TW453152U - Far infrared insole with heat storage and insulation effects - Google Patents

Far infrared insole with heat storage and insulation effects

Info

Publication number
TW453152U
TW453152U TW89211310U TW89211310U TW453152U TW 453152 U TW453152 U TW 453152U TW 89211310 U TW89211310 U TW 89211310U TW 89211310 U TW89211310 U TW 89211310U TW 453152 U TW453152 U TW 453152U
Authority
TW
Taiwan
Prior art keywords
insole
heat storage
far infrared
insulation effects
insulation
Prior art date
Application number
TW89211310U
Other languages
Chinese (zh)
Inventor
Henry Liu
Original Assignee
Henry Happy Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henry Happy Ind Co Ltd filed Critical Henry Happy Ind Co Ltd
Priority to TW89211310U priority Critical patent/TW453152U/en
Publication of TW453152U publication Critical patent/TW453152U/en

Links

TW89211310U 2000-06-30 2000-06-30 Far infrared insole with heat storage and insulation effects TW453152U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89211310U TW453152U (en) 2000-06-30 2000-06-30 Far infrared insole with heat storage and insulation effects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89211310U TW453152U (en) 2000-06-30 2000-06-30 Far infrared insole with heat storage and insulation effects

Publications (1)

Publication Number Publication Date
TW453152U true TW453152U (en) 2001-09-01

Family

ID=21669863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89211310U TW453152U (en) 2000-06-30 2000-06-30 Far infrared insole with heat storage and insulation effects

Country Status (1)

Country Link
TW (1) TW453152U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI809667B (en) * 2022-01-18 2023-07-21 稷富國際科技有限公司 Wafer Pad Body Decompression Structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI809667B (en) * 2022-01-18 2023-07-21 稷富國際科技有限公司 Wafer Pad Body Decompression Structure

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees