TW416141B - Device and method for replacing damaged DRAM memory cells with SRAM and the DRAM module thereof - Google Patents
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Description
續請要員明示,本案修正後是否變更原實質内容經濟部智慧財產局員工消費合作社印製 Λ7 Β7 0 2 修爯 iLOLEL^i ’補无 20 25 30 40 50 60 :41°6lf4f 來 88104639 五、發明說明(>) 圖示中標示之簡單說明:Continuing, the key members are requested to indicate whether the original substance will be changed after the amendment of this case. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 Β7 0 2 Repair iLOLEL ^ i 'Supplement No 20 25 30 40 50 60: 41 ° 6lf4f to 88104639 ≫) Brief description marked in the icon:
10 DRAM10 DRAM
DRAM控制邏輯電路 系統匯流排 內含位址記憶體 SRAM 配類位元 反向放大器 Π0損壞位址紀錄器 120內含位址記憶體 130 DRAM控制邏輯電路 140 SRAM 150 DRAM 160系統匯流排DRAM control logic circuit System bus Built-in address memory SRAM matching bit Inverting amplifier Π0 Damaged address recorder 120 Built-in address memory 130 DRAM control logic circuit 140 SRAM 150 DRAM 160 System bus
Π0以SRAM取代損壞的DRAM記憶胞之裝置 180以SRAM取代損壞的DRAM記憶胞之DRAM 模組方塊圖 第一實施例 請參照第2圖,其繪示爲內含位址記憶體3 0(content addressable memory,CAM)與 SRAM 40 的連接圖。首先 介紹內含位址記憶體30,它是一種特殊且不常有的記憶 體,其應用在高速的找尋表(丨〇〇k up table)是非常的有 用。內含位址記憶體30可以接受一資料字組(data word) 當作輸入(A(l〜An),當內含位址記憶體陣列(array)中儲存 -------------褒--------訂---------線 (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公釐) 經濟部中央樣準局員工消费合作衽印製 41&141〇c/ 0 0 8 B7 五、發明説明(I ) 本發明是有關於一種記憶體取代之裝置與方法,且 特別是有關於一種以SRAM取代損壞的DRAM記憶胞 (memory cell)之裝置與方法及其DRAM模組。 個人電腦的發展,動態隨機存取記憶體(DRAM)佔 有及其重要的一部份,從早期以千位元組(Kbytes)爲單 位,到現在以百萬位元組(Mbytes)爲單位。記憶體容量 不斷的擴大,加上中央處理器(CPU)的不斷加快速度, 使得現代電腦在資料處理以及運算能力上皆有長足的進 步。尤其DRAM的大小更是CPU處理能力的指標,DRAM 容量大,電腦便可處理更多的資料,以及開啓更多的程 式。 習知的DRAM模組,如第1圖所繪示,其存取方 式爲: 當作讀取的動作時,DRAM控制邏輯電路20從系 統匯流排25上接收一位址資料,將位址資料解碼,並 對應至DRAM 10中此位址資料的位置,當DRAM控制 信號爲讀取命令時,DRAM 1 0將此位置中的資料經由 DRAM控制邏輯電路20,放置於系統匯流排25,完成 讀取的動作。 當作寫入的動作時,DRAM控制邏輯電路20從系 統匯流排25上接收一位址資料,將位址資料解碼,並 對應至DRAM 10中此位址資料的位置,當DRAM控制 信號爲寫入命令時,DRAM 10將系統匯流排25中的資 料經由DRAM控制邏輯電路20,放置於此位址資料的 3 (請先閲讀背面之注意事項再填寫本頁) "° 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公嫠> 4 4 4 〇 3 Α7 經濟部辛央榡準局貝工消費合作社印繁 Β7 五、發明説明(7 ) 位置,完成寫入的動作。 但是當DRAM模組中的記憶胞一但損壞,DRAM 中資料存取就會出現錯誤,或者導致存取了不正確的資 料,所以整個模組就必須丟棄,並且更換新的DRAM模 組,才能夠使電腦正常運作。或者是半導體廠在DRAM 製程中出現一些損壞的記憶胞,這些損壞的DRAM因爲 其缺陷,並不能夠製作出DRAM模組,也必須丟棄,這 是非常不符合經濟效益。 由以上之討論,可知習知DRAM模組,在出現一 些損壞的記憶胞時並不能做有效的應用,只能將之丟 棄,實在是非常可惜。 本發明係提出一種以SRAM取代損壞的DRAM記 憶胞之裝置與方法及其DRAM模組,將損壞位址資料和 DRAM位址資料作比對,如果資料相符,則以SRAM之 位置來存取資料,並且關閉DRAM之輸出致能訊號。 爲達成本發明,因此提出一種以SRAM取代損壞 的DRAM記憶胞之裝置與方法及其DRAM模組,經由 將損壞位址資料和DRAM位址資料作比對。當資料相 符,則以SRAM之位置來存取資料,並且關閉DRAM 之輸出致能訊號。以SRAM取代損壞的DRAM記憶胞 之裝置及其DRAM模組至少包括非揮發性記憶體、DRAM 控制邏輯電路。 其中非揮發性記憶體是作爲起始的程式導引,將預 先所儲存的複數個損壞位址資料,經由電源啓動信號的 4 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS>A4規格(2丨0X297公釐) 經濟部中央標準局員工消費合作社印繁 416141 4440twf.doc/00B 五、發明説明(Λ ) 動作,送出該些損壞位址資料到內含位址記憶體。內含 位址記憶體,接至非揮發性記憶體、DRAM及SRAM, 是將該些損壞位址資料寫入,並接收DRAM位址資料, 將該些損壞位址資料與DRAM位址資料作比對,送出特 定匹配訊號。DRAM控制邏輯電路,接至該系統匯流排、 內含位址記憶體、DRAM及SRAM,用來接收位址資料、 DRAM控制信號及資料信號,根據DRAM控制信號,作 資料信號在SRAM上的存取或者根據DRAM位址資料 與DRAM控制信號,作資料信號在DRAM上的存取或 者根據DRAM控制信號及DRAM位址資料,將該資料 信號作該內含位址記憶體的寫入。 本發明之以SRAM取代損壞的DRAM記憶胞之方 法爲,將複數個損壞位址資料和DRAM位址資料作比 對,送出特定匹配資料來致能SRAM中之特定位置並 且除能DRAM中之輸出致能訊號。 爲讓本發明之上述目的、特徵、和優點能更明顯易 懂,下文特舉較佳實施例,並配合所附圖式t作詳細說 明如下: 圖式之簡單說明: 第1圖其繪示爲習知DRAM模組。 第2圖其繪示爲內含位址記憶體與SRAM的連接 圖。 第3圖其繪示爲本發明一種以SRAM取代損壞的 DRAM記憶胞之DRAM模組方塊圖。 5 *(請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4规格(2丨0X297公釐) 續請要員明示,本案修正後是否變更原實質内容經濟部智慧財產局員工消費合作社印製 Λ7 Β7 0 2 修爯 iLOLEL^i ’補无 20 25 30 40 50 60 :41°6lf4f 來 88104639 五、發明說明(>) 圖示中標示之簡單說明:Π0 Device for replacing damaged DRAM memory cell with SRAM 180 Block diagram of DRAM module for replacing damaged DRAM memory cell with SRAM The first embodiment, please refer to FIG. 2, which is shown as containing the address memory 3 0 (content addressable memory (CAM) and SRAM 40 connection diagram. First, the built-in address memory 30 is introduced. It is a special and infrequent memory. It is very useful for high-speed look-up tables. The embedded address memory 30 can accept a data word as an input (A (l ~ An). When the embedded address memory is stored in an array (----) ---- ---- 褒 -------- Order --------- line (Please read the precautions on the back before filling in this page) This paper size applies to China National Standard (CNS) A4 (21〇χ 297mm) Consumption Cooperation Printed by Employees of the Central Procurement Bureau of the Ministry of Economic Affairs 41 & 141〇c / 0 0 8 B7 V. Description of the Invention (I) The present invention relates to a device and method for memory replacement. In particular, it relates to a device and method for replacing damaged DRAM memory cells with SRAM and its DRAM module. The development of personal computers, the occupation of dynamic random access memory (DRAM) and its important part Copies, from the early units of kilobytes (Kbytes) to the units of millions of bytes (Mbytes). The continuous expansion of memory capacity, coupled with the continuous acceleration of the central processing unit (CPU), makes Modern computers have made great progress in data processing and computing capabilities. Especially the size of DRAM is an indicator of CPU processing capacity. DRAM With a large capacity, the computer can process more data and open more programs. A conventional DRAM module, as shown in Figure 1, its access method is: When used as a read operation, the DRAM controls The logic circuit 20 receives a bit of address data from the system bus 25, decodes the address data, and corresponds to the position of the address data in the DRAM 10. When the DRAM control signal is a read command, the DRAM 1 0 sets this position The data in it is placed in the system bus 25 via the DRAM control logic circuit 20 to complete the reading operation. As a write operation, the DRAM control logic circuit 20 receives a bit of data from the system bus 25 and sets the bit The address data is decoded and corresponds to the location of this address data in the DRAM 10. When the DRAM control signal is a write command, the DRAM 10 places the data in the system bus 25 through the DRAM control logic circuit 20 to the address data 3 (Please read the notes on the back before filling out this page) " ° This paper size is applicable to China National Standard (CNS) A4 specifications (210X297) 嫠 4 4 4 〇3 Industrial and consumer cooperatives繁 B7 V. Description of the invention (7), complete the writing operation. However, once the memory cell in the DRAM module is damaged, data access errors in the DRAM will occur, or incorrect data will be accessed. Therefore, the entire module must be discarded and a new DRAM module must be replaced to enable the computer to operate normally. Or a semiconductor factory has some damaged memory cells in the DRAM process. These damaged DRAMs cannot be manufactured because of their defects. The DRAM module must be discarded, which is not very economical. From the above discussion, it can be known that the conventional DRAM module cannot be effectively used when some damaged memory cells appear, and it can only be discarded. This is really a pity. The invention proposes a device and method for replacing a damaged DRAM memory cell with SRAM and a DRAM module thereof. The damaged address data is compared with the DRAM address data. If the data matches, the SRAM is used to access the data. , And turn off the output enable signal of DRAM. In order to achieve the invention, a device and method for replacing a damaged DRAM memory cell with SRAM and a DRAM module thereof are proposed, by comparing the damaged address data with the DRAM address data. When the data matches, the SRAM location is used to access the data, and the output enable signal of the DRAM is turned off. The device that replaces the damaged DRAM memory cell with SRAM and its DRAM module include at least non-volatile memory and DRAM control logic circuits. The non-volatile memory is used as the initial program guide. The damaged address data stored in advance is transmitted through the power-on signal 4 (Please read the precautions on the back before filling this page). Applicable to Chinese National Standards (CNS > A4 specifications (2 丨 0X297 mm), Employee Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs, Yinfan 416141 4440twf.doc / 00B V. Description of invention (Λ) action, send the damaged address data Including address memory. Including address memory, connected to non-volatile memory, DRAM and SRAM, is to write the damaged address data, and receive DRAM address data, and to put the damaged address data Compare with DRAM address data and send specific matching signal. DRAM control logic circuit is connected to the system bus, contains address memory, DRAM and SRAM, and is used to receive address data, DRAM control signals and data signals , According to DRAM control signal, do data signal access on SRAM or according to DRAM address data and DRAM control signal, do data signal access on DRAM or according to DRAM control signal and DRA M address data, the data signal is written into the embedded address memory. The method of replacing damaged DRAM memory cells with SRAM in the present invention is to compare a plurality of damaged address data with DRAM address data Yes, specific matching data is sent to enable a specific position in the SRAM and disable the output enable signal in the DRAM. In order to make the above-mentioned objects, features, and advantages of the present invention more obvious and understandable, the preferred embodiments are enumerated below. The following is a detailed description in conjunction with the attached diagram t: The diagram is briefly explained: Fig. 1 shows the conventional DRAM module. Fig. 2 shows the connection diagram of the internal address memory and SRAM. Figure 3 is a block diagram of a DRAM module using SRAM to replace a damaged DRAM cell. 5 * (Please read the precautions on the back before filling out this page) The paper size applies to the Chinese National Standard (CNS ) A4 specification (2 丨 0X297mm) Continue to ask the clarified members to indicate whether the original substance will be changed after the amendment of this case. Printed by the Consumers 'Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 Β7 0 2 Repair iLOLEL ^ i' Supplement No 20 25 30 40 50 60: 41 ° 6lf4f to 88104 639 V. Description of the invention (>) Brief description marked in the picture:
10 DRAM10 DRAM
DRAM控制邏輯電路 系統匯流排 內含位址記憶體 SRAM 配類位元 反向放大器 Π0損壞位址紀錄器 120內含位址記憶體 130 DRAM控制邏輯電路 140 SRAM 150 DRAM 160系統匯流排DRAM control logic circuit System bus Built-in address memory SRAM matching bit Inverting amplifier Π0 Damaged address recorder 120 Built-in address memory 130 DRAM control logic circuit 140 SRAM 150 DRAM 160 System bus
Π0以SRAM取代損壞的DRAM記憶胞之裝置 180以SRAM取代損壞的DRAM記憶胞之DRAM 模組方塊圖 第一實施例 請參照第2圖,其繪示爲內含位址記憶體3 0(content addressable memory,CAM)與 SRAM 40 的連接圖。首先 介紹內含位址記憶體30,它是一種特殊且不常有的記憶 體,其應用在高速的找尋表(丨〇〇k up table)是非常的有 用。內含位址記憶體30可以接受一資料字組(data word) 當作輸入(A(l〜An),當內含位址記憶體陣列(array)中儲存 -------------褒--------訂---------線 (請先閲讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公釐)Π0 Device for replacing damaged DRAM memory cell with SRAM 180 Block diagram of DRAM module for replacing damaged DRAM memory cell with SRAM The first embodiment, please refer to FIG. 2, which is shown as containing the address memory 3 0 (content addressable memory (CAM) and SRAM 40 connection diagram. First, the built-in address memory 30 is introduced. It is a special and infrequent memory. It is very useful for high-speed look-up tables. The embedded address memory 30 can accept a data word as an input (A (l ~ An). When the embedded address memory is stored in an array (----) ---- ---- 褒 -------- Order --------- line (Please read the precautions on the back before filling in this page) This paper size applies to China National Standard (CNS) A4 (21〇χ 297 mm)
416141 444〇twf.doc/〇〇S A7 B7 經濟部中央標準局貝工消費合作社印製 五、發明説明(^) 的資料和資料字組相同時,會產生一特定匹配訊號(match signal)來代表該位置的資料和資料字組是相同的。內含 位址記憶體30也可以當作一般的SRAM來作存取,但 是它的結構較SRAM複雜。而SRAM 40的電路結構, 是經由字元線(word line,SRAM WL0〜SRAM WLn)的選 取,從位元線(bit line,DfD,,)上來讀取記憶胞中的資料 或者將位元線上的資料寫入記憶胞。 以本實施例來說明,內含位址記憶體30可在寫入 週期(write cycle)的時候,將損壞位址資料寫入內含記憶 體30中。此時的動作和一般的SRAM —樣,選擇其中 之一條字元線(CAM WL0〜CAM WLn)並將損壞位址資料 放在位元線(A^A,,)上並寫入記憶胞。當在非比較的週期 中,所有的特定匹配訊號都會被提昇(precharge)至高電 壓。當在比較的週期中,所有的字元線均會被關閉,此 時作爲比較用的DRAM位址資料則置於位元線(A,〜An) 上,如果和損壞位址資料其中之一完全相符,則某一特 定匹配訊號會爲接地狀態(ground),其他的特定匹配訊 號則維持高電壓狀態。當此特定匹配訊號變爲接地狀 態,經過一個反向放大器60,變成其中一個SRAM字元 線(SRAM WL0〜SRAM WLn)的輸入,就可用位元線(DG〜Dn) 在該字元線所指定的SRAM記憶胞上作存取的動作。另 外,我們亦提供一配類位元50(parity bit)放在內含記億 體的記憶胞中,可將上述的電路作一更好的修正,當記 憶胞的資料是損壞位址資料時,配類位元放置數位信 7 (請先閲讀背面之注意事項再填寫本頁) 訂 -v 本紙張尺度適用中圉國家棣率(CNS > A4规格(210X297公釐) 經濟部中央標準局員工消費合作社印裝 416141 A7 4440twf.d〇c/0C8 B7 五、發明説明(() 號”ι”,當記憶胞的資料是無意義時,配類位元放置數位 信號”〇”。並在此配類位元所對應的位元線(AJ上放置數 位信號”1”,當損壞位址資料和DRAM位址資料相符以 及配類位元爲數位信號” 1”時,特定匹配訊號才會動作。 用來防範無意義的資料和DRAM位址資料相同時所產生 的錯誤。 請參照第3圖,其繪示爲本發明之一較佳實施例, 一種以SRAM取代損壞的DRAM記憶胞之方塊170及 其DRAM模組1 80。當電源開啓時,電源開啓(power up) 脈波產生,而此脈波將定義一脈波週期,使得預先儲存 在非揮發性記憶體110上的損壞位址資料得以載入內含 位址記憶體120,而損壞位址中也包含一配類位元。接 著DRAM控制邏輯電路130從系統匯流排160上接收 DRAM位址資料,並將這筆DRAM位址資料傳到內含位 址記憶體120做比較。當DRAM位址資料和損壞位址資 料其中之一完全相符時,則一特定匹配訊號會致能SRAM 的一特定位置,並且此特定匹配訊號會禁能DRAM輸出 致能訊號。接著DRAM控制邏輯電路130從系統匯流排 160上接收DRAM控制信號以及資料信號,並且送出這 些信號,SRAM 140接收DRAM控制信號以後將可做資 料信號的存取。DRAM 150因爲DRAM輸出致能訊號被 禁能,所以沒辦法作資料信號的存取。當DRAM位址資 料和損壞位址資料不相符時,則特定匹配訊號不會致能 SRAM, Μ 且止匕守寺 酉己 DRAM 111¾¾ 肯 8 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消费合作社印製 416141 A7 4 4 4 0 t w f . d o c / Ο Ο 8 B7 五、發明说明(公) 號。接著DRAM控制邏輯電路130從系統匯流排160上 接收DRAM控制信號以及資料信號,並且送出這些信 號,DRAM 150根據DRAM位址資料,以及所接收的 DRAM控制信號將可做資料信號的存取。SRAM 150因 爲特定匹配訊號沒有致能,所以沒辦法作資料信號的存 取。 在本發明中,內含記憶體120是作爲提高非揮發性 記憶體Π0與系統間之效能,使系統存取記憶體的速度 能加快,如果非揮發性記憶體Π0與系統的速度能夠相 互匹配,亦可以將內含記憶體120除去,而位址比較的 功能可由DRAM控制邏輯電路130來實現。 本發明的優點係提供一種以SRAM取代損壞的 DRAM記憶胞之裝置與方法及其DRAM模組,可以將損 壞位址預先儲存在非揮發性記憶體中,並經由內含記億 體,將損壞位址資料和DRAM位址資料作比對,如果資 料相符,則以SRAM之位置來存取資料,並且關閉DRAM 之輸出致能訊號。 綜上所述,雖然本發明已以較佳實施例揭露如上, 然其並非用以限定本發明,任何熟習此技藝者,在不脫 離本發明之精神和範圍內,當可作各種之更動與潤飾, 因此本發明之保護範圍當視後附之申請專利範圍所界定 者爲準。 訂 ." .(請先閱讀背面之注意事項再填寫本頁) 9 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇Χ;297公釐)416141 444〇twf.doc / 〇〇S A7 B7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Printed by the Shellfish Consumer Cooperative. V. When the information and the word group of the invention description (^) are the same, a specific match signal will be generated. The data and data blocks that represent the location are the same. The internal address memory 30 can also be accessed as a general SRAM, but its structure is more complicated than that of SRAM. The circuit structure of the SRAM 40 is to read the data in the memory cell from the bit line (DfD ,,) or select the bit line through the selection of the word line (word line (SRAM WL0 ~ SRAM WLn)). Data is written into the memory cell. In this embodiment, the embedded address memory 30 can write damaged address data into the embedded memory 30 during a write cycle. The operation at this time is the same as that of ordinary SRAM. Select one of the word lines (CAM WL0 ~ CAM WLn) and place the damaged address data on the bit line (A ^ A ,,) and write it into the memory cell. During non-comparison periods, all specific matching signals are precharged to high voltage. When in the comparison cycle, all the word lines will be closed. At this time, the DRAM address data used for comparison is placed on the bit line (A, ~ An). If they match exactly, one specific matching signal will be ground, and the other specific matching signals will maintain high voltage. When this specific matching signal goes to ground, it passes through an inverting amplifier 60 and becomes one of the SRAM word lines (SRAM WL0 ~ SRAM WLn). Then, bit lines (DG ~ Dn) can be used in the word line. Access to the specified SRAM cell. In addition, we also provide a parity bit of 50 in the memory cell containing the billionth body. The above circuit can be better modified. When the data of the memory cell is damaged address data A digital letter 7 is placed with a matching bit (please read the precautions on the back before filling this page) Order -v This paper size is applicable to the China National Standard (CNS > A4 size (210X297 mm)) Central Bureau of Standards, Ministry of Economic Affairs Printed by the employee consumer cooperative 416141 A7 4440twf.d〇c / 0C8 B7 V. Description of invention (() No. "ι", when the data of the memory cell is meaningless, the allocation bit places a digital signal "〇". The bit line corresponding to the matching bit (the digital signal "1" is placed on the AJ. When the damaged address data matches the DRAM address data and the matching bit is a digital signal "1", the specific matching signal will be Action. It is used to prevent errors caused when meaningless data and DRAM address data are the same. Please refer to FIG. 3, which shows a preferred embodiment of the present invention. A SRAM is used to replace a damaged DRAM memory cell. Block 170 and its DRAM module 1 80. When the electricity When turned on, a power-up pulse wave is generated, and this pulse wave will define a pulse wave period, so that the damaged address data stored in the non-volatile memory 110 in advance can be loaded into the internal address memory 120 The damaged address also contains a matching bit. Then the DRAM control logic circuit 130 receives the DRAM address data from the system bus 160 and transmits the DRAM address data to the internal address memory 120 to do Comparison. When one of the DRAM address data and the damaged address data completely matches, a specific matching signal will enable a specific position of the SRAM, and this specific matching signal will disable the DRAM output enable signal. Then DRAM control Logic circuit 130 receives DRAM control signals and data signals from system bus 160 and sends these signals. SRAM 140 can access data signals after receiving DRAM control signals. DRAM 150 is disabled because the DRAM output enable signal is disabled. Therefore, there is no way to access the data signals. When the DRAM address data and the damaged address data do not match, the specific matching signal will not enable the SRAM. DRAM 111¾¾ Ken 8 (Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210X297 mm) Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 416141 A7 4 4 4 0 twf. Doc / 〇 〇 8 B7 5. The invention description (public) number. Then the DRAM control logic circuit 130 receives the DRAM control signals and data signals from the system bus 160 and sends out these signals. The DRAM 150 according to the DRAM address data , And the received DRAM control signal can be used for data signal access. SRAM 150 is not capable of accessing data signals because certain matching signals are not enabled. In the present invention, the embedded memory 120 is used to improve the efficiency between the non-volatile memory Π0 and the system, so that the system can access the memory faster. If the speed of the non-volatile memory Π0 and the system can match each other The internal memory 120 can also be removed, and the function of address comparison can be implemented by the DRAM control logic circuit 130. An advantage of the present invention is to provide a device and method for replacing a damaged DRAM memory cell with SRAM, and a DRAM module thereof. The damaged address can be stored in a non-volatile memory in advance, and the memory can be damaged by including a memory bank. The address data is compared with the DRAM address data. If the data matches, the SRAM location is used to access the data, and the output enable signal of the DRAM is turned off. In summary, although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Retouching, so the scope of protection of the present invention shall be determined by the scope of the appended patent application. Order. &Quot;. (Please read the notes on the back before filling out this page) 9 This paper size applies to China National Standard (CNS) A4 specifications (21〇 ×; 297 mm)
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