TW410833U - Waterproof and heat insulation flooring board structure - Google Patents

Waterproof and heat insulation flooring board structure

Info

Publication number
TW410833U
TW410833U TW88220606U TW88220606U TW410833U TW 410833 U TW410833 U TW 410833U TW 88220606 U TW88220606 U TW 88220606U TW 88220606 U TW88220606 U TW 88220606U TW 410833 U TW410833 U TW 410833U
Authority
TW
Taiwan
Prior art keywords
waterproof
heat insulation
board structure
flooring board
insulation flooring
Prior art date
Application number
TW88220606U
Other languages
Chinese (zh)
Inventor
Deng-Jung Luo
Original Assignee
Jiang Yang Entpr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiang Yang Entpr Co Ltd filed Critical Jiang Yang Entpr Co Ltd
Priority to TW88220606U priority Critical patent/TW410833U/en
Publication of TW410833U publication Critical patent/TW410833U/en

Links

TW88220606U 1999-12-03 1999-12-03 Waterproof and heat insulation flooring board structure TW410833U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220606U TW410833U (en) 1999-12-03 1999-12-03 Waterproof and heat insulation flooring board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220606U TW410833U (en) 1999-12-03 1999-12-03 Waterproof and heat insulation flooring board structure

Publications (1)

Publication Number Publication Date
TW410833U true TW410833U (en) 2000-11-01

Family

ID=21656931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220606U TW410833U (en) 1999-12-03 1999-12-03 Waterproof and heat insulation flooring board structure

Country Status (1)

Country Link
TW (1) TW410833U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112609602A (en) * 2020-12-03 2021-04-06 济南华锐铁路机械制造有限公司 Antiskid ground pavement structure for high-speed rail platform and pavement method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112609602A (en) * 2020-12-03 2021-04-06 济南华锐铁路机械制造有限公司 Antiskid ground pavement structure for high-speed rail platform and pavement method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees