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Application filed by Asia Ic Mic Process IncfiledCriticalAsia Ic Mic Process Inc
Priority to TW88119903ApriorityCriticalpatent/TW429200B/en
Application grantedgrantedCritical
Publication of TW429200BpublicationCriticalpatent/TW429200B/en
This invention provides a method to form vacuum holes on an insert film in a CMP machine, wherein the formed vacuum holes match the dimension and location of the vacuum holes of a wafer carrier in the CMP machine. It uses a plate and a die to fix and position the film, and then cuts vacuum holes on it the insert film of the CMP machine using a laser machining tool with the optimal parameters of laser.
TW88119903A1999-11-161999-11-16Method for forming vacuum holes on insert film in a CMP machine
TW429200B
(en)