447071 A7 ______B7 五、發明説明（） 發明領娀： 本發明係有關於一種自動手臂裝置。特别是有關於 —種智慧型晶圓偵測自動手臂裝置。 發明背景： 隨著半導體科技的進步，半導體製程中處理的晶圓 尺寸越來越大，從早期的4叶、6对到現在普遍的8对、 甚至12吋。此舉使得每片晶圓的價値越來越高，囡此 處理時需更加小心，以免因爲一時的疏忽，造成昂貴的 晶圓發生損壞。 在半導體設備中，晶圓傳送系統是一重要的設備， 此晶圓傳送系統可以傳送晶圓至適當處，以進行半導體 製程》在晶圓傳迭系統中，自動手臂（robot)裝置負貴抓 取及傳送晶圓。由.於自動手臂（robot)裝置的運動方式相 當複雜，一有不愼，稍微的誤差都可能導致晶圓傳送失 敗，使得晶圓傳送工作停止、甚至發生晶圓損壞的事 件。因此，自動手臂裝置是晶圓傳送系統中相當重要的 裝置。 經濟部中央標準局貞工消費合作社印裝 爲了保持自動手臂裝置的正常運作，晶圓傳送系統 中有很多的感測器，以監控自動手臂裝置的運作，監控 的結果，將送到控制裝置中，以判斷自動手臂装置的運 私紙張尺度適用中國国家標準（CNS ) A4規格（2ΐ〇χ297公楚） ^ 447 Ο 7 1 A7 B7 五、發明説明（） 作是否正常，以決定繼績運作自動手臂裝置或是暫停自 動手臂裝置的運作。 雖然晶圓傳送系統中有很多的感測器，以監控自動 手臂裝置的運作，然而傳統的自動手臂裝置上面，並沒 有位置感測器或只有兩個位置感測器位於自動手臂裝 置的内部上，此結果使得傳統的自動手臂裝置在抓取及 傳送晶圓時，只能偵測，出有無晶圓在自動手臂裝置上 面’而無法查知晶圓是否有移位及移位的方向〇是以，' 當晶圓位置偏移過大時，有時將造成晶圓掉片及破裂。 此晶圓掉片及破裂事件將導致諸如自動手臂或處理室 (chamber)損害、其他後績欲處理的晶圓受到汙染、以 及有效生產時間的縮減。 因此，如何有效解決自動手臂裝置在抓取及傳送晶 圓時，無法查知晶圓在自動手臂裝置上是否有移位及移 位的方向之缺點、以及因此產生晶圓掉片及破裂事件所 導致的諸多缺失，便成爲業界人士努力的目標。 {请先閲讀背面之注意事項再填寫4頁) 訂- 經濟部中央橾準局貝工消费合作社印装 I張 一紙 本 準 標 家 ί囷 固 中 用 逍 ί 公 97 2 經濟部中央標準局員工消費合作社印聚 第 447071 A7 —____B7__； 五、發明説明（） 發明B的及概述： 本發明的主要目的爲提供一種智慧型晶圓偵測自動 手臂（robot)裝置，以偵測自動手臂上之晶圓的移位量及移 位方向。 本發明的另一目的爲提供一種智慧型晶圓偵測自動 手臂裝置，以避免晶圓掉片及破裂。 本發明的又一目的爲提供一種智慧型晶圓偵測自動 手臂裝置，以避免因爲晶圓掉片及破裂事件所導致的自動 手臂或處理室（chamber)損害。 本發明的再一目的爲提供一種智慧型晶圓偵别自動 手臂裝置，以避免因爲晶圓掉片及破裂事件所導致的有效 生產時間的縮減問題。 本發明所提出的智慧型晶圓偵測自動手臂装置玄 少包含一承載部及一感測板，其中承載部的上面包含呈 少三個感測器p爲了便於説明，今以包含三個感測器的 承載部，對本發明所提出的裝置作一説明： 本發明所提出的包含三個感測器的智慧塑晶圓横 測自動手臂裝置至少包舍一承載部，用以承載―晶圓於 承載部上，其中承載部的上面包含一第一感測器 本紙張尺度適用中國囤家標準（CNS ) A4現格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)447071 A7 ______B7 V. Description of the invention () Invention collar: The present invention relates to an automatic arm device. In particular, there is an intelligent arm detection device for intelligent wafer detection. Background of the Invention: With the advancement of semiconductor technology, the size of wafers processed in semiconductor processes is getting larger and larger, from the early 4-leaf, 6-pair to the current 8-pair, or even 12-inch. This makes the price of each wafer higher and higher, so more care must be taken during this process to avoid damage to expensive wafers due to temporary negligence. In semiconductor equipment, the wafer transfer system is an important device. This wafer transfer system can transfer wafers to appropriate places for semiconductor processing. In the wafer transfer system, an automatic robot (robot) device is responsible for Retrieve and transfer wafers. Due to the relatively complicated movement method of the robotic robot (robot) device, if there is no problem, a slight error may cause the wafer transfer to fail, causing the wafer transfer operation to stop, or even a wafer damage event. Therefore, the robot arm device is a very important device in the wafer transfer system. Printed by the Central Labor Bureau of the Ministry of Economic Affairs of the Zhengong Consumer Cooperative To maintain the normal operation of the robotic arm device, there are many sensors in the wafer transfer system to monitor the operation of the robotic arm device. The results of the monitoring will be sent to the control device. In order to judge the paper size of the automatic arm device for transporting private paper, the Chinese National Standard (CNS) A4 specification (2ΐ〇χ297 公 楚) is applicable ^ 447 〇 7 1 A7 B7 5. Description of the invention () Whether the operation is normal to determine the success of automatic operation Arm device or pause automatic arm device operation. Although there are many sensors in the wafer transfer system to monitor the operation of the automatic arm device, the traditional automatic arm device does not have a position sensor or only two position sensors are located on the inside of the automatic arm device. This result makes the traditional automatic arm device can only detect whether the wafer is on the automatic arm device when grabbing and transferring the wafer, and it is impossible to check whether the wafer is shifted and the direction of the shift. Therefore, 'When the wafer position is excessively shifted, the wafer may fall off and crack. This wafer drop and rupture event will result in damage to robotic arms or chambers, contamination of other wafers to be processed later, and reduced effective production time. Therefore, how to effectively solve the shortcomings of the automatic arm device when it is grasping and conveying the wafer, it is impossible to know whether the wafer has the displacement and the direction of the displacement on the automatic arm device, and the wafer falling and rupture events are therefore caused. Many of the resulting defects have become the goals of the industry. {Please read the precautions on the back before filling in 4 pages.) Order-Printed by the Central Laboratories of the Ministry of Economic Affairs, a printed copy of the paper, a prospective bidder, 囷 Guzhongzhong Xiaoxiao 97 2 Central Standards Bureau of the Ministry of Economic Affairs Employee Consumer Cooperative Co., Ltd. Printed No. 447071 A7 —____ B7__; 5. Description of the Invention () Invention B and Overview: The main purpose of the present invention is to provide a smart wafer detection robot (robot) device to detect the robot arm. The amount and direction of wafer displacement. Another object of the present invention is to provide an intelligent wafer detection automatic arm device to avoid wafer dropping and cracking. Yet another object of the present invention is to provide an intelligent wafer detection automatic arm device to avoid damage to an automatic arm or a chamber caused by a wafer falling or rupture event. Yet another object of the present invention is to provide an intelligent wafer detection automatic arm device to avoid the problem of reducing the effective production time caused by wafer dropping and cracking events. The intelligent wafer detection automatic arm device proposed by the present invention includes a load-bearing portion and a sensing board, wherein the load-bearing portion includes three sensors at the top. For convenience, three sensors are included here. The carrying part of the detector describes the device proposed by the present invention: The intelligent plastic wafer transverse measurement automatic arm device including the three sensors provided by the present invention includes at least one carrying part for carrying the wafer. On the load-bearing part, where the load-bearing part contains a first sensor, the paper size is applicable to China Store Standard (CNS) A4 (210X297 mm) (please read the precautions on the back before filling this page)
-IT 447071 A7 ____B7_____ 五、發明説明（） 二感測器、及一第三感測器。承載部上之第—感測器、 第一感測器' 及第三感測器，可以分别測量晶圓覆蓋第 一感測器、第二感測器及第三感測器的面積，並將此面 積轉換爲一輸出電壓分别傳至第一感測器、第二感測器 及第二感ϊ則器的輸出端，其中第一感測器、第二感測器 及第二感測器之位置配置，需位於承載部.承載晶圓時， 晶圓的邊緣上。 今説明上述之包含三個感測器的智慧型晶圓偵測 自動手臂裝置的原理如下：首先將承載部伸到一晶圓的 正下方，以抓取一晶圓。藉著晶圓覆蓋三個感測器的各 别面積大小，可知晶圓的移位量及移位的方向，以便進 行晶圓的位置校正，避免晶圓位置偏移過大所造成晶圓 掉片及破裂事件β而感測板至少包含_判斷（judgment) 模組、一決定（decision)模組、及一結合（interlock)模 組。 經濟部中央榡準局員工消费合作社印製 判斷模組包含一具有一輸入端及一輸出端的第一 比較器電路（comparator circuit)，其中第一比較器電路 的輸入端連接第一感測器的輸出端，《比較第一感測器 的輸出端之輸出電壓C!與第一比較器電路設定的電壓 範園、一具有一輸入端及一輸出端的第二比較器電路， 其中第二比較器電路的輸入端連接第二感測器的輸出 端，以比較第二感測器的輸出端之輸出電壓C2與第二 比較器電路設定的電壓範®、以及一具有一輸入端及一 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 447071 A7 ____ B7 ___________ — 五、發明説明（） 輸出端的第三比較器電路，其中第三比較器電路的輸入 端連接第三感測器的輸出端，以比較第三感測器的輸出 端之輸出電壓C3與第三比較器電路設定的電壓範園。 當晶圓覆蓋第一感測器的面積越大，第一感測器輸 出端的輸出電壓Cl越大。若第一感測器輸出端的輸出 電壓Cl在第一比較器電路設定的電歷範園内，則第一 比較器電路的輸出端輸出一”眞（True)’’的訊號；若第一 感測器輸出端的輸出電壓Ci在第一比較器電路設定的 電壓範園之外’則第一比較器電路的輸出端輸出一，，僞 (False)”的訊號。 經濟部中央標準局負工消费合作社印製 同理，當晶圓覆蓋第二感測器的面積越大，第二感 測器輸出端的輸出電壓C2越大。若第二感測器輸出端 的輸出電壓C2在第二比較器電路設定的電壓範囷内， 則第二比較器電路的輸出端輸出一，，眞”的訊號；若第二 感測器輸出端的輸出電壓C2在第二比較器電路設定的 電壓範園之外，則第二比較器電路的輸出端輸出一，，僞” 的訊號。當晶圓覆蓋第三感測器的面積越大，第三感測 器輸出端的輸出電壓C3越大。若第三感測器輸出端的 輸出電壓C3在第三比較器電路設定的電壓範園内，則 第主比較器電路的輸出端輸出一”眞”的訊號；若第三感 測器輸出端的輸出電壓C：3在第三比較器電路設定的電 壓範園之外，則第三比較器電路的輸出端輸出一，，僞” 的訊號。 本紙張尺度逋用中國國家標準（CNS ) A4現格（210Χ297公釐）-IT 447071 A7 ____B7_____ 5. Description of the invention () Two sensors, and a third sensor. The first sensor, the first sensor, and the third sensor on the carrying part can measure the areas of the wafer covering the first sensor, the second sensor, and the third sensor, respectively, and The area is converted into an output voltage and transmitted to the output ends of the first sensor, the second sensor, and the second sensor respectively, wherein the first sensor, the second sensor, and the second sensor The position of the device needs to be located on the carrying part. When carrying the wafer, it is on the edge of the wafer. The principle of the above-mentioned intelligent wafer detection automatic arm device including three sensors is explained as follows: First, the carrier portion is extended directly below a wafer to grasp a wafer. By covering the respective areas of the three sensors with the wafer, the amount and direction of the wafer displacement can be known in order to correct the position of the wafer and avoid wafer dropping due to excessive wafer position deviation. And the rupture event β, and the sensing board includes at least a judgment module, a decision module, and an interlock module. The printed judgment module of the Employees' Cooperative of the Central Economic and Technical Bureau of the Ministry of Economic Affairs includes a first comparator circuit having an input end and an output end, wherein the input end of the first comparator circuit is connected to the first sensor. Output end, "Compare output voltage C! At the output end of the first sensor with the voltage range set by the first comparator circuit, a second comparator circuit having an input end and an output end, wherein the second comparator The input end of the circuit is connected to the output end of the second sensor to compare the output voltage C2 of the output end of the second sensor with the voltage range set by the second comparator circuit, and an input end and a paper The scale applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 447071 A7 ____ B7 ___________ — V. Description of the invention () The third comparator circuit at the output end, where the input end of the third comparator circuit is connected to the third sensor To compare the output voltage C3 at the output of the third sensor with the voltage range set by the third comparator circuit. When the area of the wafer covering the first sensor is larger, the output voltage Cl of the output terminal of the first sensor is larger. If the output voltage Cl at the output end of the first sensor is within the calendar range set by the first comparator circuit, the output end of the first comparator circuit outputs a signal of "True"; if the first sensing If the output voltage Ci of the output terminal of the comparator is outside the voltage range set by the first comparator circuit, then the output terminal of the first comparator circuit outputs a ", false" signal. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics. Similarly, the larger the area of the second sensor covered by the wafer, the larger the output voltage C2 at the output of the second sensor. If the output voltage C2 of the output terminal of the second sensor is within the voltage range set by the second comparator circuit, the output terminal of the second comparator circuit outputs a signal of "1", ""; If the output voltage C2 is outside the voltage range set by the second comparator circuit, the output terminal of the second comparator circuit outputs a "1, false" signal. When the area of the wafer covering the third sensor is larger, the output voltage C3 at the output end of the third sensor is larger. If the output voltage C3 of the third sensor output terminal is within the voltage range set by the third comparator circuit, the output terminal of the first main comparator circuit outputs a "眞" signal; if the output voltage of the third sensor output terminal C: 3 is outside the voltage range set by the third comparator circuit, then the output of the third comparator circuit outputs a signal of "1, false". This paper uses China National Standard (CNS) A4. 210 × 297 mm)
44707I A7 B7 五、發明説明（ 決定（decision)模組包舍一具有三個輸入端及一個 輸出端的第一及閘（AND gate)、一具有一輸入端及一輸 出端的第一反相器（inverter)、一具有一輸入端及一輸 出端的第二反相器、一具有一輸入端及一輸出端的第三 反相器（inverter)、_具有三個輸入端及一個輸出端的 第二及閘、及一具有二個輸入端及一甸輸出端的第一或 閘（〇R gate)。 其中第一及閛的二個輸入端分别與第一比較器電 路的輸出端、第二比較器電路的輸出端及第三比較器電 路的輸出端相連接，以對第一比較器電路的輸出端、第 二比較器電路的輸出端及第三比較器電路的輸出旗之 輸出訊號做一處理。而第_反相器的輸入端與第—比較 器電路的輸出端相連接，以對第一比較器電路的輸出端 之輸出訊號做一反相處理。第二非閘的輸入端與第二比 較器電路的輸出端相連接，以對第二比較器電路的輸出 端之輸出訊號做一反相處理。第三反相器的輸入端與第 三比較器電路的輸出端相速接，以對第三比較器電路的 輸出端之輸出訊號做一反相處理。 經濟部中央標準局男工消费合作社印装 出連 輸相 的端 器出 相輸 反的 一器 第相 與反 别三 分第 端及 入端 輸出 個輸 三的 .的器 nfl HR St 才 及反 二二 第第 ' 端 輸輪 的之 器端 相出 反輸 一的 第器 對栢 以反 ， 三 接第 出 出 號 端訊 第 做 及的 端閘 出或 輸一 的第 器 相 反 一\ 理 處 •τ- (請先閲讀背面之注意事項再填寫本頁)44707I A7 B7 V. Description of the invention (The decision module includes a first AND gate with three inputs and an output, and a first inverter with an input and an output ( inverter), a second inverter with an input end and an output end, a third inverter with an input end and an output end, a second sum gate with three input ends and an output end And a first OR gate having two input terminals and one output terminal. The two input terminals of the first and second terminals are respectively connected to the output terminal of the first comparator circuit and the output terminal of the second comparator circuit. The output terminal is connected to the output terminal of the third comparator circuit to process the output signals of the output terminal of the first comparator circuit, the output terminal of the second comparator circuit, and the output flag of the third comparator circuit. The input terminal of the _th inverter is connected to the output terminal of the _th comparator circuit to invert the output signal of the output terminal of the first comparator circuit. The input terminal of the second NOT gate is compared with the second The output of the amplifier circuit is connected Connection, to perform an inversion processing on the output signal of the output terminal of the second comparator circuit. The input terminal of the third inverter circuit is quickly connected to the output terminal of the third comparator circuit, The output signal of the output terminal is processed in reverse phase. The male workers' consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs prints out a terminal device that outputs the phase of the output phase. The device that loses three is nfl HR St, and the device of the second, second, and second terminal is opposite. The device of the first and second is opposite, and the third is the third terminal. The first device that turns out or loses one is the opposite of the first one. \ Τ- (Please read the precautions on the back before filling this page)
本紙張尺度逋用中國國家標準（CNS ) A4規格（210X297公釐） 447 07 Α7 Β7 五、發明説明（） —個輸入端为别與第一及閘的輸出端及第二及閘的輸 出端相連接’以對第一及閱的輸出端及第二及閉的輸出 端之輸出訊號做一處理。 (请先閲讀背面之注意事項再填寫本頁) 若第一及閘的#出端及第二&閘的輸出端之輸出 訊號至少有一爲”眞，，的訊號，則第—或閉的輸出端輸出 —”眞”的訊號；若第-及閘的輸出端及第二及閘的輸出 端之輸出訊號均爲，，僞，，的訊號，則第一或閛的輸出端輸 出一”偽”的訊號。 結合（interlock)模組包舍一結合器，其中結合器的 輸入端與第一或閘的輸出端連接，以對第一或閘的輸出 端之輸出訊號做一處理。當第一或閘的輸出端輸出一” 眞”的訊號，則不管輸入結合器的電流^爲何，結合器 輸出電流1。^等於Iin，使得智慧型晶固偵測自動手臂 裝置繼續傳送晶圓；若第一或閑218的輸出端輸出一，， 僞”的钒號’則不管輸入結合器22〇的電流Iin爲何，結 合器輸出電流Iout爲0，使得智慧型晶圓偵測自動手臂 裝置停止傳送晶圓。 圆式簡單説明： 經濟部中央揉準工消費合作社印11 第一圖顯示本發明之一實施例中，所提出的包含三個感 測器的智慧型晶圓偵測自動手臂（robot)裝置之承載部 (blade)的示意圖。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公瀣） 447071 經濟部中央梯準局貝工消費合作社印製 A7 B7 五、發明説明（） 第二圖類示本發明之一實施例中，所提出的包含三個感測 器的智慧型晶固偵測自動手臂(robot)裝置之感測板的示 意圖》 發明詳細説 本發明提出一種智慧塑晶圓偵測自動手臂的裝 置。本發明卢斤提出的裝置i少包含一承裁部及一感測 板，其中承栽部的上面包含至少三個感測器。爲了便於 説明，今以包含三個感測器的承載部，對本發明所提出 的裝置作一說明。 第一圖顧示本發明之一實施例中，所提出的包含三 個感測器的智慧型晶圓偵測自動手臂（robot)裝置之承 載部（blade)的示意圖。本發明所提出的智慧型晶圓積 測自動手臂裝置至少包含一承載部1〇4,用以承載—晶 圓102於承載部104上，其中承載部ι〇4的上面包舍一 第一感測器一第二感測器Cg p及一第三感測器 (1 ljj承載部1 〇4上之第一感測器1 1 〇、第二感測器 1 1 2、及第三感測器1 14，可以分别測量晶圓丨〇2覆蓋 第一感測器11 0、第二感測器112及第三感測器11 4的 面積，並將此面積轉換爲一輸出電壓分别傳至第一感測 器110、第二感測器112及第三感測器114的輸出端， 其中第一感測器11 0、第二感測器1 12及第三感測器 114之位置配置，需位於承載部104承載晶圓102時， 本紙張尺度適用中國國家標準（CNS ) A4規格（2〖〇X297公釐） (請先閲讀背面之注意事項再填寫本頁} 訂· 447071 經濟部中央標準局貝工消費合作社印裂 A7 B7 五、發明説明（） 晶圓1 02的邊緣上。依據本發明之—實施例，第一感測 器1 10、第二感測器1 12及第三感測器丨14可爲完二相 同的感測器。而第一感測器110、第二感測器i 12及第 二感測器114之形狀包含孤形平板狀或矩形平板狀，依 據本發明之一較佳實施例’第一感測器n 〇、第二感測 器112及第二感+測器114的形狀爲紙形平板狀較好。 又，第一感測器U 0、第二感測器1 1 2及第三感測器u 4 可爲電容感測器。 今説明上述之包舍三個感測器的智慧型晶圓该測 自動手臂裝置的原理如下：首先將承载部1〇4伸到—晶 圓102的正下方，以抓取一晶圓1〇2。藉著晶圓1〇2覆 蓋三個感測器的各别面積大小，可知晶圓102的移位量 及移位的方向，）¾便進行晶圓102的位置校正，避免晶 圓102位置偏移過大所造成晶圓1〇2掉片及破裂事 件。 第二圖顯示本發明之一實施例中，所提出的包舍三 個感測器的智慧型晶圓偵測自動手臂（robot)裝置之感 測板的示意固。感測板200至少包含一判斷（judgment) 模組 300、一決定（decision)模組 400、及—結合 (interlock)模組 5.00。 判斷模組300包舍一具有一輸入端及一輸出端的 第一比較器電路（comparator circuit)202，其中第一比 本紙張尺度適用中國國家標準（CNS ) A4規格（2 m X 297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂· Ί A7 B7 修正 (請先閲讀背面之注意事項再填寫本頁) 202>的輸人端連接第一感測器110的輸出端， 以比較第一感測器11 ◦的輸出端之輸出電壓C1與第一 比較器電路202設定的電壓範圍、一具有一輸入端及一 輸出端的第二比較器電路204,其中第二比較器電路204 的輸入端連接第二感測器1 1'2的輸出端，以比較第二感 測器112的輸出端之輸出電壓C2與第二比較器電路204 設定的電壓範圍、以及一具有一輸入端及一輸出端的第 三比較器電路200，其中第三比較器電路206的輸入端 連接第三感測器11 4的輸出端，以比較第三感測器114 的輸出端之輸出電壓C3與第三比較器電路206設定的 電壓範圍。 當晶圓102覆蓋第一感測器110的面積越大，第一 感測器110輸出端的輸出電壓 C1越大。若第一感測器 110輸出端的輸出電壓在第一比較器電路202設定 的電壓範圍内，則第一比較器電路202的輸出端輸出一” 真（True)”的訊號；若第一感測器 110輸出端的輸出電 壓Ci在第一比較器電路202設定的電壓範圍之外，則 第一比較器電路 202的輸出端輸出一”偽（False)”的訊 號。 經濟部智慧財產局員工消費合作社印製 同理，當晶圓1 0 2覆蓋第二感測器11 2的面積越大， 第二感測器112輸出端的輸出電壓C2越大。若第二感 測器112輸出端的輸出電壓C2在第二比較器電路204 設定的電壓範圍内，則第二比較器電路204的輸出端輸 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 447071 7 7 Α βThis paper size adopts Chinese National Standard (CNS) A4 specification (210X297 mm) 447 07 Α7 Β7 V. Description of the invention () — one input terminal is the output terminal of the first and the second gate and the output terminal of the second and the gate Connected 'to process the output signals of the first and second output terminals and the second and closed output terminals. (Please read the precautions on the back before filling in this page) If at least one of the output signals of the #out end of the first and the gate and the output end of the second & gate is a signal of "眞", then the-or closed The output terminal outputs a signal of “眞”; if the output signals of the first and second gates and the output signals of the second and gate are both ,, false, and, then the output terminal of the first or 输出 outputs one. A false "signal. An interlock module includes a combiner, where the input of the combiner is connected to the output of the first OR gate to process the output signal from the output of the first OR gate. When The output terminal of the first OR gate outputs a “眞” signal, regardless of the current input to the coupler, the coupler outputs a current of 1. ^ is equal to Iin, so that the intelligent crystal solid detection automatic arm device continues to transmit wafers; If the output terminal of the first or idle 218 outputs one, the pseudo "vanadium number" will ignore the current Iin input to the coupler 22 and the coupler output current Iout will be 0, so that the intelligent wafer detection automatic arm device stops. Transfer wafers. Brief description of the circle type: Printed by the Central Ministry of Economic Affairs and the Consumers ’Cooperatives 11 The first figure shows an embodiment of the robotic device for detecting intelligent robotic wafers with three sensors in an embodiment of the present invention. A schematic view of a blade. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 gong) 447071 Printed by the Central Laboratories of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, A7, B7 5. Description of the invention () The second figure shows an embodiment of the present invention. The schematic diagram of the proposed sensing board of the intelligent crystal solid detection robotic device including three sensors "The invention details that the present invention proposes a device for intelligent plastic wafer detection of an automatic arm. The device i proposed by Lu Jin of the present invention seldom includes a cutting section and a sensing board, wherein the upper part of the mounting section includes at least three sensors. For the convenience of description, the device provided by the present invention will be described with a bearing part including three sensors. The first figure shows a schematic view of a blade part of a robotic device for an intelligent wafer detection robot including three sensors in an embodiment of the present invention. The intelligent wafer stacking and measuring automatic arm device provided by the present invention includes at least a carrier portion 104 for carrying the wafer 102 on the carrier portion 104, and the upper breadhouse of the carrier portion ι04 has a first sense. A second sensor Cg p and a third sensor (the first sensor 1 1 0 on the load bearing section 104), the second sensor 1 12, and the third sensor The device 1 14 can measure the areas of the wafer 〇 02 covering the first sensor 110, the second sensor 112, and the third sensor 114, respectively, and convert this area into an output voltage and pass it to Outputs of the first sensor 110, the second sensor 112, and the third sensor 114, where the positions of the first sensor 110, the second sensor 112, and the third sensor 114 are arranged When the wafer 102 needs to be located in the carrying section 104, the paper size applies to the Chinese National Standard (CNS) A4 specification (2 〖〇297mm） (Please read the precautions on the back before filling this page} Order · 447071 Ministry of Economic Affairs The Central Bureau of Standards Shellfish Consumer Cooperative printed A7 B7 V. Description of the invention () On the edge of wafer 102. According to the present invention-embodiment, the first The sensor 1 10, the second sensor 1 12 and the third sensor 丨 14 may be two identical sensors. The first sensor 110, the second sensor i 12 and the second sensor The shape of the sensor 114 includes a solitary flat plate shape or a rectangular flat plate shape. According to a preferred embodiment of the present invention, the shapes of the first sensor n 0, the second sensor 112, and the second sensor + sensor 114 are paper. The shape of the flat plate is better. In addition, the first sensor U 0, the second sensor 1 12, and the third sensor u 4 may be capacitive sensors. The three sensors described above will be described here. The principle of the automatic arm device of this smart wafer measurement is as follows: First, the carrier portion 104 is extended to-directly below the wafer 102 to grasp a wafer 102. By the wafer 102 covering three The size of each sensor's area can be used to know the amount and direction of the wafer 102's displacement.) ¾ will perform the position correction of the wafer 102 to avoid wafer 102 caused by excessive position deviation of the wafer 102 Film fall and rupture events. The second figure shows the sensing of an intelligent robotic robotic robot (robot) device that includes three sensors in one embodiment of the present invention. The sensing board 200 includes at least a judgment module 300, a decision module 400, and an interlock module 5.00. The judgment module 300 includes an input terminal and The first comparator circuit 202 of an output terminal, of which the first paper size applies the Chinese National Standard (CNS) A4 specification (2 m X 297 mm) (Please read the precautions on the back before filling this page ) Order · Ί A7 B7 correction (please read the precautions on the back before filling in this page) 202> The input end is connected to the output end of the first sensor 110 to compare the output end of the first sensor 11 ◦ The output voltage C1 and the voltage range set by the first comparator circuit 202, a second comparator circuit 204 having an input terminal and an output terminal, wherein the input terminal of the second comparator circuit 204 is connected to the second sensor 1 1 ' 2 to compare the output voltage C2 of the output of the second sensor 112 with the voltage range set by the second comparator circuit 204, and a third comparator circuit 200 having an input and an output, wherein Third comparator Passage 206 is connected to the input of the output terminal of the third sensor 114 to compare the output voltage at the output 114 of the third sensor C3 of the third comparator circuit 206 and voltage ranges. When the area of the wafer 102 covering the first sensor 110 is larger, the output voltage C1 at the output terminal of the first sensor 110 is larger. If the output voltage of the output terminal of the first sensor 110 is within the voltage range set by the first comparator circuit 202, the output terminal of the first comparator circuit 202 outputs a "True" signal; The output voltage Ci at the output terminal of the comparator 110 is outside the voltage range set by the first comparator circuit 202, and then the output terminal of the first comparator circuit 202 outputs a "False" signal. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics Similarly, the larger the area of the second sensor 112 covered by the wafer 102, the larger the output voltage C2 at the output of the second sensor 112. If the output voltage C2 at the output end of the second sensor 112 is within the voltage range set by the second comparator circuit 204, the output end of the second comparator circuit 204 will output 11 This paper size applies to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) 447 071 7 7 Α β
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(請先閱讀背面之生意事項再填寫本頁) 黃/的號；若第二感測器11 2輸出端的輸出電壓 C2在第二比較器電路204設定的電壓範圍之外，則第 二比較器電路204的輸出段輸出一”偽”的訊號。當晶圓 1 0 2覆蓋第三感測器11 4的面積越大，第三感測器114 輸出端的輸出電壓C3越大。若第三感測器114輸出端 的輸出電壓C3在第三比較器電路206設定的電壓範圍 内，則第三比較器電路 206的輸出端輸出一”真”的訊 號；若第三感測器114輸出端的輸出電壓（：3在第三比 較器電路206設定的電壓範圍之外，則第三比較器電路 206的輸出端輸出一”偽’’的訊號。 決定（decision)模组包含一·具有三個輸入端及一個 輸出端的第一及閘（AND gate)208 ' —具有一輸入端及 一輸出端的第一反相器（inverter)210、一具有一輸入端 及一輸出端的第二反相器 212、一具有一輸入端及一輸 出端的第三反相器（inverter)214、一具有三個輸入端及 一個輸出端的第二及閘 216、及一具有二個輸入端及一 個輸出端的第一或閘（OR gate)218。 經濟部智慧財產局員工消費合作社印製 其中第一及閘 208的三個輸入都分別與第一比較 器電路202的輸出端、第二比較器電路204的輸出端及 第三比較器電路206的輸出端相連接，以對第一比較器 電路202的輸出端、第二比較器電路204的輸出端及第 三比較器電路206的輸出端之輸出訊號做一處理。而第 一反相器 210的輪入端與第一比較器電路 202的輸出 12 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） 447071 A7 B7 --------—-------------- 五、發明説明（） 端相速接，以對第一比較器電路202的輸出端之輸出訊 號做一反相處理。第二非閘212的輸入端與第二比較器 電路204的輪出端相連接，以對第二比較器電路204 的輸出端之輪出訊號做一反相處理。第三反相器214 的輸入端與第三比較器電路206的輸出端相連接，以對 第三比較器電路206的輸出端之輸出訊號做一反相處 理。 第二及閘216的三個輸入端分别與第一反相器210 的輸出端、第二反相器212的輸出端及第三反相器214 的輸出端相連接，以對第一反相器210的輸出端、第二 反相器212的輸出端及第三反相器214的輸出端之輸 出訊號做一處理。第一或閘218的二個輸入端分别與第 一及閛208的輸出端及第二及閘216的輸出端相連 接，以對第一及閘208的輸出端及第二及閘216的輸出 端之輸出訊號做一處理。 經濟部中央t準局員工消費合作社印裝 (請先閲讀背面之注項再填寫本頁) 若第一及閘208的輸出端及第二及閘216的輸出 端之輸出訊號至少有一爲”眞”的訊號，則第一或閘218 的輸出端輸出一”眞”的訊號；若第一及閛20 8的輸出端 及第二及閘 216的輸出端之輸出訊號均爲”僞”的訊 號，則第一或閘218的輸出端輸出一”偽’’的訊號。 結合（interlock)模組包含一結合< 220，；其中結合 器220的輸入端與第一或閘218的輸出ΐ連接，以對第 13 本紙浪尺度適用中國國家標準（CNS ) Μ規格（210Χ297公釐） 447〇7i A7 ____B7 五、發明说明（) 一或閘218的輸出端之輸出訊號做一處理。當第一或閘 21S的輸出端輸出一”眞”的訊號，則不管^入結人器 220的電流lin爲何，結合器220輸出雷涂τ 咕 ^ 节碼i〇ut等於Iin， (請先閲讀背面之注$項再填寫本頁) 使得智慧型晶圓该測自動手臂裝置繼續傳送晶圓 102;右第一或閘218的輸出端輸出_，》偽，，的訊號 則 不管輸入結合器220的電流Iin爲何，結’合器輸出 電流“ut爲〇，使得智慧型晶圓偵測自動手臂裝置停止 傳选晶圓102。 利用本發明所提出的晶圓偵測自動手臂裝置，可以 偵測自動手臂裝置上之晶圓的移位量及移位方向，以避 免晶圓掉片及破裂。由於晶圓掉片及破裂事件減少，故 自動手臂或處理室（chamber)損害問題因而降低、且增 加了有效生產時間》 本發明僅以較佳實施例説明如上，並非用以限定本發 明之申請範園，凡熟習該項技藝人士，在未脱離本發明之 精神下，當可作些許改變或修飾，例如：只改變感測器之 形狀、個數或位置，然而其精神仍在於偵測承栽部1 04 上之晶圓102之移位量及移位方向。本發明之專利保護範 園均應包含在下述之申請專利範園内。 經濟部中央揉準局貝工消费合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 正 A7 B7 五、發明說明（） 圖號對照說明 102 晶 圓 104 承 載 部 110 第 一 感 測 器 112 第 二 感 測 器 114 第 三 感 測 器 200 感 測 板 202 第 . 比 較 電 路 204 第 二 比 較 電 206 第 三 比 較 電 路 208 第 一 及 閘 210 第 一 反 相 器 212 第 二 反 相 器 214 第 二 反 相 器 216 第 二 及 閘 218 第 一 或 閘 220 結 合 器 300 判 斷 模 組 400 決 定 模 組 500 結 合 模 組 經濟部智慧財產局員工消費合作社印製 (請先閲讀背面之生意事項再填寫本頁)(Please read the business matters on the back before filling in this page) Yellow /; If the output voltage C2 of the output terminal of the second sensor 11 2 is outside the voltage range set by the second comparator circuit 204, the second comparator The output section of the circuit 204 outputs a "false" signal. When the area of the wafer 102 covering the third sensor 114 is larger, the output voltage C3 at the output of the third sensor 114 is larger. If the output voltage C3 at the output of the third sensor 114 is within the voltage range set by the third comparator circuit 206, the output of the third comparator circuit 206 outputs a "true" signal; if the third sensor 114 The output voltage at the output terminal (: 3 is outside the voltage range set by the third comparator circuit 206, then the output terminal of the third comparator circuit 206 outputs a "false" signal. The decision module includes a First AND gate 208 ′ with three input terminals and one output terminal — a first inverter 210 having an input terminal and an output terminal, and a second inverter having an input terminal and an output terminal An inverter 212, a third inverter 214 having an input terminal and an output terminal, a second AND gate 216 having three input terminals and an output terminal, and a third inverter having two input terminals and an output terminal OR gate 218. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed three of the three inputs of the first and gate 208 to the output of the first comparator circuit 202 and the output of the second comparator circuit 204, respectively. End and The outputs of the three comparator circuits 206 are connected to process the output signals of the output of the first comparator circuit 202, the output of the second comparator circuit 204, and the output of the third comparator circuit 206. The round-in end of the first inverter 210 and the output of the first comparator circuit 202 12 This paper size applies to the Chinese National Standard (CNS) A4 specification (210x 297 mm) 447071 A7 B7 ---------- -------------- V. Description of the invention () The terminal is fast-connected to invert the output signal of the output terminal of the first comparator circuit 202. The second NOT gate 212 The input terminal of is connected to the round-out terminal of the second comparator circuit 204 to invert the round-out signal of the output terminal of the second comparator circuit 204. The input terminal of the third inverter 214 is connected to the third The output terminal of the comparator circuit 206 is connected to invert the output signal of the third comparator circuit 206. The three input terminals of the second and gate 216 are respectively connected to the output of the first inverter 210. Terminal, the output terminal of the second inverter 212 and the output terminal of the third inverter 214 are connected to invert the first inverter The output signals of the output terminal 210, the output terminal of the second inverter 212, and the output terminal of the third inverter 214 are processed. The two input terminals of the first OR gate 218 and the outputs of the first and 閛 208 are respectively processed. The terminal is connected to the output terminal of the second and gate 216 to process the output signals of the output terminal of the first and gate 208 and the output of the second and gate 216. (Please read the note on the back before filling this page.) If at least one of the output signals of the output terminal of the first and gate 208 and the output terminal of the second and gate 216 is "眞", the first or gate 218's The output terminal outputs a “眞” signal; if the output signals of the first and 閛 20 8 output terminals and the output of the second and gate 216 are “false” signals, the output terminal of the first OR gate 218 outputs A "false" signal. The interlock module includes a combination < 220, where the input of the combiner 220 is connected to the output of the first OR gate 218 to apply the Chinese National Standard (CNS) M specification (210 × 297) to the 13th paper wave standard. (Mm) 447〇7i A7 ____B7 V. Description of the invention () The output signal of the output terminal of the OR gate 218 is processed. When the output terminal of the first OR gate 21S outputs a signal of “眞”, regardless of the current lin that enters the knot device 220, the combiner 220 outputs a lightning coating τ ^ section code i〇ut is equal to Iin, (please first Read the note at the back of the page and fill in this page) so that the smart wafer will continue to transmit the wafer 102 to the automatic arm device; the output of the right first or gate 218 outputs _,》, false, and signals regardless of the input coupler What is the current Iin of 220? The output current of the coupler "ut is 0", so that the intelligent wafer detection automatic arm device stops passing the wafer 102. With the wafer detection automatic arm device proposed by the present invention, it is possible to detect Measure the amount and direction of wafer displacement on the automatic arm device to avoid wafer falling and cracking. As the number of wafer falling and cracking events is reduced, the problem of damage to the automatic arm or the chamber is reduced, The effective production time has been increased. "The present invention is only described in the preferred embodiment above, and is not intended to limit the application park of the present invention. Those skilled in the art can make some changes without departing from the spirit of the present invention. Change or modify For example: only the shape, number or position of the sensor is changed, but the spirit is still to detect the displacement amount and direction of the wafer 102 on the mounting part 104. The patent protection parks of the present invention should all It is included in the following patent application parks. The paper printed by the Central Government Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, is printed in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) A7 B7 V. Description of the invention () Drawing number comparison Description 102 Wafer 104 Carrying section 110 First sensor 112 Second sensor 114 Third sensor 200 Sensing board 202 First. Comparison circuit 204 Second comparison circuit 206 Third comparison circuit 208 First sum gate 210 The first inverter 212, the second inverter 214, the second inverter 216, the second and gate 218, the first OR gate 220, the combiner 300, the judgment module 400, the decision module 500, and the module. Printed (please read the business matters on the back before filling this page)
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)