TW448547B - Substrate piece of the flexible substrate based package - Google Patents
Substrate piece of the flexible substrate based package Download PDFInfo
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- TW448547B TW448547B TW089108770A TW89108770A TW448547B TW 448547 B TW448547 B TW 448547B TW 089108770 A TW089108770 A TW 089108770A TW 89108770 A TW89108770 A TW 89108770A TW 448547 B TW448547 B TW 448547B
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- substrate
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- escape
- flexible substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
4485 4 7 五、發明說明（1) 【發明領域】： 本發明係有關於一種可撓性基板（flexible substrate)封裝構造，特別言之，係有關於一種用於可撓 性基板封裝構造之基板片及鑄模裝置。 【先前技術】： 隨著更輕更複雜電子裝置需求的曰趨強烈，晶片的速 度及複雜性相對越來越高，因此需要更高之封裝效率 (packaging efficiency)。於是半導體晶片封裝業界發展 出可撓性基板（flexible substrate)球格陣列（Ball Grid Array)封裝技術，以符合其需求。 第一圖所示係為目前習用於形成可撓性基板封裝構造 (flexible substrate based pac kage )之基板片 1 〇 〇 之上 視圖。該基板片1 Ο 0 —般包含複數組陣列排列之基板單元 120，以及複數條電鍵線（plating bar)130設於該複數個 基板單元120之間。該每一基板單元120之上表面係設有複 數條導電線路（conductive traces)120a，其一端係用以 電性連接至一半導體晶片（未示於圖中），另一端則連接 於該電鍍線130。該每一個基板單元120下表面設有複數個 錫球銲墊120b (參見第二圖），其分別電性連接至該基板 單元120上表面相對應之導電線路120a。一般而言，該基 板片100之上下兩面係為一層綠漆（solder mask)覆蓋。 第三圖所示係為目前習用於形成可挽性基板封褒構造 之鑄模裝置2 0 0，其主要包含一上模220以及一下模240。 該上模220包含一上模基座222 (其下表面設有一凹部4485 4 7 V. Description of the invention (1) [Field of invention]: The present invention relates to a flexible substrate packaging structure, in particular, it relates to a substrate for a flexible substrate packaging structure. Sheet and casting device. [Previous technology]: With the increasing demand for lighter and more complex electronic devices, the speed and complexity of chips are relatively higher and higher, so higher packaging efficiency is required. Therefore, the semiconductor wafer packaging industry has developed a flexible substrate Ball Grid Array packaging technology to meet its needs. The first figure shows a top view of a substrate sheet 100, which is currently used to form a flexible substrate based pac kage. The substrate sheet 100 generally includes a plurality of substrate units 120 arranged in an array, and a plurality of plating bars 130 are disposed between the plurality of substrate units 120. A plurality of conductive traces 120a are provided on the upper surface of each substrate unit 120, one end of which is used to electrically connect to a semiconductor chip (not shown in the figure), and the other end is connected to the plating line. 130. A plurality of solder ball pads 120b (see the second figure) are provided on the lower surface of each substrate unit 120, and are electrically connected to the conductive lines 120a corresponding to the upper surface of the substrate unit 120, respectively. Generally speaking, the upper and lower sides of the substrate sheet 100 are covered by a layer of a solder mask. The third figure shows a mold device 200 currently used to form a sealable structure of a releasable substrate, which mainly includes an upper mold 220 and a lower mold 240. The upper mold 220 includes an upper mold base 222 (a recess is provided on the lower surface)
Μ P00-047.ptd 第4頁 4485 4 7 五、發明說明（2) 222a)、一上中間塊224設於該上模基座222之凹部222a中 間.，一對上嵌入件2 2 6分別設於該凹部2 2 0 a内上中間塊224 之兩側。該每一上嵌入件226下表面設有複數個凹部 ' 226a，複數個上逃氣孔道226b以及複數個壓腎區域 (clamping region)226c環設於該凹部226a以界定該凹部 226a以及上逃氣孔道226b。該下模240包含一下模基座 242 ’該下模基座242上表面設有一凹部242a，一下中間塊 244設於該下模基座242之凹部242a中間，一對下嵌入件 2 4 6分別設於該凹部2 4 2 a内下中間塊2 4 4之兩側。該上中間 塊224具有數個罐（p〇t)224a用以容置封膠塑料，以及數個 澆道（runner)224b連接該罐224a與該上嵌入件複數個凹部 226a。該下嵌入件246上表面係低於該下模基座242以及下 中間塊244上表面’因而形成一落差可用以容置一基板 片。當上、下模密合壓緊時，該上嵌入件226之壓緊區域 22 6 c與下嵌入件246之上表面將一起界定複數個模穴β 一般而言’該基板片之基板單元係分成數組進行封 膠。由圖可知’前述之基板片100其基板單元12〇係每九個 一組進行封膠。當模製品自模具取出後，需再經後硬化 (post-cure) ’ 打印（marking) ’ 植球（ball mounting)及 切割（sawing)等多道加工製程，而完成個別之可撓性基板 封裝構造。 第四圈揭示該習用模具2〇〇裝上習用可撓性基板片丨00 之部分剖示圖’其圖示三個半導體晶片31〇線接合於該基 板片100。由於該可撓性基板片10〇容易因其與丰導體晶片Μ P00-047.ptd Page 4 4485 4 7 V. Description of the invention (2) 222a), an upper middle block 224 is provided in the middle of the recess 222a of the upper mold base 222, and a pair of upper inserts 2 2 6 respectively It is provided on both sides of the upper middle block 224 in the recess 2 2 0 a. A plurality of recesses 226a are provided on the lower surface of each upper insert 226, a plurality of upper escape air channels 226b and a plurality of clamping regions 226c are circumferentially disposed in the recess 226a to define the recess 226a and the upper escape air hole. Road 226b. The lower mold 240 includes a lower mold base 242. The lower mold base 242 is provided with a concave portion 242a on the upper surface, a lower intermediate block 244 is provided in the middle of the concave portion 242a of the lower mold base 242, and a pair of lower inserts 2 4 6 are respectively It is provided on both sides of the inner lower block 2 4 4 of the recess 2 4 2 a. The upper middle block 224 has a plurality of pots 224a for accommodating the sealing plastic, and a plurality of runners 224b connect the pot 224a with the plurality of recesses 226a of the upper insert. The upper surface of the lower insert 246 is lower than the upper surface 'of the lower mold base 242 and the lower intermediate block 244, so that a drop can be formed to accommodate a substrate sheet. When the upper and lower molds are tightly pressed, the pressing area 22 6 c of the upper insert 226 and the upper surface of the lower insert 246 will together define a plurality of mold cavities. Generally speaking, the substrate unit system of the substrate sheet Divide into an array for sealing. As can be seen from the figure, the substrate unit 100 of the aforementioned substrate sheet 100 is sealed in groups of nine. After the molded product is taken out of the mold, it needs to undergo multiple processing processes such as post-cure 'marking' ball mounting and sawing to complete individual flexible substrate packaging. structure. The fourth circle reveals a partial cross-sectional view of the conventional mold 200 mounted with the conventional flexible substrate sheet 00, which shows that three semiconductor wafers 31 are bonded to the substrate sheet 100 by wires. Because the flexible substrate sheet 10 is easily
P00-047.ptdP00-047.ptd
IH 第5頁 4485 4 7 五、發明說明（3) 310熱膨脹係數不一致（CTE mismatcli)所產生之應力而產-生變形彎翹。因此，當該基板片100置於該下模240之下嵌 入件246上表面時，很容易會有空氣被包覆在基板片與’ 下嵌入件24 6間（參見第四圖）。 值得注意的是，請參照第二圖，該基板片100下表面之 兩縱向側邊區域係為綠漆覆蓋而大致呈水平狀（該電鍍線 1 3 0亦完全為綠漆覆蓋）。此外，請參照第三圖，該下模 240之下嵌入件246上表面亦呈平坦狀。因此，當上、下模 密合虔緊*並且開始注入封膠塑料時，該被包覆之空氣由 於無處可去將導致該基板月100變形而向上勉曲，嚴重'時 甚至會導致銲線與模具接觸變形（參見第五圖）^ 、 【發明概要】： 本發明之主要目的係提供一種用於形成可撓性基板 裝構造之基板片’其包含複數組陣列排列之基板單元， 基板片之特徵在於其下表面對應於每一組基板單元至1 有一逃氣诵道（vent channel)，藉此當該基板片置於一^ 具内封膠時，該逃氣通道可以幫助透氣。 ' 模 本發明之次要目的係提供一種用於形 裝構造之鑄模裝置，其特徵在於綣模成叮撓11基板封 有複數個逃氣孔道（air vent)可以暫4 1上 下模皆設 根據本發明之用於形成可撓性基板/ 片，其包含複數組陣列排列之基板輩裝構>造之基板 之上表面係用以安裝一晶片，該每一母一基f草元 用以安裝複數個錫球，該基板片之，早70之下表面係 取乃之特徵在於其下表面訝應IH Page 5 4485 4 7 V. Description of the invention (3) 310 Stress caused by inconsistent coefficient of thermal expansion (CTE mismatcli), resulting in deformation and warpage. Therefore, when the substrate sheet 100 is placed on the upper surface of the insert 246 under the lower mold 240, it is easy for air to be covered between the substrate sheet and the lower insert 246 (see the fourth figure). It is worth noting that, referring to the second figure, the two longitudinal side areas of the lower surface of the substrate sheet 100 are covered with green paint and are approximately horizontal (the plating line 130 is also completely covered with green paint). In addition, referring to the third figure, the upper surface of the insert 246 under the lower mold 240 is also flat. Therefore, when the upper and lower molds are tightly attached and the injection of plastic is started, the coated air will warp upward due to the deformation of the substrate because there is nowhere to go. In severe cases, it may even lead to welding. Deformation of the contact between the wire and the mold (see the fifth figure) ^ [Summary of the invention]: The main object of the present invention is to provide a substrate sheet for forming a flexible substrate mounting structure, which includes a substrate unit arranged in a plurality of arrays. The sheet is characterized in that the lower surface thereof has a vent channel corresponding to each group of substrate units to 1 so that when the substrate sheet is placed in an inner sealant, the vent channel can help ventilation. '' Mold The secondary object of the present invention is to provide a mold device for the shape structure, which is characterized in that the mold is staggered and the 11 substrate is sealed with a plurality of air vents. The upper and lower molds can be temporarily installed. The substrate for forming a flexible substrate / sheet of the present invention, which includes a substrate array structure with a plurality of arrays arrayed on the top surface of the substrate, is used for mounting a wafer, and each of the substrates is used for A number of solder balls are installed. The bottom surface of the substrate is characterized by its bottom surface.
P00-047.ptd 4 485 4 7 五、發明說明（4) ---- ^每組基板單元至少設有一逃氣通道（vent channel)。 基板片置於一模具内封膠時，該逃氣通道具有一預先 设疋之寬度以及一預先設定之深度，藉此可以透氣良好而 又使溢膠量降至最低。 本發明另提供一種用於形成可撓性基板封裝構造之鑄 二置，其主要包含一上模以及一下模。該上、下模各包 模，座（其表面設有一凹部）、一中間塊設於該模基 座之凹部十間’—對嵌入件分別設於該凹部内中間塊之兩 側.、。該每一上棋之嵌入件下表面設有複數個凹部，複數個 ^逃氣孔道以及複數個壓緊區域環設於該凹部以界定該凹 以及上逃氣孔道。該上模之中間塊具有至少一罐（p〇t) 用以容置一封膠塑料’以及至少一洗道（runner)連接該罐 與該上嵌入件複數個凹部之一。根據本發明之鑄模裝置， 其特徵在於該每一下模之嵌入件設有複數個下逃氣孔道。 當上、下模密合壓緊時’該下逃氣孔道具有一預先設定之 寬度以及一預先設定之深度，藉此可以透氣良好而又使溢 膠量降至最低。此外該上逃氣孔以及下逃氣孔較佳係非對 應配置〇 為了讓本發明之上述和其他目的、特徵、和優點能更明 顯特徵’下文特舉本發明較佳實施例，並配合所附囷示， 作詳細說明如下。 【發明說明】： 根據本發明之用於形成可撓性基板封裝構造之基板 片’其上表面之構成大致係類同於第一圖所示之習用基板P00-047.ptd 4 485 4 7 V. Description of the invention (4) ---- ^ Each set of substrate units is provided with at least one vent channel. When the substrate sheet is placed in a mold to seal the glue, the escape channel has a preset width and a preset depth, thereby allowing good air permeability and minimizing the overflow of glue. The present invention further provides a casting mold for forming a flexible substrate package structure, which mainly includes an upper mold and a lower mold. The upper and lower molds are each overmolded, the seat (the surface is provided with a recessed portion), and an intermediate block is provided in the ten recessed portions of the mold base '-a pair of inserts are provided on both sides of the intermediate block in the recessed portion, respectively. A plurality of recesses are provided on the lower surface of each chess piece, and a plurality of escape channels and a plurality of pressing areas are annularly disposed in the recesses to define the recesses and the escape channels. The middle block of the upper mold has at least one pot (pot) for accommodating a piece of plastic material, and at least one runner connects the pot with one of the plurality of recesses of the upper insert. The mold device according to the present invention is characterized in that the insert of each lower mold is provided with a plurality of lower escape air channels. When the upper and lower molds are tightly pressed together, the lower escape hole prop has a preset width and a preset depth, so that it can breathe well and minimize the amount of spilled glue. In addition, the upper escape hole and the lower escape hole are preferably non-corresponding configurations. In order to make the above and other objects, features, and advantages of the present invention more obvious, the following describes the preferred embodiment of the present invention and cooperates with the attached 囷The detailed description is as follows. [Explanation of the invention] The structure of the upper surface of the substrate sheet for forming a flexible substrate package structure according to the present invention is roughly similar to the conventional substrate shown in the first figure
P00-047.ptd 第7頁 4 485 4 7 五、發明說明（5). 片100。根據本發明之基板片300其特徵在於下表面對應於 每一組基板單元（3x3基板單元120)至少設有一逃氣 通道（vent channel)320 (參照第六圖）。 參照第七圖，當根據本發明之基板片300置於—習用模 具内封膠時，該逃氣通道3 20較佳具有一預先設定之寬度 (約為1-3 mm)以及一預先設定之深度（約為0.04-0. 09 mm ) ’藉此可以透氣良好而又使溢膠量降至最低。值得注 意的是，該逃氣通道之深度必須小於所使用封膠材料中填 充物顆粒的直徑，藉此阻止封膠材料溢出模具》此外，該 逃氣通道320係遠離該模具之洗道224b而設。該逃氣通道 320較佳係由該基板片3〇〇之邊緣延伸至該模具之模穴内》 因此，當上、下模密合壓緊，並且開始注入封膠塑料時， 該被包覆在基板片300與下嵌入件246間之空氣，可以經由 該逃氣通道320洩出，而不致使該基板片300彎翹。 請參照第二圖，該習用基板片1 〇 〇下表面之兩縱向側邊 區域係為綠漆覆蓋而大致呈水平狀（該電鍍線i 3〇亦完全 為綠漆復蓋）°習用基板片之綠漆層厚度約為〇. 0 8 5ηιπ1。 因此’參照第六圖’根據本發明之基板片3 〇 〇可以藉由剝 除在其左侧縱向侧邊區域内電鍍線丨3 〇上之綠漆而形成該 逃氣通道32 0 (以實線表示）^該逃氣通道32〇較佳係由相 對應之基板單元組之邊緣延伸至該基板片3 〇 〇之邊緣。 習知基板製程一般包含：（〇將一導電金屬層（例如經 過表面粗縫化的銅箔）以習用之方法（例如熱壓合法）層 壓（lamina ting)於一介電層（適合之介電材質如P00-047.ptd Page 7 4 485 4 7 V. Description of the Invention (5). Film 100. The substrate sheet 300 according to the present invention is characterized in that the lower surface corresponds to each group of substrate units (3x3 substrate units 120) and is provided with at least one vent channel 320 (refer to the sixth figure). Referring to the seventh figure, when the substrate sheet 300 according to the present invention is placed in a conventional mold for sealing, the escape channel 3 20 preferably has a preset width (about 1-3 mm) and a preset Depth (approximately 0.04-0. 09 mm) 'This allows for good ventilation while minimizing spillage. It is worth noting that the depth of the escape channel must be smaller than the diameter of the filler particles in the sealant material used to prevent the sealant material from overflowing the mold. In addition, the escape channel 320 is away from the washing channel 224b of the mold. Assume. The escape channel 320 is preferably extended from the edge of the substrate sheet 300 to the cavity of the mold. Therefore, when the upper and lower molds are tightly pressed together and the injection molding plastic is started, the The air between the substrate sheet 300 and the lower insert 246 can be discharged through the escape channel 320 without causing the substrate sheet 300 to warp. Please refer to the second figure. The two longitudinal side areas of the lower surface of the conventional substrate sheet 1000 are covered with green paint and are approximately horizontal (the plating line i 30 is also completely covered with green paint). The thickness of the green paint layer is about 0.08 5ηιπ1. Therefore, referring to the sixth figure, the substrate sheet 300 according to the present invention can form the escape channel 32 0 (by a solid line) by peeling off the green paint on the plating line in the left-side longitudinal side area. (Shown) ^ The escape channel 32 is preferably extended from the edge of the corresponding substrate unit group to the edge of the substrate sheet 300. The conventional substrate manufacturing process generally includes: (0) laminating a conductive metal layer (such as copper foil that has been rough-stitched on the surface) with a conventional method (such as hot pressing) on a dielectric layer (suitable for dielectrics) Electrical materials such as
4 485 4 7 五、發明說明（6) BT(bismaleimide-triazine)樹脂或FR-4玻璃纖維強化環 氧樹脂（fiberglass reinforced epoxy resin))之兩面。、 (B)在該基扳上形成介層洞（via)或通孔（through-hole) ’ 其可以任何習知的方法形成，例如機械鑽孔或雷射鑽孔。 並且以習知的方法如無電極電鐘（electroless plating) 在該介層洞或通孔塗覆一層導電金屬例如銅。（C)以微影 (photolithography)以及蝕刻（etching)的方式在該基板 上導電金屬層中形成所要之導電線路或導電區域例如該複 數條導電線路120a或電鍍線130 "(D)將一可光顯像的綠漆 (photoimagable solder mask)覆蓋於基板之表面，轉移 所要之圖案，然後顯影使得導電線路1 2 0 a之手指區域、錫 球銲墊120b係裸露於該拒銲劑；以及（E)將與習用連接線 (bonding wire)材料結合力佳之材料例如金或鈀電鍍在未 被綠漆覆蓋的導電金屬層。因此，只要在步驟（D)中使得 在基板片縱向侧邊區域電錄線1 3 0裸露於綠漆而形成該逃 氣通道320 (以實線表示）’則本發明之逃氣通道32〇可以 科用習用之基板製程形成而不需額外之步驟。 第八圖所示為根據本發明之用於形成可撓性基板封裝 構造之鑄模裝置4 0 0，其上模之構成大致係類同於第三圖 所示之習用上模2 2 0。根據本發明之鑄模裝置4〇〇其特徵在 於下模42 0之下嵌入件42 6表面設有複數個下逃氣孔道 426a。其中，當上模220與下模420密合壓緊時，該每—下 逃氣孔道4 26a之一端延伸至該模六對應區域4 3〇内（以虛 線界定於第八圖中），另一端延伸至該下嵌入件426之邊4 485 4 7 V. Description of the invention (6) Both sides of BT (bismaleimide-triazine) resin or FR-4 fiberglass reinforced epoxy resin. (B) A via or a through-hole is formed on the substrate, and it can be formed by any conventional method, such as mechanical drilling or laser drilling. In addition, a conductive metal such as copper is applied to the vias or vias by a conventional method such as an electrodeless plating. (C) Forming desired conductive lines or conductive areas in the conductive metal layer on the substrate by photolithography and etching, such as the plurality of conductive lines 120a or plated lines 130 " (D) will A photoimagable solder mask that covers the surface of the substrate, transfers the desired pattern, and then develops so that the finger area of the conductive line 120a and the solder ball pad 120b are exposed to the solder resist; and ( E) Electroplating materials such as gold or palladium with good bonding with conventional bonding wire materials on the conductive metal layer not covered by green paint. Therefore, as long as the recording line 130 in the longitudinal side region of the substrate sheet is exposed to the green paint in step (D) to form the escape channel 320 (represented by a solid line) ', the escape channel 32 of the present invention. It can be formed by a conventional substrate process without additional steps. The eighth figure shows a mold device 400 for forming a flexible substrate package structure according to the present invention. The structure of the upper die is roughly similar to the conventional upper die 2 2 0 shown in the third figure. The mold device 400 according to the present invention is characterized in that a plurality of lower escape air channels 426a are provided on the surface of the insert 426 below the lower mold 42. Among them, when the upper die 220 and the lower die 420 are tightly pressed together, one end of each of the lower escape air holes 4 26a extends into the corresponding area 4 30 of the die 6 (defined by a dotted line in the eighth figure), and One end extends to the edge of the lower insert 426
P00-047.ptd 第9頁 4 485 4 7 五、發明說明（7) 緣。此外，當上模220與下模42 0密合壓緊時，該逃氣通道 426a係遠離該模具之澆道224b而設。該下逃氣孔道426a具 有一預先設定之寬度（約為1-3 mm)以及一預先設定之深 度（約為0.04-0. 09 mm)，藉此可以透氣良好而又使溢膠 量降至最低。因此，當上、下模密合壓緊，並且開始注入 封膠塑料時，該被包覆在習用基板片1 0 0與下嵌入件4 2 6間 之空氣，可以經由該逃氣通道426a洩出，而不致使習用基 板片1 0 0彎翹。 該上逃氣孔2 2 6 b以及下逃氣孔42 6a較佳係非對應配 置。因為當該上逃氣孔2 2 6b與下逃氣扎4 26a對應配置時， 基板片在該對應配置區域將因為上下皆無支持而易受外力 變形。 請再參照第四圖以及第五圖，根據本發明人之研究顯 示，（A) 當基板片該每一組基板單元之面積較大（例如不 小於4 6 mm X 46 mm)而使得其預定被封膠之面積較大時 (例如不小於56 mm X 56 mm)，或是（B)當基板片之厚度 太薄（例如不大於0. 2 6 mm )時，先前敘述之習用技術問 題最為明顯。因為當基板片之厚度太薄時，更容易因熱膨 脹係數不一致（CTE mismatch)所產生之應力而產生變形彎 翹；當基板片預定被封膠之面積較大時，被包覆在基板片 與下嵌入件間的空氣也會相對增加而更易使該基板片1 0 0 變形而向上翹曲。 本發明提供一種用於形成可撓性基板封裝構造之基板 片，其下表面對應於每一組基板單元至少設有一逃氣通P00-047.ptd Page 9 4 485 4 7 V. Description of the Invention (7) Fate. In addition, when the upper die 220 and the lower die 42 are tightly pressed together, the escape channel 426a is provided away from the runner 224b of the die. The lower escape air passage 426a has a preset width (about 1-3 mm) and a preset depth (about 0.04-0. 09 mm), so that it can breathe well and reduce the amount of spilled glue. lowest. Therefore, when the upper and lower molds are tightly pressed and the injection molding compound is injected, the air covered between the conventional substrate sheet 100 and the lower insert 426 can be leaked through the escape channel 426a. Out without causing the conventional substrate sheet to warp. The upper escape holes 2 2 6 b and the lower escape holes 42 6a are preferably non-corresponding configurations. Because when the upper escape air hole 2 2 6b and the lower escape air hole 4 26a are arranged correspondingly, the substrate sheet is easily deformed by external force because there is no support in the corresponding arrangement area. Please refer to the fourth and fifth figures again. According to the research by the present inventor, (A) when the substrate sheet has a larger area (for example, not less than 4 6 mm X 46 mm) for each group of substrate units, When the area of the sealant is large (for example, not less than 56 mm X 56 mm), or (B) when the thickness of the substrate sheet is too thin (for example, not more than 0.26 mm), the conventional technical problems described previously are the most problematic. obvious. Because when the thickness of the substrate sheet is too thin, it is more likely to cause deformation and warping due to the stress generated by the CTE mismatch; when the area of the substrate sheet intended to be sealed is large, the substrate sheet is covered with the substrate sheet and The air between the lower inserts will also increase relatively, making it easier for the substrate piece 100 to deform and warp upward. The present invention provides a substrate sheet for forming a flexible substrate package structure, and a lower surface thereof is provided with at least one escape vent corresponding to each group of substrate units.
P00-047.ptd 笫10頁 4 4 85 4 7 五、發明說明（8) 道，藉此當該基板片置於一模具内封膠時，該逃氣通道可 以幫助透氣。本發明另提供一種用於形成可撓性基板封裝 構造之鑄模裝置，其特徵在於鑄模裝置之上、下模皆設有 複數個逃氣孔道可以幫助透氣。因此，只要採用本發明之 基板片或鑄模裝置，則當封膠塑料注入模穴時，存在於基 板片下表面與下模之間的空氣將可平順均一地經由該基板 片下表面之逃氣通道或下模之逃氣孔道洩出，藉此改善先 前技藝之問題。 雖然本發明已以前述較佳實施例揭示，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與修改。因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。P00-047.ptd 笫 page 10 4 4 85 4 7 V. Description of the invention (8) This way, when the substrate piece is placed in a mold sealing compound, the escape channel can help the ventilation. The present invention further provides a mold device for forming a flexible substrate package structure, which is characterized in that a plurality of escape holes are provided above and below the mold device to help ventilation. Therefore, as long as the substrate sheet or the mold device of the present invention is used, when the sealing plastic is injected into the cavity, the air existing between the lower surface of the substrate sheet and the lower mold can smoothly and uniformly escape through the lower surface of the substrate sheet. The escape hole of the channel or the lower mold is leaked, thereby improving the problems of the previous technique. Although the present invention has been disclosed by the aforementioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.
P00-047.ptd 第11頁 4485 4 /P00-047.ptd Page 11 4485 4 /
圖式簡單說明 2 24b 澆 道 226 上 嵌 入 件 2 2 6a 凹 部 2 2 6b 上 逃 氣 孔 道 2 2 6 c 壓 緊 區 域 240 下 模 242 下 模 基 座 2 42a 凹 部 244 下 中 間 塊 246 下 入 件 300 基 板 片 310 半 導 體 晶 片 320 逃 氣 通 道 400 鑄 模 裝 置 420 下 模 422 下 模 基 座 42 2a 凹 部 424 下 中 間 塊 426 下 欲 入 件 4 2 6a 下 逃 氣 孔 道 430 模 穴 對 應 區 域 P00-047.ptd 第13頁Brief description of the drawing 2 24b runner 226 upper insert 2 2 6a recess 2 2 6b escape channel 2 2 6 c clamping area 240 lower die 242 lower die base 2 42a recess 244 lower middle block 246 lower insert 300 Substrate sheet 310 Semiconductor wafer 320 Escape channel 400 Molding device 420 Lower mold 422 Lower mold base 42 2a Recess 424 Lower middle block 426 Lower insert 4 2 6a Lower escape hole 430 Mold cavity corresponding area P00-047.ptd 13 pages
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW089108770A TW448547B (en) | 2000-05-06 | 2000-05-06 | Substrate piece of the flexible substrate based package |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW089108770A TW448547B (en) | 2000-05-06 | 2000-05-06 | Substrate piece of the flexible substrate based package |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442484C (en) * | 2001-11-07 | 2008-12-10 | 先进系统自动化有限公司 | Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package |
| CN113539863A (en) * | 2020-04-20 | 2021-10-22 | 罗伯特·博世有限公司 | Method and device for producing a substrate provided with a hardenable encapsulating compound |
-
2000
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442484C (en) * | 2001-11-07 | 2008-12-10 | 先进系统自动化有限公司 | Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package |
| CN113539863A (en) * | 2020-04-20 | 2021-10-22 | 罗伯特·博世有限公司 | Method and device for producing a substrate provided with a hardenable encapsulating compound |
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