TW423168B - The manufacturing method of LED unit body - Google Patents

The manufacturing method of LED unit body Download PDF

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Publication number
TW423168B
TW423168B TW87112270A TW87112270A TW423168B TW 423168 B TW423168 B TW 423168B TW 87112270 A TW87112270 A TW 87112270A TW 87112270 A TW87112270 A TW 87112270A TW 423168 B TW423168 B TW 423168B
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mold
led
degrees
manufacturing
led unit
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TW87112270A
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Chinese (zh)
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Tzung-Wen Jan
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High Elevation Corp
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Abstract

The present invention reveals a manufacturing method of LED unit body which can shorten the production time, enhance the quality, reduce the cost, increase the revenue without huge resin-instilling space and baking oven, and reduce the secondary damage of non-uniform luminance resulted from the long duration, high temperature baking.

Description

五、創作説明( 5 10 15 C7 D7 PA870I95.AMD - 3/12 鯉濟部中央榡準局貞工消費合作社印褽 20 【技術領域】 本發明係關於一種LED單元體製造方法,特別是關於 一種全彩色(R、G、B三原色)高亮度發光二極體電子顯示 屏幕結構及其混光方法。,【先前技術】 按,一般半導體及傳統式LED之製造方法,均係以環 氧樹酯加硬化劑經攝氏90度〜110度高溫烘烤後,方可成 型’如我國公告第31 1269號專利案(下稱引證案)所述, 該引證案雖係採用塑膠封裝的製作方式,但其所用之材質 乃為可朔性之樹酯(常溫軟性需加硬化劑),並以塗佈或 噴灑的方式將該樹酯置入半導體本體表面之微接合結構中 ’待其自然硬化後,再進行後段製程加工,因其係採用嘴 灑或塗佈的封裝方式,故將導致其封裝後之表面較為粗糖 ,而無法呈現平整度及光滑狀,且在目前半導體封裝之製 作技術上’尚無法承受4 0碎以上壓力的射出衝擊,故該 引證案所述之製作方法僅適用於半導體之封裝產業上;而 本案主要材質係採用一般工業所稱之聚丙烯(塑膠,硬性 需加高熱)’該聚丙烯須經20 0度以上之高溫溶化後,再 使用40崎以上壓力直接一體射出成型,使其燈串、外形 及防水一次完成;,因其係採用一體射出成型的製作方式, 導致其表面得以較為平滑且美觀。 而對LED生i業者而言’能夠將人、事、物、視覺以 及良品率等競爭1條件提昇,是研發重點,而本發明即是朝 此方向邁進。 -3 - 本紙張尺度適用中國1家橾準(〇阳)八4*^洛(2〖0父297公釐) (請先閏讀背面之注意事項再填寫本頁)V. Creation Instructions (5 10 15 C7 D7 PA870I95.AMD-3/12 Yinzheng Central Consumers ’Bureau, Zhengong Consumer Cooperative Co., Ltd. Seal 20 [Technical Field] The present invention relates to a method for manufacturing an LED unit body, and more particularly to a method for manufacturing an LED unit body. Full-color (three primary colors of R, G, B) high-brightness light-emitting diode electronic display screen structure and its light mixing method. [Previous technology] According to the general semiconductor and traditional LED manufacturing methods, epoxy resin The hardening agent can be formed after baking at a high temperature of 90 ° C to 110 ° C. As described in the Chinese Patent No. 31 1269 (hereinafter referred to as the cited case), the cited case is a plastic packaging method, but The material used is a recyclable resin (softening at room temperature requires a hardener), and the resin is coated or sprayed into the micro-junction structure on the surface of the semiconductor body. 'After it is hardened naturally, After the latter process is performed, because it uses a sprinkler or coating packaging method, it will lead to a coarser sugar surface after packaging, which cannot show flatness and smoothness, and is currently used in the production of semiconductor packages. "The technique is not yet able to withstand the injection impact of more than 40 pieces of pressure, so the production method described in the cited case is only applicable to the semiconductor packaging industry; and the main material in this case is polypropylene (plastic, rigid Need to increase the heat) 'The polypropylene must be melted at a high temperature of more than 200 degrees, and then directly injection molding using a pressure of 40 or more, so that the lamp string, shape and waterproofing can be completed at one time; The production method results in a smooth and beautiful surface. For LED manufacturers, 'the ability to improve competition such as people, things, objects, vision, and yield is a key research and development point, and the present invention is towards this end. Move towards the direction. -3-This paper size is applicable to one Chinese company (橾 阳) 8 4 * ^ 洛 (2 〖0 father 297 mm) (Please read the precautions on the back before filling this page)

423168 C7 D7 五、創作説明( PA87Q195.ΛΜΡ - 4/12 5 10 15 經濟部中央標準f工消费合作社印m 20 LED高亮度藍色光源問世後,全彩色看板以經漸漸風 仃於多媒體之電腦世界,一般用戶及國外定單皆要求,發 光角度及色澤需達到相當均勻性,然自動點膠機極難完成 上述之要求。 LED加工封環氧樹酯或矽膠於外殼内,經由烤箱攝氏 120度以上,且在定位、膠量、平坦度皆是不定之因數, 製成率約在90%以下,且封膠故障後不能修復,單顆LED 燈體容易沾膠於前方造成陰影亮度不均。 LED高亮度藍色、綠色光源問世後,LED戶外形看板 已成為資訊時代的新寵兒,但放置於戶外需做防水,傳統 式製做方式不敷使用成本,製成時間長、良品率低,品質 在灌膠烘乾生產方式流程上無法完全掌握,所以成本居高 不下。 由此可見,上述習用物品仍有諸多缺失,實非一良善 之設計者,而亟待加以改良。 本案發明人鑑於上述習用LED單元體製造方法所衍生 的各項缺點’乃亟思加以改良創新,並經多年苦心孤錯潛 心研究後,終於成功研發完成本件LED單元體製造方法。 【發明目的】 本發明之目的即在於提供一種LED單元體製造方法, 對於環保有三點貢獻: 1、能夠去除傳統硬式環氧樹酯或石夕膠,上述兩種材 質在It固成型時會散發有毒化學物體,造成空氣環彳呆問題 -4 本紙張尺度適用中國國家標準(CNS } A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 線, 4 23168 , C7 ___PA87Q195.AMD - 5/12 五、創作説明() 2、 使用環氧樹酯需長達1小時30分鐘於烤箱烘烤,造 成二次高溫破壞,降低使用壽命;而使用塑膠射出成型時 間快,環保問題小。 3、 環氧樹酯燈體固障不能回收再製,塑膠射出成型 5 外殼可再回收使用。 本發明之次一目的係在於提供一種LED單元組合體製 造方法,在生產速度方面:以射出成型而言,LED不用長 時間被超過溫度破壞影響LED燈體正常壽命,因塑膠射出 成型時間約在40秒鐘内,從攝氏110度降至攝氏60度以下 10 ,完全符合LED燈體操作規格,生產速度約加快130倍以上 ,又可降低生產及品保人員成本,提升品質 '增加生產量 *故障品亦可將外殼塑膠溶化後,再修護LED,製成率可 高達99%以上,生產物料更容易控制。 本發明之另一目的係在於提供一種LED單元體製造方 15 法,是在整體競爭力方面;因為在此專業領域中,以往高 亮度藍光、綠光源均掌控於日本企業,所以為提升競爭力 ,遂以創新方法降低後段製程50%生產管銷,以立式塑膠 射出成型機作業,製作流程所需時間縮短、降低工資、節 省製造成本,大幅降低空氣污染及電力能源消耗。 20 又,成本降低,製作時間變短,品質提昇,交貨期準 確,國際競爭能力即增強,不失是一改革生產技術,增加 產品國際競爭力之創作。423168 C7 D7 V. Creative Instructions (PA87Q195.ΛΜΡ-4/12 5 10 15) Central standard of the Ministry of Economic Affairs and Industrial Consumer Cooperatives printed m 20 LED high-brightness blue light source, after the advent of the full-color kanban, it gradually became popular in multimedia computers. In the world, general users and foreign orders require that the light emission angle and color must be fairly uniform, but it is extremely difficult for automatic dispensers to complete the above requirements. LED processing is sealed with epoxy resin or silicone in the shell, and the oven is 120 ° C Above, and the factors such as positioning, glue amount, and flatness are all indeterminate, the production rate is less than 90%, and it cannot be repaired after the sealing failure. A single LED lamp body is easy to stick to the front, causing uneven shadow brightness. After the advent of high-brightness blue and green LED light sources, LED outdoor signage has become the new darling of the information age, but it needs to be waterproof when placed outdoors. The traditional manufacturing method is not enough for the cost of use, and it has a long production time and low yield. The quality cannot be fully grasped in the production process of the glue drying process, so the cost is high. It can be seen that there are still many shortcomings in the above-mentioned conventional items, which is not a good design. In view of the various shortcomings derived from the above-mentioned conventional LED unit body manufacturing method, the inventor of this case was eager to improve and innovate, and after years of painstaking research, he successfully developed the LED unit body. [Objective of the invention] The purpose of the present invention is to provide a method for manufacturing an LED unit body, which has three contributions to environmental protection: 1. It can remove traditional hard epoxy resin or stone rubber, and the two materials mentioned above are solid-formed when it is solid-formed. Will emit toxic chemicals, causing air dullness problems -4 This paper size applies to the Chinese national standard (CNS) A4 size (210X297 mm) (Please read the precautions on the back before filling this page) Thread, 4 23168, C7 ___ PA87Q195.AMD-5/12 5. Creation instructions () 2. It takes up to 1 hour and 30 minutes to use epoxy resin to bake in the oven, causing secondary high temperature damage and reducing service life; and the use of plastic injection molding has a fast time The environmental protection problem is small. 3. The epoxy resin lamp body cannot be recycled and rebuilt, and the plastic injection molding 5 shell can be recycled. One objective is to provide a method for manufacturing an LED unit assembly, in terms of production speed: in terms of injection molding, the LED does not need to be destroyed by excessive temperature for a long time to affect the normal life of the LED lamp body, because the plastic injection molding time is about 40 seconds , From 110 degrees Celsius to 60 degrees Celsius below 10, fully in line with the LED lamp body operating specifications, the production speed is about 130 times faster, and can reduce production and quality assurance personnel costs, improve quality 'increase production capacity * defective products can also After dissolving the plastic in the shell, and then repairing the LED, the production rate can be as high as 99% or more, and the production materials are easier to control. Another object of the present invention is to provide a method for manufacturing an LED unit body, which is in terms of overall competitiveness. ; In this professional field, in the past, high-brightness blue light and green light sources were controlled by Japanese companies. In order to improve competitiveness, we reduced the production process of the back-end process by 50% with innovative methods. The time required for the process is shortened, wages are reduced, manufacturing costs are saved, and air pollution and electricity and energy consumption are significantly reduced. 20 In addition, the cost is reduced, the production time is shortened, the quality is improved, the delivery time is accurate, and the international competitiveness is enhanced. It is a creation that reforms production technology and increases the international competitiveness of products.

I 【圖式簡單説明】 請參閱以下有關本發明一較佳實施例之詳細說明及其 -5 - 本紙張尺度逋用中國國家標隼(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁)I [Brief description of the drawings] Please refer to the following detailed description of a preferred embodiment of the present invention and its -5-This paper size uses the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the back first) (Notes for filling in this page)

.1T 經濟部中央標準局負工消費合作社印袋 4 23168 C7 _____PAS7Q195.AMD - 6/12 五、創作説明() 附圖,將可進一步瞭解本發明之技術内容及其目的功效; 有關該實施例之附圖為: 圖一為本發明LED單元體製造方法第一步驟圖; 圖二為該LED單元體製造方法之第二步驟圖; 5 圖三為該LED單元體製造方法之第三步驟圖; 圖四為該LED單元體製造方法之第四步驟圖; 圖五為該LED單元體製造方法之第五步驟圖; 圖六A習用LED單元體部份切面視圖; 圖六B為該LED單元體部份切面視圖; 10 圖七為該LED單元體製造方法之另一實施例圖; 圖八為本發明LED單元體另一製造方法第一步驟圖; 圖九為該LED單元體製造方法之第二步驟圖; 圖十為該LED單元體製造方法之第三步驟圖; 圖十一為該LED單元體製造方法之第四步驟圖;以及 15 表一為使用聚丙烯材料與環氧樹酯材料之比較對照 表。 【主要部分代表符號】 _^—丨4 II (請先閱讀背面之注意事項再填寫本頁) 經濟部中央樣率局貝工消費合作社印裝 10 LED燈體 11 電路板 12 連接線 13 模仁 14 模具 15 進膠口 16 PU塑膠 17 銅柱 18 環狀凹槽 19 橡皮圈 20 導線孔 21 LED成品 22 弧形 23 光線 -6 - 本紙張尺度適用中國國家揉隼(CNS ) A4規格(210X297公釐) 423168 C7 D7 PA870195.AMD - 7/12 經濟部中央標隼局負工消费合作社印簟 25 LED燈體 27底座 31電路板 33導孔 35模仁 37a~b兩空間 39 LED燈體 五、創作説明() 24平面 26遮陽帽 30 LED燈體 32連接線 34卡槽 36模具 38a〜b進膠口 【較佳實施例】 請參閱圖一,本發明所提供之LED單元體製造方法, 係先將數個LED燈體10焊接於已切割完成的電路板11上, 再將連接線12與電路板11焊接於適當的位置上。其中LED 5燈體1〇的排列方式,需有一定的規則及方法,在爾後混光 表現色彩時,才會有亮麗的色彩及高度的品質表現。 請參閱圖二,接著將LED燈體10埋入模仁13内,使其 固定;因為在下一步驟進行灌膠時,需確保PU塑膠不會 溢出,而影響品質,故在模仁Π方面必須與LED燈體10相 10 配合’在大小、距離方面,都要恰到好處。 請參閱圖三,將組裝完畢的LED模仁13置入模具14裡 ,其模具14會從左右相互配合向中央緊閉,直到到達定位 即停止。 請參閱圖四,當合模完成後,即可從進膠口 15射入聚 15丙烯塑膠16,在!同一時間内把固定用的銅柱17插入,並射 出成形;值得一提的是,射出之後會在背部形成一環狀凹 槽18,可以置入橡皮圈19,以防止在下雨的時候,水滴不 本紙張尺度適用中國國家榡準(CNS ) Α4規格(210X297公釐) (請先閱讀背面之注項再填寫本頁) ^ 4 2 3 16 8 C7 D7 PA870195.AMD - 8/12 經濟部中央梯隼局貞工消资合作社印裝 五、創作説明() 慎浸入導線孔20内,引起故障發生。 請參閱圖五,將完成射出的LED成品21取出。本發明 所使用的材質為聚丙烯塑膠16,射出成型時間約在30秒鐘 内,成型時從攝氏90度降至攝氏60度以下,完全符合LED 5 燈體操作規格,製成率高達99% ,而習用使用環氧樹酯或 矽膠於外殼内,經由烤箱攝氏120度以上,且在定位、膠 量、平坦度皆是不定之因數,製成率約在90%以下。 請參閱圖六A及圖六B。在圖六A中,係使用環氧樹酯 或矽膠作為材料,在長時間高溫烘烤後,會形成如圖六A 10 中的情況,燈體間會形成一弧形22,光線23(燈光或是太 陽光)照射時,產生漫射效應,色彩、亮度不夠均勻,晝 面效果自然有待加強;在圖六B中,係使用PU塑膠,射出 成型時間約在30秒鐘内,從攝氏90度降至攝氏60度以下, 在LED燈體能夠承受的溫度及短時間内,燈體間是一平面 15 24之結構,在光線23(燈光或是太陽光)照射時,直接產生 反射效果,不會產生與習用物品相同的缺點。 請參閱圖七,為本發明延伸出來的另一高度創作。現 行十字路口均會設置紅綠燈標示,作為引導行人以及車輛 通過、停止等指示,而紅綠燈因為前方有燈罩,所以不止 20 前方可以看的見燈號,連左右方來車亦可以看的見,急性 子的駕駛人或行人往往在閃黃燈時就衝出,經常會發生許 多的交通意外事故...。所以我們將LED燈體25製作成一般 眾所皆知的紅色、綠色、黃色等紅綠燈顏色,加上遮陽帽 26,底座27做成燈泡旋轉固定型態,且不需要燈罩,就會 -8 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (讀先閱讀背面之注意事項再填寫本頁).1T Printed bags for consumer labor cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 4 23168 C7 _____ PAS7Q195.AMD-6/12 V. Creation instructions () The drawings will further understand the technical content of the present invention and its effects; related to this embodiment The drawings are: Figure 1 is the first step diagram of the LED unit body manufacturing method of the present invention; Figure 2 is the second step diagram of the LED unit body manufacturing method; 5 Figure 3 is the third step diagram of the LED unit body manufacturing method ; Figure 4 is a diagram of the fourth step of the method for manufacturing the LED unit body; Figure 5 is a diagram of the fifth step of the method for manufacturing the LED unit body; Figure 6A is a section view of a conventional LED unit body; Figure 6B is the LED unit Partial cross-sectional view of the body; 10 FIG. 7 is a diagram of another embodiment of the manufacturing method of the LED unit body; FIG. 8 is a diagram of the first step of another manufacturing method of the LED unit body of the present invention; The second step diagram; Figure 10 is the third step diagram of the LED unit body manufacturing method; Figure 11 is the fourth step diagram of the LED unit body manufacturing method; and 15 Table 1 is the use of polypropylene materials and epoxy resin Comparison of materials table. [Representative symbols of main parts] _ ^ — 丨 4 II (Please read the notes on the back before filling in this page) Printed by the Central Sample Rate Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives 10 LED lamp body 11 Circuit board 12 Connection line 13 Mould 14 Mould 15 Inlet 16 PU plastic 17 Copper pillar 18 Ring groove 19 Rubber ring 20 Wire hole 21 LED finished product 22 Curved 23 Light -6-This paper size is applicable to China National Standard (CNS) A4 (210X297) (Centre) 423168 C7 D7 PA870195.AMD-7/12 Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives Cooperative Seal 25 LED lamp body 27 base 31 circuit board 33 guide hole 35 mold core 37a ~ b two spaces 39 LED lamp body Creation instructions (24 planes, 26 sun caps, 30 LED lamp bodies, 32 connecting wires, 34 card grooves, 36 molds, 38a ~ b glue inlets [Preferred Embodiment] Please refer to FIG. 1 for the manufacturing method of the LED unit body provided by the present invention. First, a plurality of LED lamp bodies 10 are soldered on the cut circuit board 11, and then the connecting wires 12 and the circuit board 11 are soldered at appropriate positions. Among