經濟部智慧財產局員工消費合作社印製 434662 A7 l'.ti〇L-/0i)6 __Β7_ 五、發明說明（1 ) 本發明是有關於一種烘烤設備，且特別是有關於一種 .具有旋轉式烤盤之烘烤模組，用於半導體製程，晶片的烘 烤製程。 烘烤對半導體製程而言是相當重要的，而烘烤的均勻 與否更左右了產品的品質'如果晶片在烘烤過程中，受熱 $均或是晶片表面上之環境差異性過大（如濕度、氣流方. 向、溫度），將會造成晶片表面特性改變而影響到後續之 製程。以沈積光阻層爲例，可能會造成形成之光阻層厚度 不均，而造成後續微影蝕刻之精確度變差。隨著製程技術 愈來愈先進，其影響愈來愈大。 舊式烤盤只將晶片置於烤盤上，並不考慮週遭環境的 差異性。請參照第1圖，其繪示習知一種烘烤模組之示意 圖。如圖所示，其中包括一烘烤室100及置於其中之烤/盤 102。進行烘烤時，晶片104被放置於烤盤102上，藉由其 下方之熱墊板103進行加熱。烘烤過程中會將晶片104上 的水氣或化學溶劑蒸發，因此就必須有一排氣孔106將烘 烤室100內的蒸發的物質108排出。然而此排氣孔的位置 與設計，會使得烘烤室100內環境條件（如層流、溫度、濕 度）改變，造成晶片104表面不同位置之烘烤效率不同，而 產生無法預期的烘烤成效，對產品之品質造成不良之影 m 〇 因此，本發明的目的就是改善烘烤室內各位置環境條 件不同之情形。 本發明的又一目的就是改善晶片表面烘烤不均之情 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ^1* If· H 1 1 «^1 ^^1 n 1 n In I ^ n I n In IV In n i n n n I ^^1 I . / 言 . 矣 (請先閱讀背面之注意事項再填寫本頁) ^34652 A7 ί 7 41 \ν I . d o c /1) ΐ) 6 _B7____ 五、發明說明（>) 形。 . 本發明的再一目的就是在不需改變現有製程條件下， (請先閱讀背面之注意事項再填寫本頁) 可改進烘烤成效。 根據本發明之上述和其他目的，提出一種旋轉式烤盤 模組，其係將承放晶片之烤盤，改爲具有旋轉功能之烤盤。 烘烤時，將晶片放置於此具有旋轉功能之烤盤上烘烤，可 依設定方式旋轉。如此可將外在環境條件均句化。讓正在 處理的晶片達到穩定一致的烘烤成效。 根據本發明上述及他目的提供一種烘烤模組，適用於 晶片之烘烤製程，其包括：一烘烤室，其至少具有一排氣 孔。一旋轉式烤盤模組，置於烘烤室中，用以承放晶片。 以及一加熱裝置，可用以加熱晶片。 依照本發明一較佳實施例，旋轉式烤盤模組的轉速約 3至6rpm。亦即每分鐘旋轉約3-6圈。 本發明尙有其他目的及特徵，將在下文中或是實施本 發明時顯示出來。爲讓本發明之上述和其他目的、特徵、 和優點能更明顯易懂，下文特舉一較佳實施例，並配合所 附圖式，作詳細說明如下： 經濟部智慧財產局員工消費合作社印製 圖式之簡單說明： •第1圖繪示習知一種烘烤模組之示意圖；以及 .第2圖繪示依照本發明一較佳實施例的一種烘烤模組 之示意圖。 圖式之標記說明： 100、200 :烘烤室 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） 4346 6 2 r.doc/Ο(Κι Α7 Β7 五、發明說明（3 ) 102、202 :烤盤 - 103、203:熱墊板 .. 1 04、204 .晶片 106、206 :排氣孔 108 :蒸發物質 201 :旋轉式烤盤模組 208 :旋轉動力裝置 實施例 請參照第2圖，其繪示依照本發明一較佳實施例的一 種旋轉式烤盤模組示意圖。如圖所示，其中包括一烘烤室 20◦及置於其中之旋轉式烤盤模組201。其中旋轉式烤盤 模組201係由傳統的烤盤202和旋轉動力裝置208所構成 的，其中旋轉動力裝置208可爲馬達，或是其他可達成帶 動烤盤202旋轉之設施。 當旋轉動力裝置208旋轉時，亦可帶動烤盤202旋轉。 除了旋轉式烤盤模組201外，在烘烤室200內尙有一加熱 裝置20,3，用以加熱晶片204。目前最常用的加熱裝置203 例如是熱墊板。若使用熱墊板作爲加熱裝置203時，其會 被裝置於烤盤202下方而隨著烤盤202旋轉，或者直接以 熱墊板作爲烤盤。 以上述烘烤模組進行烘烤時，晶片204被放置於烤盤 202上利用加熱裝置加熱。烘烤過程中將晶片104上的水 氣或化學溶劑蒸發，由一排氣孔206排出。然而此排氣孔 206的位置與設計，會使得烘烤室1〇〇內環境條件（如層流、 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -- 一 -PJ n 111 n n n n n I I I I n I I I 1 I ·1 I n I n - ν\ I. cl n c / 0 0 6 A7 B7 五、發明說明（V) 溫度、濕度）改變。此時，在烤盤204和加熱裝置203下方 •之旋轉動力裝置208以一設定的轉速旋轉，帶動上方的熱 墊板203及烤盤202 —起轉動。如此在晶片204處理過程 中，雖然各種外在條件上的差異仍然存在，然而由於晶片 204保持在旋轉的狀態，因此可以把各種外在條件上的差 異減低到最低，以符合更先進製程上的需求。 其中，烤盤202的轉速不可太快，如果太快會導致晶 片104表面因受力而產生不預期之形變。亦不可以太慢， 如果太慢將無法達到使表面條件均勻化之成果。較佳的轉 速係設立在約3-6rpm。亦即旋轉一圈約耗時10-20秒。 由上述本發明較佳實施例可知，應用本發明具有下列 優點。 首先，利用旋轉式烤盤模組，在進行烘烤時，將晶片 旋轉，使得外在條件差異性均勻化了，故可以改善烘烤室 內各位置環境條件不同之情形。 而且，由於外在條件差異性均勻化了，故可改善晶片 表面烘烤不均之情形。 此外，利用本發明的旋轉式烤盤模組，僅需更動烤盤 之設計，不需大幅修正現有設備，亦不用改變製程條件， 即可達到改進烘烤成效之成果，相當簡便，不須耗費太多 成本。Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 434662 A7 l'.ti〇L- / 0i) 6 __Β7_ V. Description of the invention (1) The present invention is related to a baking equipment, and in particular to a type. Type baking tray baking module for semiconductor manufacturing and wafer baking. Baking is very important for the semiconductor process, and the uniformity of the baking affects the quality of the product. 'If the wafer is heated during the baking process, or the environmental difference on the surface of the wafer is too large (such as humidity , Airflow direction, temperature, etc.), will cause the surface characteristics of the wafer to change and affect subsequent processes. Taking the deposition of the photoresist layer as an example, the thickness of the formed photoresist layer may be uneven, and the accuracy of subsequent lithographic etching may be deteriorated. As process technology becomes more advanced, its impact is increasing. Old-style baking trays only place the wafers on the baking tray, without taking into account the differences in the surrounding environment. Please refer to FIG. 1, which shows a schematic diagram of a conventional baking module. As shown in the figure, it includes a baking chamber 100 and a baking / pan 102 placed therein. During the baking, the wafer 104 is placed on a baking sheet 102 and heated by a hot pad 103 below it. During the baking process, water vapor or chemical solvents on the wafer 104 will be evaporated. Therefore, an exhaust hole 106 must be provided to discharge the evaporated substance 108 in the baking chamber 100. However, the location and design of this exhaust hole will cause the environmental conditions (such as laminar flow, temperature, and humidity) in the baking chamber 100 to change, resulting in different baking efficiency at different positions on the surface of the wafer 104, resulting in unexpected baking results. , Which causes a bad influence on the quality of the product m 〇 Therefore, the purpose of the present invention is to improve the situation where the environmental conditions at different locations in the baking room are different. Another object of the present invention is to improve the uneven baking on the wafer surface. 3 The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) ^ 1 * If · H 1 1 «^ 1 ^^ 1 n 1 n In I ^ n I In In In ninnn I ^^ 1 I. / Word. 矣 (Please read the notes on the back before filling this page) ^ 34652 A7 ί 7 41 \ ν I. doc / 1) ΐ) 6 _B7____ Fifth, the invention description (>) shape. Another object of the present invention is to improve the baking effect without changing the existing process conditions (please read the notes on the back before filling this page). According to the above and other objects of the present invention, a rotary baking tray module is proposed, which is a baking tray for holding wafers, and a baking tray with a rotating function. When baking, the wafer is placed on the baking pan with a rotating function to bake, and it can be rotated according to the setting method. In this way, the external environmental conditions can be homogenized. Allow the wafers being processed to achieve consistent and consistent baking results. According to the above and other objects of the present invention, a baking module is provided, which is suitable for a wafer baking process, and includes: a baking chamber having at least one exhaust hole. A rotary bakeware module is placed in the baking chamber for receiving wafers. And a heating device for heating the wafer. According to a preferred embodiment of the present invention, the rotation speed of the rotary baking pan module is about 3 to 6 rpm. That is, about 3-6 revolutions per minute. The present invention has other objects and features, which will be shown hereinafter or when the present invention is implemented. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below and described in detail with the accompanying drawings as follows: Brief description of the drawing: • Figure 1 shows a schematic diagram of a conventional baking module; and Figure 2 shows a schematic diagram of a baking module according to a preferred embodiment of the present invention. Explanation of the marks on the drawings: 100, 200: baking room 4 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 x 297 mm) 4346 6 2 r.doc / Ο (Κι Α7 Β7 V. Description of the invention ( 3) 102, 202: Baking pan-103, 203: Hot pad: 1 04, 204; Wafer 106, 206: Exhaust hole 108: Evaporated substance 201: Rotary baking pan module 208: Rotary power unit embodiment Please refer to FIG. 2, which shows a schematic diagram of a rotary baking pan module according to a preferred embodiment of the present invention. As shown in the figure, it includes a baking chamber 20 and a rotating baking pan mold placed therein. Group 201. The rotating baking pan module 201 is composed of a traditional baking pan 202 and a rotating power unit 208. The rotating power unit 208 can be a motor or other facilities that can rotate the baking pan 202. When When the rotary power unit 208 rotates, the baking pan 202 can also be rotated. In addition to the rotary baking pan module 201, a heating device 20,3 is placed in the baking chamber 200 to heat the wafer 204. The most commonly used heating at present The device 203 is, for example, a thermal pad. If a thermal pad is used as the heating device 203 , It will be installed under the baking pan 202 and rotate with the baking pan 202, or directly use a hot pad as the baking pan. When baking with the above baking module, the wafer 204 is placed on the baking pan 202 and heated The device is heated. During the baking process, water vapor or chemical solvents on the wafer 104 are evaporated and discharged through a vent hole 206. However, the location and design of the vent hole 206 will make the environmental conditions in the baking chamber 100 ( Such as laminar flow, 5 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-1 -PJ n 111 nnnnn IIII n III 1 I · 1 I n I n-ν \ I. cl nc / 0 0 6 A7 B7 5. Description of the invention (V) Temperature, humidity) change. At this time, in the baking tray 204 and Below the heating device 203, the rotating power device 208 rotates at a set speed, which drives the upper thermal pad 203 and the baking pan 202 to rotate together. Thus, during the processing of the wafer 204, although the differences in various external conditions still exist However, since wafer 204 remains in rotation Therefore, the difference in various external conditions can be minimized to meet the needs of more advanced processes. Among them, the rotation speed of the baking pan 202 cannot be too fast. If it is too fast, it will cause the surface of the wafer 104 to be stressed. Unexpected deformation. It should not be too slow. If it is too slow, the results of homogenizing the surface conditions will not be achieved. The preferred speed is set at about 3-6 rpm. That is, it takes about 10-20 seconds to make a full rotation. As can be seen from the above-mentioned preferred embodiments of the present invention, the application of the present invention has the following advantages. First, the rotary baking pan module is used to rotate the wafer during baking to make the external conditions uniform. Therefore, it is possible to improve the situation of different environmental conditions at various locations in the baking room. In addition, since the difference in external conditions is uniformized, the situation of uneven baking on the wafer surface can be improved. In addition, by using the rotary baking tray module of the present invention, only the design of the baking tray needs to be changed, the existing equipment does not need to be significantly modified, and the process conditions are not changed. The results of improving the baking effect can be achieved. Too much cost.
雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍內，當可作各種之更動與潤飾。例如應用於SOG 本紙張尺度適用中國國家標準<CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂·！ ---線 1 經濟部智慧財產局員工消費合作社印製 434§ β 2 cm丨、'.丨..心削(， A7 _____B7_______ 五、發明說明（f) 層、聚醯亞胺（polyhnide)、光阻層之烘烤等。因此本發明 、之保護範圍當視後附之申請專利範圍所界定者爲準。 (請先閲讀背面之注意事項再填寫本頁) -J-i ^ —丨丨丨訂------線丨· 經濟部智慧財產局員工消費合作社印製 準 標 家 國 國 中 用 適 度尺 張一 i 楚 公 97 2 X ο 21 — — — —— Ψ— I I i 1 I I 1 .Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. For example, it is applied to SOG. The paper size applies the Chinese National Standard < CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page). Order! --- Line 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 434§ β 2 cm 丨, '. 丨 .. Heart cut (, A7 _____B7_______ V. Description of the invention (f) Layer, polyhnide, Baking of photoresist layer, etc. Therefore, the scope of the present invention and protection shall be determined by the scope of the attached patent application. (Please read the precautions on the back before filling this page) -Ji ^ — 丨 丨 丨 Order ------ Line 丨 · The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a quasi-standard home country with a moderate ruler Zhang Yii Chu Gong 97 2 X ο 21 — — — — Ψ — II i 1 II 1.