TW430120U - Cutting device of wafer cutter - Google Patents
Cutting device of wafer cutterInfo
- Publication number
- TW430120U TW430120U TW88204617U TW88204617U TW430120U TW 430120 U TW430120 U TW 430120U TW 88204617 U TW88204617 U TW 88204617U TW 88204617 U TW88204617 U TW 88204617U TW 430120 U TW430120 U TW 430120U
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting device
- wafer cutter
- cutter
- wafer
- cutting
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88204617U TW430120U (en) | 1999-03-26 | 1999-03-26 | Cutting device of wafer cutter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88204617U TW430120U (en) | 1999-03-26 | 1999-03-26 | Cutting device of wafer cutter |
Publications (1)
Publication Number | Publication Date |
---|---|
TW430120U true TW430120U (en) | 2001-04-11 |
Family
ID=21646227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88204617U TW430120U (en) | 1999-03-26 | 1999-03-26 | Cutting device of wafer cutter |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW430120U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108327105A (en) * | 2017-01-19 | 2018-07-27 | 万润科技股份有限公司 | Chip cutting device |
-
1999
- 1999-03-26 TW TW88204617U patent/TW430120U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108327105A (en) * | 2017-01-19 | 2018-07-27 | 万润科技股份有限公司 | Chip cutting device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |