TW421094U - Tin container structure improvement for tin soldering furnace - Google Patents
Tin container structure improvement for tin soldering furnaceInfo
- Publication number
- TW421094U TW421094U TW89204512U TW89204512U TW421094U TW 421094 U TW421094 U TW 421094U TW 89204512 U TW89204512 U TW 89204512U TW 89204512 U TW89204512 U TW 89204512U TW 421094 U TW421094 U TW 421094U
- Authority
- TW
- Taiwan
- Prior art keywords
- tin
- container structure
- structure improvement
- soldering furnace
- tin soldering
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89204512U TW421094U (en) | 2000-03-21 | 2000-03-21 | Tin container structure improvement for tin soldering furnace |
TW089204512U TW483355U (en) | 2000-03-21 | 2001-08-31 | Structure improvement for tin tank device of tin soldering furnace |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89204512U TW421094U (en) | 2000-03-21 | 2000-03-21 | Tin container structure improvement for tin soldering furnace |
Publications (1)
Publication Number | Publication Date |
---|---|
TW421094U true TW421094U (en) | 2001-02-01 |
Family
ID=21665547
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89204512U TW421094U (en) | 2000-03-21 | 2000-03-21 | Tin container structure improvement for tin soldering furnace |
TW089204512U TW483355U (en) | 2000-03-21 | 2001-08-31 | Structure improvement for tin tank device of tin soldering furnace |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089204512U TW483355U (en) | 2000-03-21 | 2001-08-31 | Structure improvement for tin tank device of tin soldering furnace |
Country Status (1)
Country | Link |
---|---|
TW (2) | TW421094U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100459827C (en) | 2002-05-16 | 2009-02-04 | 横田技术有限公司 | Reflow soldering device |
-
2000
- 2000-03-21 TW TW89204512U patent/TW421094U/en not_active IP Right Cessation
-
2001
- 2001-08-31 TW TW089204512U patent/TW483355U/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW483355U (en) | 2002-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |