TW428298B - Manufacturing method and structure for 3D system on chip - Google Patents

Manufacturing method and structure for 3D system on chip

Info

Publication number
TW428298B
TW428298B TW88116072A TW88116072A TW428298B TW 428298 B TW428298 B TW 428298B TW 88116072 A TW88116072 A TW 88116072A TW 88116072 A TW88116072 A TW 88116072A TW 428298 B TW428298 B TW 428298B
Authority
TW
Taiwan
Prior art keywords
chips
chip
stacked vertically
manufacturing
electrically connected
Prior art date
Application number
TW88116072A
Other languages
English (en)
Inventor
Jian-Gau Shr
Shin-Bang Liu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW88116072A priority Critical patent/TW428298B/zh
Application granted granted Critical
Publication of TW428298B publication Critical patent/TW428298B/zh

Links

Landscapes

  • Semiconductor Memories (AREA)
TW88116072A 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip TW428298B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Publications (1)

Publication Number Publication Date
TW428298B true TW428298B (en) 2001-04-01

Family

ID=21642337

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88116072A TW428298B (en) 1999-09-17 1999-09-17 Manufacturing method and structure for 3D system on chip

Country Status (1)

Country Link
TW (1) TW428298B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906422B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906422B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7906849B2 (en) 1998-12-21 2011-03-15 Megica Corporation Chip structure and process for forming the same
US7915157B2 (en) 1998-12-21 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7915734B2 (en) 2001-12-13 2011-03-29 Megica Corporation Chip structure and process for forming the same
US7919867B2 (en) 2001-12-13 2011-04-05 Megica Corporation Chip structure and process for forming the same
US7932603B2 (en) 2001-12-13 2011-04-26 Megica Corporation Chip structure and process for forming the same
US8008776B2 (en) 2001-12-13 2011-08-30 Megica Corporation Chip structure and process for forming the same
US8546947B2 (en) 2001-12-13 2013-10-01 Megica Corporation Chip structure and process for forming the same

Similar Documents

Publication Publication Date Title
TW339455B (en) An electrode structure of semiconductor integrated circuit and method for forming the package therefor
US4638348A (en) Semiconductor chip carrier
MY121703A (en) Circuit board with primary and secondary through holes
TW232096B (en) Semiconductor chip carrier affording a high-density external interface
TW373280B (en) Multi-chip module with accessible test pads and test fixture
TW352449B (en) Method and apparatus for making single chip, contactless window ROM
TW362279B (en) Semiconductor device and method for fabricating the same, memory core chip and memory peripheral circuit chip
TW371358B (en) Semiconductor device
CN104303195B (zh) 转频层及其制造方法
IE830584L (en) Dense mounting of semiconductor chip packages
MY117529A (en) A power-ground plane for a c4 flip-chip substrate
SG75873A1 (en) Stacked flip-chip integrated circuit assemblage
TW345726B (en) Semiconductor chip, semiconductor device having such semiconductor chip installed therein, and method for making the semiconductor device
RU98117514A (ru) Непроводящая подложка, образующая ленту или единицу использования, на которой выполнено множество несущих элементов
WO2003041157A3 (en) Large area silicon carbide devices and manufacturing methods therefor
SG91815A1 (en) Multi-chip module package
EP0361825A3 (en) Semiconductor chip and method of manufacturing it
JPS6453440A (en) Three-dimensional semiconductor integrated circuit device
TW200620684A (en) Power LED package
IT1270449B (it) Porta-contatti per una presa o per una spina di un connettore elettrico.
TW359036B (en) Semiconductor memory
SE9801988L (sv) Integrerad mikrovåghybridkrets
TW428298B (en) Manufacturing method and structure for 3D system on chip
WO2004015773A3 (de) Halbleiterwafer mit elektrisch verbundenen kontakt- und prüfflächen
DE60116378D1 (de) Elektronischer datenträger

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent