TW418297B - Fluid storage and dispensing system - Google Patents

Fluid storage and dispensing system Download PDF

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Publication number
TW418297B
TW418297B TW088120690A TW88120690A TW418297B TW 418297 B TW418297 B TW 418297B TW 088120690 A TW088120690 A TW 088120690A TW 88120690 A TW88120690 A TW 88120690A TW 418297 B TW418297 B TW 418297B
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Taiwan
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fluid
container
gas
distribution
storage
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TW088120690A
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Chinese (zh)
Inventor
Luping Wang
Glenn M Tom
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Advanced Tech Materials
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Priority claimed from US09/300,994 external-priority patent/US6089027A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/32Hydrogen storage

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  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Abstract

A fluid storage and dispensing system (10) comprising a vessel (12) for holding a fluid (17) at a desired pressure. The vessel has a pressure regulator (26) set at a predetermined pressure. The regulator may be interiorly or exteriorly positioned, single-staged or multi-staged, and is associated with a port of the vessel. A dispensing assembly, e.g., including a flow control means such as a valve (20), is arranged in gas/vapor flow communication with the regulator (26), whereby the opening of the valve effects dispensing of gas/vapor from the vessel (12). The fluid in the vessel may be constituted by a liquid that is confined in the vessel at a pressure in excess of its liquefaction pressure at prevailing temperature conditions, e.g. ambient (room) temperature.

Description

五、發明說明(1) 發明說明 發明之領域 本發明係關於一種流體儲存及氣體分配系統’可利用其 儲存高壓液體或其他流體,供自系統分配氣體,並在諸如 製造半導體裝置及材料之應用,使用所分配之氣體。 相關技藝之說明 在種種工業加工及應用,需要一可靠之處理流體源。 此等加工及應用領域包括半導體製造,離子植入,平板 顯示器之製造’醫療介入及治療,水處理,緊急呼吸設 備,熔接操作,空間基液體及氣體輸送等。 1 988年5月17日授予Karl O.Knollmueller之美國專利 4, 744, 221號’揭示一種在溫度約至+ 3〇 °c,使胂與 孔大小在約5至1 5埃範圍之沸石接觸,以將胂吸附在沸 石’藉以儲存及隨後輸送胂之方法。胂隨後藉將沸石加熱 至升高之溫度至多約1 7 5。(:足夠時間予以分配,以將胂自 沸石材料釋出。V. Description of the invention (1) Field of the invention The invention relates to a fluid storage and gas distribution system that can use it to store high-pressure liquids or other fluids for distributing gas from the system, and is used in applications such as manufacturing semiconductor devices and materials Use the assigned gas. Description of related techniques In various industrial processes and applications, a reliable source of processing fluid is required. These processing and application fields include semiconductor manufacturing, ion implantation, manufacturing of flat panel displays' medical intervention and treatment, water treatment, emergency breathing equipment, welding operations, space-based liquid and gas transportation, and so on. U.S. Patent No. 4,744,221, issued to Karl O. Knollmueller on May 17, 1988, discloses a method for contacting rhenium with zeolites having a pore size in the range of about 5 to 15 angstroms at a temperature of about + 30 ° c. To adsorb radon on zeolite for storage and subsequent transport of radon. Rhenium is then heated by heating the zeolite to an elevated temperature of up to about 175. (: Allow sufficient time to dispense tritium from the zeolite material.

tKn〇HmUeller專利所揭示之方法具有缺點,因為其需 f f ί加ί裝置供沸石材料,將沸石加熱至足夠溫度,以 使先=吸者之胂以希望之量自沸石解除吸附。 為有問題,因為容器一般為m:套或其他裝置, 配操作導入顯著之滯後時間。而者之…、谷量,並因此對分 解’導致形成氫氣,其將爆炸:$逡胂之加熱導致其分 胂之此種熱促成分解,在加】f險^入加工系統。另外’ 系統完成在氣體壓力之實際The method disclosed in the tKn0HmUeller patent has disadvantages because it requires a f f ί addition device for the zeolite material to heat the zeolite to a sufficient temperature so that the adsorbent can desorb from the zeolite in a desired amount. This is problematic because the container is generally an m: sleeve or other device, and the operation introduces a significant lag time. In addition, ..., the amount of grains, and therefore the decomposition of the 'cause the formation of hydrogen, which will explode: the heating of $ 逡 胂 causes the decomposition of this heat to promote decomposition, and it is in danger to enter the processing system. In addition, the system completes the actual gas pressure

4 1829 7 五、發明說明(2) 增加’自系統之使用期限及操作效率之觀點,其可能極具 缺點,並有安全顧慮。 在沸石床本身提供在内部配置之加熱線圈或其他加熱元 件,由於此等裝置難以將沸石床均勻加熱,以達成胂氣體 釋出之希望均勻度,而有問題。 使用加熱之載體氣體流通過在其密閉容器中之沸石床, 了克服上所述缺失,但達成肺之加熱載體氣體解除吸附所 必要之溫度,可能不合宜高,或否則不適合胂氣體之最後 使用’因而隨後需要冷卻或其他處理,以調節分配之氣體 供最終使用。 1996 之名義 及分配 專利中 人專利 置,供 有機金 配容器 諸如* 之壓力4 1829 7 V. Description of the Invention (2) Increasing the term of use of the system and the efficiency of operation may be extremely disadvantageous and have safety concerns. The zeolite bed itself is provided with heating coils or other heating elements, which are problematic because it is difficult for these devices to uniformly heat the zeolite bed to achieve the desired uniformity of tritium gas release. The use of heated carrier gas flow through the zeolite bed in its closed container overcomes the above-mentioned shortcomings, but the temperature necessary to reach the lung's heated carrier gas to desorb may be undesirably high or otherwise unsuitable for the final use of tritium gas 'Thus cooling or other processing is then required to regulate the distributed gas for end use. Nominal and assigned patents in 1996, for organic gold and containers with pressure such as *

年5 月21 日,以Glenn M. Tom及James V. McManus 所授予之美國專利5, 51 8, 528號,說明一種供儲存 氣體之氣體儲存及分配系統,其克服£11〇1 ^ 所揭示,以上所討論氣體供給加工之缺點^ τ⑽等 之氣體儲存及分配系統,包含一吸附_解除吸附裝 儲存及分配氣體,例如氫化物氣體,齒 屬類組v化合物等。-等人專利之氣體儲存氣及體分U.S. Patent No. 5,51 8,528, issued by Glenn M. Tom and James V. McManus, on May 21, 2015, describes a gas storage and distribution system for storing gas, which overcomes £ 1101 ^ disclosed The disadvantages of the gas supply processing discussed above ^ τ and other gas storage and distribution systems include an adsorption-desorption device to store and distribute gas, such as hydride gas, genus group V compounds, etc. -Patented gas storage gas and components

種!逆反吸附至一種載體吸著劑, 種'弗石或活性碳材料’藉以減低所儲存吸著物氣f 更特別是’此種儲存及分配系統 器,構造並設置為供交鉍 ^ #及分g 使氣體選擇性流入及流出, 者劑媒負,』 質,在内部氣體壓力配置在嗲在 物理及耆矣 罝在及儲存及分配容器;一種令Species! Reverse adsorption onto a carrier sorbent, which is used to reduce the stored sorbent gas f. More specifically, 'this storage and distribution system is constructed and set to deliver bismuth ^ # And g make the gas selectively flow in and out, or the agent medium is negative, and the internal gas pressure is arranged in the physical and the storage and distribution containers;

41829T 五、發明說明(3) ' ---- 物氣體’物理吸附在固相物理吸著劑媒質;一分配總成, 聯'1為與儲存及分配容器成氣體流動相通,並且構造及設 置為在儲存及分配容器外部提供一低於該内部壓力之壓 力,以完成吸著物氣體自固相物理吸著劑媒質解除吸附, 及巧除吸附氣體之氣體流動通過分配總成;其中固相物理 吸著劑媒質無微量組份,諸如水,金屬,及氧化過渡金屬 類(例如氧化物,亞硫酸鹽及/或硝酸鹽),其否則將會在 儲存及分配容器分解吸著物氣體。 自固相物理吸著劑媒質消除此等微量組份,吸著物氣體 之分解例如在1年後’在25 t及内部壓力狀況,保持在極 低水準’致使以分解吸著物氣體之重量計不超過卜5%。 相對於先則技藝使用高壓氣體鋼瓶’ T 〇 m等人專利之儲 存及分配容器因此在該項技藝具體實施一項實際進展。習 知高壓氣體鋼瓶易受自損壞或故障調節器總成泄漏之影 響’以及如果氣體之内部分解導致在鋼瓶快速增加内部氣 體壓力’易受斷裂或其他不想要之氣體自鋼瓶大量釋出之 影響。 因此在該項技藝需要提供克服以上所說明各種缺失之改 進流體儲存及輸送系統,供選擇性分配氣體。 相對於該項技藝現況,以及如在下文更完全說明之本發 明,相關技藝包括下列參考資料:授予Stenner之美國專利 3,590,860號(a manual adjustable regulator for a liquid propane cartridge, including a regulator diaphragm and actuating spring assembly);授予41829T V. Description of the invention (3) '---- Gas' is physically adsorbed on the solid-phase physical sorbent medium; a distribution assembly, Lian'1 is in communication with the storage and distribution container for gas flow, and the structure and setting In order to provide a pressure lower than the internal pressure outside the storage and distribution container to complete the desorption of the sorbent gas from the solid phase physical sorbent medium, and the gas that removes the adsorbed gas flows through the distribution assembly; the solid phase The physical sorbent medium is free of trace components such as water, metals, and oxidative transition metals (eg, oxides, sulfites and / or nitrates), which would otherwise decompose the sorbent gas in storage and distribution containers. These solid components are eliminated from the solid-phase physical sorbent medium, and the decomposition of the sorbent gas is, for example, 'maintained at an extremely low level at 25 t and internal pressure conditions' after one year, so that the weight of the sorbent gas is decomposed. Calculated not to exceed 5%. Compared to the prior art, a high-pressure gas cylinder, such as the storage and distribution container patented by Tom et al., Is used to implement a practical progress in this technology. It is known that high-pressure gas cylinders are susceptible to self-damage or leaking regulator assembly leaks' and that if the internal decomposition of the gas causes a rapid increase in the internal gas pressure in the cylinders, it is susceptible to fractures or other undesired gas releases from the cylinders in large quantities . It is therefore necessary in this art to provide an improved fluid storage and delivery system that overcomes the various deficiencies described above for selective gas distribution. Relative to the state of the art, and the present invention as explained more fully below, the related art includes the following references: US Patent No. 3,590,860 to Stenner (a manual adjustable regulator for a liquid propane cartridge, including a regulator diaphragm and actuating spring assembly);

88120690.ptd 第7頁 418297 五、發明說明(4) b b88120690.ptd Page 7 418297 V. Description of Invention (4) b b

Coffre 等人之美國專利4, 836, 242(a pressure reducer for supplying electronic grade gas, including a bellows and inlet valve, with a solid particles filter disposed between the bellows and a low pressure outlet);授予Ollivier 之美國專利 5, 230, 359 號(a diaphragm-based pressure regulator for a high pressure gas cylinder, where i n a valve is positioned in the regulator for adjustably throttling the flow of pressurized fluid);授予 63^11〇1^1^,<11:5>之美國專利3,699,998 號(8 cali bratable pressure regulator in whichleaf spring fasteners are ut1i zed to retain regulator components in position);授予Mays 之美國專利 3,791,412 號(a pressure reducing valve for high pressure gas container, including a pair of valve elements for dispensing low pressure throttled fluid);授予 Wormser 之美國專利3,972, 346 號(pressure regulator featuring a U-ring seal poppet 压5861111315〇;授予£1(13111〇犷6之美國專利4,793,379 號 (button-operated valve for main shut-off and flow control of a pressurized gas cylinder, using magnetic actuation of valve components);授予 Senesky之美國專利2,615,287 號(a gas pressure regulator including diaphragm andCoffre et al. U.S. Patent 4, 836, 242 (a pressure reducer for supplying electronic grade gas, including a bellows and inlet valve, with a solid particles filter disposed between the bellows and a low pressure outlet); U.S. Patent 5 to Ollivier No. 230, 359 (a diaphragm-based pressure regulator for a high pressure gas cylinder, where ina valve is positioned in the regulator for adjustably throttling the flow of pressurized fluid); awarded 63 ^ 11〇1 ^ 1 ^, < 11 : 5 > US Patent No. 3,699,998 (8 cali bratable pressure regulator in whichleaf spring fasteners are ut1i zed to retain regulator components in position); US Patent No. 3,791,412 to Mays (a pressure reducing valve for high pressure gas container, including a pair of valve elements for dispensing low pressure throttled fluid); U.S. Patent No. 3,972,346 to Wormser (pressure regulator featuring a U-ring seal poppet pressure 5861111315〇; U.S. Patent No. 4,793,379 (13111〇6) ( button-operated valve for main shut-off and flow control of a pressurized gas cylinder, using magnetic actuation of valve components); US Patent No. 2,615,287 to Senesky (a gas pressure regulator including diaphragm and

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88120690.ptd 第8頁 » 418297 五、發明說明(5) diaphragm-clamping member elements);授予 Martin 之 美國專利4, 1 73, 986 號(pressurized gas flow control valve including pressure regulator and responsive poppet valve structure);授予Baumann 等人之美國專利 3, 388, 962 lfe(pressurized gas fuel metering device including sintered metal pellet flow element);授 予Jenkins 之美國專利1,679,826 號(fluid pressure regulator for high pressure container, utilizing diaphragm element and gas filtering means comprising a felt strip);授予 St。Clair 之美國專利 2,354,283號(fluid pressure regulator for petroleum gas tanks, comprising pressure actuated diaphragm with flow restrictor structure to minimize vibration);授予Lhomer等人之美國專利5, 566,713號 (gas flow control dispensing assembly including pi ston-type pressure regulator and block reducer/regulator means);授予Amidzich之美國專利 5, 645, 192號(valve assembly for relieving excess gas pressure in a container, comprising sealing ring/spring assembly);授予Cannet等人之美國專利 5,678,602 號(gas control and dispensing assembly for a pressurized gas tank, including reducer and regulator means with indexed flowmeter valve);授 予Webster 之美國專利2, 793, 504 號(valve for88120690.ptd Page 8 »418297 V. Description of the invention (5) diaphragm-clamping member elements); US Patent No. 4, 1 73, 986 issued to Martin (pressurized gas flow control valve including pressure regulator and responsive poppet valve structure); U.S. Patent 3,388,962 lfe (pressurized gas fuel metering device including sintered metal pellet flow element) to Baumann et al .; U.S. Patent No. 1,679,826 to Jenkins (fluid pressure regulator for high pressure container, reducing diaphragm element) and gas filtering means comprising a felt strip); awarded to St. Clair U.S. Patent No. 2,354,283 (fluid pressure regulator for petroleum gas tanks, including pressure actuated diaphragm with flow restrictor structure to minimize vibration); U.S. Patent No. 5,566,713 (Lomar et al., Gas flow control dispensing assembly including pi ston) -type pressure regulator and block reducer / regulator means); US Patent No. 5,645, 192 to Amidzich (valve assembly for relieving excess gas pressure in a container, including sealing ring / spring assembly); US patent to Cannet et al. No. 5,678,602 (gas control and dispensing assembly for a pressurized gas tank, including reducer and regulator means with indexed flowmeter valve); U.S. Patent No. 2,793,504 to Webster (valve for

88120690.ptd 第9頁 4 18zy 7 五、發明說明(6)88120690.ptd Page 9 4 18zy 7 V. Description of Invention (6)

pressurized fluid container including pressure reducer and regulator and spring bias closure means);授予Harris 之美國專利 1,659,263 號(regulator for pressurized gas cylinder including a diaphragm and anti-friction washer between diaphragm and annular seat of regulator);授予Thomas之美國專利 2,047,339號(liquefied petroleum gas storage apparatus including flow control unit and leakage prevention valve);以及授予Baumann等人之美國專利 3,994,674號(detachable burner assembly for container of pressurized liquefied combustible gas, including a regulator valve assembly)。 因之本發明之一項目的’為提供一種克服先前作法之上 述缺失,供選擇性分配氣體之改進流體儲存及分配系統。 本發明之另一目的’為提供一種供選擇性分配氣體之改 進流體儲存及分配系統,特徵為在成本,容易使用,及性 能上之顯著優點。 自隨後之揭示及後附申請專利範圍,將會更完全明白本 發明之其他諸多目的及優點。pressurized fluid container including pressure reducer and regulator and spring bias closure means); US Patent No. 1,659,263 (regulator for pressurized gas cylinder including a diaphragm and anti-friction washer between diaphragm and annular seat of regulator) to Harris; US patent to Thomas No. 2,047,339 (liquefied petroleum gas storage apparatus including flow control unit and leakage prevention valve); and U.S. Patent No. 3,994,674 to Baumann et al. (Detachable burner assembly for container of pressurized liquefied combustible gas, including a regulator valve assembly) . Therefore, one of the items of the present invention is to provide an improved fluid storage and distribution system for selectively distributing gas, which overcomes the above-mentioned shortcomings of the previous practice. Another object of the present invention is to provide an improved fluid storage and distribution system for selective gas distribution, which is characterized by significant advantages in terms of cost, ease of use, and performance. Many other objects and advantages of the present invention will be more fully understood from the subsequent disclosure and the appended patent application scope.

發明之概沭 本發明係關於一種供儲存及分配流體之系統,供使用於 諸如製造半導體產品之應用。 本發明之流體儲存及氣體分配系統,包含一儲存及分配 容器,構造並設置為供容納一種其蒸汽構成將行予以分配Summary of the Invention The present invention relates to a system for storing and distributing fluids for use in applications such as manufacturing semiconductor products. The fluid storage and gas distribution system of the present invention includes a storage and distribution container, which is constructed and arranged to hold a vapor composition for distribution.

88120690.ptd 第10頁 41829788120690.ptd Page 10 418297

五、發明說明(7) +之# 級體例如在其流體為在液體狀態之壓 以合納在儲存及分配容器内。储存及分配容器包括 並裝有一聯結至出口之分配總成,其玎例如包含 碩L成,包括一分配閥及—出口,供選擇性排出自容 之液體所導得之氣體。 力, 一出 〜閥 器内 成體壓力調節器與出口關聯,並可例如在容器之頸部 與出口關聯之麈力調節器/分相器總成之一部份, 恤^體容留在容器内,並在流體在液體形式時,防止液 器 ' 漏至分配閥及出口。壓力調節器及任選所包括之分相 ^以設置為位於自容器通過出口所分配流體之流動路^ 遷力調節器及任選所包括之分相器,可配置在容器内 或外部。較佳為’此等元件予以在配置内部,以使在使 办時搜擊及環境暴露之可能性最小,並使所容納之流體自 备器之泄漏路徑最小。在壓力調節器及任選所包括之分相 器予以在内部配置時,容器可利用一在出口之單一焊接或 接縫密封容器。 ^ ^相器可適當包含一多孔膜月,其可透自液體所導得之 蒸'α或氣體’但不可透液體,並且分相器較佳為配置在壓 力調節器上游之保護模式,致使在容器内所容納之流體為 液體時’防止液體進入及妨礙壓力調節器保持液體在容器p 内之功能,並防止液體自容器流出。 調節器為一流動控制裝置,其可予以設定在預定壓力水 準’以在此壓力水準自鋼瓶分配氣體或蒸汽。依分配狀 況’及自容器氣體排出之模式而定,壓力水準設定點可為V. Description of the invention (7) The + -stage body is contained in a storage and distribution container, for example, when its fluid is in a liquid state. The storage and distribution container includes and is equipped with a distribution assembly connected to the outlet, which includes, for example, a large assembly, including a distribution valve and an outlet for selectively discharging the gas derived from the self-contained liquid. The output pressure is associated with the outlet and the body pressure regulator in the valve is associated with the outlet, and can be part of the pressure regulator / phase separator assembly associated with the outlet at the neck of the container, for example. Inside and when the fluid is in liquid form, prevents the dispenser 'from leaking to the dispensing valve and outlet. The pressure regulator and optional phase separator ^ are set to be located in the flow path of the fluid dispensed from the container through the outlet ^ The force regulator and the optional phase separator can be placed inside or outside the container. It is preferable that these elements are arranged inside to minimize the possibility of search and environmental exposure during operation and to minimize the leakage path of the contained fluid self-container. When pressure regulators and optional phase separators are configured internally, the container may be sealed with a single weld or seam at the outlet. ^ ^ The phaser may suitably include a porous membrane, which is permeable to the vapor 'α or gas' derived from the liquid but is impermeable to liquid, and the phase separator is preferably a protection mode arranged upstream of the pressure regulator. When the fluid contained in the container is a liquid, it prevents the liquid from entering and prevents the pressure regulator from keeping the liquid in the container p, and prevents the liquid from flowing out of the container. The regulator is a flow control device that can be set at a predetermined pressure level 'to distribute gas or steam from the cylinder at this pressure level. Depending on the distribution status ’and the mode of gas venting from the container, the pressure level set point can be

88120690.ptd 第11買 418297 五、發明說明(8) 超大氣壓,次大氣壓或大氣壓壓力。 本發明之流體儲存及分配容器,可以習知高壓氣體鋼瓶 之方式形成,有一細長主體部份,相對於容器之主體剖 面’有一縮小剖面積之頸部。容器可在此形體適合於習知 製造,其中容器予以清潔,並且然後安裝一閥頭總成,包 括一在岐管配置中之閥(手動或自動),以及關聯之壓力及 流動控制元件。 雖然在使用本發明之流體儲存及氣體分配系統時,液體 =佳作為谷納之流體媒f,但也可利用高塵力氣體,作為 予以儲存及選擇性分配之流體媒質。 ,用-種習知壓力調節器’設定流體塵力調節器在適當 ,厭ί水準:致使氣體或蒸汽為在低於壓力調節器設定點 衽-蓝叙藉二可容易填滿儲存及分配容器,壓力調節器包 Ϊ it:,其可藉一偏壓元件,諸如-彈簧偏壓元 ί壓:=一閉合位置’並且其響應高於設定點壓力 門π,i ^力閉合,但其響應低於設定點壓力之壓力而 開口’並允許流體流動通過。 因之,在容器建立壓力調節器之 内部壓力水準,藉以免誶齑駚、,么如動凡件自其座刀離之 0 方式流入容器,藉以可實力分配模式之逆向流動 以及在第一情㊉,允許容自容器流出以供分配, 要不然,容器可ML;?單一 口充填流體。 了予以構形為具有雙流體流動口,盆可適88120690.ptd Buy 11 418297 V. Description of the invention (8) Superatmospheric, sub-atmospheric or atmospheric pressure. The fluid storage and distribution container of the present invention can be formed in a manner known in high pressure gas cylinders, and has an elongated main body portion, and a neck portion with a reduced cross-sectional area relative to the main body cross-section of the container. The container in this form is suitable for conventional manufacturing, where the container is cleaned and then a valve head assembly is installed, including a valve (manual or automatic) in a manifold configuration, and associated pressure and flow control elements. Although in the use of the fluid storage and gas distribution system of the present invention, liquid is preferably used as the fluid medium f of Guna, but high dust gas can also be used as the fluid medium for storage and selective distribution. Use a conventional pressure regulator to set the fluid dust regulator at an appropriate level, so that the gas or steam is below the pressure regulator set point.-Lan Suo Born II can easily fill storage and distribution containers. The pressure regulator includes it: It can borrow a biasing element, such as-a spring biasing element: = a closed position 'and its response is higher than the set point pressure gate π, i ^ force closes, but its response A pressure below the set point pressure opens and allows fluid to flow through. Therefore, the internal pressure level of the pressure regulator is established in the container, so as to avoid 谇 齑 駚, so that everything moves into the container in a manner of 0 away from its seat, so that the reverse flow of the power distribution mode and the first situation Alas, the container is allowed to flow out of the container for distribution. Otherwise, the container can be ML;? A single mouth filled with fluid. In order to be configured with dual fluid flow ports, the basin can be adapted

418297 五、發明說明(9) J單獨之充填及分配管線。例如,分配口可位於容器之頸 Z,並與-習知閥頭總成關聯,而充填口可提供在容器結 構之另一位置。 可利用本發明之容器,供儲存及分配任何適當流體,諸 =如氫化物流體(例如肿,膦,録化三氫,石夕烧等)以及酸 1氣體(例如氣化氫,氯化氫,氣,三氯化蝴,四氟化硼,齒化 石夕燒及乙石夕烧等),供使用於半導體製造操作。 在使用時,可提供一分配閥,作為與容器之口關聯之分 配總成之一部份,並且此閥可手動或自動開啟,以允許氣 ,流動通過多孔膜片或分相器元件(在存在時)’及通過調 節器,供自流體儲存及分配系統排出氣體,以及隨後流動 至—下游加工系統’諸如離子植入裝置,化學汽相沉積 室’半導體設備清潔站等。 在另一方面,本發明係關於一種供儲存及分配流體之方 法,包含: 在對流體壓力調印器之限定狀態,將流體容納在對流體 壓力調節器之流體流動下游閉合之流體流動路徑;以及 開啟流體流動路徑至流體壓力調節器之流體流動了游, 藉以選擇性分配限定之流體,並以流體壓力調節器所域定 之速率排出流體, 在分配為在流體壓力調節器分相之上游時,任選其中容 納之流體為一種液體及流體’以允許僅自容納在限定狀雜 之流體排出氣體。 在另一方面,本發明係關於一種流體儲存及分配系統,418297 V. Description of the invention (9) J Separate filling and distribution pipeline. For example, the dispensing port may be located at the neck Z of the container and associated with the conventional valve head assembly, while the filling port may be provided at another location in the container structure. The container of the present invention can be used for storage and distribution of any suitable fluids, such as hydride fluids (such as swollen, phosphine, hydrogenated trihydrogen, sybarium, etc.) and acid 1 gas (such as hydrogenated gas, hydrogen chloride, gas , Trichloride butterfly, boron tetrafluoride, tooth fossil yaki and yishi yaki, etc.) for semiconductor manufacturing operations. In use, a distribution valve can be provided as part of the distribution assembly associated with the mouth of the container, and this valve can be manually or automatically opened to allow gas to flow through the porous membrane or phaser element (in the (If present) 'and through regulators for exhausting gas from the fluid storage and distribution system, and subsequently flowing to-downstream processing systems' such as ion implanters, chemical vapor deposition chambers, semiconductor equipment cleaning stations, etc. In another aspect, the invention relates to a method for storing and distributing fluid, comprising: in a restricted state of a fluid pressure regulator, containing the fluid in a fluid flow path closed downstream of the fluid flow of the fluid pressure regulator; and The fluid that opens the fluid flow path to the fluid pressure regulator flows, thereby selectively distributing the defined fluid, and discharging the fluid at a rate defined by the fluid pressure regulator. When it is distributed upstream of the phase division of the fluid pressure regulator, Optionally, the fluid contained therein is a liquid and fluid 'to allow gas to be exhausted only from the fluid contained in the confined impurities. In another aspect, the invention relates to a fluid storage and distribution system,

4 16^97 五、發明說明(ίο) 包含: 一流體儲存及分配容器,包封一内部容積,供容納一種 流體’其中容器包括一流體流動口; 一流體分配總成,聯結成與該口流體流動相通; 一雙級流體壓力調節器,與該口關聯,並設置為在容器 之内部容積保持預定壓力; 流體分配總成,為可選擇性作動’以使自容器内部容積 之流體導得之氣體流動通過雙級流體歷力調節器及流體分 配總成,供氣體自容器排出。 在另一方面,本發明係關於一種流體儲存及氣體分配系 統,包含: 一儲存及分配容器,構造並設置為供容納一種其蒸汽構 成予以分配之流體之液體,其中流體予以在其流體為在液 體狀態之壓力容納在儲存及分配容器; 儲存及分配容器包括一流體流動口; —分配總成聯結至出口;以及 一雙級流體廢力調節器/微粒過濾器總成,在内部配置 在容器;以及4 16 ^ 97 V. Description of the invention (ίο) Contains: a fluid storage and distribution container, enclosing an internal volume for containing a fluid, wherein the container includes a fluid flow port; a fluid distribution assembly connected to the port Fluid flow is communicated; a two-stage fluid pressure regulator is associated with the port and is set to maintain a predetermined pressure in the internal volume of the container; the fluid distribution assembly is selectively actuated to allow fluid from the internal volume of the container to be conducted The gas flows through the two-stage fluid calendar regulator and the fluid distribution assembly for the gas to be discharged from the container. In another aspect, the invention relates to a fluid storage and gas distribution system comprising: a storage and distribution container constructed and arranged to hold a liquid whose vapor constitutes a fluid to be distributed, wherein the fluid is The pressure of the liquid state is contained in the storage and distribution container; the storage and distribution container includes a fluid flow port;-the distribution assembly is connected to the outlet; and a two-stage fluid waste conditioner / particulate filter assembly, which is arranged inside the container ;as well as

裝置’供選擇性作動分配總成,以完成自容器中之液體 所導得氣體之流動’通過流體調節器/微粒過濾器總成及 分配總成’供自系統排出氣體。 在另一方面 法,包含: 本發明係關於一 種供儲存及分配流體之方 在對流體壓力調節器之限定狀態 I流體容納在對流體The device 'is used to selectively actuate the distribution assembly to complete the flow of the gas derived from the liquid in the container' through the fluid regulator / particulate filter assembly and the distribution assembly 'for exhausting gas from the system. In another aspect, the method comprises: The present invention relates to a method for storing and distributing fluid in a restricted state of a fluid pressure regulator.

88120690.ptd 第14頁 418297 流體流動下游閉合之 動路徑至流體壓力調 配限定之流體,並以 體。 一方面,係關於一種 力調節器之限定狀態 流體流動下游閉合之 動路徑至流體壓力調 配限定之流體,並以 體;以及 體產品時使用排出之 本發明之另一方面,係關於一種 包含一容納一種物理吸附材料之容 約5 0psig(表計磅/平 一氣體分配總成,與 五、發明說明(11) 壓力調節器之 開啟流體流 藉以選擇性分 之速率排出流 本發明之另 法,包含: 在對流體壓 壓力調節器之 開啟流體流 藉以選擇性分 之速率排出流 在製造半導 中在内部壓力 附在其上,及 操作自容器分配氣體 流體流動路徑;以及 節器之流體流動下游 流體壓力調節器所確定 製造半導體產品之方 ,將流體容納在對淹 流體流動路徑;以及 節器之流體流動下游, 流體壓力調節器所讀定 流體。 /J|I*體儲存及分配系姚’ 器,有一種氣體在容器 方吋)至5000psig,吸 容器聯結,並選擇性< 在一另外方面,本發明係關於一種半導體製造系統,包 含一利用一種氣體,及該氣體源之半導體製造裝置,其肀I〕 此源包含一容納一種物理吸附材料之容器,有一種氣體在 容器令在内部壓力約50psig至5000pSig,吸附在其上,及 一氣體分配總成,與容器聯結’並選擇性可操作自容器分 配氣體。 本發明之再一方面係關於一種供儲存及分配流體之方88120690.ptd Page 14 418297 The closed motion path downstream of the fluid flow to the fluid pressure dispenses the defined fluid, and the body. On the one hand, it relates to a closed state of a fluid flow path downstream of a force regulator to a fluid pressure to dispense a defined fluid and use the body; and in another aspect of the present invention, the use and discharge of a body product relates to a method comprising a The capacity to contain a physical adsorption material is about 50 psig (gauge pounds per square meter of a gas distribution assembly, and 5. Description of the invention (11) The pressure regulator opens the fluid flow to discharge the flow at a selective fraction rate. Containing: the opening of the fluid flow to the fluid pressure pressure regulator at a selective fractional rate, the exhaust flow is attached to the internal pressure in the manufacturing semiconductor, and the gas flow path for distributing gas from the container is operated; and the fluid flow of the restrictor The downstream fluid pressure regulator determines the method of manufacturing semiconductor products, and holds the fluid in the submerged fluid flow path; and downstream of the node's fluid flow, the fluid pressure regulator reads the fluid. / J | I * Bulk storage and distribution system Yao 'device, there is a kind of gas in the container inch) to 5000psig, the suction container is connected, and optionally < In one aspect, the present invention relates to a semiconductor manufacturing system including a semiconductor manufacturing device utilizing a gas and the gas source, the source of which includes a container containing a physical adsorbent material, and a gas in the container and an interior thereof. The pressure is about 50 psig to 5000 pSig, adsorbed on it, and a gas distribution assembly, which is connected to the container 'and is selectively operable to distribute gas from the container. Another aspect of the invention relates to a method for storing and distributing fluids.

418297 五、發明說明(12) 法,包含: 在壓力在約5 0至5 0 0 0 p s i g之範圍,將流體容納在至少部 份吸附狀態;以及 將流體自吸附狀態解除吸附,並將其自密閉容器釋出, 藉以選擇性分配流體。 本發明之另一方面,係關於一種流體儲存及分配系統, 包含 一流體儲存及分配容器,包封一内部容積少於約5 〇公 升,並有一進口開口大於1吋NGT ; —流體分配總成,設置為供自容器選擇性分配流體;以 及 一在容器内部容積之流體壓力調節器,設置為在其中保 持預定壓力。 谷器可有一内部容積少於約2〇公升,並且最佳為少於約 1 0公升’例如在約1至1 〇公升之範圍β此容器可予以構形 及成尺寸及形狀如在下文所更完全說明。容器較佳為有— 壓力容量’亦即一可適應而無不利效應之連續服務壓力水 準(容器斷裂或流體自其泄漏),直到至少約1〇〇〇磅〆平方 吋,並且更佳為至多約5000磅/平方吋。容器可予以設置418297 V. Description of the invention (12) method, comprising: accommodating the fluid in at least a partially adsorbed state at a pressure in a range of about 50 to 5000 psig; and desorbing the fluid from the adsorbed state, and The closed container is released to selectively distribute the fluid. Another aspect of the present invention relates to a fluid storage and distribution system, including a fluid storage and distribution container, enclosing an internal volume of less than about 50 liters, and having an inlet opening greater than 1 inch NGT;-fluid distribution assembly , Configured to selectively distribute fluid from the container; and a fluid pressure regulator in the internal volume of the container, configured to maintain a predetermined pressure therein. The trough can have an internal volume of less than about 20 liters, and preferably less than about 10 liters', e.g. in the range of about 1 to 10 liters. This container can be shaped and sized and shaped as described below More fully explained. The container preferably has a "pressure capacity", which is an adaptable continuous service pressure level (the container breaks or fluid leaks from it) without adverse effects, up to at least about 1,000 pounds square inches, and more preferably at most About 5000 pounds per square inch. Container can be set

為選擇性分配至一下游耗用氣體設施,例如半導體製造設 施。 本發明之又一方面,係關於一種半導體製造系統,包含 一利用一種氣體,及該氣體源之半導體製造裝置,其中該 源包含:For selective distribution to a downstream gas-consuming facility, such as a semiconductor manufacturing facility. Another aspect of the present invention relates to a semiconductor manufacturing system including a semiconductor manufacturing apparatus using a gas and the gas source, wherein the source includes:

88120690.ptd 第16頁 4 18297 五、發明說明(13) 一流體儲存及分配容器,包封一内部容積少於約5 0公 升’並有一進口開口大於1吋NGT ; 一流體分配總成,設置為供自容器選擇性分配流體;以 及 一流體壓力調節器,在容器之内部容積,設置為在其中 保持預定壓力。 在另一方面,本發明係關於一種流體儲存及分配容器, 包含一 2.0-2,25 公升 DOT 3AA 2015 鋼瓶,有一 1.5 吋 NGT 開口,有1 1/2-11 1/2NGT螺紋,4, 187至4. 25吋外徑,額 定壁厚度0· 094至〇· 125吋,及長度12. 75至13. 75吋。 本發明之再一方面’係關於一種流體儲存及分配總成, 包含一容器有一内部容積少於50公升及一H吋阢^頸部開 口’ 一分配總成聯結至頸部開口,一調節器聯結至分配總 成,並配置在容器之内部容積。 自隨後之揭示及後附申請專利範圍,將會更完全明白在 本發明之其他諸多方面,特色及實施例。 發-明及其較佳會施例之詳細說明 本發明係部份依據發現將一流體壓力調節器配置在限定 之液體容積與一包括氣體流動控制元件,諸如氣體流動势 ,質量流動控制器’或類似者之氣體分配總成之間, 藉以可容易製成一種型式為提供代替Tora等人美國專利 5, 518, 5 28號之流體儲存及分配系統之流體儲存及分配系 統。 輔助此項發現,為發現流體壓力調節器可有利在内部配88120690.ptd Page 16 4 18297 V. Description of the invention (13) A fluid storage and distribution container encapsulating an internal volume of less than about 50 liters' and an inlet opening greater than 1 inch NGT; a fluid distribution assembly, set For selective distribution of fluid from the container; and a fluid pressure regulator provided in the internal volume of the container to maintain a predetermined pressure therein. In another aspect, the present invention relates to a fluid storage and distribution container comprising a 2.0-2,25 liter DOT 3AA 2015 cylinder, a 1.5-inch NGT opening, 1 1 / 2-11 1/2 NGT threads, 4, 187 To 4.25 inches outer diameter, rated wall thickness 0. 094 to 0. 125 inches, and length 12.75 to 13.75 inches. Another aspect of the present invention is 'a fluid storage and distribution assembly, including a container having an internal volume of less than 50 liters and a H-inch 阢 ^ neck opening', a distribution assembly connected to the neck opening, a regulator It is connected to the distribution assembly and is arranged in the internal volume of the container. From the subsequent disclosure and appended patent application scope, many other aspects, features and embodiments of the present invention will be more fully understood. The detailed description of Faming and its preferred embodiments The present invention is based in part on the discovery that a fluid pressure regulator is configured to a defined liquid volume and that includes a gas flow control element such as a gas flow potential, a mass flow controller ' Or similar gas distribution assemblies, so that a type of fluid storage and distribution system can be easily made to provide a fluid storage and distribution system that replaces Tora et al. US Patent No. 5,518,5 28. To assist in this discovery, to find that the fluid pressure regulator can be

88120690.ptd 第17頁88120690.ptd Page 17

/Π 82 9 T 五、發明說明(14) ---------—-- 置在流體儲存及分邴贲取 ,〇 &冰& ; α ^,以便其藉容器,例如鋼瓶套殼 " , “礎,以防揸擊,環境暴露及損壞。 々然流體[力調節器較佳為在内部配置在流體儲存及分 gp今器’但在本發明之廣義實施,可將此元件配置在容器 夕部。本發明因此廣義擬想提供與容器之流體流動口關聯 之内部及外部配置之流體壓力調節器裝置。 流體壓力調節器可為任何適當型式,例如Inte^a^d Flow Systems, Inc.所發售之SR4系列設定壓力調節器。 如在發明之概述段其所討論,流體壓力調節器可為一種提 動閥型 包含一提動元件,其予以偏壓至一座結構,以 防止在高於設定點值壓力之流動。 設定點可為一”天然”或固定設定點裝置,或裝置可包含 二:,設定點(可調整)裝置。較佳為,流體壓力調節器就 ,、汉疋點壓力而言為一可變,可調整裝置◎意在作為實 例,流體壓力調節器可予以設定至適當水準,例如7〇〇 分配總成之流動控制闕,藉以使與容器 分配;成對流動開啟時,在此設定點 1力水準,挺供分配之流體自儲存及分配容 、在流體儲存及分配容器中之流體媒質,可為^ 流體儲存狀況之任何適當流體媒冑 p 則為-種液體,在流體【所;:種高”Γ 作為予以分配之氣體源。因此定點壓力, 高壓氣體或一種液化氣體。 、 乳體源可為一種 任選並合宜利用一分相器,以在氣體源為高壓液體時,/ Π 82 9 T V. Description of the invention (14) ------------ placed in fluid storage and decanting, 〇 & 冰 &; α ^, so that it can borrow containers, such as "Cylinder cover", "foundation, to prevent thumping, environmental exposure and damage. Natural fluid [The force regulator is preferably arranged internally in the fluid storage and distribution gp device ', but in the broad implementation of the present invention, can This element is arranged in the container. The present invention therefore broadly intends to provide internal and external fluid pressure regulator devices that are associated with the fluid flow port of the container. The fluid pressure regulator may be of any suitable type, such as Inte ^ a ^ SR4 series set pressure regulators sold by d Flow Systems, Inc. As discussed in the overview section of the invention, a fluid pressure regulator can be a poppet type including a poppet element that is biased to a structure To prevent flow at pressures higher than the setpoint value. The setpoint can be a "natural" or fixed setpoint device, or the device can contain two: setpoint (adjustable) devices. Preferably, a fluid pressure regulator In terms of pressure It is intended to be used as an example. The fluid pressure regulator can be set to an appropriate level, such as the flow control of a 700 distribution assembly, so as to distribute with the container. When the paired flow is turned on, set the point here 1 force level, the self-storage and distribution capacity of the fluid for distribution, and the fluid medium in the fluid storage and distribution container can be any suitable fluid medium in the fluid storage state, p is a kind of liquid in the fluid : Seed height "Γ as the source of the gas to be distributed. So point pressure, high pressure gas or a liquefied gas. The milk source can be an optional and suitable use of a phase separator, so that when the gas source is a high pressure liquid,

ΗΓ 88120690.pcd 第18頁 418297 五、發明說明(15) 防止液體泄漏越過調節器閥座。分相器可為任何適當形 式,但較佳為包含一多孔臈片,其可透氣體或所容納液體 之蒸汽’但不透液相。供此分相器可透膜片之適當材料, 包括適當孔隙度及可透性特徵之各種聚合材料薄膜,及所 §月之可哞吸"織物’諸如W.L. Gore & Associates,ΗΓ 88120690.pcd Page 18 418297 V. Description of the invention (15) Prevent liquid from leaking past the regulator valve seat. The phase separator may be of any suitable form, but preferably comprises a porous septum which is permeable to the gas or vapor of the contained liquid 'but is impermeable to the liquid phase. Suitable materials for the permeable membrane of this phase separator include various polymeric material films with appropriate porosity and permeability characteristics, as well as absorbing fabrics such as W.L. Gore & Associates,

Inc. (Elkton,MD)以商標"Gore — Tex” ,nActivent", DryLoft ,及"Gore Windstopper"所商業性製造者 e 可在一可在内部配置在流體儲存及分配容器或配置在其 外部之總成,彼此配合利用壓力調節器及分相器。較佳 為’此流體壓力調郎器及分相器總成予以在内部配置 存及分配容器^Inc. (Elkton, MD) under the trademarks " Gore — Tex ", nActivent ", DryLoft, and " Gore Windstopper " are commercially available from manufacturers such as in a fluid storage and distribution container or in a The external assembly uses the pressure regulator and the phase separator in cooperation with each other. It is preferable that the fluid pressure regulator and the phase separator assembly be internally stored and distributed.

在本發明之流體儲存及分配容器所利用之流體,可包含 任何適當流體,諸如例如一種供半導體製造操作之氫化物 ,體。此類型之氫化物流體之實例,包括胂,膦,銻化三 氫,石夕院,氯石夕烧,及乙鄉烧。可採用可用於半導體製造 操作之其他流體,包括在半導體製造操作利用作為齒化物 蝕刻劑,清潔劑,源反應劑等之酸類氣體,諸如氟化氫, 三氣化硼,四氟化硼,氯化氫,鹵化矽烷(例如SiF4)及乙 矽烷(例如Si2F6)等。 本發明之流體儲存及分配容器’可容易利用習知流體壓 力調節器裝置構造而成。相對於在美國專利5,51 8,528號 所說明之吸著劑基氣體儲存及分配系統,在流體為在液相 時’本發明之流體儲存及分配容器提供顯著較大流體儲存 容量。The fluid utilized in the fluid storage and distribution container of the present invention may comprise any suitable fluid, such as, for example, a hydride for use in semiconductor manufacturing operations. Examples of this type of hydride fluid include tritium, phosphine, antimony trihydrogen, Shixiyuan, chlorite yaki, and Ogo-yaki. Other fluids that can be used in semiconductor manufacturing operations, including acid gases used as etchants, cleaners, source reagents, etc. in semiconductor manufacturing operations, such as hydrogen fluoride, boron trioxide, boron tetrafluoride, hydrogen chloride, halogenation Silane (such as SiF4) and ethane (such as Si2F6). The fluid storage and distribution container 'of the present invention can be easily constructed using a conventional fluid pressure regulator device. Compared to the sorbent-based gas storage and distribution system described in U.S. Patent No. 5,51,528, the fluid storage and distribution container of the present invention provides a significantly larger fluid storage capacity when the fluid is in the liquid phase.

88120690.ptd 第19頁 五、發明說明(16) 型ί 2 ί實:列’供美國專利5, 1 5 8, 528號中所示及說明 瓶二A蝕六吸著劑基氣體儲存及分配系統’使用一"JY”鋼 J =儲存及分配容器’並容納-種物理吸著劑材料,對 之氣體具有吸附親合性,在肿氣 1 為輸送約0· 5公斤左右之氣體。 存在2明之流體儲存及氣體分配系統之對應容器,可儲 存:::液體胂’及可自其分配18公斤胂氣體。 益體儲f:及分配系統允許流體之高純度分配, ;中所:有存::基儲存及分配系統利用之吸著劑材 科甲所特有存在之潛在污染物或雜質。 供古^ a本發明之流體儲存及分配系統,在流體之配置提 厭水準’因為儲存及分配容器可製成為有一在内部 動力調節器及選用之分相胃,並且與容器之流體流 之接縫將構成在否則為無縫容器構造之僅有泄漏 ^而且,在習知流體鋼瓶之情形,因為對照於容器之 剖面,鋼瓶頸部之相對小尺寸,提供-供氣體流入或 ':出:最小泄漏路徑’其可容易藉銅焊,•接,以一種高 度不透流體密封劑黏性密料,使為防泄漏。 0 ==,如曾巳述及,可構造流體儲存及分配容器僅有一 心體流動口。如果流體壓力調節器予以設定在適當壓 f水準、’例如700托’則容器可在溫度降低至氣體蒸汽壓 予以分配之流體者)為低於調節器設定點之點。在此等 ,况下,調節器之提動元件將會自其座分離,並允許氣體 自一外部源流入儲存容器。88120690.ptd Page 19 V. Description of the invention (16) Type ί 2 ί Real: Column 'for the storage and distribution of bottle 2A etch and 6 sorbent-based gas shown and explained in US Patent No. 5, 1 5 8, 528 The system 'uses a " JY "steel J = storage and distribution container' and contains a kind of physical sorbent material, which has an adsorption affinity for the gas, and transports about 0.5 kg of gas in the swollen gas 1. There is a corresponding container for the fluid storage and gas distribution system, which can store ::: Liquid plutonium and 18 kg of plutonium gas that can be dispensed from it. Beneficial storage f: and the distribution system allows high-purity fluid distribution, Presence: Potential pollutants or impurities that are unique to the sorbent materials used in the base storage and distribution system. For the ancient ^ a The fluid storage and distribution system of the present invention is annoying in the configuration of fluids because of storage And the distribution container can be made with an internal power regulator and optional split stomach, and the seam with the fluid flow of the container will constitute only leakage in otherwise seamless container construction ^ Furthermore, in conventional fluid steel cylinders, Situation, as compared to containers The cross section, the relatively small size of the steel bottleneck, provides-for gas inflow or ': out: minimum leakage path', which can be easily brazed, and connected with a highly fluid-tight sealant Leak-proof. 0 ==, as mentioned previously, fluid storage and distribution containers can be constructed with only one core body flow port. If the fluid pressure regulator is set to an appropriate pressure level, such as 700 torr, the container can be cooled to The fluid to be dispensed by gas vapor pressure) is below the set point of the regulator. In this case, the regulator's lifting element will separate from its seat and allow gas to flow into the storage container from an external source.

418297 五、發明說明(π) 現請參照圖式,圓1為一根據本發明實施例之液體儲存 及氣體分配系統1 〇之示意剖面,正視圖。 流體儲存及氣體分配系統1 〇包括一儲存及分配容器丨2, 包括一圓柱形侧壁14,一底板16及一上頸部18,界定一容 納液體1 7之封閉内 體,諸如一種供使 證性氫化物包括胂 體1 7予以在足夠壓 一包含閥2 0與閥 之上頸部1 8,蒸汽 配0 闕2 0不為有關 既定最後使用所希 要不然,閥20可予 置。 閥2 0予以接合為 一種採用一提動元 在閉合狀況,並且 水準時,提動元件 定至次大氣Μ,大 對於在容器中所容 以選擇為適合儲存 一包括一膜片元 聯結,其為可透自 部容積15。液體17可包含任何適當液 用於半導體製造操作之液體氫化物。例 ’膦,銻化三氫’矽烷,乙硼烷等。液 力下保持在容器1 2中,俾保持在液相。 出口 22相通之閥頭總成,配置在容器12 自其在箭頭Α所指示之方向自容器分 聯之致動器24,其可如在應用本發明之 望’為任何適當類型(電動,氣動等)6 以手動作動,或設有其他流動控制裝 0 與壓力調節器26成氣體流動相通,其為 件之習知型式,其可例如予以彈簧偏壓 其中在越過提動元件之壓力差超過一定 經歷位移。壓力調節器26可例如予以設 氣壓或超大氣壓力值,例如70 0托。相 納之液體或其他流體,特定壓力水準予 及分配操作。 件30之分相器28,予以與壓力調節器26 液體1 7導得之氣體或蒸汽,但不透液體418297 V. Description of the invention (π) Please refer to the drawings. Circle 1 is a schematic cross-section and a front view of a liquid storage and gas distribution system 10 according to an embodiment of the present invention. The fluid storage and gas distribution system 10 includes a storage and distribution container 2 including a cylindrical side wall 14, a bottom plate 16 and an upper neck 18 defining a closed inner body containing a liquid 17 such as a supply container. Evidence of hydride including carcass 17 shall be sufficient pressure to include valve 20 and neck 18 above valve. Steam distribution 0 to 20 is not required for the intended final use, otherwise valve 20 may be placed. The valve 20 is joined as a kind of adopting a lift element in a closed state, and when the level is up, the lift element is set to the subatmosphere M, which is suitable for storage in the container and is selected to include a membrane element connection. Is transparent from the internal volume of 15. Liquid 17 may include any suitable liquid hydride for semiconductor manufacturing operations. Examples include 'phosphine, antimony trihydro' silane, diborane and the like. It is held hydraulically in the container 12 and the tritium is kept in the liquid phase. The valve head assembly communicating with the outlet 22 is arranged in the container 12 and the actuator 24 which is separated from the container in the direction indicated by the arrow A, which can be any suitable type (electric, pneumatic Etc.) 6 It is operated by hand, or other flow control devices are provided. It communicates with the pressure regulator 26 in gas flow. It is a known type of piece. It can be spring biased, for example, where the pressure difference across the lifting element exceeds Must undergo displacement. The pressure regulator 26 may be set to, for example, a barometric or super-atmospheric pressure value, such as 700 Torr. For liquids or other fluids to be accepted, specific pressure water is granted and dispensed. The phase separator 28 of the piece 30 is to be connected with the pressure regulator 26. The gas or vapor derived from the liquid 17 is liquid-tight.

88120690,ptd 第21頁 卜.4 182 9 7 五、發明說明(18) 本身。 蒸汽/可透氣體,不透液體臈片,可以僅自液體傳輸氣 體或蒸汽,但防止液體流動通過之任何適當材料形成。膜 片可實際以種種潛在有效之材料形成,包括例如聚丙烯, 聚偏二氟乙烯,聚四氟乙烯,多氟醋酸酯,矽,及表面處 理玻璃織物。一種較佳之有效材料,包含諸如以商標 ’Gore-Tex" (Gore-tex Corporation)所銷售之聚偏二氣乙 烯11可呼吸"織物。供使用作為膜月分相器材料之其他發售 材料,包括 Noryl 薄膜(General Electric Company,88120690, ptd p. 21 b. 4 182 9 7 V. Description of the invention (18) itself. Vapor / breathable, liquid-impermeable diaphragm, formed of any suitable material that can transport gas or vapor only from liquid, but prevents liquid from flowing through. Diaphragms can actually be formed from a variety of potentially effective materials including, for example, polypropylene, polyvinylidene fluoride, polytetrafluoroethylene, polyfluoroacetate, silicon, and surface treated glass fabrics. A preferred effective material includes fabrics such as polyvinylidene chloride 11 breathable " sold under the trademark 'Gore-Tex " (Gore-tex Corporation). Other available materials for use as membrane moon phase separator materials, including Noryl films (General Electric Company,

Pittsfield, ΜΑ)。 在使用圖1之液體儲存及氣體分配系統時,液體予以儲 存在預定壓力’保證其液性。為供此目的,壓力調節器26 予以設定在預定水準,在容器之内部容積15保證適當内部 壓力,不可透液體,氣體/可透蒸汽膜片30保證無液體將 會流入氣體調節器26,即使容器自圖1中所示之垂直巧|)態 傾斜,同時保持大致直立。 在希望自容器12分配氣體時,閥致動器24予以作動以開 啟閥2 0,藉以允許自液體導得之氣體或蒸汽流動通過可透 膜片30,壓力調節器26及閥20,供通過出口 22自閥頭分配 總成流出。 閥20之開口在可透膜片30之排出侧完成壓力之減低,並 導致自液體導得之蒸汽滲透通過膜片,以供排出。同時, 流體壓力調節器將會保持予以分配之氣體之壓力在設定點 壓力水準。Pittsfield, MA). When using the liquid storage and gas distribution system of Fig. 1, the liquid is stored at a predetermined pressure 'to ensure its liquidity. For this purpose, the pressure regulator 26 is set at a predetermined level, and an appropriate internal pressure is ensured in the internal volume 15 of the container. The liquid-impermeable, gas / vapor-permeable diaphragm 30 ensures that no liquid will flow into the gas regulator 26, even if The container is tilted from the vertical position shown in Figure 1 while remaining approximately upright. When it is desired to distribute the gas from the container 12, the valve actuator 24 is actuated to open the valve 20, thereby allowing the gas or vapor derived from the liquid to flow through the permeable diaphragm 30, the pressure regulator 26 and the valve 20 for passage. The outlet 22 flows from the valve head distribution assembly. The opening of the valve 20 completes the pressure reduction on the discharge side of the permeable membrane 30 and causes the vapor derived from the liquid to permeate through the membrane for discharge. At the same time, the fluid pressure regulator will keep the pressure of the gas being dispensed at the set point pressure level.

t, 4189 Q 五、發明說明(19) 圖1實施例中之容器12,可如圖示裝有一單獨之充填口 4 2 (相對於流體流動口在容器之頸部),並且此單獨之充填 口可予以聯結至一供充填容器之液體源。 要不然’容器可僅只設有一頸部開口,壓力調節器設定 在供充填之適當溫度水準。在充填操作時,容器可予以冷 卻’如藉容器置於一致冷器或冷卻劑池,以減低容器之溫 度低於壓力調節器所建立之預定壓力點。流體壓力調節器 然後在容器之内部容積15將會有一氣體壓力低於調節器之 設定點,藉以允許壓力調節器之提動元件自其座分離,並 允許流體流入至容器,供液體隨後儲存在其中。 圖2為一利用一根據本發明之流體儲存及分配.系統π 〇之 半導體製造系統之示意圖示。流體儲存及分配系統11 〇包 括一大致圓柱形容器112,大致沿圖1中之容器12之管線構 造而成。容器使液體容納在預定壓力。閥頭總成包含一閥 120 ’有一致動器124設置為選擇性作動閥,並完成氣體在 管線142自容器排出。 閥致動器124藉中央處理器單元2 10予以控制,其可包含 一電腦或微處理器控制裝置,藉信號傳輸線路21 2與閥致 動器124聯結成控制關係。 中央處理器單元210可予以構造及設置為根據一循環時 間程式作動閥。要不然,中央處理器單元210可在半導體 製造設施200,藉加工狀況信號傳輸線路216傳達一指示既 定加工狀況之信號至中央處理器單元’監視加工狀況,導 致單元響應式作動閥致動器124至對應之程度’以調變在t, 4189 Q V. Description of the invention (19) The container 12 in the embodiment of FIG. 1 may be provided with a separate filling port 4 2 (as opposed to the fluid flow port on the neck of the container), and this separate filling The mouth can be connected to a liquid source for filling the container. Otherwise, the container may be provided with only one neck opening, and the pressure regulator is set at an appropriate temperature level for filling. During the filling operation, the container may be cooled, such as by placing the container in a uniform cooler or coolant pool to reduce the temperature of the container below a predetermined pressure point established by the pressure regulator. The fluid pressure regulator will then have a gas pressure in the internal volume 15 of the container below the set point of the regulator, thereby allowing the lifting element of the pressure regulator to separate from its seat, and allowing fluid to flow into the container for subsequent storage of the liquid in among them. FIG. 2 is a schematic illustration of a semiconductor manufacturing system utilizing a fluid storage and distribution system π 0 according to the present invention. The fluid storage and distribution system 110 includes a generally cylindrical container 112 constructed approximately along the pipeline of the container 12 in FIG. The container holds the liquid at a predetermined pressure. The valve head assembly includes a valve 120 'having an actuator 124 configured to selectively actuate the valve, and complete discharge of gas from the container at line 142. The valve actuator 124 is controlled by the central processing unit 2 10, which may include a computer or microprocessor control device, and the signal actuator 124 is connected with the valve actuator 124 to form a control relationship. The central processing unit 210 may be constructed and arranged to actuate a valve according to a cycle time program. Otherwise, the central processing unit 210 may transmit a signal indicating the predetermined processing condition to the central processing unit at the semiconductor manufacturing facility 200 via the processing status signal transmission line 216 to monitor the processing status, resulting in the unit responding to actuate the valve actuator 124 To the corresponding degree '

88120690.Ptd 第23頁 418297 五、發明說明(20) 管線142中之氣體流動,與半導體製造設施之需要成比 例。 中央處理器單元210也可在信號傳輸線路214接收一與容 器:溫度相關之信號,其可予以接合至一與容器112關聯 之”、、感測器或嵌入之熱電偶’以相對於容器丨〗2之溫度, 補償流體在管線1 42中之流動。 半導體製造設施2〇〇可包含供生產半導體材料或裝置, 或含此等材料或裝置之產品之半導體加工設備之任何適當88120690.Ptd Page 23 418297 V. Description of the invention (20) The gas flow in the pipeline 142 is proportional to the needs of the semiconductor manufacturing facility. The central processing unit 210 can also receive a signal related to the container: temperature on the signal transmission line 214, which can be connected to a container 112 ", a sensor or an embedded thermocouple 'to be relative to the container. Temperature 〖2, compensating fluid flow in line 1 42. Semiconductor manufacturing facility 2000 may include any suitable semiconductor processing equipment for the production of semiconductor materials or devices, or products containing such materials or devices.

例如,半導體製造設施2〇〇可包含一離子植入系統,平 版印刷執(lithotracks),化學汽相沉積反應器,以及關 聯之反應劑供給及汽化設備(包括液體輸送設備,起泡器 等)’触刻單元’清潔裝置等。For example, semiconductor manufacturing facility 2000 may include an ion implantation system, lithotracks, chemical vapor deposition reactors, and associated reagent supply and vaporization equipment (including liquid delivery equipment, bubblers, etc.) 'Touch engraving unit' cleaning device, etc.

,本發明之一種特定實施例,一種液體氫化物流體予以 在壓力下保持在容器112中,並且自其導得之氣體予以在 管線142選擇性分配至包含—離子植入室之半導體製造設 施200 °分配之氣體,連同適當載體及/或(諸)稀釋劑氣 體’予以經歷離子化,並且所獲得之離子類予以植入在一 基片’諸如一半導體裝置先質結構或子組件。 在使用分配之氣體後,半導體製造設施200在管線2 02排 出一流出氣體流,其可流動至一排出氣體處理系統204, 供在管線2 0 6中處理及排出最後淨化流出物。 請予認知’半導體製造設施可予以各種變化及構形,如 例如採用报多種處理氣體,其可自根據本發明所構造及操In a specific embodiment of the present invention, a liquid hydride fluid is held in a container 112 under pressure, and a gas derived therefrom is selectively distributed in a line 142 to a semiconductor manufacturing facility 200 including an ion implantation chamber. The distributed gas, together with a suitable carrier and / or diluent gas, is subjected to ionization, and the obtained ions are implanted on a substrate such as a semiconductor device precursor structure or subassembly. After using the distributed gas, the semiconductor manufacturing facility 200 discharges an outflow gas stream at line 202, which can flow to an exhaust gas processing system 204 for processing and discharge of the final purified effluent in line 206. Please recognize that the semiconductor manufacturing facilities can be variously modified and configured, such as, for example, using multiple processing gases, which can be constructed and operated in accordance with the present invention.

418297418297

五、發明說明(21) 作之對應個別流體儲存及分配容器予以分配。 請予認知,本發明之流體儲存及分配裝置提供高度有效 並容易製成之裝置,供流體諸如胂之高容量儲存及輸送, 其能在壓力下予以液化,不費太多工夫或費用。V. Description of the invention (21) The corresponding fluid storage and distribution container is used for distribution. Please recognize that the fluid storage and distribution device of the present invention provides a highly efficient and easy-to-manufacture device for the high-capacity storage and transportation of fluids such as tritium, which can be liquefied under pressure without much effort or expense.

而且,在流體儲存及分配容器之内部容積,在内部配置 一流體壓力調節器,容器藉以可製成為在其頸部僅有一單 一接缝,作為流體類流入或流出之潛在泄漏路徑。因之, 容器可容易製成,並且在使用時’内部配置之氣體壓力奶 節器受到保護’以防否則可能不利影響容器之結構完整性 或操作之衝擊以及環境暴露,以及構成一供儲存及分配容 器之另外潛在泄漏路徑。 雖然配合圖1所說明系統之方法大致令人滿意,但在流 體容器之長期儲存狀況下’可能發生液體凝結在膜片之下 游側。例如,如果容器予以安置在其側面,並且液體容積 在此位置延伸高於可透分相器膜>{之高度,則存在一小潛 能梯度,並等於與此液體"頭”關聯之重力潛能。為了使二 液體頭潛能平衡,液體將會凝結在膜片之閥侧,直到在膜 片相對兩側之各別液體水準巳相等。Moreover, the internal volume of the fluid storage and distribution container is equipped with a fluid pressure regulator inside, so that the container can be made with only a single seam on its neck as a potential leak path for fluids flowing in or out. Therefore, the container can be easily manufactured, and the "internally configured gas pressure milk nipple is protected" during use to prevent shocks and environmental exposure that may adversely affect the structural integrity or operation of the container, and constitute a storage and Another potential leak path for the dispensing container. Although the method used in conjunction with the system illustrated in Figure 1 is generally satisfactory, under long-term storage conditions of the fluid container ', liquid may condense on the downstream side of the diaphragm. For example, if the container is placed on its side and the volume of liquid extends at this position above the height of the permeable phase separator membrane > {, then there is a small potential gradient equal to the gravity associated with this liquid " head " Potential: In order to balance the potential of the two liquid heads, the liquid will condense on the valve side of the diaphragm until the respective liquid levels on the opposite sides of the diaphragm are equal.

另外’供高壓鋼瓶型式,諸如習知採用供Θ氟化硼 (BF3)之氣體儲存及分配容器,系統之氣體儲存容量通常 由鋼飯壓力予以確定及限制^在此等情形供氣體液化所將 必要之壓力可能過高。 。另在上述之外,習知供壓縮氣體服務使用之氣體鋼瓶容 器’如National Gas Taper(NGT)標準所測定,一般利用In addition, for the type of high-pressure cylinders, such as the conventional use of gas storage and distribution containers for Θ boron fluoride (BF3), the gas storage capacity of the system is usually determined and limited by the pressure of the steel meal. The necessary pressure may be too high. . In addition to the above, conventional gas cylinder containers used for compressed gas service ’are determined by the National Gas Taper (NGT) standard and generally used.

88120690.ptd 第25頁 五、發明說明(22) 1/4吋NGT,1/2吋NGT,及較小之閥進口。為了有效利用” 瓶中調節器”方法,需要大於目前習知現有之鋼瓶進口。88120690.ptd Page 25 V. Description of the invention (22) 1/4 inch NGT, 1/2 inch NGT, and smaller valve inlet. In order to effectively use the "regulator in a bottle" method, it needs to be larger than the steel cylinder imports currently known.

Compressed Gas Association(CGA)之最大建議壓縮氣體 鋼瓶進口為1. 5吋NGT-11 l/2tpi (螺紋/吋)開口,有一最 小直徑1. 7 9吋。大於1 / 4吋N G T之開口,一般予以設計為供 其在高流動之應用’並且需要較大鋼瓶(>5〇公升内部容 積)。發明人等不知道具有容積少於50公升之任何鋼舰, 有開口大於1吋NGT,並且非常不大可能採用大於1吋NGT 之任何開口供容積少於2 〇公升之鋼瓶。 為使允許商業性”瓶中調節器方法,必要提供一種鋼 瓶’其滿足美國運輸部(USD0T)包裝標準,有一進口開口 大於習知現有,並可經得起在約1000至約5000磅/平方吋 (psi)範圍之壓力。先前技藝未曾建議或製成此種容器, 並且沒有曾市售者。 在本發明之流體儲存及分配系統,包括一流體儲存及分 配容器,特色為一流體流動口,有一流體分配總成聯結為 與該口成流體流動相通,與根據本發明之口關聯之調節 器,可適當包含一雙級調節器,以解決在上文所說明之分 相問題。Compressed Gas Association (CGA) 's largest recommended compressed gas cylinder inlet is 1.5 inch NGT-11 l / 2tpi (thread / inch) opening, with a minimum diameter of 1. 7 9 inches. Openings larger than 1/4 inch N GT are generally designed for high flow applications' and require larger cylinders (> 50 liters internal volume). The inventors do not know that any steel ship with a volume less than 50 liters has an opening greater than 1 inch NGT, and it is very unlikely that any opening larger than 1 inch NGT will be used for cylinders with a volume less than 20 liters. In order to allow a commercial "in-bottle regulator" method, it is necessary to provide a steel bottle that meets the US Department of Transportation (USD0T) packaging standards, has an inlet opening larger than conventionally available, and can withstand about 1000 to about 5000 pounds per square Pressure in the range of inches (psi). No such container has been suggested or made by prior art and has not been marketed. The fluid storage and distribution system of the present invention includes a fluid storage and distribution container and is characterized by a fluid flow port. A fluid distribution assembly is connected in fluid communication with the mouth, and the regulator associated with the mouth according to the present invention may suitably include a two-stage regulator to solve the phase separation problem described above.

如曾巳述及,如果儲存及分配容器配合一分相器單元利 用一單級調節器,容器如果安置在其侧面’可容納足夠液 體,致使液體容積延伸高於玎透分相器膜片之高度。在此 種狀況下,液體將會凝結在膜片之閥侧,直到在臈片之相 對兩側之各別液體水準相等。As mentioned, if the storage and distribution container is combined with a phase separator unit using a single-stage regulator, if the container is placed on its side ', it can hold enough liquid, so that the volume of the liquid extends above the height of the perforated phase separator diaphragm. In this condition, the liquid will condense on the valve side of the diaphragm until the respective liquid levels on the opposite sides of the diaphragm are equal.

88120690.ptd 第26頁88120690.ptd Page 26

41829T 五、發明說明(23) 使用雙级調節器避免此種缺點。如果來自谷益之大夏内 部容積之液體’在雙級調節器之第一與第二級之間移動, 雙級調節器之高壓級之壓敏元件(高壓,級為在容器中與液 體初始流體流動相通之調節器級’及低壓級為隨後與第一 級流體流動相通之調節器級),將會被強制至閉合位置。 各別調節器級之壓敏元件一般為一提動閥°當高壓級被強 制閉合,並且壓力在級間部位(在高壓級與低壓級之間)上 升時,此增加之級間壓力’在自第二級排出之流體之最後 壓力,將會有很少影響。41829T 5. Description of the invention (23) The use of a two-stage regulator avoids such disadvantages. If the liquid from Guyi's Daxia's internal volume moves between the first and second stages of the two-stage regulator, the pressure-sensitive element of the high-pressure stage of the two-stage regulator (high pressure, the stage is The fluid flow regulator stage 'and the low pressure stage are regulator stages which are subsequently communicated with the first fluid flow stage) and will be forced to the closed position. The pressure-sensitive element of each regulator stage is generally a poppet valve. When the high-pressure stage is forcibly closed and the pressure rises between the stages (between the high-pressure stage and the low-pressure stage), the increased inter-stage pressure is The final pressure of the fluid discharged from the second stage will have little effect.

二級調節器之高壓級之壓力設定點,可予以設定至高於 雙級調節器之最後級(低壓級)之壓力之任何適當塵力水準 。藉此種配置,便解決單級調節器配置之液體凝結問題, 而不影響流體儲存及分配系統之總體操作,包括此,系統之 充填操作(流體裝填)。 因之’利用雙級調節器之儲存及分配系統,可予以構形 大致如圖1中所示在上文所說明,但其中壓力調節器26為 雙級調節器而非單級調節器。 雙級流體壓力調節器從而與容器之口關聯 為在容器之内部容積保持預定壓力。 並予以設置The pressure set point of the high pressure stage of the secondary regulator can be set to any suitable dust level higher than the pressure of the final stage (low pressure stage) of the dual regulator. With this configuration, the liquid condensation problem of the single-stage regulator configuration is solved without affecting the overall operation of the fluid storage and distribution system, including this, the system's filling operation (fluid filling). Therefore, the storage and distribution system using the two-stage regulator can be configured as shown in Fig. 1 as described above, but the pressure regulator 26 is a two-stage regulator instead of a single-stage regulator. The two-stage fluid pressure regulator is thus associated with the mouth of the container to maintain a predetermined pressure in the internal volume of the container. And set it up

勺另—方面,係關於一種流體儲存及分配系統 =種ϋΐίΐ種物理吸附材料之容器,對一種氣體,例 體所組成體,齒化物氣體及有機金屬化合物 (亦㈣理具有吸附親合性。此類型之—種氣 次附材料對其具有吸附親合性者)予以在内部In another aspect, it is about a fluid storage and distribution system = a container for a variety of physical adsorption materials. For a gas, an example composition, a dentate gas, and an organometallic compound (it also has adsorption affinity). This type of—a kind of gaseous secondary materials with which it has an adsorption affinity) is given internally

88l20690.ptd 第27頁 4 彳 8297 五、發明說明(24) 器壓力約50至5000磅/平方吋規格(psig)容納在容器中。 較佳為’約5至約40%之此種氣體存在於一種自由(未吸附) 狀態’並且約6 0至約9 5 %之此種氣體在吸附狀態存在於物 理吸著劑材料。 其中容納吸附材料之容器,可予以構造及設置為有一分 配總成或其他排出裝置,如在i 996年5月21日,以Glenn M. Torn及James V. McManus之名義所授予之美國專利 5, 528, 518號中所說明,其揭示經予全部參考併入本文。 0 容器可代之為予以構造如其圖1中所示,但其中液體17由 一種吸附式容留一氣體類之物理吸附材料床所替代,其也 存在於物理吸附床之空隙’以及存在於在容器内部容積之 頭空間。 雖然先前技藝曾揭示在美國專利5,528,518號說明所提 ^型式之吸著劑基氣體儲存及分配系統’為利用供在壓力 同於大氣麗力之氣體儲存及分配,例如,Mm年1月6日授 予Glenn M. Tom等人之美國專利5,7〇4,967號(其說明超大 ,遷低於約1 200托"),但先前技藝未曾擬想可有效採 =此4吸著劑基氣體儲存及輸送系統,作為在顯著較高壓 力之氣體源,例如高於約50psig,及更佳為高於約 :sig二供此情沉之原因,為在初始考慮將似乎為,容 ^被,耆劑材料之物理質量閉塞將會具有缺點,造成"損 失之谷積1將會減低在容器所可儲存氣體之淨量。 ^此情況,吾人曾驚異並出乎意外發現,在容器之内部 谷積’配置-種利用高壓儲存狀況吸著劑基氣體儲 88120690.ptd 第28頁88l20690.ptd Page 27 4 彳 8297 V. Description of the invention (24) The pressure of the device is about 50 to 5000 pounds per square inch (psig). It is preferred that 'about 5 to about 40% of this gas is present in a free (non-adsorbed) state' and about 60 to about 95% of this gas is present in the physical sorbent material in an adsorbed state. The container containing the adsorbent material can be constructed and arranged with a distribution assembly or other discharge device, such as US Patent 5 granted on behalf of Glenn M. Torn and James V. McManus on May 21, 996 , 528, 518, the disclosure of which is incorporated herein by reference in its entirety. 0 The container can be constructed instead as shown in Figure 1, but the liquid 17 is replaced by an adsorbent bed that holds a gas-type physical adsorbent material, which also exists in the void of the physical adsorption bed 'and in the container. Headroom of the internal volume. Although the prior art has disclosed that the sorbent-based gas storage and distribution system of the type described in US Patent No. 5,528,518 describes the use of a gas storage and distribution system that is at the same pressure as the atmosphere, for example, January 6, Mm US Patent No. 5,704,967 to Glenn M. Tom et al. And delivery systems, as a source of gas at significantly higher pressures, such as above about 50 psig, and more preferably above about: sig two reasons for this affection, for initial consideration it would seem to be Occlusion of the physical quality of the agent material will have disadvantages, resulting in a " lost product 1 " which will reduce the net amount of gas that can be stored in the container. ^ In this case, I was surprised and unexpectedly found that the grain accumulation inside the container is configured-a kind of sorbent-based gas storage using high pressure storage conditions 88120690.ptd page 28

五 '發明說明(25) 配系統,在容納吸著劑之容器之储存容量,提供顯著之改 進。將鋼瓶充填一種固相物理吸附材料,較佳為成分隔形 式,如在上述Tom等人美國專利5, 5 18, 528所說明,可將可 吸附氣體在一近似於液相之物理狀態儲存在鋼瓶,而較之 習知高壓氣體鋼瓶’具有大為增強之氣體儲存容量β 在以下之表I中之資料,例示氣體儲存容量之此種出乎 意外之增強,其中BF3之儲存容量,在吸附填滿氣體鋼瓶 與在習知氣體鋼瓶在室溫(2〇, c)予以比較。在表I中之bf 3 之吸附容量,係使用一種電腦模塑’具有預測可靠性土 2 0% ’供2. 2公升内部容積之氣體儲存及分配容器(相等於, 一種市售"JY"鋼瓶)所確定,吸附物為一種在Tom等人美國 專利5,7 0 4,9 6 5號中所揭示類型之小球活性碳吸著劑材 料’其揭示經予全部參考併入本文。 P力 吸附物 填滿 鋼瓶 ^ 高壓 鋼瓶 Rpsig) 吸附 無 ~吸附 無 BF3 BF3 Total BF3 BF3 Total (g) (g) (g) 1 (g) (g) (g) ~ Pi 220 3 223 0 6 6 500 569 —------ 24 593 0 48 46 ^ 836 109 945 Ί 0 218 218〜 hi- 889 ~173~ 1062 0 346 346 ~~ 1000 906 215 1121 0 430 430〜 1500 925 321 1246 一 0 642 642V. Description of the invention (25) The system provides significant improvements in the storage capacity of the sorbent container. The cylinder is filled with a solid-phase physical adsorption material, preferably in a separated form. As described in the above-mentioned Tom et al. The cylinder, compared with the conventional high-pressure gas cylinder 'has a greatly enhanced gas storage capacity β The information in Table I below illustrates the unexpected increase in gas storage capacity, of which the storage capacity of BF3 is in the adsorption Filling gas cylinders is compared with conventional gas cylinders at room temperature (20, c). The adsorption capacity of bf 3 in Table I is a computer-molded 'storage with predictable reliability 20%' for a gas storage and distribution container with an internal volume of 2.2 liters (equivalent to a commercially available " JY & quot (Steel cylinder) determined that the adsorbate is a type of pellet activated carbon sorbent material of the type disclosed in Tom et al. US Patent No. 5,704,995, the disclosure of which is incorporated herein by reference in its entirety. P-force adsorbent fills the cylinder ^ High pressure cylinder Rpsig) No adsorption ~ No adsorption BF3 BF3 Total BF3 BF3 Total (g) (g) (g) 1 (g) (g) (g) ~ Pi 220 3 223 0 6 6 500 569 ------- 24 593 0 48 46 ^ 836 109 945 Ί 0 218 218 ~ hi- 889 ~ 173 ~ 1062 0 346 346 ~~ 1000 906 215 1121 0 430 430 ~ 1500 925 321 1246 1 0 642 642

88120690.ptd 第29頁 jl 4^8297 五、發明說明(26) ----- 氟之中绝之/料所示,在填滿吸附物之鋼瓶中所容納四 ί一致大於在習知(無吸附物)氣體鋼瓶中所 瓶"斤容納四iLr二填滿吸附物之鋼 體鋼槪中所容納四:::::二大艾在習知(無吸附物)氣 填滿吸附#氟 之直12。35倍β在1 5001)5“,在 .r ' 鋼瓶中所容納四氟化硼之總量,為大於在習 …、吸附)氣體鋼瓶中所容納四氟化硕之量丨.g 4倍。 0 八t Ϊ發日:之另一方面,一種根據本發明之流體儲存及 刀,^ ^驊,括—流體儲存及分配容器,有一流體流動 口,一 ^體分配總成與該口流體流動相通,及一流體壓力 調節器與該口關聯,可予以構形為具有下列特色: (i)内部谷積少於約5 0公升’更佳為少於約2 〇公升, 最,,少於約10公升,例如在約1至10公升之範園;以及 (11) 一進口開口大於1吋NGT。 此谷器較佳為有一壓力容量,亦即一可適應而無不利效 應(容器之斷裂或流體自其泄漏)之連續服務壓力水準,直 到至少約1 0 0 0磅/平方吋,更佳為直到約5 〇 〇 〇磅/平方吋。 在一種實施例,此容器可為2· 〇公升内部容積,有一5 叶NGT鋼瓶閥進口’致使進口開口為足夠大以配合一調節 器裝置諸如IF S設定點調節器。88120690.ptd page 29 jl 4 ^ 8297 V. Description of the invention (26) ----- The absolute content of fluorine is shown in the steel cylinder filled with adsorbate. No adsorptive) Gas cylinders " Kings hold four iLr II Steel shovel filled with adsorptive four steels ::::: Erda is filled with adsorptive gas (without adsorptive gas) # The straightness of fluorine is 12.35 times β in 1,5001) 5 ". The total amount of boron tetrafluoride contained in .r 'cylinders is greater than the amount of tetrafluoride contained in gas cylinders.丨 .g 4 times. 0 eight t bursting date: on the other hand, a fluid storage and knife according to the present invention, ^ ^ 骅, including-a fluid storage and distribution container, a fluid flow port, a total body distribution It is in fluid communication with the mouth, and a fluid pressure regulator is associated with the mouth, and can be configured to have the following characteristics: (i) internal valleys of less than about 50 liters, more preferably less than about 20 liters , Most, less than about 10 liters, for example, in the range of about 1 to 10 liters; and (11) an inlet opening greater than 1 inch NGT. This trough is preferably a pressure Volume, which is an adaptable continuous service pressure level without adverse effects (fracture of the container or leakage of fluid from it) up to at least about 1,000 pounds per square inch, and more preferably up to about 5,000 pounds per square inch Square inch. In one embodiment, the container may have an internal volume of 2.0 liters with a 5-leaf NGT cylinder valve inlet 'such that the inlet opening is large enough to fit a regulator device such as an IFS setpoint regulator.

供瓶中調節器構形,必要一此性質叶NGT)之進口 開口,由於(1)調節器諸如IFS設定點調節器之直徑一般為 大於1.5吋及少於1。6吋’其需要一約1.5吋NGT之開口, 俾供調節器配合在鋼瓶内,及(2) —NGT開口僅接受USDOT wmFor the configuration of the regulator in the bottle, it is necessary to have an inlet opening of this nature (NGT). Because (1) the diameter of the regulator such as the IFS set-point regulator is generally greater than 1.5 inches and less than 1.6 inches, it needs an approx. 1.5 inch NGT opening, 俾 for regulator to fit in the cylinder, and (2) — NGT opening only accept USDOT wm

88120690.ptd 第30頁 418297 五、發明說明(27) 批准之之鋼瓶進口 ’供包括儲尨88120690.ptd Page 30 418297 V. Description of the invention (27) Approved steel cylinder imports

AsH3,F2,PH3,SiH4等之應用。㉝送氣體諸如肫3, 進口,諸如有外螺紋連接或直螺咬壬何其他型式之鋼瓶閥 接#螺紋者,目前均不被USD0T 按又’作為供此#氣體之合法容許連接。 在製造此型有一>1吋NGT進口關η — 步驟一般包括: 進口開口之容器時,加工製造 (1)將一金屬圓盤冷壓成為—圓柱形杯,· (2 )藉熱金屬旋塵形成鋼瓶頸部;以及 =)利用手動或自動化切削加工,在容器之頸部製成鋼 瓶開口。 此型容器之一種特定實施例,包含一2〇_2.25公升D〇T U 3AA 2015鋼瓶,有一1·5吋NGT開口有〗1/2_u 1/2料7螺 紋,容器有一4. 187至4.25吋外徑,額定壁厚度〇〇94至 0. 125吋,額定頸部外徑2. 5吋,旋轉狀態最大頸部之内徑 1.5对’及12.75至13. 75吋之長皮。此種容器適合配合四 氣化爛作為予以儲存在及自容器分配之氣體類使用。 圖3為一根據本發明之一種例證性實施例之流體儲存及 分配系統300之示意剖面正視圖D系統3〇〇包括一大致圓柱 形式之流體儲存及分配容器302 ’圓柱形侧壁304在其下端 藉底板構件306閉合。在容器之上端為一頸部308,包括一 圓柱形套環31 0,界定並外切容器之頂部開口。容器壁, 底板構件及頸部從而如圖示封閉内部容積328。 在容器之頸部,閥頭總成31 4之有螺紋插塞3 1 2予以與套 環31 0之有内螺紋開口螺合。閥頭總成31 4包括一中央流體Application of AsH3, F2, PH3, SiH4, etc. Gases such as 肫 3, inlets, such as cylinder valves with external threaded connections or straight screw bites, or other types of cylinder valves connected to #threads, are not currently being used by USD0T as legally permitted connections for this #gas. In the manufacture of this type, there is a > 1-inch NGT inlet. The steps generally include: When the container is open at the inlet, processing (1) cold pressing a metal disc into a cylindrical cup, (2) hot metal screw Dust forms a steel bottleneck; and =) a manual or automated cutting process is used to make a cylinder opening in the neck of the container. A specific example of this type of container includes a 20-2.25 liter D0TU 3AA 2015 steel bottle with a 1.5-inch NGT opening with 1 / 2_u 1/2 material and 7 threads, and the container has a 4.187 to 4.25 inch Outer diameter, rated wall thickness of 〇94 to 0.125 inches, rated neck outer diameter of 2.5 inches, the inner diameter of the largest neck in the rotating state 1.5 pairs' and 12.75 to 13.75 inches of long skin. This kind of container is suitable for use with the gasification rotten as the gas to be stored and distributed from the container. Figure 3 is a schematic cross-sectional front view of a fluid storage and distribution system 300 according to an exemplary embodiment of the present invention. System D includes a generally cylindrical fluid storage and distribution container 302 'with a cylindrical side wall 304 therein. The lower end is closed by the floor member 306. At the upper end of the container is a neck 308, which includes a cylindrical collar 3110, which defines and circumscribes the top opening of the container. The container wall, floor member and neck thus close the internal volume 328 as shown. At the neck of the container, the threaded plug 3 1 2 of the valve head assembly 31 4 is screwed with the internally threaded opening of the collar 3 10. Valve head assembly 31 4 includes a central fluid

88120690.ptd 第31頁 41829788120690.ptd Page 31 418297

流動通道320,接合為與一在閥頭總成之中央工 成流體流動相通。中央工作容積腔復 ' 324,其可有外螺紋,專否則構造為^^口^;; 管道,導管等與其附著。 逅按盗及關聯之 -閥元件322配置在中央工作容積腔,其在所示 例予以接合至一手輪326,但可代之為接合至一自動^致 動器或其他控制器或作動裝置。 閥頭總成314在閥座也具特色為—通氣孔流動通道31 6 合至一超壓力減壓閥318,並與容器之内部容積328相通, 供減輕容器中之總超壓力狀況 在閥頭總成314中之中央流體流動通道3 2 〇,予以在其 端接合至一連接器流動管330,其復予以接合至調節器^Μ 。調節器予以設定為保持自容器排出之流體之選定壓力。 一管狀接頭336予以接合在調節器之下端,其 ,妾子以接合至一在其下末端有一擴散器端丄= 政器單元334。擴散器單元可以不銹鋼形成,而擴散器壁 係以一種燒結不銹鋼諸如316L不銹鋼形成。擴散器單元有 —壁孔隙度允許在30標準公升/分氣體流動速率,自系統 除去大於預定直徑,例如大於〇. 〇〇3微米之所有微粒。此 型過滤器擴散器單元係由The flow passage 320 is connected to communicate with a working fluid in the center of the valve head assembly. The central working volume cavity is complex 324, which may have external threads, otherwise it is constructed as ^^ 口 ^; pipes, ducts, etc. are attached to it.逅 Pressing and associating-The valve element 322 is disposed in the central working volume cavity, which in the example is coupled to a hand wheel 326, but may instead be coupled to an automatic actuator or other controller or actuator. The valve head assembly 314 is also featured in the valve seat-the vent hole flow channel 31 6 is combined with an overpressure relief valve 318 and communicates with the internal volume 328 of the container. The central fluid flow channel 3 2 0 in the assembly 314 is joined at its end to a connector flow tube 330, which is then joined to the regulator ^ M. The regulator is set to maintain a selected pressure of fluid discharged from the container. A tubular joint 336 is engaged at the lower end of the regulator, and the rafters are joined to a diffuser end at its lower end 丄 = government unit 334. The diffuser unit may be formed of stainless steel, and the diffuser wall is formed of a sintered stainless steel such as 316L stainless steel. The diffuser unit has a wall porosity that allows a gas flow rate of 30 standard liters per minute to remove all particles from the system that are larger than a predetermined diameter, such as greater than 0.03 microns. This filter diffuser unit consists of

Corporation(Bedford,ΜΑ)以商標WAFERGARD所發售。 f使用時’將一種適當流體反應劑容納在容器302之内 部容積328,#例如一種高壓氣體或一種液化氣體,或代之 為一種可吸著氣體吸附性容留在一種對氣體具有吸附親合Corporation (Bedford, MA) is marketed under the trademark WAFERGARD. When in use ’, a suitable fluid reactant is contained in the internal volume 328 of the container 302, such as a high-pressure gas or a liquefied gas, or a sorbable gas adsorbed and retained in a gas having an adsorption affinity

五、發明說明(29) 性之物理吸著劍’其中内部容積容納一種適當固相物理吸 著劑材料之床。流體壓力調節器33 2予以設定至一選定之 設定點,以在閥在閥頭總成3 14開啟時,提供所分配流體 之流動,流體流動通過擴散器單元334,接頭336,調節器 332,連接器流動管330 ’在閥頭總成314之中央流體流動 通道320 ’中央工作容積腔’及出口 324 »如在本發明之既 定最後使用應用可能合宜或需要,閥頭總成可予以接合至 其他管道,導管,流動控制器,監視裝置等。 σ 圖4為圖3流體儲存及分配系統之閥頭總成3〗4之透視 圖。在圖4中,其中對應元件予以與圖3對應編號,插塞 31 2示為設有與在套環3 1 0之内表面之螺紋互補之螺紋 31 3 ’從而閥頭總成之插塞及容器可彼此以一種防泄漏方 式互補式配合。 圖5為在圖3流體儲存及分配系統3〇〇所採用擴散器單元 334之正視圖。擴散器單元334如圖示有一管狀接頭部份, 其以螺紋337予以螺接,供與圓3中所示調節器3 32之 可配合貼接》 〃 圖6為^圖^谕體儲存及分配系統30 0之調節器332之部份吾 開圖調節器3 3 2如例示有一下流體進口 3 3 3,擴散器單天 之管狀:頭予以螺接至此進口。_節器332在其上端設單有 二In體綱口’其士0圖3中所*,予以接合至連接器流鸯 吕330。調郎器可為單級調節器或多級調節器。如曾巳述 t f:調即器具有克服使用膜片分相器附帶之流體凝 、、Ό ’目、於容器之倒轉或傾斜之問題之優點,並且如在本 0 0V. Description of the invention (29) A physical absorbing sword of sexual nature 'wherein the internal volume contains a bed of a suitable solid phase physical sorbent material. The fluid pressure regulator 33 2 is set to a selected set point to provide a flow of the dispensed fluid when the valve is opened at the valve head assembly 3 14, and the fluid flows through the diffuser unit 334, the joint 336, and the regulator 332, Connector flow tube 330 'in the central fluid flow channel 320 of the valve head assembly 314' central working volume cavity 'and outlet 324 »If the end-use application of the invention may be appropriate or needed, the valve head assembly may be joined to Other pipes, conduits, flow controllers, monitoring devices, etc. σ Figure 4 is a perspective view of the valve head assembly 3〗 4 of the fluid storage and distribution system of FIG. 3. In FIG. 4, the corresponding components are numbered corresponding to FIG. 3, and the plug 31 2 is shown as a plug 31 3 ′ provided with a thread complementary to the thread on the inner surface of the collar 3 1 0 and thus the plug of the valve head assembly and The containers can complement each other in a leak-proof manner. 5 is a front view of a diffuser unit 334 employed in the fluid storage and distribution system 300 of FIG. The diffuser unit 334 has a tubular joint part as shown in the figure, and it is screwed with a thread 337 to fit and fit with the adjuster 3 32 shown in the circle 3. "6 Figure 6 is the storage and distribution of ^ Figure ^ Part of the regulator 332 of the system 300, the regulator 3 3 2 is shown as an example with a fluid inlet 3 3 3, and the single-day tubular of the diffuser: the head is screwed to this inlet. The joint 332 is provided at its upper end with a single In-body port, as shown in FIG. 3 *, and is connected to the connector Liu 330. The regulator can be a single-stage regulator or a multi-stage regulator. As previously stated, t f: the regulator has the advantage of overcoming the problems of using the fluid condensing, diaphragm, and reversing or tilting of the container with the diaphragm phase separator, and as in this 0 0

88120690.ptd 第33頁 418297 五、發明說明(30) -- 發明之既定最後使用應用所可希望,容器可採用單級或多 級調節器,而無此種膜片分相器單元,並且有或無微粒過 濾擴散器單元。 圖7為圖3流體儲存及分配系統30 0之流體儲存及分配容 器3 0 2,其上區段之剖面正視圖。例示之容器3 〇 2之部份, 包括圓柱形壁304,頸部308及套環310。套環之内表面藉 螺紋3 0 9予以螺接,其與在閥頭總成3丨4之插塞3丨2之螺紋 313互補(請見圖4)。容器可以一種不銹鋼材料或其他鐵金 屬合金,或其他金屬或非金屬構造材料形成,製成如在上 文所說明,並提供> 1吋NGT頸部開口及適當NGT螺紋。 可單獨或彼此成各種變更或組合,利用本案例證性揭示 之各種特色及方面,以提供一種構成一有效源流體裝置, 供特定之運用需求之流體儲存及分配系統。 因此,雖然本發明業經在本文參照特定元件,特色及實 施例予以例證性說明,但請予認知,本發明不因此在結構 或操作上有所限制,而是本發明與本文之揭示一致予以廣 義解釋為包含如將會容易對一般精於此項技藝者呈現之 種變化,修改及實施例。 產業應用 〇 本發明之流體儲存及分配系統,可在產業上有利採用於 需要氣體供各種單元操作,諸如蝕刻,化學汽相沉積,離 :植入等之製造半導體裝置。很多此等氣體危險及/或昂 貴,並且氣體供給容器必須在精確分配源氣體時防泄漏, 並高度可靠,並且由於在半導體製造設施之空間限制很嚴88120690.ptd Page 33 418297 V. Description of the invention (30)-It is hoped that the invention can be used in a single-stage or multi-stage regulator without the diaphragm phase splitter unit. Or particulate-free filter diffuser unit. Fig. 7 is a sectional front view of the upper section of the fluid storage and distribution container 300 of the fluid storage and distribution system 300 of Fig. 3. The portion of the illustrated container 302 includes a cylindrical wall 304, a neck 308, and a collar 310. The inner surface of the collar is screwed by a thread 3 09, which is complementary to the thread 313 of the plug 3 丨 2 in the valve head assembly 3 丨 4 (see Figure 4). The container may be formed from a stainless steel or other ferrous metal alloy, or other metallic or non-metallic construction material, made as described above, and provided with a > 1 inch NGT neck opening and appropriate NGT threads. Various changes or combinations can be made individually or with each other, utilizing the various features and aspects exemplarily disclosed in this case, to provide a fluid storage and distribution system that constitutes an effective source fluid device for specific application needs. Therefore, although the present invention has been exemplarily described herein with reference to specific elements, features, and embodiments, please recognize that the present invention is not limited in structure or operation, but the present invention is broadly consistent with the disclosure herein It is construed to include variations, modifications, and embodiments as would be readily apparent to those skilled in the art. Industrial Application 〇 The fluid storage and distribution system of the present invention can be used industrially to manufacture semiconductor devices that require gas for various unit operations, such as etching, chemical vapor deposition, and implantation. Many of these gases are dangerous and / or expensive, and the gas supply container must be leak-proof when the source gas is accurately distributed, highly reliable, and due to tight space constraints in semiconductor manufacturing facilities

f 4182 97 五、發明說明(31) 格,而較佳為具有高儲存容量。供此等應用及符合此等標 準,本發明之儲存及分配系統為高度有效率。 元件編號之說明 10 流體儲存及分配系統 12 儲存及分配容器 14 圓柱形侧壁 15 封閉内部容積 16 底板 17 液體 18 上頸部 20 閥 22 閥出口 24 閥致動器 26 壓力調節器 28 分相器 30 膜片元件 42 充填口 110 流體儲存及分配系統 112 圓柱形容器 120 閥 124 致動器 142 管線 200 半導體製造設施 202 管線f 4182 97 V. Description of invention (31), and preferably high storage capacity. For these applications and compliance with these standards, the storage and distribution system of the present invention is highly efficient. Description of component numbers 10 Fluid storage and distribution system 12 Storage and distribution container 14 Cylindrical side wall 15 Closed internal volume 16 Base plate 17 Liquid 18 Upper neck 20 Valve 22 Valve outlet 24 Valve actuator 26 Pressure regulator 28 Phase separator 30 Diaphragm element 42 Filling port 110 Fluid storage and distribution system 112 Cylindrical container 120 Valve 124 Actuator 142 Line 200 Semiconductor manufacturing facility 202 Line

88120690.ptd 第35頁 五、發明說明 204 排 206 210 212 214 216 300 302 304 306 308 309 310 312 313 314 316 318 320 322 324 326 328 330 管 中 信 信 加 流 流 圓 底 頸 螺 圓 插 螺 閥 通 超 中 閥 出 手 封 連 (32) 出氣體處理系統 線 央處理器單元 號傳輸線路 號傳輸線路 工狀況信號傳輸線路 體儲存及分配系統 體儲存及分配容器 柱形侧壁 板構件 部 紋 柱形套環 塞 紋 頭總成 氣孔流動通道 壓力減壓閥 央流體流動通道 元件 輪 閉内部容積 接器流動管88120690.ptd Page 35 V. Description of Invention 204 Row 206 210 212 214 216 300 302 304 306 308 309 310 312 313 313 314 316 318 320 322 324 326 328 330 Super middle valve release hand seal (32) Outlet gas processing system line Central processor unit No. Transmission line No. Transmission line Working condition Signal transmission line Body storage and distribution system Body storage and distribution container Cylindrical sidewall plate member part pattern cylindrical sleeve Ring plug head assembly air hole flow channel pressure reducing valve central fluid flow channel element wheel closed internal volume connector flow tube

88120690.ptd 第36頁 418297 五、發明說明(33) 331 擴散器端蓋 332 調節器 3 33 下流體進口 334 擴散器單元 3 3 5 流體出口 3 36 管狀接頭 337 螺紋88120690.ptd Page 36 418297 V. Description of the invention (33) 331 Diffuser end cap 332 Regulator 3 33 Lower fluid inlet 334 Diffuser unit 3 3 5 Fluid outlet 3 36 Tubular joint 337 Thread

88120690.ptd 418297 圖式簡單說明 圖1為一根據本發明實施例之流體儲存及分配系統之示 意剖面正視圖。 圖2為根據本發明之一另外實施例,利用自圖1中所示型 式之儲存及分配系統分配之流體之半導體製造設施之示意 圖示。 圖3為一根據本發明另一實施例之流體儲存及分配系統 之示意剖面正視圖。 圖4為圖3流體儲存及分配系統之閥頭總成之透視圖。 圖5為在圖3流體儲存及分配系統中所採用擴散器單元之 正視圖。 圖6為圖3流體儲存及分配系統之調節器之部份剖開圖。 圖7為圖3流體儲存及分配系統流體儲存及分配容器,其 上區段之剑面正視圖。88120690.ptd 418297 Brief description of the drawings Figure 1 is a schematic sectional front view of a fluid storage and distribution system according to an embodiment of the present invention. FIG. 2 is a schematic illustration of a semiconductor manufacturing facility utilizing a fluid dispensed from a storage and distribution system of the type shown in FIG. 1, according to another embodiment of the present invention. FIG. 3 is a schematic sectional front view of a fluid storage and distribution system according to another embodiment of the present invention. FIG. 4 is a perspective view of a valve head assembly of the fluid storage and distribution system of FIG. 3. FIG. FIG. 5 is a front view of a diffuser unit used in the fluid storage and distribution system of FIG. 3. FIG. FIG. 6 is a partial cutaway view of a regulator of the fluid storage and distribution system of FIG. 3. Fig. 7 is a front view of the sword face of the upper section of the fluid storage and distribution container of the fluid storage and distribution system of Fig. 3;

88120690.ptd 第38頁88120690.ptd Page 38

Claims (1)

六、申請專利範圍 體儲存及 存及分配 流體,其中容器包括 配總成, 力調節器 中之流體 1, 一種流 一流體儲 一流體分 一流體壓 之内部容積 力; 流體分配 動,以使自 過流體壓力 致使氣體 通過流體壓 2. 如申請 流體壓力調 3. 如申請 流體壓力調 流動通過流 4. 如申請 分相器包含 5. 如申請 分配總成包 總成包含 容器之内 調節器及 在流動通 力調節器 專利範圍 節器予以 專利範圍 節器有一 體壓力調 專利範圍 一可透氣 專利範圍 括一流動 器,及一自動控制器 整,供控制自容器中 6. —種流體儲存及 分配系統,包含: 容器,包封一内部容積,供容納一種 一流體流動口; 聯結為與該口成流體流動相通; ,與該口關聯,並設置為保持自容器 所導得之自容器所排出氣體之預定壓 一流動控制元件,其為可選擇性作 部容積中之流體所導得之氣體流動通 流體分配總成,供氣體自容器排出; 過流動控制元件前,在該排出時流動 〇 第1項之流體儲存及分配系統,其中 在内部配置在容器之内部容積。 第1項之流體儲存及分配系統,其中 分相器與其操作式關聯,供防止液體 節器。 第3項之流體儲存及分配系統,其中 體、不透液體膜片。 第1項之流體儲存及分配系統,其中 控制閥,操作式聯結於其之閥致動 ,供作勢閥致動器,以起始閥之調 之流體所導得之氣體之排出流動。 分配系統,包含:6. The scope of the patent application: storage, storage and distribution of fluids, where the container includes the assembly assembly, fluid 1 in the force regulator, an internal volumetric force that flows a fluid to store a fluid and divides a fluid pressure; Self-fluid pressure causes gas to pass through the fluid pressure 2. If fluid pressure regulation is applied 3. If fluid pressure regulation is applied to flow through the flow 4. If phase separator is included 5. If the distribution assembly package is included contains the regulator inside the container -The patented scope of the flow-through regulator is patented. The scope has an integrated pressure adjustment. The patentable scope includes a first-rate actuator and an automatic controller for control from the container. 6. Kind of fluid storage and The distribution system includes: a container encapsulating an internal volume for containing a fluid flow port; connected to communicate with the port in fluid flow; and associated with the port and arranged to maintain a self-contained container derived from the container The predetermined pressure of the exhaust gas is a flow control element, which is a gas flow channel that can be selectively used as a fluid in a partial volume. A fluid distribution assembly for gas to be discharged from the container; before passing through the flow control element, the fluid flows at the time of the discharge. The fluid storage and distribution system of item 1 is arranged inside the internal volume of the container. The fluid storage and distribution system of item 1, wherein the phase separator is associated with its operation type for preventing a liquid node. The fluid storage and distribution system of item 3, wherein the body is a liquid-impermeable membrane. The fluid storage and distribution system of item 1, wherein the control valve is actuated by a valve coupled to it for actuation as a potential valve actuator, which discharges the gas derived from the fluid regulated by the starting valve. Distribution system including: 88120690.ptd 第39頁 4182 9 7 存及分配容器,包封一 容器包括一流體流動口 配總成,聯結為與該口 力調節器,與該口關聯 中之流體所導得之自容 六、申請專利範圍 一流體儲 流體,其中 一流體分 一流體壓 之内部容積 力; 流體分配 動,以使自 過流體壓力 一種容納 化酸類氣體 7. —種流 一流體儲 流體,其中 一流體分 一流體壓 之内部容積 力; 流體分配 動,以使自 過流體壓力 以及 其中液體 烷及乙硼烷 總成包含一 容器之内部 調節器及流 在容器内部 所組成類組 體儲存及分 存及分配容 容器包括一 配總成,聯 力調節器, 中之流體所 流動控制元 容積中之流 體分配總成 容積,選自 之液體。 配系統,包 器 流體流動口 結為與該口 與該口關聯 導得之自容 内部容積,供容納一種 7 成流體流動相通; ,並設置為保持自容器 器所排出氣體之預定壓 件,其為可選擇性作 體所導得之氣體流動通 ,供氣體自容器排出; 由液化氫化物氣體及液 η 含 包封一内部容積,供容納一種 總成包含一流動控制元 容器之内部容積中之流 調節器及流體分配總成 成流體流動相通; ,並設置為保持自容器 器所排出氣體之預定壓 件,其為可選擇性作 體所導得之氣體流動通 ,供氣體自容器排出; 氫化物包含一種選自由胂,膦,銻化三氫,石夕 所,組成類組之II化物類。88120690.ptd Page 39 4182 9 7 A storage and distribution container, which encloses a container including a fluid flow port assembly, is connected to the mouth force regulator, and is self-contained by the fluid associated with the mouth. The scope of the application for a patent is a fluid storage fluid, in which a fluid is divided into a fluid pressure and an internal volumetric force; the fluid is dispensed so that the self-fluid pressure accommodates an acidic gas. The internal volumetric force of a fluid pressure; the fluid is dispensed so that the self-fluid pressure and the liquid alkane and diborane assembly in which the container contains the internal regulator The distribution container includes a distribution assembly, a joint force regulator, and a fluid distribution assembly volume in a fluid control element volume in which the fluid flows, and is selected from the group of liquids. Equipped with a system, the fluid flow port of the container is a self-contained internal volume derived from the mouth and the mouth, which is used to accommodate a 70% fluid flow communication; and is arranged to maintain a predetermined pressure piece of gas discharged from the container It is a gas flow channel derived from a selective body for the gas to be discharged from the container; the liquefied hydride gas and the liquid η contain an internal volume for containing an internal volume of an assembly containing a flow control element container The medium flow regulator and the fluid distribution assembly are in fluid communication; and it is arranged to maintain a predetermined pressure member for the gas discharged from the container, which is a gas flow channel derived from the selective operation for the gas from the container Exhaust; the hydride contains a type II compound selected from the group consisting of rhenium, phosphine, antimony trihydrogen, Shi Xisuo. 88120690.ptd 第40頁 4182 9 7 六、申請專彳!1範® 一 " --— _ 8. —種流體儲存及分配系統,包含: -流體:存及分配容器,包封 流體’其中容器包括一流體流動口;㉟W納-種 一流f ί Ϊ總成’聯結為與該口成流體流動相通. -流體塵力調節器,與該口關聯,並設置為=自一 =部容積中之流體所導得之自容器所排出氣體之預= 流體分成包含一流動控制元件,其為可選擇性作 動’以使自容器之内部容積中之流體所導得之 過流體壓力調節器及流體分配總成Μ共氣體自容器=通 以及 ^ 一種容納在容器内部容積,選自由胂,三氣化硼及四氟 化硼所組成類組之液體。 f 9. 一種流體儲存及氣體分配系統,包含: 一儲存及分配容器,被構造及設置以容納一種其蒸汽構 成予以分配之流體之液體,其中該流體在流體為液體狀態 之壓力下予以容納在儲存及分配容器; 儲存及分配容器包括一流體流動口; 一分配總成,聯結至出口;以及 一流體壓力調節器/分相器總成,被内部配置在容器, 以將液體容留在容器,並防止液體在氣體分配時流入分配 總成;以及 一控制器,供選擇性作動分配總成,以完成自容器中之 液體導得之氣體流動通過流體調節器/分相器總成及分配88120690.ptd Page 40 4182 9 7 VI. 1 范 ® one-"__ 8.-a fluid storage and distribution system, including:-fluid: storage and distribution container, encapsulating fluid 'where the container includes a fluid flow port; ㉟W-a first-class f ί Ϊ Ϊ The assembly is connected in fluid communication with the mouth.-A fluid dust regulator is associated with the mouth, and is set to = from a = the volume of the fluid in the volume, the pre-exhaust gas from the container = fluid It is divided into a flow control element, which is selectively actuable to pass the fluid pressure regulator and the fluid distribution assembly M derived from the fluid in the internal volume of the container. The internal volume of the container is selected from the group consisting of thorium, boron trioxide and boron tetrafluoride. f 9. A fluid storage and gas distribution system comprising: a storage and distribution container constructed and arranged to contain a liquid whose vapor constitutes a fluid to be distributed, wherein the fluid is contained in the fluid under pressure in a liquid state; Storage and distribution container; storage and distribution container includes a fluid flow port; a distribution assembly connected to the outlet; and a fluid pressure regulator / phase separator assembly disposed inside the container to hold the liquid in the container, And prevent liquid from flowing into the distribution assembly during gas distribution; and a controller for selectively actuating the distribution assembly to complete the flow of gas derived from the liquid in the container through the fluid regulator / phase separator assembly and distribution 88120690.ptd 第41頁 418P9? 六、申請專利範圍 總成,供氣體自系統排出; 致使氣體在流動通過流動控制元件前,在該排出時流動 通過流動控制元件。 1 0.—種流體儲存及氣體分配系統,包含: —流體儲存及分配容器,包封一内部容積,供容納一種 流體,其中容器包括一流體流動口; 一流體分配總成,聯結為與該口成流體流動相通; 一流體壓力調節器,與該口關聯,並設置為保持自容器 之内部容積中之流體所導得之自容器所排出氣體之預定壓 力; 流體分配總成包含一流動控制元件,其為可選擇性作 動,以使自容器之内部容積中之流體所導得之氣體流動通 過流體壓力調節器及流體分配總成,供氣體自容器排出; 以及 在流體流動口有一單一接縫。 11.如申請專利範圍第9項之流體儲存及氣體分配系統, 其中分相器包含一多孔膜片,其為可透自液體導得之氣 體,但不可透液體,配置在壓力調節器之上游,因而防止 液體進入及妨礙流體壓力調節器保持液體在容器中之功 能,並防止液體自容器流出。 1 2.如申請專利範圍第9項之流體儲存及氣體分配系統, 其中容器有雙流體流動口。 1 3. —種流體儲存及氣體分配系統,包含: 一流體儲存及分配容器,包封一内部容積,供容納一種88120690.ptd Page 41 418P9? 6. Scope of patent application Assembly for the gas to be discharged from the system; before the gas flows through the flow control element, it flows through the flow control element during the discharge. 1 0.—A fluid storage and gas distribution system, including: — a fluid storage and distribution container, enclosing an internal volume for containing a fluid, wherein the container includes a fluid flow port; a fluid distribution assembly connected to the fluid The port is in fluid communication; a fluid pressure regulator is associated with the port and is set to maintain a predetermined pressure of the gas discharged from the container derived from the fluid in the internal volume of the container; the fluid distribution assembly includes a flow control A component, which is selectively actuable so that the gas derived from the fluid in the internal volume of the container flows through the fluid pressure regulator and the fluid distribution assembly for the gas to be discharged from the container; and there is a single connection at the fluid flow port Seam. 11. The fluid storage and gas distribution system according to item 9 of the scope of patent application, wherein the phase separator includes a porous membrane, which is a gas that is permeable to liquid, but is impermeable to liquid, and is arranged in the pressure regulator. Upstream, thus preventing liquid from entering and preventing the fluid pressure regulator from maintaining the function of the liquid in the container, and preventing liquid from flowing out of the container. 1 2. The fluid storage and gas distribution system according to item 9 of the patent application, wherein the container has a dual fluid flow port. 1 3. A fluid storage and gas distribution system comprising: a fluid storage and distribution container, enclosing an internal volume for containing one 88120690.ptd 第42頁 418297 六、申請專利範圍 流體,其中容器包括一流體流動口; 一流體分配總成,聯結為與該口成流體流動相通; 一流體壓力調節器,與該口關聯,並設置為保持自容器 之内部容積中之流體所導得之自容器所排出氣體之預定壓 力; 流體分配總成包含一流動控制元件,其為可選擇性作 動,以使自容器之内部容積中之流體所導得之氣體流動 通過流體壓力調節器及流體分配總成,供氣體自容器排 出;以及 其中容器容納一種選自由液化氫化物氣體及液化酸類氣 體所組成類組之流體。 14. 一種半導體製造系統,包含一利用一種氣體,及該 氣體源之半 一流體儲 流體,其中 一流體分 一流體壓 之内部容積 力流體分配 動,以使自 過流體壓力 以及 導體製造裝置,其中該源包含: 存及分配容器,包封一内部容積,供容納一種 容器包括一流體流動口; 配總成,聯結為與該口成流體流動相通; 0 力調節器,與該口關聯,並設置為保持自容器 中之流體所導得之自容器所排出氣體之預定壓 總成包含一流動控制元件,其為可選擇性作 容器之内部容積中之流體所導得之氣體流動通 調節器及流體分配總成,供氣體自容器排出; 一種在流體儲存及分配容器内部容積之流體,其中該流 體為選自由高壓氣體及液化氣體所組成之類組。88120690.ptd Page 42 418297 VI. Patent application fluid, where the container includes a fluid flow port; a fluid distribution assembly connected to communicate with the port in fluid flow; a fluid pressure regulator associated with the port, and It is set to maintain a predetermined pressure of the gas discharged from the container, which is derived from the fluid in the internal volume of the container; the fluid distribution assembly includes a flow control element, which is selectively actuable so that The gas derived from the fluid flows through the fluid pressure regulator and the fluid distribution assembly for the gas to be discharged from the container; and the container contains a fluid selected from the group consisting of a liquefied hydride gas and a liquefied acid gas. 14. A semiconductor manufacturing system, comprising a gas and a half of a fluid storage fluid of the gas source, wherein an internal volumetric force of a fluid is divided into a fluid pressure to distribute the fluid so that the pressure of the fluid and the conductor manufacturing device, The source includes: a storage and distribution container that encloses an internal volume for containing a container including a fluid flow port; an assembly assembly connected to communicate with the port for fluid flow; 0 a force regulator associated with the port, It is arranged to maintain a predetermined pressure assembly of the gas discharged from the container derived from the fluid in the container, and includes a flow control element for selectively adjusting the flow of gas derived from the fluid in the internal volume of the container. And a fluid distribution assembly for gas to be discharged from the container; a fluid in a fluid storage and distribution container internal volume, wherein the fluid is selected from the group consisting of high-pressure gas and liquefied gas. 88120690.ptd 第43頁 418^97 六、申請專利範圍 15.如申請專利範圍第14項之半導體製造系統,其中半 導體製造裝置為選自由離子植入室,化學汽相沉積反應 器,平版印刷執單元,起泡器,液體輸送單元,及清潔設 備所組成之類組。 1 6. —種供儲存及分配流體之方法,包含: 將流體在一種對流體壓力調節器之限定狀態容納在一藉 一在該流體壓力調節器下游之該流體流動路徑之流動控制 元件,對流體壓力調節器之下游之流體流動閉合之流體流 動路徑;以及88120690.ptd Page 43 418 ^ 97 6. Application for Patent Scope 15. For the semiconductor manufacturing system under item 14 of the scope of patent application, the semiconductor manufacturing device is selected from the group consisting of ion implantation chamber, chemical vapor deposition reactor, and lithographic printing executive. Units, bubblers, liquid delivery units, and cleaning equipment. 1 6. —A method for storing and distributing fluid, comprising: accommodating the fluid in a defined state for a fluid pressure regulator in a flow control element borrowing a fluid flow path downstream of the fluid pressure regulator, and A closed fluid flow path for fluid flow downstream of the fluid pressure regulator; and 開啟在該流體流動路徑之流動控制元件,以導致流體在 流體壓力調節器下游流動,並排出流體,藉以選擇性分配 限定之流體,致使流體在流動通過流動控制元件前,在此 排出時流動通過流體壓力調節器; 其中該流體予以在一有一流體流動口之流體儲存及分配 容器之封閉内部容舍保持在該限定狀態,並且該流體壓力 調節器予以與流體流動口關聯。Turn on the flow control element in the fluid flow path to cause the fluid to flow downstream of the fluid pressure regulator and discharge the fluid, thereby selectively distributing the defined fluid, so that the fluid flows through before the fluid flows through the flow control element A fluid pressure regulator; wherein the fluid is maintained in the restricted state in a closed internal container of a fluid storage and distribution container having a fluid flow port, and the fluid pressure regulator is associated with the fluid flow port. 1 7.如申請專利範園第1 6項之方法’其中所容納之流體 為一種液體’並且流體在分配時在流體壓力調節器之上游 予以分相,以僅允許氣體自容納在限定狀態之流體排出。 1 8, —種製造半導體產品之方法’包含: 將流體在一種對流體壓力調節器之限定狀態容納在一藉 一在該流體壓力調節器下游之該流體流動路徑之流動控制 元件,對流體壓力調節器之下游之流體流動閉合之流體流 動路徑;1 7. The method according to item 16 of the patent application park, wherein the contained fluid is a liquid, and the fluid is phase-separated upstream of the fluid pressure regulator during distribution to allow only the gas to be contained in a limited state. The fluid is drained. 1 8. —A method of manufacturing a semiconductor product 'includes: accommodating a fluid in a restricted state of a fluid pressure regulator in a fluid control element of the fluid flow path downstream of the fluid pressure regulator, and applying pressure to the fluid; Closed fluid flow path for fluid flow downstream of the regulator; 88120690.ptd 第44頁 4 182 9 7 六、申請專利範圍 開啟在該流體流動路徑之流動 必麯默士喟銪突-T、祕Λ 1 動接制元件,以導致流體在 流體壓力调郎=流動,並排出流體,#以選擇性分配 限定之流體,致J流體在流動通過流動控制元件前,在此 排出時流動通過/;,L體壓力調節器;以及 使用排出之诡體於製造半導體產品; 其中該流體予=在—有一流體流動口之流體儲存及分配 容器之封閉肉鄯:積保持在該限定狀態,並且該流體壓力 調節器予以與旅體流動口關聯。 1 9.如申請專牙丨乾圍第1 8項之方法,其中使用排出之流 體包含離子植A 20.如申請專利範圍第18項之方法,其中使用排出之流 體包含化學汽相沉積。 2 1 _ —種流體擁存及分配系統,包含: 一流體儲存及/刀配各器,包封~'内部容積,供容納一種 流體,其中容舞包括一流體流動口; 一流體分配總^,聯結為與該口成流體流動相通; 一流體壓力調$器,與該口關聯,並設置為保持自容器 之内部容積中之流體所導得,自容器所排出氣體之預定壓 力; A) 流體分配總成包含一流動控制元件,其為可選擇性作 動,以使自容内部容積中之流體所導得之氣體流動通 過流體壓力調節器及流體分配總成,供氣體自容器排出; 以及 其中流體壓力調節器予以設置為供在次大氣壓力自容器88120690.ptd Page 44 4 182 9 7 6. The scope of patent application opens the flow of the fluid flow path in the fluid flow path of Mercury Condyle-T, Secret Λ 1 to actuate the control element to cause the fluid to adjust in fluid pressure = Flow and discharge fluid, # to selectively distribute the defined fluid, so that the J fluid flows through the flow control element before it flows through the flow control element, and the L body pressure regulator; and uses the discharged body to manufacture semiconductors Product; wherein the fluid is pre-closed in a fluid storage and distribution container with a fluid flow port: the product is maintained in the restricted state, and the fluid pressure regulator is associated with the travel flow port. 1 9. The method of applying for the special tooth 丨 dry circumstance No. 18, wherein the discharged fluid includes ion implantation A 20. The method of applying for the patent scope No. 18, wherein the discharged fluid includes chemical vapor deposition. 2 1 _ —A fluid storage and distribution system, including: a fluid storage and / or knife distribution device, encapsulating ~ 'an internal volume for containing a fluid, wherein the capacity dance includes a fluid flow port; a fluid distribution total ^ , The connection is in fluid communication with the mouth; a fluid pressure regulator is associated with the mouth and is set to maintain a predetermined pressure derived from the fluid in the internal volume of the container and the gas discharged from the container; A) The fluid distribution assembly includes a flow control element that is selectively actuable to allow the gas derived from the fluid in the internal volume of the container to flow through the fluid pressure regulator and the fluid distribution assembly for gas to be discharged from the container; and Wherein the fluid pressure regulator is provided for the subatmospheric pressure from the container 88120690.ptd 第45頁 六、申請專利範圍 排出氣體。 2 2.如申請專利範圍第1項之流體儲存及分配系統,其中 流體壓力調節器予以設置為供在壓力低於700托自容器排 出氣體。 2 3.如申請專利範圍第9項之流體儲存及氣體分配系統, 其中流體壓力調節器/分相器總成予以設置為供在次大氣 壓力自系統排出氣體。 2 4.如申請專利範圍第9項之流體儲存及氣體分配系統, 其中流體壓力調節器/分相器總成予以設置為供在壓力低 於70 0托自系統排出氣體。 2 5. —種半導體製造系統,包含一利用一種氣體,及該 氣體源之半導體製造裝置,其中該源包含: 一流體儲存及分配容器,包封一内部容積,供容納一種 流體,其中容器包括一流體流動口; 一種流體,其中容器包括一流體流動口; 一流體分配總成,聯結為與該口成流體流動相通; 一流體壓力調節器,與該口關聯,並設置為保持自容器 之内部容積中之流體所導得,自容器所排出氣體之預定壓 力; 流體分配總成包含一流動控制元件,其為可選擇性作 動,以使自容器之内部容積中之流體所導得之氣體流動通 過流體壓力調節器及流體分配總成,供氣體自容器排出; 以及88120690.ptd Page 45 6. Scope of Patent Application Exhaust gas. 2 2. The fluid storage and distribution system according to item 1 of the scope of the patent application, wherein the fluid pressure regulator is set to discharge gas from the container at a pressure lower than 700 Torr. 2 3. The fluid storage and gas distribution system according to item 9 of the scope of the patent application, wherein the fluid pressure regulator / phase separator assembly is set to discharge gas from the system at sub-atmospheric pressure. 2 4. The fluid storage and gas distribution system according to item 9 of the scope of patent application, wherein the fluid pressure regulator / phase separator assembly is set to discharge gas from the system at a pressure lower than 700 Torr. 2 5. A semiconductor manufacturing system comprising a semiconductor manufacturing device using a gas and the gas source, wherein the source includes: a fluid storage and distribution container encapsulating an internal volume for containing a fluid, wherein the container includes A fluid flow port; a fluid, wherein the container includes a fluid flow port; a fluid distribution assembly coupled to communicate with the port in fluid flow; a fluid pressure regulator associated with the port and configured to remain in the container The predetermined pressure of the gas discharged from the container derived from the fluid in the internal volume; the fluid distribution assembly includes a flow control element that is selectively actuable to cause the gas derived from the fluid in the internal volume of the container Flowing through a fluid pressure regulator and a fluid distribution assembly for gas to be discharged from the container; and 其中流體壓力調節器予以設置為供在次大氣壓力自容器 8S120690.ptd 第46頁 4182P 六、申請專利範圍 排出氣體。 體壓力調節^号/ =範圍第14項之半導體製造系統,其中流 自系統排出^分相器總成予以設置為供在壓力低於700托 2:·對流種二體力之:,供儲存及分配,包含: 壓力調節器之碉即器之限定狀態,將流體容納在對流體 開啟流體炉if流動下游閉合之流體流動路徑;以及 藉以選擇性乂至流體壓力調節器之流體流動下游, 之逮率排出二體,^定之流體,並以流體壓力調節器所確定 Jr* m 其t流體壓Λ _ π „ 體至流體流動'予以設置為供在次大氣壓力排出流 2:如申請專利範圍第 之方法 器予以設置為供在壓力低於7 ,,; : f !壓力㈣ 徑。 在於^υϋ托排出流體至流體流動路 29. 一種製造半導體產品之方法,包含: 對流體壓力謂節器之限定狀態,將流體 壓力調節器之流體流動下游閉合之流體流動路=在對流體 開啟流體流動路徑至流體壓力調節器之流體;私 藉以選擇性分配限定之流體, 體凌動下游, 之速率排出流體, α即器所確定 使用排出之流體於製造半導體產品; 其f流體壓力調節器予以設置為供在次 體至流體流動路徑。 &力排出流Among them, the fluid pressure regulator is set to discharge the gas from the container at the sub-atmospheric pressure 8S120690.ptd Page 46 4182P VI. Body pressure adjustment ^ number / = The semiconductor manufacturing system of item 14 in which the flow is discharged from the system ^ The phase separator assembly is set to be used at a pressure lower than 700 Torr 2: Convection type two physical strength: for storage and Distribution, including: the restricted state of the pressure regulator, the fluid is contained in the fluid flow path closed downstream of the fluid if the fluid furnace is opened; and the selective fluid flow downstream of the fluid pressure regulator The second fluid is discharged at a fixed rate, and Jr * m determined by the fluid pressure regulator, and its fluid pressure Λ _ π „body-to-fluid flow 'is set to be discharged at the sub-atmospheric pressure 2: The method device is set to be provided at a pressure lower than 7 ;; f! Pressure ㈣ diameter lies in the discharge fluid to the fluid flow path 29. A method of manufacturing a semiconductor product, comprising: In a limited state, the closed fluid flow path downstream of the fluid flow of the fluid pressure regulator = the fluid that opens the fluid flow path to the fluid to the fluid pressure regulator; the private choice The fluid with limited distribution is discharged at a rate downstream of the body agitation, α is the determined use of the discharged fluid for the manufacture of semiconductor products; and the f fluid pressure regulator is set for the secondary body to fluid flow path. &Amp; Force discharge 88120690.ptd 第47頁 * 418297 l 六、申請專利範圍 _ Λ〇‘二申署請,專利範園第18項之方法,其中流體麗力調r 徑。"供在壓力低於700托排出流體至流體流動‘ 31. 一種流體儲存及分配系統,包含: :流=存及分配容器’包封一内部容積,供容納 流體’其中容器包括一流體流動口; 種 一種在該内部容積在超大氣壓力之流體; 一流體分配總成,聯結為與該口成流體流動相通. 一流體壓力調節器’與該口關聯,並設置為保持自办 之内部容積中之流體所導得之自容器所排出氣體之^ 力,致使氣體在壓力低於該超大氣壓力自容器排出, Γ) 流體分配總成包含一流動控制元件,其為可選擇性 動,以使自容器之内部容積中之流體所導得之氣體、,免^、 過流體壓力調節器及流體分配總成’供氣體自容器=出通 致使流體在流動通過流動控制元件前,在該排出時流動通 過流體壓力調節器。 W 32. 如申請專利範園第31項之流體儲存及分配系統,i 中該流體包含一種選自由氫化物,鹵化物’蝕刻氣體/及 供半導體製造設備之清潔反應劑所組成類纽之流體。 33. 如申請專利範園第31項之流體儲存及分配系統,兑Q 中該流體包含一種逡自由胂,膦,銻化三氣,矽烷,/、 烷,乙硼烷’及四氟化棚所組成類組之流體類。 34. —種流體儲存及分配裝置’包含: 一流體儲存及分酿容器,有一頸部界定容器之一口 . —88120690.ptd Page 47 * 418297 l 6. Scope of Patent Application _ Λ〇 ‘Two applications, the method of Item 18 of the Patent Park, in which the fluid force adjusts the r diameter. " For discharging fluid to fluid flow at a pressure lower than 700 Torr '31. A fluid storage and distribution system comprising:: flow = storage and distribution container' encloses an internal volume for containing fluid 'wherein the container includes a fluid flow A fluid distribution assembly connected in fluid communication with the mouth; a fluid pressure regulator 'is associated with the mouth and is set to maintain its own interior The force of the gas discharged from the container by the fluid in the volume causes the gas to be discharged from the container at a pressure lower than the superatmospheric pressure. Γ) The fluid distribution assembly includes a flow control element, which is selectively movable. In order to make the gas derived from the fluid in the internal volume of the container through the fluid pressure regulator and the fluid distribution assembly 'supply gas from the container = out of the way before the fluid flows through the flow control element, Flows through the fluid pressure regulator during discharge. W 32. If the fluid storage and distribution system of item 31 of the patent application park, the fluid in i contains a fluid selected from the group consisting of hydrides, halides' etching gases, and cleaning reagents for semiconductor manufacturing equipment . 33. If the fluid storage and distribution system of item 31 in the patent application park, the fluid contains a kind of tritium free tritium, phosphine, antimony trigas, silane, alkane, diborane 'and tetrafluoride shed The fluid class of the group. 34. —A fluid storage and distribution device ’includes: a fluid storage and distribution container, and a neck defining a mouth of the container. — 88120690.ptd88120690.ptd 六、申請專利範圍 一氣體調節器,安裝在該口,並設定至一預定壓力水 準,供在預定壓力水準分配自流體該容器中之導得之氣 體;以及 一閥頭,接合至容器之頸部,該閥頭包括一閥,其為可 選擇性開啟或關閉,設置為致使流體在流動通過閥前,在 該分配時流動通過流體壓力調節器,以在氣體調節器予以 設定之預定壓力水準,控制氣體之分配。 3 5,如申請專利範圍第3 4項之流體儲存及分配裝置,容 納一種半導體製造用之流體。 3 6.如申請專利範園第34項之流體儲存及分配裝置,在 口有一單一接縫。 37.如申請專利範圍第34項之流體储存及分配裝置,其 中調節器之至少一部份為在容器之頸部内。 3 8.如申請專利範圍第34項之流體儲存及分配裝置,其 中調節器之至少一部份為在容器之内部容積。 3 9.如申請專利範圍第34項之流體儲存及分配裝置,其 中閥頭之閥包含一自動閥。 4 0.如申請專利範圍第34項之流體儲存及分配裝置,其 中閥頭之閥包含一手動閥。 41.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含一種氫化物氣體之流體。 4 2.如申請專利範圍第3 4項之流體儲存及分配裝置,容 納一種包含一種酸類氣體之流體。 43.如申請專利範圍第34項之流體儲存及分配裝置,容6. Scope of patent application: a gas regulator installed at the port and set to a predetermined pressure level for distributing the gas derived from the container at a predetermined pressure level; and a valve head connected to the neck of the container The valve head includes a valve that is selectively openable or closable, and is configured to cause fluid to flow through the fluid pressure regulator before the fluid passes through the valve to a predetermined pressure level set by the gas regulator. Control the distribution of gas. 35. If the fluid storage and distribution device in the scope of patent application No. 34, contains a fluid for semiconductor manufacturing. 3 6. If the fluid storage and distribution device of item 34 of the patent application park has a single seam at the mouth. 37. The fluid storage and distribution device of claim 34, wherein at least a portion of the regulator is within the neck of the container. 3 8. The fluid storage and distribution device according to item 34 of the patent application, wherein at least a part of the regulator is the internal volume of the container. 39. The fluid storage and distribution device of claim 34, wherein the valve at the valve head includes an automatic valve. 40. The fluid storage and distribution device of claim 34, wherein the valve at the valve head includes a manual valve. 41. The fluid storage and distribution device of claim 34, which contains a fluid containing a hydride gas. 4 2. The fluid storage and distribution device according to item 34 of the scope of patent application, which contains a fluid containing an acid gas. 43. If the fluid storage and distribution device of item 34 of the scope of patent application, 88120690.ptd 第49頁 4 1 A797 六、申請專利範圍 納一種包含一種選自由胂,膦,銻化三氫,矽烷,及乙硼 烷所組成類組之流體類之流體。 44. 如申請專利範圍第34項之流體儲存及分配裝置,另 包含一種可透氣體液體阻擋層,設置為防止液體與氣體調 節器接觸。 45. 如申請專利範圍第34項之流體儲存及分配裝置,其 中氣體調節器包含一提動元件,其予以偏壓至一座結構, 以防止在壓力高於預定壓力水準之流動。 46. 如申請專利範圍第34項之流體儲存及分配裝置,其 中氣體調節器為一固定設定點裝置。 47. 如申請專利範圍第34項之流體儲存及分配裝置,其 中氣體調節器為一可變設定點裝置。 48. 如申請專利範圍第34項之流體儲存及分配裝置,其 中該閥頭包含一電動閥。 4 9.如申請專利範圍第34項之流體儲存及分配裝置,其 中該閥頭包含一氣動閥。 5 0.如申請專利範圍第34項之流體儲存及分配裝置,其 中該容器包含一單一口。 5 1.如申請專利範圍第34項之流體儲存及分配裝置,另 包含一該閥用之閥致動器。 5 2,如申請專利範圍第51項之流體儲存及分配裝置,另 包含一中央處理器單元,聯結為與閥致動器成控制關係, 以調變在其分配之氣體之流動。 5 3.如申請專利範圍第52項之流體儲存及分配裝置,其88120690.ptd Page 49 4 1 A797 6. Scope of patent application A fluid containing a fluid selected from the group consisting of rhenium, phosphine, antimony trihydrogen, silane, and diborane. 44. The fluid storage and distribution device according to item 34 of the patent application, further comprising a gas-permeable liquid barrier provided to prevent liquid from contacting the gas regulator. 45. The fluid storage and distribution device of claim 34, wherein the gas regulator includes a lifting element that is biased to a structure to prevent flow at a pressure higher than a predetermined pressure level. 46. The fluid storage and distribution device according to item 34 of the application, wherein the gas regulator is a fixed setpoint device. 47. The fluid storage and distribution device according to item 34 of the patent application, wherein the gas regulator is a variable setpoint device. 48. The fluid storage and distribution device of claim 34, wherein the valve head includes an electric valve. 49. The fluid storage and distribution device of claim 34, wherein the valve head includes a pneumatic valve. 50. The fluid storage and distribution device of claim 34, wherein the container includes a single port. 5 1. The fluid storage and distribution device according to item 34 of the patent application, further comprising a valve actuator for the valve. 52. For example, the fluid storage and distribution device according to item 51 of the patent application scope further includes a central processing unit, which is connected in a control relationship with the valve actuator to modulate the flow of the gas distributed in it. 5 3. If the fluid storage and distribution device of scope 52 of the patent application, 88120690.ptd 第50頁 4 1829 7 六、申請專利範圍 中中央處理器單元予以結合為對一在其中耗用所分配氣體 之加工設施成監視關係,以監視該設施之加工狀況,並響 應式作動閥致動器,以對應於該設施之該氣體之需求,調 變氣體流動至該設施。 5 4.如申請專利範圍第53項之流體儲存及分配裝置,其 中加工設施包含一半導體製造設施。 55.如申請專利範圍第52項之流體儲存及分配裝置,其 中中央處理器單元予以結合為對容器成熱監視關係,以對 應調整氣體之流動,以相對於容器之溫度補償氣體流動。 5 6.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含胂之流體。 5 7.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含膦之流體。 58.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含銻化三氫之流體。 5 9.如申請專利範圍第3 4項之流體儲存及分配裝置,容 納一種包含矽烷之流體。 6 0.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含乙硼烷之流體。 61.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含三氯化硼之流體。 6 2.如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含四氟化硼之流體。 6 3.如申請專利範圍第34項之流體儲存及分配裝置,容88120690.ptd Page 50 4 1829 7 VI. In the scope of the patent application, the central processing unit is combined into a monitoring relationship with a processing facility that consumes the allocated gas in order to monitor the processing status of the facility and act responsively. A valve actuator modulates the flow of gas to the facility corresponding to the gas demand of the facility. 54. The fluid storage and distribution device of claim 53, wherein the processing facility includes a semiconductor manufacturing facility. 55. For a fluid storage and distribution device according to item 52 of the patent application scope, in which the central processing unit is combined to form a thermal monitoring relationship to the container to adjust the gas flow accordingly and compensate the gas flow relative to the temperature of the container. 5 6. The fluid storage and distribution device according to item 34 of the scope of the patent application, which contains a fluid containing tritium. 5 7. The fluid storage and distribution device according to item 34 of the patent application, which contains a fluid containing phosphine. 58. The fluid storage and distribution device according to item 34 of the patent application, which contains a fluid containing antimony trihydrogen. 5 9. The fluid storage and distribution device according to item 34 of the patent application scope, which contains a fluid containing silane. 60. The fluid storage and distribution device according to item 34 of the scope of the patent application contains a fluid containing diborane. 61. A fluid storage and distribution device according to item 34 of the patent application, containing a fluid containing boron trichloride. 6 2. The fluid storage and distribution device according to item 34 of the patent application, which contains a fluid containing boron tetrafluoride. 6 3. If the fluid storage and distribution device of item 34 of the scope of patent application, 88120690.ptd 第51頁 六、申請專利範圍 納一種包含一種鹵化物之流體。 6 4,如申請專利範圍第34項之流體儲存及分配裝置,容 納一種包含一種清潔反應劑之流體。 6 5.如申請專利範圍第1項之流體儲存及分配系統,其中 該容器包含一界限該流體流動口之頸部。 ' 6 6.如申請專利範圍第6 5項之流體儲存及分配系統,其 中至少流體壓力調節器之一部份為在容器之頸部内。 6 7,如申請專利範圍第6 5項之流體儲存及分配系統,其 中至少流體壓力調節器之一部份為在容器之内部容積。 6 8.如申請專利範圍第1項之流體儲存及分配系統,其中 q 容器之該内部容積不容納加熱器。 _ 6 9.如申請專利範圍第1項之流體儲存及分配系統,其中 流體壓力調節器予以設定至次大氣壓預定壓力水準。 7 0.如申請專利範圍第1項之流體儲存及分配系統,其中 流體壓力調節器予以設定至大氣壓預定壓力水準。 7 1.如申請專利範圍第1項之流體儲存及分配系統,其中 流體壓力調節器予以設定至超大氣壓預定壓力水準。 7 2.如申請專利範圍第1項之流體儲存及分配系統,其中 該流體包含氣體。 73. 如申請專利範圍第1項之流體儲存及分配系統,其中 」 該流體包含液化氣體。 74. 如申請專利範圍第1項之流體儲存及分配系統,另包 _ 含一中央處理器單元,聯結為與流動控制元件成控制關 係,以調變在其該排出之氣體之流動。 :88120690.ptd Page 51 6. Scope of patent application A fluid containing a halide is accepted. 64. The fluid storage and distribution device according to item 34 of the patent application contains a fluid containing a cleaning reagent. 6 5. The fluid storage and distribution system according to item 1 of the patent application scope, wherein the container includes a neck that limits the fluid flow opening. '6 6. The fluid storage and distribution system according to item 65 of the patent application scope, wherein at least a part of the fluid pressure regulator is in the neck of the container. 67. If the fluid storage and distribution system according to item 65 of the patent application scope, at least a part of the fluid pressure regulator is the internal volume of the container. 6 8. The fluid storage and distribution system according to item 1 of the patent application, wherein the internal volume of the q container does not contain a heater. _ 6 9. If the fluid storage and distribution system of item 1 of the scope of patent application, the fluid pressure regulator is set to a predetermined pressure level of sub-atmospheric pressure. 70. The fluid storage and distribution system according to item 1 of the scope of patent application, wherein the fluid pressure regulator is set to a predetermined pressure level of atmospheric pressure. 7 1. The fluid storage and distribution system according to item 1 of the scope of patent application, wherein the fluid pressure regulator is set to a predetermined pressure level of superatmospheric pressure. 7 2. The fluid storage and distribution system according to item 1 of the patent application scope, wherein the fluid contains a gas. 73. The fluid storage and distribution system according to item 1 of the patent application, wherein the fluid contains a liquefied gas. 74. If the fluid storage and distribution system of item 1 of the scope of the patent application, the additional package _ contains a central processing unit connected to the control relationship with the flow control element to modulate the flow of the exhaust gas in it. : 88120690.ptd 第52頁 4 18297 六、申諳專利範圍 7 5.如申請專利範圍第1項之流體儲存及分配系統,其中 該流體儲存及分配容器包含一垂直細長大致圓柱形容器。 7 6. —種流體儲存及分配系統,包含: 一流體儲存及分配容器,包封一内部容積,供容納一種 流體,其中容器包括一流體流動口; 一流體分配總成,聯結為與該口成流體流動相通; 一雙級流體壓力調節器,與該口關聯,並設置為在容器 之内部容積保持預定壓力; 流體分配總成為可選擇性作動,以使自容器之内部容積 中之流體所導得之氣體流動通過流體壓力調節器及流體分 配總成,供氣體自容器排出。 7 7.如申請專利範圍第76項之系統,其中雙級流體壓力 調節器予以在内部配置在容器之内部容積。 7 8.如申請專利範圍第76項之系統,其中分配總成包括 一流動控制閥,與一供其之閥致動器操作式聯結,及一自 動控制器,供作動閥致動器,以起始閥之調整,供控制自 容器中之流體所導得之氣體之排出流動。 7 9.如申請專利範圍第76項之流體儲存及氣體分配系 統,另包含一種容納在容器内部容積,選自由液化氫化物 氣體及液化酸類氣體所組成類組之液體。 8 0.如申請專利範圍第76項之流體儲存及氣體分配系 統,另包含一種容納在容器内部容積,選自由胂,膦,銻 化三氫,矽烷,乙硼烷,氟化氫,三氣化硼,四氟化硼, 氯化氫,化矽烷及乙矽烷所組成類組之液體。88120690.ptd Page 52 4 18297 VI. Patent application scope 7 5. The fluid storage and distribution system according to item 1 of the patent application scope, wherein the fluid storage and distribution container comprises a vertically elongated, substantially cylindrical container. 7 6. A fluid storage and distribution system comprising: a fluid storage and distribution container enclosing an internal volume for containing a fluid, wherein the container includes a fluid flow port; a fluid distribution assembly coupled to the port A two-stage fluid pressure regulator is associated with the port and is set to maintain a predetermined pressure in the internal volume of the container; the fluid distribution always becomes selectively actuable so that the fluid in the internal volume of the container The resulting gas flows through the fluid pressure regulator and the fluid distribution assembly for the gas to be discharged from the container. 7 7. The system according to item 76 of the patent application, wherein the two-stage fluid pressure regulator is arranged inside the internal volume of the container. 7 8. The system of claim 76, wherein the distribution assembly includes a flow control valve, operatively coupled with a valve actuator therefor, and an automatic controller for actuating the valve actuator to The adjustment of the starting valve is for controlling the exhaust flow of the gas derived from the fluid in the container. 7 9. The fluid storage and gas distribution system according to item 76 of the patent application scope, further comprising a liquid contained in a container, selected from the group consisting of liquefied hydride gas and liquefied acid gas. 80. The fluid storage and gas distribution system according to item 76 of the patent application scope, further comprising a volume contained in the container, selected from the group consisting of thorium, phosphine, antimony trihydro, silane, diborane, hydrogen fluoride, and boron trioxide. , Boron tetrafluoride, hydrogen chloride, silane and ethilanes. S8120690.ptd 第53頁 418297S8120690.ptd Page 53 418297 六、申請專利範圍 81.如申請專利範圍第76項之流體儲存及氣體分配 統,另包含一種容納在容器内部容積’選自由肿,二、 硼及四氟化硼組成類組之液體。 —: 8 2, —種流體儲存及氣體分配系統,包含: 一儲存及分配容器,被構造並設置為供容納—種其策 汽構成予以分配之流體之液體,其中該流體在流體為、在 4 體狀態之壓力下予以容納在儲存及分配容器; 〜 液· 儲存及分配容器,包括/流體流動口; 一分配總成,聯結至出口;以及 一雙級流體壓力調節器/微粒過濾器總成,被内部配置 在容器;以及 —控制器,供選擇性作動分配總成,以完成自容器中之 液體導得之氣體流動通過流體調節器/分相器總成及分配 總成,供氟體自系統排出。 83. 如申請專利範圍第82項之流體儲存及氣體分配系 統,其中容器容納一種選自由液化氫化物氣體及液化酸類 氣體所組成類組之流體。 84. —種半導體製造系統,包含一利用一種氣體,及該 氣體源之半導體製造裝置,其中該源包含: 一流體儲存及分配容器,包封一内部容積,供容納一種 流體,其中容器包括一流體流動口; 一流體分配總成,聯結為與該口成流體流動相通; 一多級流體壓力調節器,與該口關聯,並設置為在容器 之内部容積保持預定壓力;6. Scope of patent application 81. The fluid storage and gas distribution system according to item 76 of the patent application scope further includes a liquid contained in the container's volume selected from the group consisting of swollen, boron, and boron tetrafluoride. —: 8 2, — A fluid storage and gas distribution system comprising: a storage and distribution container constructed and arranged to hold a liquid of a fluid whose distribution is constituted by steam, wherein the fluid is 4 Storage and distribution containers under pressure in the state of the body; ~ Liquid storage and distribution containers, including / fluid flow ports; a distribution assembly connected to the outlet; and a two-stage fluid pressure regulator / particulate filter assembly It is internally arranged in the container; and-the controller for selectively actuating the distribution assembly to complete the flow of the gas derived from the liquid in the container through the fluid regulator / phase separator assembly and the distribution assembly to supply fluorine The body is discharged from the system. 83. The fluid storage and gas distribution system according to item 82 of the application, wherein the container contains a fluid selected from the group consisting of a liquefied hydride gas and a liquefied acid gas. 84. A semiconductor manufacturing system comprising a semiconductor manufacturing device using a gas and the gas source, wherein the source includes: a fluid storage and distribution container encapsulating an internal volume for containing a fluid, wherein the container includes a A fluid flow port; a fluid distribution assembly coupled to communicate fluid communication with the port; a multi-stage fluid pressure regulator associated with the port and set to maintain a predetermined pressure in the internal volume of the container; 88120690.ptd 第54頁 六、申請專利範圍 流體分配總成,為可選擇性作動,以使自容器之内部容 積中之流體所導得之氣體流動通過流體壓力調節器及流體 分配總成,供氣體自容器排出。 8 5.如申請專利範圍第84項之半導體製造系統,其中半 導體製造裝置為選自由離子植入室,化學汽相沉積反應 器,平版印刷軌單元,起泡器,液體輸送單元,及清潔設 備所組成之類組。 8 6. —種供儲存及分配流體之方法,包含: 在對流體壓力調節器之限定狀態,將流體容納在對流.體 壓力調節器之流體流動下游閉合之流體流動路徑; 開啟流體流動路徑至流體壓力調節器之流體流動下游, 藉以選擇性分配限定之流體,並以流體壓力調節器所確定 之速率排出流體。 8 7.如申請專利範圍第8 6項之方法,其中所容納之流體 為一種液體。 8 8. —種製造半導體產品之方法,包含: 在對流體壓力調節器之限定狀態,將流體容納在對流體 壓力調節器之流體流動下游閉合之流體流動路徑; 開啟流體流動路徑至流體壓力調節器之流體流動下游, 藉以選擇性分配限定之流體,並以流體壓力調節器所確定 之速率排出流體;以及 使用所排出之流體於製造半導體產品。 8 9.如申請專利範圍第88項之方法,其中使用排出之流 體包含離子植入。88120690.ptd Page 54 VI. Patent application fluid distribution assembly, which can be selectively actuated so that the gas derived from the fluid in the container's internal volume flows through the fluid pressure regulator and the fluid distribution assembly for The gas is discharged from the container. 8 5. The semiconductor manufacturing system as claimed in claim 84, wherein the semiconductor manufacturing device is selected from the group consisting of an ion implantation chamber, a chemical vapor deposition reactor, a lithographic track unit, a bubbler, a liquid conveying unit, and a cleaning device. Made up of groups like that. 8 6. —A method for storing and distributing fluid, comprising: in a restricted state of a fluid pressure regulator, containing the fluid in a convection. The fluid flow path closed downstream of the fluid flow of the body pressure regulator; opening the fluid flow path to Downstream of the fluid flow of the fluid pressure regulator, the defined fluid is selectively distributed and the fluid is discharged at a rate determined by the fluid pressure regulator. 8 7. The method of claim 86, wherein the fluid contained therein is a liquid. 8 8. A method for manufacturing a semiconductor product, comprising: in a restricted state of a fluid pressure regulator, containing a fluid in a fluid flow path closed downstream of the fluid flow of the fluid pressure regulator; opening the fluid flow path to the fluid pressure regulation The fluid flows downstream of the device, thereby selectively distributing the defined fluid and discharging the fluid at a rate determined by the fluid pressure regulator; and using the discharged fluid to manufacture semiconductor products. 8 9. The method of claim 88, wherein using the discharged fluid comprises ion implantation. 88120690,ptd 第55頁 182 +··_:ι 182 +··_:ι88120690, ptd Page 55 182 + ·· _: ι 182 + ·· _: ι 六、申請專利範圍 9 0 ·如申凊專利範園8 卜化學汽相沉赭. 貝之方法,其令使用排出之流 體包含化學汽相沉積 9 1.如申s青專利範園第 中流體壓力調節器予以儲存及其 出氣體e D又為供在次大氣壓力自容器排 92. 如申請專利範 中流體壓力調節写予儲存’其 排出氣體。“置為供在壓…U器 93. -種流體储存及分配 理吸附材料,有一種氣 03谷器容納一種物 〇 至SOOOpsig吸附在其上,=j内部壓力約5〇psig 結,並可選擇性操作,以自容===成,與容器聯 94. 如申請專利範圍第93 ^體 中該氣體包含一種選自击急/IL儲存及分配系統,其 金屬化合物氣體所如+氫化物氣體,_化物氣體及有機 笼蜀1 口视轧體所組成類組之氣體類。 中今4令1在自由狀態及在吸附狀態之該氣體。 96·如申請專利範圍第93項之流體儲存及分配盆 中約5至:,之該氣體在物理吸著劑材料存在於自由狀 態,及約60至約95%之該氣體在物理吸著劑材料存在於吸 附狀態。 贼一主種/ΛΓ Μ造系、统,包含一利用一種氣體及該氣 體源之4*導體製造褒置’其中該源包含一容器容納一種物 理吸附材料,有一種氣體在容器中在内部壓力約5〇psig至Sixth, the scope of application for patents is 9 0 · Rushen Patent Patent Park 8 Chemical vapor phase sinking method. The method of using the discharged fluid to include chemical vapor deposition 9 1. Russian Patent Fanyuan No. The pressure regulator stores it and its gas e D is discharged from the container at sub-atmospheric pressure 92. As described in the patent application, the fluid pressure regulation is written to the storage 'its exhaust gas. "Set for pressure ... U-93.-A fluid storage and distribution physical adsorption material, there is a gas trough device to hold a substance 0 to SOOOpsig adsorbed on it, = j internal pressure is about 50psig junction, and Selective operation to self-capacity === Cheng, associated with the container 94. For example, in the scope of the patent application No. 93, the gas contains a type selected from the emergency / IL storage and distribution system, the metal compound gas is + hydride Gases, organic compounds, and organic cages. The gas groups of the mouth rolling group. The gas is in the free state and in the adsorbed state. 96. Fluid storage such as the 93th in the scope of the patent application In the distribution basin, about 5 to: the gas exists in the free state in the physical sorbent material, and about 60 to about 95% of the gas exists in the adsorbed state in the physical sorbent material. One main species of thief / ΛΓ The manufacturing system includes a gas and a 4 * conductor manufacturing device of the gas source, wherein the source includes a container containing a physical adsorption material, and a gas in the container with an internal pressure of about 50 psig to 20690.ptd ι·ϋ20690.ptd ι · ϋ 4^829γ 六、申請專利範圍 5 0 0 Ops i g吸附在其上,及一氣體分配總成與容器聯結,並 可選擇性操作,以自容器分配氣體。 98.如申請專利範圍第97項之半導體製造系統,其中半 導體製造裝置係選自由離子植入室,化學汽相沉積反應 器,平版印刷軌單元,起泡器,液體輸送單元,及清潔設 = 備所組成之類組。 9 9. 一種供儲存及分配流體之方法,包含: 在壓力在約5 0至5 0 0 0 p s i g之範圍,將流體容納在至少部 份吸附狀態;以及 將流體自吸附狀態解除吸附,並將其自密閉容器釋出, 藉以選擇性分配流體。 7 10 0.如申請專利範圍第99項之方法,另包含在半導體製 造加工,使用自密閉容器所釋出之流體。 1 01. —種流體儲存及分配系統,包含 一流體儲存及分配容器,包封一内部容積少於約5 0公 升,並有一進口開口大於lc寸NGT ; —流體分配總成,設置為供自容器選擇性分配流體;以 及 一流體壓力調節器,在容器之内部容積,設置為在其中L. 保持預定壓力。 1 j 1 02.如申請專利範圍第1 01項之流體儲存及分配系統, 其中該容器之内部容積為少於約2 0公升。 ^ 1 0 3.如申請專利範圍第1 01項之流體儲存及分配系統, 其中該容器之内部容積少於約1 0公升。 :4 ^ 829γ VI. Patent application scope: 500 Ops i g is adsorbed on it, and a gas distribution assembly is connected with the container, and can be selectively operated to distribute gas from the container. 98. The semiconductor manufacturing system of claim 97, wherein the semiconductor manufacturing device is selected from the group consisting of an ion implantation chamber, a chemical vapor deposition reactor, a lithographic track unit, a bubbler, a liquid transport unit, and a cleaning device. Group of equipment. 9 9. A method for storing and distributing a fluid, comprising: accommodating the fluid in at least a partially adsorbed state at a pressure in the range of about 50 to 5000 psig; and desorbing the fluid from the adsorbed state, and It is released from a closed container, thereby selectively distributing the fluid. 7 10 0. The method according to item 99 of the scope of patent application, further comprising semiconductor manufacturing and processing, using a fluid released from a closed container. 1 01. — A fluid storage and distribution system, including a fluid storage and distribution container, enclosing an internal volume of less than about 50 liters, and having an inlet opening greater than lc inch NGT; — fluid distribution assembly, set for The container selectively distributes fluid; and a fluid pressure regulator, in the internal volume of the container, arranged to maintain a predetermined pressure therein. 1 j 1 02. The fluid storage and distribution system according to the scope of patent application No. 101, wherein the internal volume of the container is less than about 20 liters. ^ 1 0 3. The fluid storage and distribution system according to item 101 of the patent application scope, wherein the internal volume of the container is less than about 10 liters. : S8120690*ptd 第57頁 4 丨82 97 六、申請專利範圍 104_如申請專利範圍第ιοί項之流體儲存及分配系統, 其中該容器之内部容積為在自約1至約10公升之範圍。 10 5.如申請專利範圍第ιοί項之流體儲存及分配系統, 其中容器之壓力容量為至少1〇〇〇磅/平方叶。 10 6.如申請專利範圍第1〇1項之流體儲存及分配系統, 其中容器之壓力容量為至少5〇〇〇磅/平方对。 107. 如申請專利範圍第1〇1項之流體儲存及分配容M, 其中進口開口為1 1/2吋NGT。 5 ’ 108. 如申請專利範圍第1〇1項之流體儲存及分配容 其中進口 開口為1 1/2 吋NGT-11 l/2tpi。 ° ’ 1〇9_ —種半導體製造系統’包含一利用一種氣體 氣體源之半導體製造裝置,其中該源包含: ^ 一流體儲存及分配容器’包封一内部容積少於約5〇八 升’並有一進口開口大於1吋NGT ; A 一流體分配總成,設置為供自容器選擇性分配流體;以 及 一流體壓力調節器,在容器之内部容積,設置為 保持預定壓力。 T 110·如申請專利範圍第109項之半導體製造系統, 半導體製造裝置為選自由離子植入室,化聲呤、 于/飞邪沉積反廍 器’平版印刷軌單元’起泡器’液體輸送單元,生讯 備所組成之類組。 月/ °又 111. 一種流體儲存及分配容器,包含一2. 〇_2 25八 DOT 3ΑΑ 2015 鋼瓶,有一1. 5 吋NGT 開口有 j 1/2·_η ΑS8120690 * ptd Page 57 4 丨 82 97 VI. Patent Application Range 104_If the fluid storage and distribution system of the patent application No. ιοί, the internal volume of the container is in the range from about 1 to about 10 liters. 10 5. The fluid storage and distribution system according to the scope of the patent application, wherein the pressure capacity of the container is at least 1,000 pounds per square leaf. 10 6. The fluid storage and distribution system of claim 101, wherein the pressure capacity of the container is at least 5,000 pounds per square pair. 107. For example, the fluid storage and distribution volume M of the scope of application for patent 101, the inlet opening is 1 1/2 inch NGT. 5 ′ 108. For example, the fluid storage and distribution capacity of item 101 of the patent application scope, wherein the inlet opening is 1 1/2 inch NGT-11 l / 2tpi. ° '109__ A semiconductor manufacturing system' includes a semiconductor manufacturing device utilizing a gas source, wherein the source includes: ^ a fluid storage and distribution container 'encapsulates an internal volume of less than about 508 liters' and There is an inlet opening greater than 1 inch NGT; A a fluid distribution assembly set to selectively distribute fluid from the container; and a fluid pressure regulator set in the internal volume of the container to maintain a predetermined pressure. T 110 · If the semiconductor manufacturing system of the 109th scope of the patent application, the semiconductor manufacturing device is selected from the ion implantation chamber, sulfonate, Yu / Feixie deposition reactor 'lithographic printing track unit' bubbler 'liquid delivery Unit, a group consisting of bio-informatics equipment. Month / ° and 111. A fluid storage and distribution container, including a 2.0 〇 25 25 DOT 3ΑΑ 2015 steel cylinder, a 1.5 inch NGT opening with j 1/2 · _η Α 418297 六、申請專利範圍 ^ = Τ螺紋,4.187至4.25对外徑,額定壁厚 0, 125吋,及長度12. 75至13. 75吋。 沒υ.ϋΜ至 112·—種流體儲存及分配總成,& j _ 積少於50公升,及一 顒部^ 有一内部容 至頸邹開口,一調節器聯結至分配分配總成聯結 内部容積。 才配總成,並配置在容器之 113頸:申請專利範圍第112項之流體儲存及分配總成, 、員開口為一1. 5对NGT頸部開口。 另114各如申請專利範圍第112項之流體儲存及分配總成, 連接至調節器之微粒過遽器,供防止微粒進入流 媸分配總成。 二i申請專利範圍第112項之流體儲存及分配總成, 中5周節器包含一多級調節器。 盆1中11如申請專利範圍第112項之流體儲存及分配總成, 二甲谷器容納一種物理吸附材料,及物理吸附材料對直且 有吸附親合性之一種氣體。 ’ 11 7,如申請專利範圍第u 6項之流體儲存及分配容器, 中在容器内部容積之壓力為大於5〇psigo418297 VI. Application patent scope ^ = T thread, 4.187 to 4.25 pairs of outer diameter, rated wall thickness 0, 125 inches, and length 12.75 to 13.75 inches. No υ.ϋΜ to 112 · —a kind of fluid storage and distribution assembly, & j _ volume is less than 50 liters, and a crotch ^ has an internal volume to the neck opening, a regulator connected to the interior of the distribution and distribution assembly Volume. Only equipped with the assembly, and is arranged in the 113 neck of the container: the fluid storage and distribution assembly of the 112th patent application, the opening of the member is a 1.5 pair of NGT neck opening. The other 114 are fluid storage and distribution assemblies each corresponding to item 112 of the scope of patent application, and a particulate filter connected to the regulator for preventing particles from entering the flow distribution assembly. The fluid storage and distribution assembly of the second application for item 112 of the patent application includes a multistage regulator in the middle 5 weeks. In 11 of basin 1, such as the fluid storage and distribution assembly of item 112 of the scope of the patent application, the Dijia Valley device contains a physical adsorbent material, and a gas that is straight and has an affinity for adsorption. ′ 11 7. If the fluid storage and distribution container of item u 6 of the scope of patent application, the pressure in the internal volume of the container is greater than 50 psigo
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Publication number Priority date Publication date Assignee Title
TWI680254B (en) * 2014-06-13 2019-12-21 美商恩特葛瑞斯股份有限公司 Adsorbent-based pressure stabilization of pressure-regulated fluid storage and dispensing vessels

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI680254B (en) * 2014-06-13 2019-12-21 美商恩特葛瑞斯股份有限公司 Adsorbent-based pressure stabilization of pressure-regulated fluid storage and dispensing vessels

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