terminal of the 1C chip, the resin composed of the conductive particles and the adhesive is preferably the necessary component, and it is preferably used with the antenna and the 1C chip. Conductive paint with strong adhesion of terminal metals. Metal powder, especially silver powder, is a representative conductive particle. It is also possible to use conductive particles other than silver, such as gold, platinum, copper, nickel (Ni), cobalt (Co), palladium, germanium, and the like. The insulating adhesive (L) has a function of fixing the position of the 1C chip by adhesion, preventing a short circuit between the conductive connection portions, and further protecting the conductive connection portion from external impact. Therefore, it is better to have high adhesion to metal, base material, and circuit parts on the base material, and excellent insulation, and it can absorb stress-strain from thermal shock or physical shock. Of resin. Moreover, if the resin alone is not easy to reach (please read the precautions on the back before filling out this page) -a This paper size applies to China's national standard (CNS) A4 specification (210 X 29? Mm) A7 460560 5319twf. doc / 008 B7 5. Description of the invention (β) Insulation fillers can also be added in the case of margins, such as silicon oxide, oxide bromide, glass, talc, rubber, etc. Forming a conductive adhesive substance (κ), or an insulating adhesive The resin containing the essential components of the substance (L) may also be a 'well-known thermoplastic resin or thermosetting resin or both. Thermoplastic resin' such as polyethylene, polypropylene, polystyrene, ABS resin, polymethylmethacrylate Methyl acrylate, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyvinyl alcohol, polyoxymethylene, polycarbonate, polyethylene terephthalate, polybutylene terephthalate Phenol, poly 2,3-dihydroxyoxaline, polymaple, polyimide, polyether maple, polypropylene ester, polyether hexyl ether ketone, polytetrafluoroethylene, silicone resin, etc., can also be one or two A combination of the above types, but it is not limited to this. Lipid composition, which is selected from those which do not produce volatilization to # during the curing reaction, such as (1) the compound of bisphenol A or bisphenol F 'or 3,4-epoxycyclohexylmethyl-3,4-epoxy Liquid epoxy resins typified by cyclohexyl carboxylic acid esters, and amine compounds, phenol compounds, acid anhydride compounds' organic acid compounds or tweezing chlorine compounds, (2) 1,1 di (4-cyanic acid) Liquid cyanate resins and metal salt catalysts represented by Yiyuan, (3) additional polymers of dimaleic acid diimide or dimaleic anhydride imine and diamine compounds, and amine compounds , Propylene-based compound or radical initiator, (4) propylene-based compound represented by diallylphthalate, and amine-based compound or radical initiator, (5) triallyl isocyanurate Ester or tricyanopropanol cyanurate, and amine compounds or peroxides, (6) polyvalent active hydrogen compounds represented by polyethanol, hexaethylene glycol, glycerin, and isohydrogen vinegar, (7) to Polypropylene 62 This paper size applies to Chinese National Standards (CNS) Λ4 specifications (210X29? Mm) (Please read the precautions on the back before filling Page) ir Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs® Industrial and Consumer Cooperatives 〇U56〇A7 5319twf.doc / 008 B7_____ V. Description of the invention () (Please read the precautions on the back before filling this page) Diethylene glycol Aliphatic acrylate compounds represented by esters, and radical initiators, (8) liquid polyolefins containing vinyl groups, and radical initiators, (9) compounds having ethylene silane compounds, SiH and the like , And platinum catalysts, etc., but it is not limited to this. If the conductive adhesive (K) and the insulating adhesive (L) 'can be removed from the solvent before thermal compression bonding of the 1C wafer, the solvent may be contained. As a solvent, a well-known thing can be used. However, in order to avoid remaining in the system after curing reaction, the boiling point should be lower than 250 ° C. For example, hydrocarbon solvents such as toluene, cyclohexane, methylcyclohexane, η-hexane, and pentane; alcohols such as isopropanol and butanol; cyclohexanone, methyl ethyl ketone, and methyl can be used. Ketones such as isobutyl ketone, diethyl ketone, isophorone, esters such as ethyl acetate, propyl acetate, and butyl acetate, methoxyethylene glycol, ethoxypropanol, and methoxydiacetone Glycol, 3-methoxy-3-methylbutyl acetate, and other glycol alcohol ethers, these acetates, and one or more of the above-mentioned solvents are mixed systems. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. And the 'adhesives' can be placed in a semi-cured state by heating, electromagnetic wave irradiation or electron beam irradiation, etc. before mounting the chip in advance. When light is irradiated from visible light to ultraviolet rays, a well-known photocurable resin composition is added. For example, a combination of an epoxy resin and a photocation generator, an acrylate resin and a photoradical generator, and the like. Moreover, well-known additives such as release agents, surface treatment agents, extenders, pigments, and dyes can also be added. For example, waxes, zinc stearate, and the like can be used as a release agent, and a silane coupling agent can be used as a surface treatment agent. Can be silica, alumina, talc, clay, etc. as fillers. The conductive adhesive (K) and insulating adhesive (l) mentioned above can be divided into ___ ^ _ __ 63 ^ Paper size is applicable ^ 1 National Standard (CNS &gt; A4 Specification (210 × 297 mm)-4 60 5 60 A7 5319twf. Doc / 008 B7 V. Description of the Invention (Hungary) (Please read the notes on the back before filling out this page) Do not borrow the ingredients, or mix them with a well-known appropriate method such as a kneader, 3 rollers, etc. It is uniformly dispersed. Then, the adhesive substance is adjusted to a thick liquid state within a temperature range in which the base material does not deteriorate during printing. This is applied to the base material after the circuit is formed by the printing method. Although it is well known The printing method is used, but the screen printing method is better. Moreover, the reactivity of these adhesive substances (K) and (L) is adjusted to the final thermal compression bonding conditions when the wafer is mounted, preferably 40-250 ° In the temperature range of C, the time range of 0.M20 seconds and the pressure range of 0.1-0.5Mpa will fix the 1C wafer. Then refer to Figures 11 (A) to 11 (E) and 12 (A) to Figure 12 (F) illustrates an example of the installation method, while Figures 12 (A) to (F) show it as Figure 11 (A) to (E) are schematic cross-sectional views of the mounting positions. For the mounting position A of the base material 22 that forms the circuit 21 as the surface antenna by the above method, the 1C chip 23 is mounted by the following process. Form circuit 21 (Figure 11 (A), Figure 12 (A)) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (ii) Except for the contact part with the 1C chip 23 terminal device 24 (here there are two places) Use the above-mentioned insulating adhesive substance (L) to apply the printing method to form the insulating adhesive portion 25 (FIG. 11 (B), FIG. 12 (B)). The insulating adhesive portion 25 may be applied before the next process. For heating, electromagnetic wave irradiation or electron beam irradiation, it can also be directly moved to the next project. (Iii) In order to make it absolutely contact the 1C chip 23 terminal device 24, a conductive adhesive substance (K) is used for terminal adhesion. The printing method of the part 26 is from the above-mentioned insulating adhesive part 25 to the above-mentioned circuit 21 to form a thickness. That is, (64 papers from the circuit, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). Intellectual property of the Ministry of Economic Affairs) Printed by the Bureau's Consumer Cooperatives 460560 A7 5319twf.doc / 008 B7 2. Description of the invention ((^) Calculate the height of the insulation adhesive part d) &lt; (Calculate the height of the terminal adhesion part d from the circuit). (Figure 11 (C), Figure 12 (C)) The terminal bonding portion 26 may be heated, electromagnetic wave irradiated, or electron ray irradiated before the first project, or it may be directly moved to the next project. In any case, the volatile components must be fully removed before the next project. (iv) Adjust the positions of the insulating adhesive part 25 and terminal adhesive part 26 of the 1C wafer 23 formed by the above (ii) (iii) process coating by appropriate methods (Figure U (D), Figure 12 (D) Figure). (v) The 1C wafer 23 is thermocompression bonded using an appropriate device (Fig. 11 (E), Fig. 12 (E)). The insulation bonding portion 25 and the terminal bonding portion 26 are preferably performed under the conditions of a temperature range of 0.M to 20 seconds and a pressure range of 0 to 1 to 5 Mpa. After thermocompression bonding, in order to further complete the reaction, heat curing or electromagnetic wave irradiation may be performed. Installation of the 1C chip 23 is completed as above (FIG. 12 (F)). Furthermore, in order to protect the 1C wafer mounting portion, after mounting in the present invention, the whole or a part of the mounting portion may be covered with an adhesive material, a coating material, or the like. From this, it can be seen that the manufacturing process of a non-contact data transmitting and receiving device mounted with a 1C chip can be simplified. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. 65 (Please read the notes on the back first and fill in this page)

This paper size applies to Chinese national standard {〇 阳} 〇4 size (210 \ 297 mm)

Claims (1)

90. 3. 27 A8 B8 C8 D8 460560 fl.doc / 008 .L * rt ίίΗ || II II IJJ-Renovation for the special issue of the table no. Mi υ ν υ 6. Apply for a patent for dry-wall 1. A light curing Conductive coating, the coating is cured by light irradiation so that its surface resistance is lower than 200mO / sq, 'The photocurable conductive coating includes a conductive powder and a photocurable resin composition' and its weight ratio is 50 / 50-95 / 5, where 'the conductive powder is a fully conductive powder containing more than 80% of dendritic conductive powder and scaly conductive powder' and the average densities of the dendritic conductive powder are 〇. 〇5_ 丨, QV m〇 'surface coefficient is 0.5-5.0 ma / g, the scale-like conductive powder system, the average particle diameter is 1.0-10.0 # m, the surface coefficient is 0.5-5.0 πί / g' the The weight ratio of the dendritic conductive powder to the scaly conductive powder is 60 / 40-95 / 5. 2. The photocurable conductive coating according to item 1 of the scope of the patent application, which contains a complex of an aromatic halogen chloride initiator and a non-aromatic epoxy resin formulated at a weight ratio of 0.01 / 100-10 / 100. . 3. The photocurable conductive coating according to item 1 or 2 of the scope of the patent application, wherein the photocurable resin composition contains thioanthrone, thiophenol derivative, anthraquinone derivative, At least one selected from the group consisting of sulfonium sulphuric acid derivatives and at least one selected from the group consisting of acrylates and methacrylic acid esters, and a complex prepared by mixing at a weight ratio of 0.01 / 100-10 / 100 . 4. The photocurable conductive coating according to item 1 or 2 of the scope of the patent application, preferably at least selected from the group consisting of silicon oxide, saturated polyester, polyvinyl ether resin, and phenoxy resin A coating and flexing conditioner of one term, the surface coefficient of the silica is higher than 100 Πΐ / g, the apparent specific gravity is lower than 50g / l, the average primary particle diameter is lower than 30nm, and the softening point of the saturated polyester is lower than 100 ° C, molecular weight is 1000-50000, the glass of this polyvinyl ether resin is 66 IIII I ------- ^ — — — — — — I— ^ --------- 1 ^ · ( Please read the notes on the back before filling out this page) Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, this paper uses Chinese National Standard (CNS) A4 (210 X 297 mm). Yinhe 460560 5394pif1.doc / 008 fefii B81l637〇5 ^ cpX # iij * Bgn ^ ih ^ jlf IE H ^: 2 0 0 1.3.2 7 VI. Patent application scope Glass transition point (Tg) is lower than -30 ° C The softening point of the phenoxy resin is higher than 00 ° c. 5. —A photocurable conductive coating containing at least one compound selected from the group consisting of silver powder, a photoreactive resin, a photocuring initiator, and a photosensitizer. The above compound has a maximum optical performance in the 300-450nm band. absorb. 6. The photocurable conductive coating according to item 5 of the scope of the patent application, wherein the photoreactive resin is a compound selected from at least one of the group consisting of an acrylate compound and a methacrylate compound. 7. The photocurable conductive coating according to item 5 of the scope of the patent application, wherein the photoreactive resin is composed of an alicyclic epoxide, an oxetane compound, an alkene oxyalkylene compound, and a glycidyl ether. At least one compound is selected from the group consisting of a compound and a vinyl ether compound. 8. The photocurable conductive coating according to any one of items 5 to 7 of the scope of the patent application, consisting of [4- (methylphenylthio) phenyl] benzyl alcohol, ethylanthraquinone, 4,4-diethylanthracene phenol, 2-chloroanthracene phenol, 2-benzyl-2-dimethylamine-1- (4-morpholinylphenyl) -1-butanone, 2,4- Trichloromethyl (4'-methoxynaphthalene) -6-triazine, 2,4-trichloromethyl (4'-styryl) -6-triazine, p-dimethylaminobenzoic acid isopropyl At least one of the group consisting of amyl ester and perylene anthracene is used as the photocuring initiator or photosensitizer. 9. A conductive coating containing a binder resin with a glass transition point (Tg) of less than o ° c and a solids content of 0.2-5%. 10. The conductive coating according to item 9 of the scope of the patent application, wherein the binder resin is at least one selected from the group consisting of a polyvinyl ether resin and polybutadiene. 67 nnnn * n _ fft · if E ti I 《Please read the precautions on the back before filling in this page） This paper size applies to China National Standard (CNS) A4 Specification &lt; 210 X 297 mm) 460560 5394pifl.d〇 c / 008 A8 B8 C8 ΓΝΟ The consumer cooperation agreement of the Intellectual Property Bureau of the Ministry of Economic Affairs is printed as ^ BH 1.1 .1 b J 7 ^ and "^ ~ 柯." Patent application scope 11. The conductive coating according to item 10 of the patent application scope, containing a volatile solvent. 12. A method for curing conductive coatings, which uses a UV spotlight that radiates with infrared rays as a light source, and irradiates the conductive coatings with light from the light source to cure the conductive coatings. 13. A method for curing a conductive coating according to item 12 of the scope of the patent application. The ultraviolet radiation lamp is at least one selected from the group consisting of a metal halide mercury lamp, a high-pressure mercury lamp, and a xenon lamp. 14. A method for forming a non-contact data transmitting and receiving credit antenna having a 1C chip and an antenna, comprising: a step of printing a thermosetting conductive paint on a base material provided with a 1C chip in a pattern of the antenna shape; and ± The step of irradiating the printed surface of the thermosetting conductive coating material with infrared rays to cure the thermosetting conductive coating material. 15. The method for forming a non-contact data transmitting / receiving credit antenna according to item 14 of the scope of patent application, wherein the infrared rays irradiated onto the printing surface are near infrared rays. 16. · A method for forming a non-contact data transmitting and receiving credit antenna with an IC chip and an antenna, comprising: printing an antenna-shaped pattern on a base material equipped with a 1C chip, as described in items 1 to 12 of the scope of patent application A step of any one of the conductive coatings; and a step of curing the conductive coating. 17_ — A kind of non-contact data receiving and sending letter 68 with IC chip and antenna (please read the precautions on the back before filling in this page). Clothing 丨 丨 Order --------- line {This paper size is applicable to China National Standard (CNS) A4 Specification (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 6506〇 A8 B8 5394pif1.doc / 008 is &quot; Ji UU _L _L. j 7 u 号 屮 __ The patented E repair it glue ItH period _ please patent the method of forming the antenna for the scope of the patent, the above-mentioned antenna system is configured by the antenna main body configured in a spiral shape and connected to the antenna main body to cross An antenna composed of crossed lines of an antenna main body, the method includes: a step of printing and forming a base material on which a 1C chip is provided by applying any one of the conductive paints described in items 1 to 12 of the patent application park; A step of curing the conductive coating; a printing step of an insulating material composed of an epoxy-based ultraviolet curable resin and insulating inorganic fine particles at a predetermined arrangement position of the cross line; a step of curing the insulating material by ultraviolet radiation; A step of printing and forming a conductive wire connected to one end of the antenna body on the cured insulating material as described in any one of the first to the twelfth conductive paints of the patent application scope; . 18 · —A method for forming a non-contact data transmitting and receiving credit multi-layer circuit with a 1C chip and an antenna, which includes sequentially printing a conductive coating and an insulating coating on a base material by using a printing drying method ' A photocurable coating is added to at least one of the conductive coating or the insulating coating. 19. The method for forming a non-contact data transmitting and receiving credit multi-layer circuit according to item 18 of the scope of patent application, wherein the above-mentioned multi-layer circuit has an antenna function. 20. A non-contact data transmitting and receiving device, a 1C chip is mounted on a multilayer circuit formed by using the method described in any one of the 18th or 19th patent application. 69 This paper has been used in China National Standard (CNS) A4 ^ ίΓ? 2Ϊ〇χ 297 ----- Ill ----- ~ -Clothing ------- Order ---- I! Line ('I (Please read the precautions on the back before filling out this page) 60 560 A8 B8 5394pifl · doc / 008 C8 D8 丄 dj 7 ϋ 3A Righteousness Patent scope revision: i \ U ΊΕ 0: ^ τυ ~ ΰ ~ ι. ό. ζ VI. Patent application scope 21. —A method for forming a non-contact data transmitting and receiving credit antenna with a 1C chip and an antenna, including: printing on one side of a sheet-like base material to form the first scope of the patent application The antenna I-line made of the conductive paint according to any one of item 12 is set as a step of setting a symmetrical pattern on a line-symmetrical position in the fold line of the base material; for the antenna on at least one side The step of coating the loop forming surface with a coating; and the step of folding the base material from the fold line so that the antenna loop is inside, and the antenna loop is bonded. 22. A force method for mounting a 1C chip on a base material circuit, including: Equipped with 1C wafer as the base material. A step of forming a circuit by printing a conductive paint; a step of curing the conductive paint; a step of printing and forming a portion connected to a terminal of an IC chip on the base material by a conductive adhesive substance; a step of forming a circuit by an insulating adhesive substance Steps of printing to form an insulating portion of an IC chip mounting position on a base material 'A step of disposing a 1C chip at the mounting position; and a step of mounting by thermal compression bonding from above the 1C chip. 70 ------- ---- 1 ^ Loading · ----- 丨 丨 Order -------- line one, I (Please read the notes on the back before filling this page) The paper size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm)