4452 1 3 _jjfe 89100006 年 月 日 五、發明說明Cl) 修正4452 1 3 _jjfe 89100006 5 、 Invention description Cl) Amendment
本發明係指一種噴墨頭之晶片製造方法’特别係指— 種將晶片喷砂打洞以形成墨水通道之方式。 在現今之技術領域裡，喷墨印表機的喷墨碩大致上。 分為熱汽泡式喷墨頭以及壓電式（piezoelectric)噴黑可 頭°熱汽泡式噴墨頭係利用加熱裝置產生高溫，將位t於加 熱裝置上之墨水瞬間加熱產生汽泡，藉由汽泡之壓力將墨 水喷出。而壓電式喷墨頭係利用壓電材料作為驅動方式， 即利用電極電壓的改變透過薄膜施壓於墨水，使該點之墨 水經由噴孔喷出。 土 而習知熱汽泡式之喷墨頭，其係於一晶片上形成多數 個加熱元件，於每一加熱元件上形成有容置墨水之墨水 腔，及喷孔板覆蓋於晶片上，而於喷孔板上鄰近每一加熱 兀件處形成有喷孔；使得墨水腔内之墨水被加熱元件加熱''、 產生氣泡後，由喷墨頭之喷孔噴出於列印 喷墨之作業。 啊工向凡成 該喷墨頭係、固定於墨纟g之墨水輸 之…央適當位置形成有一貫通晶片之 水匣内之墨水經由該供墨通道流入噴墨頭：； 吏墨 知於晶月上形成供墨通道之方式，係 f:丄: 該孔洞喷射於晶片上再砂透過 如是’該喷墨頭之供墨通道形 ^、墨通道。 層上之孔洞準確地對準晶片欲形成 ^必須將該保護 程上相當不便，且精確度較低。 土逋道之位置，在製 有鑑於此，發^乃本於赭器爭精. 4452l3 --一案號89100006 年（I月 p 五、發明說明（2^ '- Ϊ 4戮力於喷墨頭之研發，乃發明出本發明噴墨頭之晶月 取造方法，使喷墨頭之供墨通道製作上更為便利及精確。 本發明之主要目的，在於提供—種喷墨頭之晶片製造 " 其具有製程簡便之功效，以達到降低生產成本。 本發明之另一目的，在於提供一種喷墨頭之晶月製造 万法，其可使設有孔洞之保護層精密地貼合於晶片之功 效’使晶片可準確地形成供墨通道。 為達上述之目的，本發明喷墨頭之晶片製造方法，包 括下歹!步驟；提供一晶片，於該晶片上形成一感光保護 層’提供一光罩圖案於該保護層上方，以光蝕刻方式於該 保護層上形成供墨通道預定區；將該晶片進行喷砂打洞’ 使°玄Β曰片形成貫穿晶片之墨水通道；再將感光保護層去 除。 如是’其製程上較為簡便，且可準確地於晶片上形成 墨水通道。 圖式說明： 圖1為本發明噴墨頭之晶片製造方法之第一流程圖。 圖2為本發明喷墨頭之晶片製造方法之第二流程圖。 圖3為本發明喷墨頭之晶片製造方法之第三流程圖。 圖4為本發明噴墨頭之晶片製造方法之第四流程圖。 圖5為本發明晶片之立體圖。 圖6為本發明晶片設置於墨水g之示意圖。 μ參閱圖1 ’為本發明用於噴墨頭之晶片製造方法之The present invention refers to a method for manufacturing a wafer of an inkjet head, and particularly to a method of sandblasting a wafer to form an ink channel. In today's technology, inkjet printers are roughly inkjet printers. It is divided into thermal bubble type inkjet head and piezoelectric (piezoelectric) black jet head. The thermal bubble type inkjet head uses a heating device to generate high temperature, and the ink on the heating device is instantaneously heated to generate a bubble. The ink is ejected by the pressure of the bubble. The piezoelectric inkjet head uses a piezoelectric material as a driving method, that is, changes in electrode voltage are used to apply pressure to the ink through a film, so that the ink at this point is ejected through a nozzle hole. The conventional thermal bubble type inkjet head is formed by forming a plurality of heating elements on a wafer, forming an ink chamber for containing ink on each heating element, and an orifice plate covering the wafer, and Spray holes are formed on the nozzle plate adjacent to each heating element; so that the ink in the ink chamber is heated by the heating element '', and after generating air bubbles, the nozzles of the inkjet head are used for printing and inkjetting. Ah Gong, where the inkjet head is fixed, and the ink fixed to the ink g is delivered to the central position. An ink in a water tank penetrating the wafer is formed at an appropriate position and flows into the inkjet head through the ink supply channel: The method of forming the ink supply channel on the moon is f: 丄: the hole is sprayed on the wafer and then sanded through, such as the shape of the ink supply channel of the inkjet head, the ink channel. The holes in the layer are precisely aligned with the wafer to be formed. The protection process must be quite inconvenient and the accuracy is low. The location of the earthen road, in view of this, is based on the fact that ^^ was published in the wares. 4452l3-Case No. 89100006 (January p. 5. Description of the invention (2 ^ '-Ϊ 4 is dedicated to inkjet) The research and development of the head is to invent the method for making the crystal moon of the inkjet head of the present invention, which makes the ink supply channel of the inkjet head more convenient and accurate. The main purpose of the present invention is to provide a wafer for an inkjet head. Manufacturing " It has the effect of simple manufacturing process to reduce the production cost. Another object of the present invention is to provide a method for manufacturing a crystal moon of an inkjet head, which can precisely attach a protective layer provided with holes to the protective layer. The effect of the wafer 'allows the wafer to accurately form the ink supply channel. In order to achieve the above purpose, the wafer manufacturing method of the inkjet head of the present invention includes the following steps: providing a wafer to form a photosensitive protective layer on the wafer' A photomask pattern is provided above the protective layer, and a predetermined area of the ink supply channel is formed on the protective layer by photo-etching; the wafer is sandblasted and punched to form a ° Xuan B film to form an ink channel penetrating the wafer; and Remove the photosensitive protective layer. If it is' the process is relatively simple, and the ink channel can be accurately formed on the wafer. Schematic description: Figure 1 is a first flowchart of a method for manufacturing a wafer of an inkjet head according to the present invention. Figure 2 is a flowchart of the inkjet head according to the present invention. The second flowchart of the wafer manufacturing method. Figure 3 is the third flowchart of the wafer manufacturing method of the inkjet head of the present invention. Figure 4 is the fourth flowchart of the wafer manufacturing method of the inkjet head of the present invention. Figure 5 is the present invention. A perspective view of a wafer. FIG. 6 is a schematic view of a wafer set in the ink g of the present invention. Μ Refer to FIG. 1 'This is a wafer manufacturing method for an inkjet head of the present invention.
第5頁 案號 89100006Page 5 Case number 89100006
445213 五、發明說明（3) 第一流程圖，首先提供一晶圓！ 〇，其 上形成-電阻層’並以光蝕刻方式、閬乂 ： ’於晶圓1 0 片12，使每-晶片12上形成有多形成多數晶 例中喷墨元件14為加熱n ;再於 ^件14 ’本實施 形成-導電層，於每-晶片5上=土’該電阻層上方 嘴墨元件“之電連接線路(圖上上未方式形成連接 連接線路傳遞至喷墨元件】4，以控丁一冑控制讯號由電 元件。 以控制母—個晶片1 2之喷墨 請參閱圖2，為本發明噴墨頭之晶片製造方法之第二 流程圖，於晶園]〇上方形成一感井彳 ^ ^ ^ 蛾7^保蠖層18 ’本實施例 中’感光保s蔓層18為一厚膜光阻，而丨、丨.在麻士丄 序胰尤丨且而以滾壓方式貼設於晶 圓I 0上方。 請參閱圖3，為本發明喷墨頭之晶片製造方法之第三 流程圖，提供一光罩圓案20於感光保護層18上方，以光蚀 刻方式於該感光保護層〗8上形成每一晶片丨2之供墨通道預 定區22，如圊4所示；將晶圓10進行喷砂打洞，使每一晶 片+12形成貫穿之供墨通道26，再將感光保護層丨8去除，接 著於晶圓10上以滾壓方式形成一厚膜光阻16，於厚膜光阻 上相對於每一晶片1 2之喷墨元件1 4上方，以光蝕刻形成墨 水腔1 5 ’最後將整個晶圓1 〇進行切割成多數個晶片1 2，而 完成整個噴墨頭之晶片丨2製作，如圖5所示。 請參閱圖6，噴墨頭在組裝時，係將晶片丨2設於墨水 £28之墨水輪出埠3〇上，並將喷孔板32固定於晶片12上， 如是’墨水匣28内之墨水經由晶片12之供墨通道26流入墨 水腔内’經喷墨元件1 4作動，由嘖孔板3 2之噴孔喷出。445213 V. Description of the invention (3) First flow chart, first provide a wafer! 〇, a -resistive layer 'is formed thereon, and the photo-etching method is used, 阆 乂:' on the wafer 10 pieces 12, so that each -wafer 12 is formed in a large number of examples, the inkjet element 14 is heated n; On the 14th part, the “conductive layer is formed in this embodiment, on each wafer 5 = soil.” The electrical connection line of the nozzle element above the resistive layer (the connection connection line is not formed on the figure to pass to the inkjet element) 4 The control signal is controlled by the electronic components. To control the inkjet of the mother-chip 1 2 Please refer to FIG. 2, which is the second flowchart of the method for manufacturing the wafer of the inkjet head of the present invention, in Jingyuan]. A sense well ^ ^ ^ 7 moth protection layer 18 is formed on the top. 'In this embodiment, the photo-protection layer 18 is a thick film photoresist, and 丨, 丨. It is mounted on the wafer I 0 in a rolling manner. Please refer to FIG. 3, which is a third flowchart of the method for manufacturing a wafer of an inkjet head according to the present invention. A predetermined ink supply channel area 22 for each wafer 2 is formed on the photosensitive protective layer 8 by etching, as shown in FIG. 4; the wafer 10 is subjected to Sand holes to make each wafer +12 form a penetrating ink supply channel 26, and then remove the photosensitive protective layer 丨 8, and then form a thick film photoresist 16 on the wafer 10 by rolling. Above the inkjet element 14 corresponding to each wafer 12, an ink cavity 15 ′ is formed by photoetching, and finally the entire wafer 10 is cut into a plurality of wafers 12 to complete the wafer of the entire inkjet head. 2 production, as shown in Figure 5. Please refer to Figure 6, when the inkjet head is assembled, the wafer 2 is set on the ink wheel outlet port 30 of the ink £ 28, and the nozzle plate 32 is fixed to the wafer 12 For example, if the ink in the ink cartridge 28 flows into the ink chamber through the ink supply channel 26 of the wafer 12, it is actuated by the inkjet element 14 and ejected from the nozzle holes of the counterbore plate 32.
4452 1 3 _ 案號89100006 牙j年Η月 >丨日 修正_ 五、發明說明（4) 另外，該喷孔板32在實施上可為一厚膜光阻，在完成 墨水腔1 5之製作後，將用以製作喷孔板32之厚膜光阻貼設 於晶圓10上’而以光触刻方式，於喷孔板32上相對於每一 喷墨元件1 4位置形成喷孔。 如 是， 本發 明 喷 墨 頭 之 晶 片 製 造 方 法， 以 感 光保 護層 18 貼 設 於設 有 噴 墨 元 件14 的 晶 圓 10 上 再提供 一 光 罩 圖 案 20 而 以光 刻 方 式 於 每 一 晶 片 12 上 形 成供 墨 通 道 預 定 區 22 j 以 噴砂 打 洞 方 式 形 成 噴 供 墨 通 道26 ，在 製 造 上 相 當 地 便 利 > 且可 準 確 地 於 每 j. 晶 片 12 上 形 成 供墨 通 道26 使 晶 片 12 之 製作 更 為 精 確 ϊ 可 解 決 習 知 晶 片 之供 墨 通 道 製 作 上 之 缺 失 ，以 達 到 更 為 實 用 之 S 的 D 圖 號 說 明： 晶 圓 10 晶 片 12 喷 墨 元 件14 感 光 保 護 層18 墨 水 腔 15 厚 膜 光 阻 16 光 罩 圖 案20 供 墨 通 道預 定 區22 供 墨 通 道 26 墨 水 匣 28 墨 水 輸 出 埠30 噴 孔 板 324452 1 3 _ Case No. 89100006 Year and month of the year > 丨 Day Amendment _ V. Description of the invention (4) In addition, the orifice plate 32 may be implemented as a thick film photoresistor. After the fabrication, the thick film photoresist used to make the orifice plate 32 is mounted on the wafer 10, and an orifice is formed on the orifice plate 32 with respect to each inkjet element 14 by photo-engraving. . If so, in the method for manufacturing a wafer of an inkjet head of the present invention, a photosensitive protective layer 18 is attached to a wafer 10 provided with an inkjet element 14 and then a photomask pattern 20 is provided to form each wafer 12 by photolithography. The ink supply channel predetermined area 22 j is formed by sandblasting and punching to form the ink supply channel 26, which is quite convenient in manufacturing > and can accurately form the ink supply channel 26 on each j. Wafer 12 to make the manufacture of wafer 12 more Precise ϊ Can solve the lack of ink supply channels of conventional wafers to achieve a more practical D. Figure number description: wafer 10 wafer 12 inkjet element 14 photosensitive protective layer 18 ink cavity 15 thick film photoresist 16 Mask pattern 20 Ink supply channel predetermined area 22 Ink supply channel 26 Ink cartridge 28 Ink output port 30 Nozzle plate 32
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