TW444933U - Wafer surface pad structure - Google Patents

Wafer surface pad structure

Info

Publication number
TW444933U
TW444933U TW89201660U TW89201660U TW444933U TW 444933 U TW444933 U TW 444933U TW 89201660 U TW89201660 U TW 89201660U TW 89201660 U TW89201660 U TW 89201660U TW 444933 U TW444933 U TW 444933U
Authority
TW
Taiwan
Prior art keywords
wafer surface
pad structure
surface pad
wafer
pad
Prior art date
Application number
TW89201660U
Other languages
Chinese (zh)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89201660U priority Critical patent/TW444933U/en
Publication of TW444933U publication Critical patent/TW444933U/en

Links

TW89201660U 2000-01-28 2000-01-28 Wafer surface pad structure TW444933U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89201660U TW444933U (en) 2000-01-28 2000-01-28 Wafer surface pad structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89201660U TW444933U (en) 2000-01-28 2000-01-28 Wafer surface pad structure

Publications (1)

Publication Number Publication Date
TW444933U true TW444933U (en) 2001-07-01

Family

ID=21663677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89201660U TW444933U (en) 2000-01-28 2000-01-28 Wafer surface pad structure

Country Status (1)

Country Link
TW (1) TW444933U (en)

Similar Documents

Publication Publication Date Title
EP1198845A4 (en) Indirect back surface contact to semiconductor devices
HK1064639A1 (en) Resilient floor surface
AU2034802A (en) Semiconductor wafer processing to increase the usable planar surface area
EP1231640A4 (en) Semiconductor device
EP1346798A4 (en) Polishing device
GB0022329D0 (en) Semiconductor device
GB0003302D0 (en) Semiconductor devices
GB0101867D0 (en) Semiconductor device
GB2361447B (en) Wafer polishing apparatus
EP1087042A4 (en) Silicon wafer
GB2376199B (en) Surface finishing pad
GB2366755B (en) Wafer polishing apparatus
GB2361448B (en) Wafer polishing apparatus
SG94730A1 (en) Contact structure having contact bumps
EP1209752A4 (en) Semiconductor device
TW446183U (en) Wafer surface structure
TW444933U (en) Wafer surface pad structure
EP1332835A4 (en) Polishing device
GB2335874B (en) Wafer polishing
GB0108357D0 (en) High density plasma-fluorinated silicon
AU2001295749A1 (en) Segmented wafer polishing pad
TW440054U (en) Wafer surface re-arrangement structure
AU3902501A (en) Surface finishing pad
GB0017493D0 (en) Flat wafer
TW418641U (en) Improved pad structure for babies

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004