them, the arrangement of the LED 5 lamp body 10 needs certain rules and methods. Only when the light is mixed later to express the color will it have bright colors and high quality performance. Please refer to Figure 2, and then embed the LED lamp body 10 in the mold core 13 to fix it; because in the next step of filling, it is necessary to ensure that the PU plastic will not overflow and affect the quality, so it must be With the 10 phase of the LED lamp body 10, the size and distance must be just right. Please refer to Fig. 3, put the assembled LED mold 13 into the mold 14, and the mold 14 will cooperate with each other from the left and right to tightly close the center until it stops and stops. Please refer to Figure 4. After the mold clamping is completed, the poly 15 acrylic plastic 16 can be injected from the glue inlet 15. At the same time, the fixed copper column 17 is inserted and shot out; it is worth mentioning that After injection, a ring-shaped groove 18 will be formed on the back, and a rubber band 19 can be inserted to prevent water droplets from falling when it rains. The paper size applies to the Chinese National Standard (CNS) Α4 size (210X297 mm) (please first Read the note on the back and fill in this page) ^ 4 2 3 16 8 C7 D7 PA870195.AMD-8/12 Printed by Zhengong Consumer Cooperative of the Central Ladder Bureau of the Ministry of Economic Affairs 5. Creation Instructions () Carefully dip into the wire hole 20 , Causing a malfunction. Referring to FIG. 5, the finished LED finished product 21 is taken out. The material used in the present invention is polypropylene plastic 16. The injection molding time is about 30 seconds. During molding, the temperature is reduced from 90 degrees Celsius to 60 degrees Celsius, which fully meets the LED 5 lamp body operation specifications, and the production rate is as high as 99%. However, the conventional use of epoxy resin or silicone in the shell, through the oven above 120 degrees Celsius, and in the positioning, the amount of glue, flatness are uncertain factors, the production rate is about 90% or less. Please refer to Figure 6A and Figure 6B. In Figure 6A, epoxy resin or silicone is used as the material. After long-time high-temperature baking, the situation shown in Figure 6A 10 will be formed. An arc 22 will be formed between the lamp bodies, and the light 23 (light (Or sunlight) when it is irradiated, it produces a diffuse effect, the color and brightness are not uniform, and the daytime effect naturally needs to be strengthened; in Figure 6B, the use of PU plastic, the injection molding time is about 30 seconds, The temperature is reduced to below 60 degrees Celsius. In the temperature and short time that the LED lamp body can withstand, there is a plane 15 24 structure between the lamp bodies. When the light 23 (light or sunlight) is illuminated, it directly reflects the effect. Does not cause the same disadvantages as conventional items. Please refer to FIG. 7, which is another highly creative extension of the present invention. At the current intersections, traffic lights will be set as instructions to guide pedestrians and vehicles to pass, stop, etc., because the traffic lights have a lampshade in front, so you can see more than 20 lights in front, even when you come to the left and right to see, acute Of drivers or pedestrians often rush out when the yellow light flashes, and many traffic accidents often occur ... Therefore, we will make the LED lamp body 25 into the commonly known red, green, yellow and other traffic light colors, plus the sun hat 26, the base 27 is made of a fixed rotation of the bulb, and does not require a lampshade, it will be -8- This paper size applies to China National Standard (CNS) A4 (210X297 mm) (read the precautions on the back before filling in this page)

4^3168 C7 D7 PA870195.AMD - 9/12 經来部中央標率局員工消費合作社印製 五、創作説明() 因為LED光源直射的原理,只能讓前方車子看見燈號,左 右車子只好等到變燈後才能開動。其製作的流程與前述之 製作流程並無有所不同。 請參閱圖八’為本發明LED單元體之另一製造方法第 5 一步驟圖。係先將數個LED燈體30焊接於已切割完成的電 路板31上。 請參閱圖九,與圖一不同之處,係在於連接線32並未 預先和電路板31相接,而是先將連接線32穿過事先成型的 外殼導孔33,再與電路板31相接,完成之後再將電路板31 後推至外殼内部的卡槽34部予以定位,接著埋入模仁35内 *使其固定。 請參閱圖十,將安裝完成的LED模仁35置入模具36内 ,因為電路板31在内部阻隔之緣故,以致於形成前後兩空 間37a、37b,在進膠時必須從兩個不同的進膠口 38a、38b 1S射入PU塑膠。 請參閱圖十一,將成型的LED燈體39離模。其射出成 型時間約在30秒鐘内,從攝氏90度降至攝氏60度以下,完 全符合LED燈體操作規格,製成率高達99%。 表一係為本發明所採用之聚丙烯材料與傳統技術所 20 使用之環氧樹酯材料比較對照表。【特點及功效】, I 本發明所揭I供之LED單元體製造方法,與前述引證案 及其他習用技術相互比較時,更具有下列之優點: 位置定位性:發光二極體與印刷電路板結合下錫爐焊 -9 - 本紙張尺度適用中國國家標準(CNS ) Μ規格(210X297公釐) (請先閲讀背面之注意事項再填寫本I) " 訂 423168 C7 D7 PA870195.AMD - 10/12 經濟部中央梯準局員工消费合作社印衷 五、創作説明() 接固定時,先以射出塑膠模具固定發光二極體中心點位置 ,減少因為偏移而產生發光角度錯誤。 平坦性:以模具射出成形外殼,含遮陽帽及其平坦性 之定位卡榫。4 ^ 3168 C7 D7 PA870195.AMD-9/12 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Creation Instructions () Because of the principle of direct light from the LED light source, only the cars in front can see the lights, left and right cars have to wait until It can only start after changing the lights. The production process is not different from the aforementioned production process. Please refer to FIG. 8 ′, which is a step diagram of the fifth step of another manufacturing method of the LED unit body of the present invention. A plurality of LED lamp bodies 30 are first welded to the cut circuit board 31. Please refer to FIG. 9, which is different from FIG. 1 in that the connecting wire 32 is not connected with the circuit board 31 in advance, but the connecting wire 32 is passed through the pre-molded shell guide hole 33 before being connected to the circuit board 31. Then, after completion, the circuit board 31 is pushed back to the slot 34 in the housing to be positioned, and then buried in the mold core 35 * to fix it. Please refer to FIG. 10, the installed LED mold 35 is placed in the mold 36, because the circuit board 31 is internally blocked, so that the two front and rear spaces 37a and 37b are formed. The plastic ports 38a and 38b 1S are injected into the PU plastic. Referring to FIG. 11, the molded LED lamp body 39 is released from the mold. The injection molding time is about 30 seconds, from 90 degrees Celsius to below 60 degrees Celsius, which fully meets the operating specifications of LED lamp bodies, and the production rate is as high as 99%. Table 1 is a comparison table between the polypropylene material used in the present invention and the epoxy resin material used in the conventional technology. [Features and effects], The LED unit manufacturing method disclosed in the present invention has the following advantages when compared with the aforementioned citations and other conventional technologies: Position positioning: light-emitting diodes and printed circuit boards Combined with solder furnace soldering-9-This paper size applies Chinese National Standard (CNS) M specifications (210X297 mm) (Please read the precautions on the back before filling in this I) " Order 423168 C7 D7 PA870195.AMD-10 / 12 Employees' Cooperatives of the Central Government Bureau of the Ministry of Economic Affairs of the People's Republic of China. V. Creation Instructions () When fixed, first use a plastic mold to fix the center position of the light-emitting diode to reduce the error of the light-emitting angle caused by the offset. Flatness: The molded shell is injected with a mold, including the sun hat and its flat positioning tongue.

5 防水性:當外殼塑膠模具結合射出一體成形,使LED 與外殼塑膠完全結合密封,形成滴水不漏之led燈體成品 〇 . 並且在人、事方面,可以降低工作時數,所聘用之人 員少,管銷費降低,且塑膠射出一體成形方式,改善工作 10 環境,不會造成環保污染。 若LED燈體損壞,(只壞紅、綠、藍其中一色),其 外殼可回收,將PC溶化後,PCB及塑膠部分日後可在重 新製作。在視覺上,因射出時模具以完全將燈體定位完成 ,在視覺角度及亮度較一般灌膠方式在其亮度、色彩度及 15 其平坦度更均勻。且在良品率方面,因為燈體採用射出一 體成形,良品率幾乎可提昇至99%以上,製作成本下降, 獲利提昇。 上列詳細說明係針對本發明之一可行實施例之具體說 明,惟該實施例並非用以限制本發明之專利範圍,凡未脫 20 離本發明技藝精神所為之等效實施或變更,均應包含於本 案之專利範圍中。 綜上所述,本案不但在技術思想上確屬創新,並能較 習用物品增進上述多項功效,應已充分符合新穎性及進步 性之法定發明專利要件,爰依法提出申請,懇請貴局核 • 1〇 - 本紙張尺度適用中國國家梯準(CNS ) Α4規格(210Χ297公釐) ---------1------ΐτ--------^ ··:-) .) (請先閱讀背面之注意事項再域寫本頁) ^23168 C7 _ _D7_PA870195.AMD · I"I2 五、創作説明() 准本件發明專利申請案,以勵發明,至感德便。 (請先閲讀背面之注意事項再填寫本S )5 Water resistance: When the plastic mold of the housing is combined with the injection molding, the LED and the housing plastic are completely combined and sealed to form a leak-proof LED lamp body product. In addition, in terms of personnel and affairs, the number of working hours can be reduced, and fewer personnel are employed. The cost of management and sales is reduced, and the integrated plastic injection molding method improves the working environment and does not cause environmental pollution. If the LED lamp body is damaged (only one of the red, green, and blue colors is damaged), its shell can be recycled. After the PC is dissolved, the PCB and plastic parts can be rebuilt in the future. Visually, because the mold completes the positioning of the lamp body at the time of injection, the visual angle and brightness are more uniform in its brightness, color, and flatness than the general pouring method. And in terms of yield, because the lamp body is molded by injection, the yield can be increased to more than 99%, the production cost is reduced, and the profit is improved. The above detailed description is a specific description of a feasible embodiment of the present invention, but this embodiment is not intended to limit the scope of the patent of the present invention. Any equivalent implementation or change without departing from the technical spirit of the present invention should be Included in the patent scope of this case. To sum up, this case is not only technically innovative, but also enhances the above-mentioned multiple effects compared with conventional items. It should have fully met the requirements for statutory invention patents that are novel and progressive, and applied for it in accordance with the law. 1〇- This paper size is applicable to China National Standard (CNS) Α4 specification (210 × 297 mm) --------- 1 ------ ΐτ -------- ^ · :: -).) (Please read the precautions on the back before writing this page) ^ 23168 C7 _ _D7_PA870195.AMD · I " I2 V. Creative Instructions () Approve this invention patent application to encourage inventions . (Please read the notes on the back before filling out this S)

'1T 經濟部中央標隼局—工消費合作杜印褽 1 本紙張尺度逋用中國國家梂準(CNS ) Α4規格(210Χ297公釐)'1T Central Bureau of Standards, Ministry of Economic Affairs—Industrial-Consumer Cooperation Du Yin 褽 1 This paper size is in accordance with China National Standards (CNS) Α4 size (210 × 297 mm)

Claims (1)

^3168^ 3168 Q100.AI\j1〇 ^ !£/!: 申請專利範圍 1. 一種LED單元體製邊方法,其中包括五步驟: 步驟一:係先將數個LED燈體焊接於已切割完成的電 路板上,再接上連接線; 步驟二:將步驟一中組裝完成之構件埋入模仁中,緊 5 密的固定LED燈體,並露出適當之需灌聚丙烯部位; 步驟三:將組裝完成的LED模仁置入模具組中; 步驟四:在同一時間將固定用的銅柱插入,並合模由 進膠口灌入聚丙烯、射出成形; 步驟五:將完成射岀的成品由模具中離模取出。 10 2. 一種LED單元體製造方法,其中包括四步驟: 步驟一:係先將數個LED燈體焊接於已切割完成的電 路板上: 步驟二:將步驟一中組裝完成之構件置入事先成型完 畢之外殼中,再將連接線穿過外殼與電路板焊接; 15 步驟三:將電路板後送到殼體中,會有一卡槽頂住電 路板,將殼體隔開形成前、後兩空間,再同時經由兩 進膠口灌入聚丙烯、射出成形; 步驟四:接將完成射出的成品由模具中離模取出。 3. 如申請專利範圍第1項所述之LED單元體製造方法, 20 其中該LED燈體可以製作成單色彩,當做各類型的燈 泡使用。 4. 如申請專利範圍第2項所述之LED單元體製造方法, 其中該LED燈體可以製作成單色彩,當做各類型的燈 泡使用。 -12 - 本紙張尺度適用中國國家標準ί CNS ) Α4規格(210Χ297公釐) (請先鬩讀背面之注意事項再填寫本頁) *1T 經濟部智慧財產局員工消費合作社印製 3 2 4 經濟部中央標準局員工消费合作社印裝 6 8 A9 B9 C9 D9 式 表 性質 環氧樹酯(液態塑膠) 一 聚丙;^ (固態塑膠) 使用方式 需加硬化劑及抗紫外線劑 需加高溫200度 到1裝對象 LED晶粒、IC晶片 成形後LED、1C整體防水 填入方式 塗佈、喷灑、注入 射出擠壓 射出壓力 使用塗佈及注入近於零 用40-80磅高壓擠壓入模 硬化方式 85 度=4HR,10〇i = 2HR 155度入模後10秒内成型 可使用時間 調合後25度=4HR,40度= 5HR 永久(不受環境影響) 熱變形溫度 122度 135度 燃點特性 無法抗燃燒(會助燃) 抗燃燒(不會助燃)UL94 介電常數 IKHz 時為 3.12 ΙΟΟΟΚΗζ時為3. 09 體積電阻 Ohra-cm 1.3x100,000 Ohra-cm 1, 000, 000, 000UP 耐電弧性 無耐電弧性 130秒 硬度 114 R-Scal 90 R-Scal 煮沸吸水率 1小時 0·42% (23度=0% ) 1 小時 0.02% (23度=0 % ) 熱膨脹係數 6.0 X (-100,000) 6.0 X (-100,000) 本紙張尺度朝家縣(⑽)从規格(21Qx297公釐)Q100.AI \ j1〇 ^! £ / !: Patent application scope 1. An LED unit system edge method, which includes five steps: Step 1: First, solder several LED lamp bodies to the cut circuit board. Connect the connecting wire again; Step 2: Embed the assembled components in Step 1 into the mold core, fix the LED lamp body tightly and expose the proper parts to be filled with polypropylene; Step 3: Put the assembled LED The mold core is placed in the mold group; Step 4: Insert the fixed copper pillar at the same time, and close the mold to inject polypropylene from the plastic inlet and injection molding; Step 5: The finished product is ejected from the mold. Remove the mold. 10 2. A method for manufacturing an LED unit body, which includes four steps: Step one: first welding several LED lamp bodies to a cut circuit board: step two: placing the assembled components in step one in advance In the molded shell, pass the connecting wire through the shell to the circuit board and solder; 15 Step 3: Send the circuit board back to the case, there will be a card slot against the circuit board, and the shells are separated to form the front and back. Two spaces, and then inject polypropylene through two plastic inlets at the same time, and injection molding; Step 4: Take out the finished finished product from the mold and remove it from the mold. 3. The method for manufacturing an LED unit body as described in item 1 of the patent application scope, wherein the LED lamp body can be made into a single color and used as various types of lamps. 4. The method for manufacturing an LED unit body as described in item 2 of the patent application scope, wherein the LED lamp body can be made into a single color and used as various types of lamps. -12-This paper size applies the Chinese national standard CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page) * 1T Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 3 2 4 Economy Printed by the Consumer Standards Cooperative of the Ministry of Standards of the People's Republic of China 6 8 A9 B9 C9 D9 Type Epoxy Resin (Liquid Plastic) Polypropylene; ^ (Solid Plastic) Use method requires hardener and anti-ultraviolet agent. 1 object LED die, IC chip, LED, 1C overall waterproof filling method after coating, spraying, injection, injection, extrusion, injection pressure using coating and injection nearly 40-80 pounds high pressure extrusion die hardening method 85 degrees = 4HR, 10〇i = 2HR 155 degrees molding within 10 seconds after mold-in. Available time after blending 25 degrees = 4HR, 40 degrees = 5HR Permanent (not affected by the environment) Thermal deformation temperature 122 degrees 135 degrees Flammability Anti-combustion (will support combustion) Anti-combustion (not support combustion) 3.94 at IKHz dielectric constant 3.12 at ΙΟΟΟΚΗζ Volume resistance Ohra-cm 1.3x100,000 Ohra-cm 1, 000, 000, 000UP Arc resistance No arc resistance 130 seconds Hardness 114 R-Scal 90 R-Scal Boiling water absorption for 1 hour 0.42% (23 degrees = 0%) 1 hour 0.02% (23 degrees = 0%) Thermal expansion coefficient 6.0 X (-100,000) 6.0 X (-100,000) The size of this paper is Chaojia County (⑽) from the specifications (21Qx297 mm)
TW87112270A 1998-07-27 1998-07-27 The manufacturing method of LED unit body TW423168B (en)

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