TW447775U - Insulating structure of laminated chip type electronic device - Google Patents
Insulating structure of laminated chip type electronic deviceInfo
- Publication number
- TW447775U TW447775U TW89211724U TW89211724U TW447775U TW 447775 U TW447775 U TW 447775U TW 89211724 U TW89211724 U TW 89211724U TW 89211724 U TW89211724 U TW 89211724U TW 447775 U TW447775 U TW 447775U
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic device
- type electronic
- insulating structure
- chip type
- laminated chip
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89211724U TW447775U (en) | 2000-07-07 | 2000-07-07 | Insulating structure of laminated chip type electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89211724U TW447775U (en) | 2000-07-07 | 2000-07-07 | Insulating structure of laminated chip type electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW447775U true TW447775U (en) | 2001-07-21 |
Family
ID=21670139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89211724U TW447775U (en) | 2000-07-07 | 2000-07-07 | Insulating structure of laminated chip type electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW447775U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI610602B (zh) * | 2015-01-30 | 2018-01-01 | 村田製作所股份有限公司 | 電子零件之製造方法及電子零件 |
-
2000
- 2000-07-07 TW TW89211724U patent/TW447775U/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI610602B (zh) * | 2015-01-30 | 2018-01-01 | 村田製作所股份有限公司 | 電子零件之製造方法及電子零件 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2391388B (en) | Electronic structure | |
GB2365008B (en) | Insulating ceramic compact,ceramic multilayer substrate and ceramic electronic device | |
TW477516U (en) | Shielding structure of electronic device | |
GB2360036B (en) | Insulating ceramic multilayer ceramic substrate ceramic electronic parts and laminated ceramic electronic parts | |
GB2360404B (en) | Electronic circuit | |
GB2358987B (en) | Electronic devices | |
GB2372601B (en) | Semiconductor integrated circuit | |
GB0111267D0 (en) | Electronic circuit | |
HK1040569B (zh) | 改進了的集成電路結構 | |
GB0215527D0 (en) | Integrated circuit chip and mounting structure | |
GB2370687B (en) | An integrated circuit package | |
GB0121204D0 (en) | Electronic circuit structure with improved dielectric properties | |
GB0115221D0 (en) | Electronic circuit | |
TW452235U (en) | Connection device of electronic card | |
TW447775U (en) | Insulating structure of laminated chip type electronic device | |
GB2362155B (en) | Laminated electronic component | |
IL134628A0 (en) | Electronic circuit breaker | |
TW508042U (en) | Structure of circuit board combination | |
GB0105655D0 (en) | An electronic circuit | |
TW472950U (en) | Insulation coating structure of laminated chip-type electronic device | |
TW461586U (en) | Package structure of integrated circuit | |
TW482333U (en) | Package structure of integrated circuit | |
TW492622U (en) | Electronic device case structure | |
TW464054U (en) | Encapsulaton structure of integrated circuit | |
GB0006406D0 (en) | Electronic devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MC4K | Revocation of granted utility model |