TW458385U - Lead frame having die pad - Google Patents

Lead frame having die pad

Info

Publication number
TW458385U
TW458385U TW89218169U TW89218169U TW458385U TW 458385 U TW458385 U TW 458385U TW 89218169 U TW89218169 U TW 89218169U TW 89218169 U TW89218169 U TW 89218169U TW 458385 U TW458385 U TW 458385U
Authority
TW
Taiwan
Prior art keywords
lead frame
die pad
die
pad
lead
Prior art date
Application number
TW89218169U
Other languages
Chinese (zh)
Inventor
Spencer Su
James Lai
Chien-Tsun Lin
Chao-Chia Chang
Yu-Hsieh Su
Original Assignee
Walsin Advanced Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Advanced Electronics filed Critical Walsin Advanced Electronics
Priority to TW89218169U priority Critical patent/TW458385U/en
Publication of TW458385U publication Critical patent/TW458385U/en

Links

TW89218169U 2000-10-18 2000-10-18 Lead frame having die pad TW458385U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89218169U TW458385U (en) 2000-10-18 2000-10-18 Lead frame having die pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89218169U TW458385U (en) 2000-10-18 2000-10-18 Lead frame having die pad

Publications (1)

Publication Number Publication Date
TW458385U true TW458385U (en) 2001-10-01

Family

ID=21674013

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89218169U TW458385U (en) 2000-10-18 2000-10-18 Lead frame having die pad

Country Status (1)

Country Link
TW (1) TW458385U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253508B2 (en) 2003-12-19 2007-08-07 Advanced Semiconductor Engineering, Inc. Semiconductor package with a flip chip on a solder-resist leadframe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7253508B2 (en) 2003-12-19 2007-08-07 Advanced Semiconductor Engineering, Inc. Semiconductor package with a flip chip on a solder-resist leadframe

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees