TW458385U - Lead frame having die pad - Google Patents
Lead frame having die padInfo
- Publication number
- TW458385U TW458385U TW89218169U TW89218169U TW458385U TW 458385 U TW458385 U TW 458385U TW 89218169 U TW89218169 U TW 89218169U TW 89218169 U TW89218169 U TW 89218169U TW 458385 U TW458385 U TW 458385U
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- die pad
- die
- pad
- lead
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89218169U TW458385U (en) | 2000-10-18 | 2000-10-18 | Lead frame having die pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89218169U TW458385U (en) | 2000-10-18 | 2000-10-18 | Lead frame having die pad |
Publications (1)
Publication Number | Publication Date |
---|---|
TW458385U true TW458385U (en) | 2001-10-01 |
Family
ID=21674013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89218169U TW458385U (en) | 2000-10-18 | 2000-10-18 | Lead frame having die pad |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW458385U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7253508B2 (en) | 2003-12-19 | 2007-08-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with a flip chip on a solder-resist leadframe |
-
2000
- 2000-10-18 TW TW89218169U patent/TW458385U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7253508B2 (en) | 2003-12-19 | 2007-08-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with a flip chip on a solder-resist leadframe |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |