TW418161B - Manufacturing process of ink jet printhead - Google Patents

Abstract

The present invention relates to a manufacturing process of an ink jet printhead. The ink jet printhead comprises a plurality of ink tanks for storing an ink; a nozzle plate having a plurality of ink nozzles corresponding to the plurality of ink tanks for ejecting the ink; and a chip for controlling the ejection of the ink. The process comprises: (a) coating a photoresist layer on the chip; (b) performing a photolithography step on the photoresist layer to produce a plurality of ink tanks; (c) aligning a plurality of ink nozzles with the plurality of ink tanks by installing a nozzle plate on the photoresist layer; and (d) heating the photoresist layer so that the photoresist layer is adhered to the chip and the nozzle plate.

Description

Printed by Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs

d 1 6 l .j ^ '% * A7 _B7_ V. Description of the invention (1) This case relates to a method for manufacturing the inkjet head of an inkjet printer, especially an inkjet printer that does not require adhesive bonding. Inkjet head manufacturing methods · Inkjet printers have always occupied a place in the printing market. With its increasing resolution and easy application in color printing, inkjet printers have not been used for laser printing. The appearance of the printer was eliminated. For inkjet printers, the inkjet head is a very important part because it is closely related to print quality. Please refer to the first figure, which shows a typical inkjet The head, the main body of the inkjet head is a wafer 1, which contains a circuit for receiving the control of the software to perform the inkjet action. There is a hollow in the middle which is the ink storage place 2 I for storing all the ink 21, There are a number of ink tanks 3 around the ink storage site 2 which can communicate with the ink storage site 2 so that the ink 21 can flow in. The ink tank 3 is covered with an orifice plate 4 containing a plurality of inkjet holes 41. The ink tanks 3 each correspond to an inkjet hole 41 as a means for ejecting ink. • an enlarged mouth portion thereof as shown in the second graph in FIG. Please refer to the second figure, which is an enlarged circle of a side cross section of an ink tank 3 in the first figure. The ink tank 3 is a groove obtained by lithography of a photoresist layer 31. The wafer 1 includes a heating sheet. When we instruct to print on paper, the circuit in wafer 1 controls the heating sheet to start heating the ink 21, and the ink 21 is ejected from the inkjet holes 41 on the nozzle plate 4 to the paper. It can be seen that when we If an inkjet printer is required to have high resolution, the inkjet hole 41 must be small enough to control the ejection amount of the ink 21. Please refer to the third figure. It is a conventional inkjet printer Schematic diagram of the manufacturing method of the inkjet head. Firstly, a photoresist layer 31 is coated on the wafer 1, and the micro paper size 2 is applicable to the Chinese national standard {CMS) A4 specification (210X297 mm). (Please read the precautions on the back first. Then fill in this I) Ding Consumer Cooperative Printing Bag of the Central Standards Bureau of the Ministry of Economic Affairs; '· Α7 __Β7 _ V. Description of the Invention (2) The space formed by the shadow is used as the ink tank 3 containing the ink 21, and then these components are hard roasted, Reduce the residual solvent content in the photoresist layer 31, and then Point the adhesive 5 on the photoresist layer 31, and finally put the nozzle plate 4 * After aligning the inkjet hole 41 with the ink tank 3, you can add the temperature to the house. The biggest disadvantage of this method is that the precision parts The amount of adhesive required is very small * The amount of adhesive is difficult to control properly * If the amount of adhesive is too large, it is easy to block the tiny inkjet holes, causing the ink tank to be blocked, and the ink cannot be ejected from the inkjet holes. If the amount is not enough, it will cause improper adhesion, which will cause the nozzle plate to fall off, or the ink leaked from the ink tank. In addition, precision dispensing equipment is very expensive, but even the most precise dispensing equipment cannot reach 100%. The yield rate is only about 50%, which is a real waste of manufacturing costs. Therefore, in view of the lack of conventional technology * and the spirit of perseverance and excellence in research, the present invention finally issues the inkjet of this case in order to solve the problem of defective rate of the inkjet head manufactured in conventional technology. Method for manufacturing inkjet head of an inkjet printer · The main purpose of this case is to provide a method for producing an inkjet head of an inkjet printer | It is not necessary to adhere the nozzle hole sheet with an adhesive. Another object of this case is to provide a method for manufacturing an ink jet head of an ink jet printer, which can achieve the effect of saving manufacturing time with fewer steps. According to the main purpose of the present case, the idea is to provide a method for manufacturing an inkjet head of an inkjet printer. The inkjet head includes a plurality of ink tanks for containing an ink, and an orifice plate corresponding to A plurality of ink jet holes of the plurality of ink tanks are used for ejecting the ink; a chip is used to control the ink paper size applicable to the Chinese National Standard (CNS) Λ4 specification (210X297)

(Please read the precautions on the back before filling this page) • ^ τ A7 A7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs __B7 V. Description of the invention (3) The injection of water, its ankle system includes: a) in A photoresist layer is coated on the wafer; b) a lithography step is performed on the photoresist to generate the plurality of ink tanks; c) the nozzle plate is placed on the photoresist layer * The plurality of inkjet holes are aligned with the plurality of ink tanks: and d) heating the photoresist layer to make the photoresist layer adhere to the wafer and the orifice plate. According to the above concept, the material of the photoresist layer in the method of manufacturing the inkjet head of the inkjet printer includes a resin. According to the above concept, the material of the photoresist layer in the method of manufacturing the inkjet head of the inkjet printer The material is a dry photoresist, and the thickness of the photoresist layer is preferably 50 μΐη to 100 μm. According to the above-mentioned concept * In the method of manufacturing the inkjet head of an inkjet printer, the material of the photoresist layer is a liquid photoresist The thickness of the photoresist layer is preferably 0. Ιμιπ to 50μιηο. According to the above-mentioned concept, the step d) of the method for manufacturing an inkjet head of an inkjet printer includes a step dl) and a pressure is applied to the nozzle plate. The pressure range is preferably from 0.01 kg / cm2 to 1 kg / cm2. According to the above idea, in the method of manufacturing inkjet heads of inkjet printers, the heating step is a heating plate. The temperature range of the heating step is The temperature is preferably 100 ° C to 250 ° C, and the time of the heating step is preferably 1 minute to 10 hours. According to the above idea, in the method of manufacturing the inkjet head of the inkjet printer, the orifice plate is a metal piece, and the metal piece is preferably a nickel piece. In this case, the following diagram and preferred embodiments are used. Detailed explanation • Get a deeper understanding: (Please read the notes on the back before filling this page)

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Employees of the Central Government Bureau of the Ministry of Economic Affairs of the People's Republic of China printed cooperatives * A7 > > > &___; B7_ Five 'Description of the Invention (4) The first picture: is a schematic circle of a typical inkjet head; the second picture: is The first figure is an enlarged side sectional view of the ink tank; the third figure is a schematic diagram of a manufacturing method of a conventional inkjet printer inkjet head; and the fourth figure is an inkjet type of a preferred embodiment of the present invention Schematic diagram of the manufacturing method of the printer's inkjet head * The main labels in the figure are as follows: Wafer 1; Ink storage 2; Ink 21; Ink tank 3; Photoresistance 31; Nozzle 4; Inkjet 41 41; Adhesive 5. Please refer to the fourth figure, which is a schematic diagram of a method for manufacturing an inkjet head of a star-jet printer according to a preferred embodiment of the present invention. First, a photoresist layer 31 is coated on the wafer 1, and the material of the photoresist layer 31 It is sufficient to use a conventional photo-sensitive material, as long as the liquid photoresist or dry photoresist is used depending on the thickness of the required photoresist layer 31. The liquid photoresist contains more solvent components, which is suitable for forming a thin photoresist. The thickness of the layer is about 0.πμπ »to 50μιη; while the dry photoresist has less solvent components, which is suitable for forming a thicker photoresist layer with a thickness of about 50μιη to 100μιη. The current inkjet heads use dry photoresistors. Can hold more ink. In addition, as long as the resin component in the photoresist material can have a good adhesion effect, there is no special requirement; the coating method is a spin coating method, so the method can uniformly coat the photoresist layer 31 on the wafer 1 Top >> Then, a lithography step is performed. After soft baking, exposure, and development are sequentially performed, unnecessary portions are washed away to form a circular hole-shaped groove. This groove portion is used to hold the ink 21 Ink tank 3. Manufactured by the conventional 5 paper size uses China National Standard (CNS) Λ4 specification (210X297 mm)

(Please read the note on the back before filling this page) 、 1Τ

Λ I Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. A7-B7 V. Description of the invention (5) Method, followed by the lithography step, followed by hard baking to evaporate the solvent in the photoresist layer 31 and increase the photoresist layer 31 Adhesion to wafer 1, but after photoresist 靥 31 has dried, it is no longer possible to adhere to other items; this embodiment is to suspend the hard baking step here. • Before the solvent remains in the photoresist layer 31, Pierce the ink channel, and then use the precise alignment device to place the nozzle plate 4 on the correct position of the wafer, so that the inkjet holes 41 on the nozzle plate 4 are aligned with each corresponding ink tank 3, and then proceed. Steps of Hard Baking · Then bake the entire component hard to reduce the residual solvent content in the photoresist layer 31, so that the photoresist 31 can be properly adhered to the wafer 1 and the nozzle hole 4. The traditional heat conduction heating method uses the parallel heating plate heating and heating temperature and time on both sides of the wafer 1 and the nozzle hole 4 according to the characteristics of the photoresist material. Generally speaking, about 100 ° C to 25 (TC heating for 1 minute to 10 hours. If heating temperature Too low * it takes a long time to evaporate the solvent; if the heating temperature is too high, the element will be unevenly heated, and the surface portion of the photoresist layer 31 will be hardened first, and the internal solvent will not evaporate, which will affect the photoresist layer Adhesiveness 31 of the photoresist layer 31 will worsen the adhesion of the photoresist layer 31 due to the accumulation of too much tensile stress: if the heating time is too short, the residual amount of the solvent inside the photoresist layer 31 will be too large, which will not be appropriate. The wafer 1 and the nozzle plate 4 are bonded together; if the heating time is too long, the adhesion will be reduced due to the brittleness of the photoresist * and the heating cost is wasted. In addition, the nozzle plate 4 can be applied during the heating process. A pressure of about 0.01 kg / cm2 to 1 kg / cin2 * can accelerate the effect of adhesion. Of course, because the manufacturing method provided in this case is simple to implement and almost unlimited. • A slight change in this method can make the efficiency of manufacturing inkjet heads. More (Please read the precautions on the back before filling out this page) Order! 6 This paper size applies the Chinese National Standard (C_NS) A4 format (2Ϊ〇 × 297 mm)

Printed by a member of the Standards Bureau of the Ministry of Economic Affairs and printed by a consumer cooperative 丨 8 1 、 * A7 '__B7 V. Description of the invention (6) For the purpose of mentioning, for example, * The traditional method of bonding nozzle holes is to glue the nozzle holes one by one to the components. On the wafer because of the limitation of the precision adhesive step. • If you want to apply the adhesive to the wafer at one time | and then perform the entire batch of spray hole bonding steps, the adhesive coating time is too long. I am afraid that the adhesive has not been completely applied. The adhesive that was applied earlier has been dried out and cannot be used to bond the nozzle holes. Therefore, the nozzle holes have to be adhered to the wafer one by one. If one wafer contains two hundred wafers, the time required for two hundred sticking steps is considerable; and the method provided by the present case, which uses a photoresist layer to adhere crystal wafers and orifices, can include one whole wafer to two hundred wafers. The nozzle plate is placed on the wafer directly in precise alignment, so that the ink tank is aligned with the inkjet hole, and then heated and pressed with a parallel plate. Two hundred nozzle plates are glued at one time. Obviously, the increase in yield can not be underestimated. Compared with the conventional manufacturing method of inkjet heads for inkjet printers, this case not only saves the manufacturing steps, but also does not require a dispensing step that seriously affects the yield. . In terms of saving steps, this case eliminates the step of glue one by one, and because the applied adhesive also needs to be heated or exposed to ultraviolet light, the adhesive is crosslinked and hardened, and the desired adhesion is achieved. Effect, while in this case, the hard baking step was postponed, and the adhesiveness of the photoresist itself was used directly, eliminating the step of glue one by one and waiting for the adhesive to harden, speeding up the manufacturing process; in addition, in terms of improving yield, Because there is no need to dispense I, there is no need to worry about problems such as nozzle orifices falling off, ink tank leaking, or ink tank blocking due to the difficult to control adhesive dose. Using the photosensitivity of the photoresist, a suitable shape can be formed after the lithography step. Ink tank • Coupled with precise alignment, the photoresist layer can be properly adhered around the inkjet hole, and the yield rate can reach 100%. Finally, please read the precautions on the back before filling in this page)

-1T 7 This paper size is applicable to the country of China_ 家 _ ^ 7 ^) _ A4 (2! OX 297 mm)

4 A7 B7 V. Description of the invention (7 Because the expensive dispensing equipment has been omitted, and the manufacturing yield has been greatly improved. "Therefore, the manufacturing method of the inkjet head of this inkjet printer not only saves equipment costs, but also Reduced raw material cost * Can effectively reflect the progress of this manufacturing method in both manufacturing cost and production capacity * In summary, the manufacturing method of the inkjet head of the inkjet printer provided in this case | Seen in any publication * Therefore it meets the novelty requirements of the invention patent, its streamlined equipment and easy manufacturing • Mass production can be carried out immediately, which meets the practical requirements of the invention patent * and at the same time improves the manufacturing yield and meets the progressive requirements of the invention patent * It is a very expensive work. This case can be modified by any person who is familiar with this skill, but it is not inferior to those who want to protect the scope of patent application. (Please read the note on the back. (Fill in this page again) Consumption cooperation between employees of the Central Bureau of Standards of the Ministry of Economic Affairs Du printed paper size applicable to China National Standards (CNS) A4 specifications (210X297 mm)

Claims (1)

^ C8 · _ D8___ VI. Patent Application Fanyuan 1 · —A method for manufacturing the inkjet head of an inkjet printer, the inkjet head includes a plurality of gutters for holding an ink; There are a plurality of nozzle holes corresponding to the plurality of ink tanks for ejecting the ink; a wafer for controlling the ejection of the ink, the steps include: a) coating a photoresist layer on the wafer; b) performing a lithography step on the photoresist layer to generate the plurality of ink tanks; c) placing the spray hole sheet on the photoresistor so that the plurality of inkjet holes on the photoresist layer are aligned with the plurality An ink tank; and d) heating the photoresist layer so that the photoresist layer adheres to the wafer and the nozzle plate. 2 * The method for manufacturing an inkjet printer inkjet head as described in item 1 of the scope of patent application, wherein the material of the photoresist layer comprises a resin · 3 · The inkjet type as described in item 2 of the scope of patent application A method for manufacturing an inkjet head of a printer, wherein the material of the photoresist layer is a dry type photoresist · 4 · The method for manufacturing an inkjet head of an inkjet printer as described in item 3 of the patent application scope, wherein The thickness of the photoresist layer is 50μη to 100μm. 5. The method of manufacturing the inkjet head of a jet printer as described in item 2 of the patent application chart. The material of the photoresist layer is a liquid photoresist. Printed by the Men ’s Consumer Cooperatives of the Central Gradient Bureau of the Ministry of Economic Affairs (please read the precautions on the back before writing this page) Table 6 · Manufacture of inkjet heads of jet printers as described in item 5 of the scope of patent application Method, wherein the thickness of the photoresist layer is 0.ΐμπι to 50 μηι · 7. The method for manufacturing an inkjet head of an inkjet printer as described in the patent application Fangu Item 1, wherein step d) includes a step Step dl) Apply a pressure on the nozzle plate " 4 1 A8 B8 C8 D8 VI. Patent Application Range 8. The manufacturing method of the inkjet head of the inkjet printer as described in item 7 of the patent application scope, wherein the pressure range is 0.01 kg / cm2 to lltg / cm2. 9. The method for manufacturing an ink jet head of an ink jet printer as described in item 1 of the scope of patent application *, wherein the heating step is a heating plate. 10. The method for manufacturing an inkjet printer inkjet head as described in item 9 of the scope of the patent application, wherein the temperature range of the heating step is 10 (TC to 250 ° C · 11 · as described in the scope of item 10 of the patent application scope) The manufacturing method of the inkjet printer inkjet head, wherein the time range of the heating step is from 1 minute to 10 hours. 1 2 * As described in the patent application scope item 1 of the inkjet printer inkjet head The manufacturing method, wherein the orifice sheet is a metal sheet. 13. The manufacturing method of an inkjet head of an ink jet printer as described in item 12 of the patent application scope, wherein the metal sheet is a nickel sheet. (Please read the note on the back before filling out this page.) Paper size t «« Home kneading rate (CNS > A4 size (210X297 mm)