TW422761B - Replaceable polishing pad for chemical mechanical polishing - Google Patents

Abstract

The present invention discloses an innovative installation device for a polishing pad in the improved chemical mechanical polishing (CMP) device that the polishing pad is attached on a polishing pad support table and it can be easily connected to a rotatable polishing platen base or dismounted from the rotatable polishing platen base. Using the polishing pad support table can allow the CMP device to change or replace a polishing pad in the shortest idle time. The polishing pad can be removed temporarily from the CMP device and re-mounted on the CMP device for further use so that it can extend the lifespan of the polishing pad.

Description

422761 A7 1Γ 5. Description of the invention (5-1 Inventive jaw: This invention relates to a device for chemical mechanical polishing (CMP) semiconductor substrate, in particular to an improved device for attaching a polishing pad to a rotatable Rotatable polishing platen. 5-? BACKGROUND OF THE INVENTION: The manufacturing of metal wires for semiconductor integrated circuits is used to interconnect many components in component circuits. As the density of circuits in semiconductor circuit wafers increases, multiple connections are required to The interconnection between components is achieved, and the planarization of the inner dielectric layer becomes a key step in the manufacturing process. The technology must form the component interconnects on a substrate containing component circuits. Traditionally, these interconnects are metal. Or a conductor is used to interconnect discrete circuit elements. These metal connections are made of a thin insulating substance, such as chemical vapor deposition (CVD) oxide, to further insulate the next interconnect. To connect different wires The metal lines of the layer form a window in the dielectric layer to provide a circuit access path therebetween, and these wires are manufactured in a process where the dielectric layer is most flat Outer surface. Install ----- '玎 ------- ^! (Please read the back first, 6 of it; i-notes and then fill in the pages)-Shellfish Consumer Cooperative Du Yin, Central Bureau of Standards, Ministry of Economic Affairs The chemical mechanical polishing (CMP) process is developed to provide a flat dielectric surface. The process briefly involves rotating a thin, flat semiconductor substrate under controlled chemical reagents, pressure, and temperature conditions. On the abrasive surface of a wet lake ^ — A chemical abrasive slurry contains an abrasive reagent such as alumina or

5. Description of the invention () Silicon oxide is used as an abrasive material. In addition, the chemical polishing slurry contains a selected γ-milling chemical agent to etch different surfaces on the substrate during the polishing process. In the process, the result of combining mechanical and chemical removal of substances can obtain an extremely flat surface. CMP can also be used to remove different materials and a gold layer from the surface of a semiconductor substrate, for example, when forming a contact window on a dielectric material Later in the layer, the "general layer was deposited on it in a comprehensive manner" and then flat metal studs were generated using CMP. For more complicated circuits that require multiple wire layers, CMP must be used repeatedly to smooth out and remove different conductors and dielectric materials. Actually grind each phase. "A custom-made polishing pad must have appropriate hardness and porosity. In addition, the polishing pre-material requires a custom-made polishing slurry for the custom-made polishing pad in order to return the effect. Traditionally, the polishing pad is a deformable polyurethane6. It is said that the grinding and fixing of the Central Standards Bureau of the Ministry of Economic Affairs, the Shellfish Consumer Cooperative, and the use of adhesives on the rotatable grinding table. This method of fixing is very laborious, because it requires carefulness. And professional technology to ensure that the surface of the fixed polishing pad is almost frank. If the surface of the polishing pad is uneven, it will reduce the uniformity and yield of the polishing removal rate during the polishing process. In addition, once the polishing pad is fixed on the rotatable polishing table, The polishing pad must be destroyed in order to remove it. These factors seriously affect the cost of the CMP process' because of the need: 1. Each polishing pad is combined with a polishing slurry with a dedicated CMP equipment; or 2. The polishing pad is changed to conform to the next CMP polishing process In this step, when the polishing pad is replaced, the equipment needs to be stopped to limit the output of the CMP equipment. The first figure illustrates that a conventional CMP apparatus 10 has a rotatable polishing table 11 and a polishing pad 12 adhered to the rotatable table.] The paper size is in accordance with the Chinese Standard for Standards (CNS). ': Ί) 4227¾) ΐΐ ^ Duanxu A 7 1Γ, Work and Consumption Cooperation, Central Standards Bureau, Ministry of Economic Affairs 5. Description of the Invention () Surface, a rotatable substrate grinding head 13, so that the force indicated by an arrow 14 Applied to the substrate 15, a chemical polishing slurry supply system includes at least a reservoir 16 and a guide camp 17 to distribute the polishing slurry on the polishing pad 12. Replacing the polishing pad 12 in this device is an important and time-consuming operation, because the deformable polishing pad is adhered to the rotatable table with an adhesive. 'The replacement of the polishing pad will cause the previously fixed polishing pad to be destroyed, and the replacement The CMP device must also be stopped during the polishing pad process. The shutdown of the CMP device will reduce the output of the device and increase the cost of manufacturing the product. When manufacturing very large semiconductor integrated circuits, CMP is a basic process and is implemented in several process steps to produce a multi-layer structure. An important challenge in CMP is to reduce the cost of the CMP process. This challenge can increase the efficiency of the CMP device by increasing the output. And reduce the downtime of CMP equipment. In addition, improve the uniformity and reliability of the CMP process to improve product yield and reduce costs. Reducing the cost of CMP can also be achieved by reducing the use of consumables such as slurry chemistry. Reagents and polishing pads. Several inventions have been implemented to improve CMP devices and processes. For example, US Patent No. 5,664,989, "Polishing Pad, Polishing Apparatus And Polishing Method" by Rempei Nakata et al., 1997 discloses a polishing device and a polishing method, one of which A pad with a variable cell array is inserted between the polishing pad and the rotatable polishing table. This invention improves the uniformity of the pressure of the substrate to be ground and the uniformity of the polishing rate of the substrate to be ground. -4- Paper Zhang Zhitong.com China National Standards (CNS) Λ *! Regulation Orange (210X24 ^ 1, --------- install I (please read first, please note the f-itemΐ4ίΗ large page) Order Central Bureau of Standards, Ministry of Economic Affairs, Shellfish Consumer Cooperative, Innu 422761 A; ___ 1Π 5. Description of the Invention () US Patent No. 5,658,1 90 by David Q. Wright and others in 1997, `` Apparatus For Separating Wafer From Polishing '' Pads Used in Chemical-Mechanical Planarization of Semiconductor Wafers " -Disclose a wafer separator for removing a wafer from a polishing table. In one embodiment, the wafer separator includes an edge element adsorption A polishing pad, the wafer, or a wafer polishing head to push a portion of the wafer away from the polishing pad, thus promoting the polishing crystal >! to be separated by the polishing pad. US Patent No. 5,697,065 by Gray 0. Henderson in 1997 丨 ' Wafer Carrier Having Carrier Ring Adapted For Uniform Chemical-Mechanical Planarization 〇f Semiconductor Wafers ", discloses a wafer polishing head for a CMP device, wherein the wafer polishing head has a carrier ring bent from the inner edge to the outer edge away from the polishing pad. The device improves the flow of polishing slurry between the wafer and the polishing pad and further improves the polishing uniformity. The present invention discloses a novel CMP device in which the polishing pad is installed. 5.3 The objective oil and summary of the invention: _ The purpose of the present invention is to provide a Improved device for chemical mechanical polishing of semiconductor substrates. The paper's dimensions are applicable to China National Standard Soap (CNS) Λ4Λ 枋 (210 × 297) 筇 ΐ---II -.1— --button ^ ----IIII 1- I! ...... I ΐ-i [! (Read first, read the back and pay attention to item r ^ Fill this page)-27 6 tl A 7 V. Description of the invention (Another object of the present invention is to provide An improved chemical mechanical polishing apparatus, wherein the abrasive Sook easily replaced or changed. Yet another object of the present invention is to provide an improved chemical mechanical polishing device, in which the polishing pad can be temporarily removed from the chemical mechanical polishing device 'and then reassembled to the chemical mechanical polishing pad when further used. According to the present invention, 'the formation of a grinding table assembly in a chemical mechanical grinding device is used to grind a semiconductor substrate'. The grinding table assembly includes at least:-a rotatable grinding table base, a grinding and polishing stand, and a grinding and polishing pad. A device attached to the polishing potential support base and a device for easily connecting and separating the polishing pad support base and the rotatable polishing base. Please read the notes on the back-fill in the fl. Fill in the __Song ordering IHJ Shi Shi Er Di Zhifa Yu Hua Tan Ping mechanical mechanization to use research in Yi Yi,, a seat and base Table, base grinding base, base research support table, rotary support, grinding pad, grinding, grinding, grinding, grinding, grinding, grinding: Grinding, grinding, grinding, grinding, and grinding The body support and guide pad are connected to the semi-grind and the base of the table is equipped with a holder and a base. The table grinds and grinds the grind. Basic research team

Line I The Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, printed this and the basic materials of the application 1 and the mother of the installation. Grinding the ground force of the grinding equipment, the pressure of the rotation of one pad, grinding the ground | quasi one standard-country J country fit | suitable ruler: Zhang paper | this

Ns 42276 Λ * Β: 5. Description of the invention (Refer to the following description together with the accompanying drawings, the foregoing ideas and many advantages of this invention will become easier to understand and understand, of which: The first figure illustrates the conventional technology of chemical mechanical polishing A cross-sectional view of the device. The second view illustrates a polishing table assembly according to a preferred embodiment of the present invention. The third view illustrates a first device for attaching the polishing pad support to the polishing table base. The fourth view illustrates a first Two devices are used to attach the polishing pad support base to the polishing table base. The fifth figure illustrates a third device is used to attach the polishing pad support base to the polishing table base. The sixth figure illustrates the CMP of the present invention. Sectional view of the device.

Please read the reverse. Attention Μ Re_ fill in 'I Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives, India, India 10 Traditional CMP device 11 Rotary table 12 Grinding pad 13 Rotary substrate grinding head 14 Arrow 15 Substrate 16 Reservoir 17 Conduit 20 Grinding table base 21 Arrow 22 Grinding pad support seat 23 Grinding pad 30 Grinding table base 31 Arrow 33 Multiple inserts σ 34 Multiple plugs 35 Polishing pad support 40 Paper base of the polishing table The scale is applicable to Chinese National Standards (CNS) 44 is now (210/297) 厶 22 6 1 μ _________ " ~ 15. Description of the invention () 42 Upper surface 44 Protruding part 46 Several pins 61 Rotary grinding Table base 63 Rotatable base polishing head 6 5 Base material 67 Conduit 41 Arrow 43 Groove 45 Polishing pad support 60CMP device 62 Polishing pad 64 Arrow 6 6 Storage unit 70 Polishing pad support Far describes a new and improved chemical mechanical polishing device (CMP) 'in which polishing pads can be easily replaced or changed, as will be described in detail below. Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperatives ^ Please refer to the second figure to describe the polishing pad assembly of the present invention. A polishing table base 20 has a circular disk: The polishing table base 20 is attached with a device to provide rotation for the polishing. The table base 'shows the arrow 21', the motor and the drive mechanism provide rotation, and are not shown because they are not part of the present invention. A polishing pad support 22 is attached to the upper surface of the polishing table base 20 'The polishing pad support 22 and the attachment device to the polishing table base 20 will be described later' The polishing pad support 22 and the An important feature of the attachment device of the grinding table base 20 is that it is easy to connect and separate the grinding entire floating seat 22 and the grinding table base 20, and the grinding pad support seat 22 has a circular disk whose diameter is approximately equal to the grinding The diameter of the table base 20 and the thickness of the polishing pad support seat 22

Dimensions of this paper: Material (CNS > Eight 4 Secrets (210'X297 ,,. ≫ FT A? 9761 Λ ··

fi 'M __ 一 · ------ 5. Description of the invention () The degree can be between about 0.0625 and 2.0 inches. The preferred thickness of the grindstone support base 22 is between about 0.25 and 0.5 inches. 'The abrasive plastic support base 22 is formed of a suitable metal or plastic, for example,' the entire support base 22 may be formed of an aluminum sheet or a stainless steel sheet ', and a polishing pad 2: 3 is attached to the polishing pad support base 22 On the upper surface, the polishing pad 23 is a deformable material such as polyurethane adhered to the upper surface of the polishing pad support 22 with an appropriate adhesive. Traditional polishing pad manufacturers manufacture the polishing pad with an adhesive layer. Fixed on the back of the polishing pad, a protective layer is first attached to the surface of the polishing pad to be peeled off by the adhesive layer. Please refer to the third figure to describe a first device for attaching the polishing pad support to the polishing table base. The polishing table base 30 has a pan. The polishing table base 30 is attached to a device to provide rotation. The grinding table base 30, as shown by arrow 31, is provided with a motor and a driving mechanism for rotation ', which is not shown because it is not part of the present invention. A plurality of sockets 33 are formed in the upper surface of the polishing table base 30. The plurality of sockets 33 are used to engage a plurality of bolts 34 corresponding to the bottom surface of the polishing pad support base 35. The sockets are arranged with the bolts. In order to allow the polishing pad support base 35 to be easily connected to or separated from the polishing table base 30, the other function of the socket and the plug arrangement is to firmly attach the polishing pad support base 35 to the polishing table base 30, so it is applied to The rotation of the base of the polishing table also causes the same rotation of the support of the polishing pad. The plurality of plugs and the corresponding plurality of sockets include at least one socket and one plug. However, the socket and the plug are The quantity and position are during the 30 rotation of the grinding table base during CMP. 'Ensure the research-9-This paper's standard is applicable to the Chinese National Standard (CNS) Λ4 Regulations (210x1 ^^ --------- ^ ----- 1T ------ 0 Please read the note on the back _ 'item ^ 4. 41) 41) Printed by the Consumers Cooperative of the Central Bureau of Procurement, Ministry of Economic Affairs The pad support base 35 is firmly attached to the polishing table base 30. Please refer to the fourth figure to describe a second device for attaching the polishing pad support to the polishing table base. The polishing table base 40 has a pan. The polishing table base 40 is attached to a device to provide rotation. As shown by arrow 41, the grinding table base 40 is provided with a motor and a driving mechanism for rotation, and is not shown because it is not a part of the present invention. A groove 43 is formed in the upper surface 42 of the polishing table base 40 and has the same length as the diameter of the polishing table base 40. The groove 43 is used to engage the protrusion on the bottom surface of the corresponding polishing pad support seat 45. As shown in the fourth figure, the protruding portion 44 may be a rail type having a rectangular cross-section with a rectangular cross-section corresponding to the groove 43. Other options are shown in the fifth figure. The protruding portion may include at least a plurality of pegs 46 to engage the grooves 43. At least two of the plurality of pegs are used to ensure that the grinding table base 40 rotates during CMP to ensure that The polishing pad support base 45 is firmly attached to the polishing table base 40. The sixth figure illustrates the CMP device 60 of the present invention. The CMP device includes at least a rotatable polishing table base 61 '-a polishing pad support 70, a polishing pad 62 adhered to the upper surface of the polishing pad support 70, a The rotatable substrate grinding head 63 is connected to the substrate 65 by applying a force as indicated by arrow 64. A chemical polishing slurry supply system includes at least a reservoir 66 and a duct 67 to distribute the polishing slurry to the polishing pad 62. on. One of the main features of the present invention is that the polishing pad support base 70 can be easily connected to or detached from the rotatable polishing table base 61, and the polishing pad 62 is adhered to the polishing pad support -10. This paper size applies to Chinese national standards ( CNf5) Λ4 gauge (210. < 21 ^ 公 #) (Please read the notes on the back first, and then 嗔 艿. ^ Page)

The Central Bureau of Standards, Ministry of Economic Affairs, Shellfish, Consumer Cooperation, and Sealing Disaster IΓ 5. Description of the Invention () The upper surface of the holder 70, this feature allows the polishing pad of the CMP device to be easily changed, and the CMP device can handle multiple CMP processes and CMP processes When changing, the device has a minimum downtime, and the maximum polishing life is obtained from each polishing pad, because it does not need to remove the polishing pad directly adhered to a rotatable polishing table. The present invention is described above with a preferred embodiment, and is only used to help understand the implementation of the present invention, and is not intended to limit the spirit of the present invention. Those skilled in the art will not depart from the present invention after understanding the spirit of the present invention. Within the scope of the spirit, when it can be modified and replaced with equivalent changes, the scope of patent protection shall depend on the scope of the attached patent application and its equivalent fields. Install

Line 1T Line Inu slave of the Central Bureau of Standards, Ministry of Economic Affairs, Shellfish Consumer Cooperative * 11 · ™ This paper size applies to China National Standard (CNS) Λ4 specification (210X2W enthalpy)

Claims (1)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs CS D8 6. Scope of patent application 1. A polishing table assembly is used to grind a semiconductor substrate in a chemical mechanical polishing (CMP) device. The polishing table assembly includes at least: rotatable Grinding table base; polishing pad support device; grinding pad adhered to the grinding pad support base; and the device can easily connect or separate the polishing pad support base and the rotatable polishing base base. 2. The polishing table assembly according to item 1 of the patent application scope, wherein the above-mentioned polishing pad support has a diameter the same as that of the above-mentioned polishing table base. 3. For the polishing table assembly according to item 1 of the patent application scope, wherein the above-mentioned polishing pad support seat has a thickness between about 0.0625 and 2.0 inches. 4. The polishing table assembly according to item 1 of the patent application scope, wherein the above-mentioned polishing pad support seat has a preferred thickness between about 0.25 and 0.5. 5. The polishing table assembly according to item 1 of the patent application scope, wherein the above-mentioned polishing pad is adhered to the polishing pad support base with an adhesive. 6. For the polishing table assembly of the first scope of the patent application, the device for easily connecting or separating the polishing pad support base and the base of the rotatable polishing table at least includes a plurality of bolts fixed to the polishing pad. Support -12- This paper size applies to China National Standard (CNS) A4 (210 * 297 mm) -------------- Installation ------- Order- -------- Line --- (Please read the note of δ and fill in page t). The bottom of the scope of patent application and the corresponding plural are inserted into the surface. Formed on the above-mentioned rotatable grinding table base printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 7. If the grinding table assembly of the sixth scope of the patent application, the above-mentioned plurality of bolts include at least one bolt and the corresponding above-mentioned The plurality of sockets includes at least one socket. 8. For the polishing table assembly of the first scope of the patent application, the device for easily connecting or separating the polishing pad support base and the base of the rotatable polishing table at least includes a groove formed in the above-mentioned rotatable polishing. The corresponding protruding part in the upper surface of the table base and the corresponding protruding part is on the bottom of the above-mentioned polishing pad support seat, and the protruding part is used to engage the groove. 9. The polishing table assembly according to item 8 of the patent application, wherein the above-mentioned groove is formed in a diameter across the upper surface of the above-mentioned rotatable polishing table base. 10. A device for chemical mechanical planarization of a semiconductor substrate at least includes: a rotatable polishing table base: a polishing pad support; the polishing pad is adhered to the polishing pad support; the device can easily support the polishing pad The base is connected or separated from the base of the rotatable grinding table; the semiconductor substrate grinding head is located at the relative position of the grinding pad: -13-This paper size applies to the national standard (CNS) A4 (210 * 297 mm). ------ Order --------- Line --- (Please read the precautions on the back before filling in this page) 4227 6 1] 'VI. Patent Application The polishing slurry is distributed to the device on the polishing pad; -------------- 奘! (Please read the back of "" It ’s difficult to fill in this page before filling in this page) For the first rotating device The base of the grinding table is rotated; a second rotating device is used to rotate the substrate grinding head; and a pressure device is used to apply pressure between the substrate and the grinding unit. 11. The device according to item 10 of the patent application, wherein the above-mentioned grinding cymbal support base has a diameter the same as that of the above-mentioned rotatable grinding table base. 12. For the device under the scope of patent application, wherein the above-mentioned grinding pad support seat has a thickness of between about 0.025 and 2.0 inches. 13 ' The device according to item 10 of the patent application range, wherein the above-mentioned grinding pad support seat has a preferred thickness between about 0.25 and 0.5. 14_ The device according to item 10 of the patent application range, wherein the above-mentioned grinding pad is adhered to the grinding pad support base with an adhesive. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs15. For the device in the scope of patent application, the device mentioned above can easily connect or separate the polishing pad support base and the rotary grinding table base. The bolt is fixed on the bottom of the polishing pad support seat and the corresponding plurality of sockets are formed in the upper surface of the rotatable polishing table base. -14- This paper size applies to one country's national standard (CNSM4 specification (210 X 297 public love) C8 D8 6. Application for patent scope 16. For the device with scope of patent application No. 15 in which the above-mentioned multiple plugs are at least It includes a plug and the corresponding plurality of sockets including at least one socket. 17. If the device of the scope of patent application No. 10 'wherein the above can easily connect the polishing pad support base with the base of the rotatable polishing table or The separated device includes at least a groove formed in the upper surface of the above-mentioned rotatable grinding table base and a corresponding protruding portion is at the bottom of the above-mentioned polishing pad support seat, and the protruding portion is used to engage the groove. The device of the scope of application for patent No. 17, wherein the above-mentioned groove is formed on a diameter across the upper surface of the above-mentioned rotatable grinding table base. ^ ------- Order · --------- -(Please read the note on the back of the book and fill in this page) * Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -15- This paper is applicable to the national standard (CNS) A4 (210 X 297 Mm)