TW427550U - Device to reduce the device charging - Google Patents

Device to reduce the device charging

Info

Publication number
TW427550U
TW427550U TW87215496U TW87215496U TW427550U TW 427550 U TW427550 U TW 427550U TW 87215496 U TW87215496 U TW 87215496U TW 87215496 U TW87215496 U TW 87215496U TW 427550 U TW427550 U TW 427550U
Authority
TW
Taiwan
Prior art keywords
reduce
charging
device charging
Prior art date
Application number
TW87215496U
Other languages
Chinese (zh)
Inventor
Shr-Fang Tzou
Yu-Ru Shiung
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW87215496U priority Critical patent/TW427550U/en
Publication of TW427550U publication Critical patent/TW427550U/en

Links

TW87215496U 1998-09-18 1998-09-18 Device to reduce the device charging TW427550U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87215496U TW427550U (en) 1998-09-18 1998-09-18 Device to reduce the device charging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87215496U TW427550U (en) 1998-09-18 1998-09-18 Device to reduce the device charging

Publications (1)

Publication Number Publication Date
TW427550U true TW427550U (en) 2001-03-21

Family

ID=21636246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87215496U TW427550U (en) 1998-09-18 1998-09-18 Device to reduce the device charging

Country Status (1)

Country Link
TW (1) TW427550U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111211032A (en) * 2018-11-21 2020-05-29 台湾积体电路制造股份有限公司 Method for manufacturing semiconductor structure and plasma processing equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111211032A (en) * 2018-11-21 2020-05-29 台湾积体电路制造股份有限公司 Method for manufacturing semiconductor structure and plasma processing equipment
US10879052B2 (en) 2018-11-21 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Plasma processing apparatus and manufacturing method using the same
TWI756584B (en) * 2018-11-21 2022-03-01 台灣積體電路製造股份有限公司 Methods for manufacturing semiconductor structures and plasma processing apparatus
CN111211032B (en) * 2018-11-21 2022-12-27 台湾积体电路制造股份有限公司 Method for manufacturing semiconductor structure and plasma processing equipment

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees