TW407572U - Improvement of mold structure for injection molding of sensors - Google Patents

Improvement of mold structure for injection molding of sensors

Info

Publication number
TW407572U
TW407572U TW88215149U TW88215149U TW407572U TW 407572 U TW407572 U TW 407572U TW 88215149 U TW88215149 U TW 88215149U TW 88215149 U TW88215149 U TW 88215149U TW 407572 U TW407572 U TW 407572U
Authority
TW
Taiwan
Prior art keywords
sensors
improvement
injection molding
mold structure
mold
Prior art date
Application number
TW88215149U
Other languages
Chinese (zh)
Inventor
Rung-Tang Huang
Original Assignee
Jian Huei Jiuan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jian Huei Jiuan filed Critical Jian Huei Jiuan
Priority to TW88215149U priority Critical patent/TW407572U/en
Publication of TW407572U publication Critical patent/TW407572U/en

Links

TW88215149U 1999-09-04 1999-09-04 Improvement of mold structure for injection molding of sensors TW407572U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88215149U TW407572U (en) 1999-09-04 1999-09-04 Improvement of mold structure for injection molding of sensors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88215149U TW407572U (en) 1999-09-04 1999-09-04 Improvement of mold structure for injection molding of sensors

Publications (1)

Publication Number Publication Date
TW407572U true TW407572U (en) 2000-10-01

Family

ID=21653204

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88215149U TW407572U (en) 1999-09-04 1999-09-04 Improvement of mold structure for injection molding of sensors

Country Status (1)

Country Link
TW (1) TW407572U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665076B (en) * 2018-09-26 2019-07-11 瑞皇精密工業股份有限公司 Liquid silicone molding die

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665076B (en) * 2018-09-26 2019-07-11 瑞皇精密工業股份有限公司 Liquid silicone molding die

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees