TW451095B - Automated chip/phasar holder - Google Patents

Abstract

An automated optical chip holder for use in a pigtailing system precisely positions an optical chip at a predetermined location in three-dimensional space to align to align the optical chip within the pigtailing system. An adjustable chuck assembly is driven by a stepper motor under PLC control to position optical chip. After alignment, the optical chip is clamped by the adjustable chuck assembly during the pigtailing process to prevent the optical chip from moving out of alignment. This significantly reduces the occurrence of glue-joint failure and misalignment due to retraction stress. The clamp is fabricated using soft resilient materials at the point of contact with the chip. Thus, uniform pressure is exerted on the chip, micro-vibrations are absorbed, damage to the chip is reduced, and the necessity of precision motion control of the chuck assembly is avoided. The design of the automated chip holder allows the optical chip to be loaded and the pigtailed chip to be automatically unloaded using minimal operator involvement. The automated chip holder also accommodates different sized optical chips without altering the size of the chuck assembly holding the device.

Description

451 095 A7 ___ B7 V. Description of the invention (/) Field of the invention: The present invention relates to an optical chip holder for an optical fiber tail lobe, especially an automatic optical chip holder. The device includes an optical chip and an optical chip for removing the optical fiber tail lobe. Automated in a large number of fiber tail lobe systems. BACKGROUND OF THE INVENTION Optical fibers must be accurately and robustly aligned with collective optical wafer waveguides in the processing of fiber tail lobes. Otherwise, the light transmitted through the formed device will be severely deteriorated due to attenuation and other optical losses. In addition, it is unnecessary to rely on extensive manual labor. From an efficiency point of view, optical wafers, precise alignment, tail lobe processing, and removal of the entire fiber tail lobe process are most automated and reproducible. Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economics One method considered involves the use of vacuum chucks. Optical wafers are usually placed on the chuck stepped surface with air oxygen dust, which communicates with the enclosed space. The vacuum is applied to the air in the enclosed space and the generated vacuum force holds the optical wafer against the surface of the step. However, this approach has several drawbacks. First, the vacuum chuck has a tendency to fluctuate the air, which will generate small vibrations' and thus disturb the optical wafer. Therefore, the stability of the optical wafer cannot be maintained during the curing of the adhesive. More importantly, the shrinkage stress during the curing of the adhesive will cause the optical wafer waveguide to fail to align the fiber or the entire fiber array. Therefore, the device has lower reliability and the resulting optical loss is quite high. Another disadvantage of this method is that it is highly manual. Operators need to manually install the optics and remove the fiber tail lobe optics. Because it is a very precise operation, the success of the fiber tail lobe processing process is mainly determined by the operator's experience. '. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 451095 A7--B7 V. Description of the invention (Industrial) Central Standard of the Ministry of Economy 戽 Employee Consumer Cooperatives printed in the other method considered , Use a sliding member to fix the optical chip in place. Use the surface of the optical wafer substrate as a gift reference position. Although the stability of the optical device is improved, the formed crystal >! Thickness dispersion will tend to negatively affect the reproducibility of the process. Similar to the previously described method ', this method requires the operator to manually set up the optical wafer and remove the fiber tail lobe optical crystal. Because this is a very precise operation and the process of achieving the fiber tail lobe is determined by the operator's experience. Therefore, there is a need for precise, rugged, and reproducible positioning and decoupling of unautomated wafer holders in fiber optic tail systems. In addition, there is a need for a non-automated wafer holder to manually and automatically install optical wafers and remove the field-contacted optical chirps, which are suitable for a large number of optical devices for manufacturing optical fiber tail lobes. Summary of the invention: The present invention solves the problem of the conventional system described previously. Β The automatic wafer S1 of the present invention fixes the automatic device and accurately places the optical wafer at a predetermined position. The tail lobe of the miscellaneous material is not suitable. The position 'fixes the wafer in its two-dimensional space. The elastic clamping material compensates for irregularities in the hard surface of the chuck platform to promote a more uniform pressure distribution on the wafer. g], and the small vibrations substantially reduce the shank and the wafer to avoid damage, which leads to an improvement in manufacturing volume. In addition, the elasticity of the material provides compensation in positioning and in the position adjustment of the shaft. After the fiber tail lobe is formed, the fiber tail lobe is automatically removed with minimal manual intervention. Wafer holders are compatible with different shapes and sizes of optical wafers. 3 Ψ fn- m ^^ 1 nn I J-— (Please read the precautions on the back before filling this page) Order

^ 51095 A7 V. Description of the invention (3) Printed by the Consumers' Cooperative of the China Prototype Bureau of the Ministry of Hydrogenation This invention is an automated wafer holder for positioning an optical wafer in an optical fiber tail lobe system. The optical wafer has an aligned edge and an aligned surface. The automatic wafer holder positions the optical wafer in a three-dimensional space by using X, y, and Z-axis right-angle coordinate systems. The automated wafer holder includes: a support base having a sliding rail parallel to the X-axis; an alignment member is fixed to the support base to define an alignment position in a three-degree space; an adjustable chuck assembly is slidably located on the slide bar By moving the optical device between the device exchange position and the alignment position, the adjustable chuck assembly is movable in the X-axis direction and adjustable in the 2-axis direction to reflect the force in the X-axis direction; and the driving component is connected to the adjustable clamp The head assembly applies an X-axis force to the adjustable chuck assembly. In another aspect, the invention includes a method for positioning an optical device in a fiber optic tail lobe system of an automated wafer holder. The optics include aligned edges and aligned surfaces. The automated wafer holder includes a support base with a sliding rail, and an alignment member is fixed to the support base to define an alignment position in a three-degree space, which is represented by a system having x, y, and z-axis right-angle coordinates. The positioning method includes the following steps: providing an adjustable chuck assembly slidably located on the slide rail to move the optical device between the device exchange position and the alignment position; the adjustable chuck assembly is movable in the X-axis direction and between The Z-axis direction is adjustable to reflect the X-axis force; and the X-axis force is applied to move the optical device from the device exchange position to the alignment position. It is understood that the previous general description and the following detailed description are provided merely as examples of the invention and as a framework or summary for understanding the principles and features of the invention encompassed by the scope of the claimed patent. The drawings are provided as a further understanding of the present invention, and are added here to form a part of the description of the present invention. The paper size is applicable to the Chinese national standard (cm> A4 specification (210X297 mm) I-^^ 1 I- H-I -gn * n — (Please read the notes on the back before filling this page) 1T_

Description of invention (ten) Economy. Printed by Qiu Central Bureau of Standards Consumer Cooperatives. The drawings enumerate the implementation of the county for the explanation of the principle and operation of the present invention. Brief description of the drawings: f A figure (Figure 1) is a side end view of the automatic crystal moon holder of the present invention; a second figure (Figure 2) is a rear end view of the automatic wafer holder of the present invention; a third figure (Figure 3) Is a detailed diagram showing a uniform force applied in the direction of alignment during the alignment process; the fourth diagram (FIG. 4) is a detailed diagram of the alignment member of the present invention; the fifth diagram (FIG. 5) is an adjustable chuck assembly of the present invention Detailed view from the side; Figure 6 (Figure 6) is a detailed view showing the application of uniform force in the X direction during the alignment process; Figure 7 (Figure 7) is a rear end view of the adjustable chuck assembly of the present invention Detailed drawings; Figures 8 (C, 8) are detailed drawings of the swap positions of the automatic wafer holder device of the present invention; Figure 9 (Figure 9) is a detailed view of the alignment positions of the automatic wafer holder of the present invention. Description of the symbols of the drawing elements: wafer holder 10; support base 12; sliding rail 14; rail guide 16; alignment member 20; x-axis reference position 22; surface area 24; column member 26; cantilever member 28; stop block Member 30; stopper tab 32; fixture 34; chuck assembly 40; transfer member 42; stopper edge 44; inclined surfaces 46, 48; adjustment platform 50; stage member 52; fitting member 54; stopper edge 56; Motor 60; Rotating Screw 62; Programmable Logic Controller (PLC) This paper size applies to China National Standard (CNS) A4 (210X297 mm) 7 (Please read the note on the back before filling this page)

Printed by the Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives 451095 A7 V. Description of the Invention (y) 64; Optical wafer 100; Aligned edge 102; Aligned surface 1.04 Notch 22o; Arm 280, 282; open area 284; transfer member edge 420; stage edge 520; wedge 522; elastic washer 524; inclined surface 526,528. Detailed description: A detailed description will now be given of the preferred embodiment of the present invention, an example of which is listed in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. An exemplary automated wafer holder of the present invention is shown in FIG. 1 and designated by reference numeral 10. The wafer holder 10 of the present invention includes an adjustable chuck assembly 40, which moves the optical wafer 100 to a precise position in a three-degree space. The optical wafer is located on an elastic gasket and adjacent elastic wedges to protect the wafer from damage during clamping. During the processing of the fiber tail lobe, the elastic material applies a uniform clamping force to the horizontal and vertical directions. This is an important feature for absorbing microvibrations, which will eliminate wafer misalignment due to shrinkage stress. There are other advantages to using elastic materials. The gradual movement of the chuck cannot be as precise as having a hard, inelastic surface. If the non-resilient chuck exerts too much force on the wafer, it will damage the wafer. Therefore, the mobile control system must use stricter errors to avoid this damage. On the other hand, the elastic material has a wide range and it can be used for inaccurate incremental movement during clamping. It is thus possible to avoid the need for more precise movement control and reduce the associated costs. The elastic wedges can be interchangeable to enable the collet assembly 40 to fit different sizes and shapes of optical wafers. As explained previously, the automated wafer holder 10 is positioned at a precise position in a three-degree space. Move in three degrees space for mutual difference X axis, y axis This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)

4 51 0 9 B A7 Printed by the Central Co-operation Bureau Shellfish Consumer Cooperative of the Ministry of Economic Affairs 5. Description of the invention (¢ 7 and Z-axis right-angle coordinate system description. The length of the automated wafer holder 10 corresponds to the X-axis and the width corresponds to the y-axis , And the height corresponds to 2 axes. As illustrated in the embodiment, and depicted in FIG. 1, the automated wafer holder 10 includes a support base 12, which functions as a base for the automated wafer holder. The base 12 of the building includes a slide bar 14 It is a protruding part for use as a guide to adjust the chuck assembly 40 in the direction along the X axis. The alignment member 29 is connected to the support #base 12 and defines the alignment position of the optical chip in the three-degree space. The adjustable chuck assembly 40 is slidably located on the support base 12 and carries the optical wafer 100 between the device exchange position and the alignment position. The adjustable chuck assembly 40 includes a transfer member 42 moving along the X-axis direction, and an adjustable platform 50, which adjusts the optical wafer 100 position along the z axis. The device's parental change position and alignment position will be described in detail below. The rotation screw 62 is connected to the adjustable inflammation head assembly 40. The rotation screw 62 uses The wire rotation causes the adjustable central head assembly 40 to move in any direction along the X axis. The stepper motor 60 is connected to the rotatable screw 62 and rotates clockwise or counterclockwise in the opposite direction. Programmable logic controller (PLC) 64 Connected to the stepper motor 62. The operating sequence of the automatic holder 10 is carried on the PLC 64. According to the present invention, the alignment member 20 may further include a column member 邡, which is fixed to the support base 12 to extend parallel to the z-axis direction. 26 is connected to the cantilever member 28 and is parallel to the support base 12. An adjustable adjustment member is placed on the cantilever member 28 to be separated from the column member 26. The space is a variety of wafer sizes that can be changed to accommodate automation. The stop block member plus and The surface area 24 of the cantilever member 28 in the space between the stiffener members 26 is the z-axis alignment reference position equivalent to the alignment surface. The column surface 22 provides the X-axis alignment reference position to align with this paper standard. ) A4 size (210X297 Gongchu) (Please read the notes on the back before filling out this page) Order _ 451095 Printed by A7 B7, Central Consumers ’Bureau, Ministry of Economic Affairs Description of the invention (1) Alignment edge 102 of the optical wafer 100. As illustrated in FIG. 2, the rear end view of the automated wafer holder of the present invention includes a cantilever member 28, which is an arm 280 and 282 forming an open area 284. May The adjustment stop block member 30 includes a stop block tab extending downward in the z-axis direction into the open area 284. The adjustable platform 50 includes a fitting member extending upward in two directions. The optical wafer 100 is in two axial directions. During the movement, the adjustable platform 50 is clamped against the surface 24, and the alignment surface 104 is positioned as the z-axis alignment. During the clamping process, the elastic pad 524 supports the optical wafer 100 and the z-axis direction Generates uniform clamping force. The elastic gasket 524 compensates for irregularities in the surface of the adjustable platform, otherwise an uneven pressure distribution will be produced. Note that the locking of the fitting member 54 and the stopper tab 32 will prevent the adjustable platform 50 from moving under certain conditions. As shown in Fig. 3, a uniform clamping force is applied by the elastic washer 524, and the force is approximately equal to 100 g / mm. Uniform force means that the magnitude of the linear force exerted by the elastic pad 524 at each contact point between the elastic pad 524 and the optical wafer 100 is equal. Fig. 4 is a detailed view of the alignment member 20 in the plane formed by the X-axis and the y-axis of the present invention. The arms 280 and 282 of the cantilever member 28 are connected to the pillar member 26 to form a region 284 having a ϋ-shaped opening. The adjustable stop block 30 is placed on the arms 280 and 282 and is adjustable along the X axis to fit any size optical wafer. The position of the adjustable stop block 30 is fixed by a fixing device 34 to a specific size optical device. The fixture 34 may be of any known suitable form, such as a screw abutting against the arm 280. FIG. 4 also depicts a stopper tab 32 which locks the fitting member 54. In the X-axis alignment, the alignment edge 102 is used as the transfer member. The private paper size is applicable to the China National Standard (CNS) Α4 specification (210X297 mm) 1〇 (Please read the precautions on the back before filling this page)

451D9S A7 B7 V. Description of the Invention (Name) 42 As it advances in the X-axis direction, it elastically abuts on the column surface 22 by the elastic wedge 522. In order to reduce the amount of friction between the optical wafer 义 and the reference axis 22 of the sense axis and to ensure the accuracy of the reference position, a notch 220 is formed in the pillar member 26. Therefore, the contact point between the optical wafer 100 and the X-axis reference position 22 is reduced to a smaller range. FIG. 5 is a detailed side view of an adjustable chuck assembly according to the present invention. According to the present invention, the adjustable central head assembly 40 can further include a transfer member 42 and an adjustable platform 50. The transfer member 42 is placed on the support base 12 and is connected to a rotation screw 62. The transfer member is moved in either direction of the X axis by turning the screw 62. The transfer member 42 includes transfer inclined surfaces 46 and 48 to support the adjustable platform 50. The inclined surfaces 46 and 48 are finely polished and coated with Teflon to reduce the coefficient of friction. A transfer stop block edge 44 is provided to limit the movement of the adjustable platform 50. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs As shown in FIG. 5, the adjustable platform 50 is placed on the transfer member 42. The adjustable platform 50 is movable and is not connected to the transfer member 42 by any connector or adhesive. The adjustable platform is kept in position on the transfer member 42 only by gravity and frictional force, and is able to slide freely on the polished inclined surfaces 46 and 48 surfaces. The adjustable platform 50 includes a stage member 52, a tongue member member 54, and a platform stop block edge 56. The stage member 52 is provided with an elastic wedge 522, which, as previously explained, generates a uniform force in the X direction during clamping and alignment. The optical wafer 10 is placed on the elastic spacer 524. The stage forms inclined surfaces 526 and 528, which correspond to the transfer inclined surfaces 46 and 48. The inclined surfaces 526 and 528 are polished and coated with Teflon. The optical chip slides on the inclined surfaces 46 and 48 along the z-axis. The paper size is applicable to the Chinese national standard (CNS > A4 size (210X297 mm)).

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45109S A7 B7 V. Description of the invention (q) Adjust the inclined surface. As explained previously, the fitting member 54 prevents the adjustable platform 50 from moving along the X axis, and when the fitting member 54 locks the adjustable stop block piece 30 of the adjustable stop block member 30. The platform stop edge is locked with the transfer stop edge 44 to prevent the adjustable platform 50 from completely sliding off the transfer member 42. As depicted and illustrated in Figure 6, the uniform clamping force exerted by the elastic wedge is approximately equal to 40 grams / mm. The ratio between the z-axis force and the x-axis force is approximately 5: 2. However, the X-axis force is at least 10 g / mm. Again, "equal hooking force" means that the linear force exerted by the elastic wedge 522 is equal at any point of contact between the elastic wedge 522 and the optical wafer 100. The elastic wedge 522 can compensate for any irregular surface of any platform 52, otherwise it will generate an uneven pressure distribution on the optical wafer 100. Printed by the Employees' Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs Figure 7 is a detailed diagram of the rear end of the adjustable Yantou component 40 of the present invention. The transfer member 42 has a rail guide 16 formed in the bottom surface. The rail guide 6 is matched with the support base 12 sliding rail 14. The stop edge member 56 is fixed to the transfer member 42 such that the inclined surfaces 526 and 528 abut against the inclined surfaces 46 and 48. This design eliminates the movement of the collet assembly 40 along the y-axis. The optical wafer is placed on the elastic spacer 524. As shown, the elastic washer 524 is inserted into a groove formed along the edge of the stage member 52 and generates a uniform clamping force in the z-axis direction. In one embodiment, the position of the optical wafer 1000 on the front stage member 52 on which the adjustable platform 50 is placed on the transfer member 42 is predetermined and fixed to produce a y-axis alignment. Thus, the entire unit of the optical wafer 100 and the adjustable platform 50 is lowered onto the transfer member 42. In another embodiment, the adjustable stage 50 is placed on the transfer member 42 before the device optical wafer 100. In this embodiment, the vacuum chuck carries the optical wafer 100 to the adjustable plain paper size and applies the Chinese national standard (CNS > A4 size (210X297 mm) 4510S | Α7 Β7 Central Office of Standards, Ministry of Economic Affairs and Consumer Cooperatives Printing 5. Description of the invention (p) The stage 50 and the optical wafer 100 are placed on an adjustable platform 50 at a predetermined position. Therefore, in any of the embodiments, the optical wafer 100 is automatically aligned when the device enters the automatic holder. Aligned on the y-axis. The operation of the automated wafer holder 10 is now described with reference to FIGS. 8 and 9. FIG. 8 is a detailed diagram of the chuck assembly 40 in the automatic wafer holder 10 device exchange position of the present invention. Placed on the X-axis at a position adjacent to the end wall plate 18 of the support base 12. At this position, the optical wafer 100 and the optical fiber surface are removed by the automated wafer holder β, as described above, during the installation process. Alignment of the y-axis is achieved. The alignment edge 101 is aligned with the stage edge 520 by appropriately selecting the size of the elastic wedge 522. The stage edge 520 is aligned with the edge 420 of the transfer member to produce Adjust the X-axis distance between the elastic platform and the cantilever member 28. Once the device is completed, the adjustable platform 50 can slide forward on the transfer member 42 until the edge of the platform stop block% contacts the edge of the transfer stop block 44. This will increase The X-axis distance between the alignment surface 1Q4 and the surface 24, z-axis alignment reference position. There must be sufficient distance for the fitting member 54 to pass through the adjustable stop block member 30 when the transfer member 42 moves forward in the X-axis direction. Tab 32. Fig. 9 is a detailed view of the alignment position of the automatic wafer holder 10 of the present invention. According to the size and thickness of the optical wafer 100, under the control of PLC 64, the stepping motor 60 drives the transfer member 42 from the device exchangeable position to χ-axis alignment position. Once the transfer member 42 reaches this position on the X-axis, the alignment edge 10 is pressed against the χ-axis alignment reference position 22, and the movement of the adjustable platform imprint in the direction of the sense axis will stop. In this case The uniform force of the χ axis is applied to the opposite edge of the optical wafer 100 by the elastic wedge 522. Because the adjustable platform 50 cannot be positioned on the χ axis

(Please read the notes on the back before filling this page) Order -I d I. -II 1 _ 13 451 0 9 § A7 B7 2 11 V. Description of the invention The inclined surfaces 46 and 48 slide under the inclined surfaces 526 and 528, forcing the * T adjustment platform 50 to move upward in the z-axis toward the z-axis alignment reference surface 24. Then, the locking member 54 locks the stop block The tab 32 and the alignment surface 104 are clamped against the surface 24. When the optical wafer 100 is elastically clamped, the stepping motor 60 stops supplying power and the rotatable screw 62 stops rotating. The elastic wedge 522 is applied to the optical wafer The uniform force on 100 and the elastic gasket 528 are maintained by the adjustable screw 62, which is fixed in place until the processing of the fiber tail lobe is completed. After the fiber tail lobe is completed, the fiber tail lobe is turned into an optical chip Move back to the device exchangeable position, as shown in Figure 8. The stepper motor 60 then applies power and starts turning the rotatable screw in the opposite direction to cause the transfer member 42 to retract along the x-axis. The transfer member 42 follows the x-axis to Moving in the opposite direction, the fitting member 54 is pressed against the stopper tab 32 to prevent the adjustable platform 50 from moving along the X axis. The inclined surfaces 46 and 48 slide under the inclined surfaces 526 and 528 and can be adjusted toward the z direction The support base 12 moves. Once the fitting member 54 is removed by the stopper tab 32, the adjustable chuck assembly 40 is moved toward the device exchange position. Once the fiber tail lobe wafer is exchanged with the unprocessed wafer, repeat the above description Processing process. Those skilled in the art can make many changes and changes to the present invention, but they will not depart from the spirit and scope of the present invention. The following patent application scope will cover these changes and changes. The paper standard is applicable to the Chinese National Standard (CNS ) A4 size (210X297mm) (Please read the precautions on the back before filling in this purchase) Order

Claims (1)

AS B8 CS D8 VI. Patent Application Fanyuan 1. An automated wafer holder to position the optical wafer in the fiber tail lobe, § The optical wafer has an aligned edge and an aligned surface, where the automated wafer holder positions the optical wafer at With X axis, y axis, 2: In the third degree space of the axis right-angle coordinate system, the automatic wafer holder includes: a support base having a sliding rail parallel to the X axis; an alignment member which is relatively fixed to the support base to The alignment position is defined in the three-degree space; the adjustable chuck assembly is slidably located on the sliding rail to move the optics. The wafer is between the device exchange position and the alignment position. The adjustable chuck assembly is in the X-axis direction Is movable and adjustable in the Z-axis direction to reflect the force in the χ-axis direction; and a drive unit connected to the adjustable chuck assembly to apply the χ-axis force to the adjustable chuck assembly. 2. The automatic wafer holder according to item 1 of the patent scope, wherein the driving unit further includes: a rotatable screw element connected to the adjustable clamping test piece, wherein the adjustable screw element applies the χ axis by rotating The power of the Central Ladder Bureau of the Ministry of Economic Affairs, the Consumers' Cooperative Consumer Cooperative, is a stepping horse, which is connected to a rotatable screw element to turn the screw element. A logic controller connected to a stepper motor to control the stepper motor. 3. The automatic chip timing device according to item 1 of the patent scope, in which the alignment component further includes: X-axis alignment reference, the material of which lays together is difficult to refer to Apply for a patent Fanyuan A8 Β8 C8 D8 4 Printed by the Central Ministry of Economic Affairs, Central Bureau of Standards and Technology, Cooperatives, and aligns the optical chip with the dry X-axis reference position; and the X-axis aligns the reference position by aligning the aligned surface with Align the optical f-chip with the Z-axis reference position at the 2 drawing reference position. 4. The automatic wafer holder according to item 1 of the patent application scope, wherein the alignment member further includes: a column member fixed to the support base and extending parallel to the z-axis direction, wherein the X-axis alignment reference position is at least a column member The surface of the cantilever beam member, which is fixed to the beam member and extends in a direction parallel to the support base, where the Z-axis alignment reference position is the surface area of the cantilever beam member; and an adjustable stop block which is movably connected to the cantilever Beam member with the Z-axis alignment reference position between the adjustable stop block member and the column member. 5. The automated wafer holder according to item 1 of the patent application scope, wherein the adjustable chuck assembly is aligned by aligning the alignment edge to the x-axis alignment reference position and the alignment surface to the z-axis alignment reference position. . 6. The automated wafer holder according to item 5 of the patent application, wherein the adjustable stop block member includes a stop tab to prevent the adjustable chuck assembly from moving in the X-axis direction and in the aligned position. 7. The automatic wafer holder according to item 4 of the patent application scope, wherein the adjustable chuck assembly further comprises: a transfer member located on the slide bar and operatively connected to the drive unit and movable in the X-axis direction to respond Force in the X-axis direction; and an adjustable platform that fixes the optical chip, the adjustable platform is located on the transfer member and is adjustable in the Z-axis direction to reflect the movement of the transfer member in the X-axis direction; among which the platform and the optical chip can be adjusted At the interchangeable position of the device, please read the notes of the mouth two before filling in this page] ------ Order -------- ^ ----- ^ --- Thai paper from the applicable national standards (CNS) Eight 4 Lins (Execution Secret) 5 4 B8 C8 • D8 VI. Application for patents 5 The Printing Office of the Central Consumers' Bureau of the Ministry of Economic Affairs of the Bayer Consumer Cooperative Co. uses the entire unit to adjust the chuck assembly towel and Remove from it. 8. The automated wafer holder according to item 7 of the scope of patent application, wherein the transfer member further includes: a first inclined surface to support the adjustable platform; a driving screw moving the transfer member in the X-axis direction; and alignment with the adjustable platform The first edge is in the device exchange position. 9. The automated wafer holder according to item 4 of the patent application scope, wherein the adjustable platform further includes: a stage member having a stage to fix the optical wafer, an alignment edge, and a second inclined surface relative to the first inclined surface Wherein the alignment edge is aligned with the first guide edge in the exchange position; and the fitting member is connected to the stage member and is connected with the adjustable stop block in the alignment position. 10. The automated wafer holder according to item 9 of the scope of patent application, wherein the movement of the sense transfer member in the Z axis direction toward the alignment position causes the alignment edge to lean against the χ axis alignment reference position causing the second inclined surface to slide to the first inclination The alignment surface is moved on the surface and thus in the z-axis direction toward the z-axis to align the reference position. 11 'The automated wafer holder according to item 9 of the scope of patent application, wherein the transfer member moves in the X-axis direction toward the exchange position, forcing the fitting member to lean on the adjustable stop block age, which promotes the 帛 -tilt surface to mean 帛 -inclined surface The stage member is moved upward and thus in the z-axis direction toward the support base until the fitting member is disengaged by the adjustable stop member. 12. The automatic wafer holder according to item 9 of the scope of patent application, wherein the stage member further includes: This paper is from General China (2iqx29_ ^ ------: ----- (Please read the back first Note f item, please fill in this page again) Order — 'Line 45ί 〇9s AS B8 C8 D8, patent application scope, Central Standards Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative, printed elastic wedges, placed on the plane of the stage, located on the fitting member and optical chip Between, wherein the elastic wedge presses the alignment edge against the X-axis alignment position with a uniform force; and the 'elastic pad is placed on the surface of the stage to elastically support the optical chip, wherein the elastic pad uses uniform force Press the alignment surface tightly against the Z-axis alignment test position. 13. 伕 According to the automatic wafer holder of item 9 of the patent application scope, the elastic wedge is selected to match the size and shape of the optical wafer. Η According to the patent application scope The automated wafer holder of item 7, wherein when the adjustable platform and the optical wafer device are placed in the adjustable chuck assembly by placing the adjustable platform on the transfer member, a y-axis pair is generated 15. The automatic wafer holder according to item 7 of the scope of patent application, wherein the adjustable chuck assembly further includes: an elastic wedge presses the alignment edge against the alignment member with a uniform force in the X axis direction; and the elastic pad is z Uniform force in the axial direction presses the alignment surface against the alignment member. 16. A method for automatically positioning an optical wafer in a fiber tail lobe system having an automated wafer holder, the optical wafer having an alignment edge and an alignment surface, The automated wafer holder includes: a support base with a sliding rail; and an alignment member that fixes an optical wafer pair in a three-degree space with an X-axis, a y-axis, and a 2-axis rectangular coordinate system relative to the support base. The method for automatically positioning an optical chip includes the following steps: Provide an adjustable ship miscellaneous part on a sliding rotary bar to move the optical chip between the device exchange position and the alignment position. The adjustable chuck assembly Paper New Zealand is applicable to the national standard vehicles (Μ) Μ regulatory road (2l0X ^^ jy (Please read the precautions on the back before filling Page] Order ---- 17451 Dig A8 BB C8 D8 VI. Apply for a patent Fanyuan Economic Bureau Central Standards Bureau Shellfish Consumer Cooperatives printed parts can be moved in the X axis direction. It can be adjusted in the moving and Z axis direction. To reflect the force in the X-axis direction; to apply a 5-axis force to move the optical chip from the device exchange position to the alignment position; and to connect the optical fiber tail lobe to the optical chip. 17. The method according to item 16 of the scope of patent application, which provides The step of the adjustable chuck assembly further includes: providing a transfer member on the slide rail and operatively connected to the drive. The unit and being movable in the X-axis direction to reflect the force in the X-axis direction; and providing an adjustable platform to be fixed Optical wafer, the adjustable platform is located on the transfer member and is adjustable in the Z-axis direction to reflect the movement of the transfer member in the sense axis direction; wherein the adjustable platform and the optical wafer are placed on the entire unit at the exchangeable position of the device. In and out of the adjustable collet assembly. 18. The method according to item i 7 of the patent application scope, wherein the alignment member further comprises a column member having an X-axis alignment reference position; a cantilever beam member fixed to the column member and having a z-axis alignment reference position; and An adjustable stop block member is connected to the cantilever member, which locks the adjustable platform during alignment. 19. The method according to item 18 of the patent application scope, wherein applying the X-axis force further includes the following steps: pressing the alignment edge against the X-axis alignment reference position to generate the X-axis alignment, wherein the pressing step promotes the adjustable platform Slide on the transfer member and move in the z-axis direction towards the z-axis to align the reference position; and (please read the note on the back before filling this page) Order --- 0 .. This paper New Post (2 丨 45, 0f Printed for the Beijiao Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, and applied for patents. Press the alignment surface against the Z-axis alignment reference position to generate 2-axis alignment, where the X-axis alignment and the 2-axis alignment have effects Position alignment occurs immediately. 20. The method according to item is in the scope of the patent application, which further includes moving the fiber tail lobe device from the alignment position to the device exchange position. 21. According to the method in scope 20 of the patent application, The steps of moving the fiber optic tail lobe device from the alignment position to the device exchange position include the following steps: Squeezing the adjustable platform against the adjustable stop block member thereby urging the adjustable platform to slide over the transfer member And moving in the z-axis direction toward the support base until the adjustable platform is released by the adjustable stop member; and collectively moving the transfer member in the x-axis direction and the adjustable platform's switching position toward the device. The method further includes the following steps: removing the optical fiber tail lobe by moving the adjustable platform away from the transfer member at the exchange position; and placing the adjustable platform on the transfer member to set the second position when the device is switched. Optical chip. (Please read the precautions on the back before filling in this page.) The size of the paper for the thread guide is applicable to China National Standard (CNS) A4 (