TW402536B - Multi-tool positioning system - Google Patents

Abstract

A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet (""UV"") lasers, which readily cut conductor and dielectric layer, and making the other half of the tools are infrared (""IR"") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.

Description

Α7 Β7 V. Description of the invention (1) Field of the invention: This invention relates to a method for placing a sequence tool "tool" (such as a laser beam or other radiation beam) on a multi-matching workpiece with respect to the target position surface plus M. The positioning device and method are more particularly related to a system capable of M-multi-stage, multi-head positioning device to precisely coordinate the positioning of multiple tools and matching target positions. BACKGROUND OF THE INVENTION: Many different techniques are the use of tools to perform fine machining at a target location of a job, or to deposit models or materials. For example, a micro-sized drill can be used to make a bracket for a micro-sized motor; a micro-sized punch can be used to make a hole in a thin gold plate; a laser It can be used for fine processing or etching gold tincture, crystal or amorphous samples; M and young child beams can be used to implant charged particles into integrated circuits. All of the above processes share the need for the right tools and precision. And quickly positioned at the target position on the workpiece. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) In terms of certain high-volume manufacturing applications, multiple tools can be positioned relative to multiple matching workpieces at the same time. Improves throughput during processing and reduces overall manufacturing costs. One such application is to use a multi-spindle drilling machine to drill through the same set of holes on multiple circuit boards. This type of machine has throughput, but it requires multiple jobs to be accurately fixed, and it cannot compensate for dimensional differences between workpieces, and often has to be stopped due to drill replacement. In terms of related applications, the staff using the previous technology uses Ray-4- This paper size is applicable to China National Standards (CNS) A4 specifications (210X297 mm) 403536 at B7 V. Description of the invention (>) Perforations between layers on the upper side of a multilayer circuit board. This type of machine has high accuracy * and does not require bit changes, but it cannot produce the high throughputs obtained with multi-master sleeve drills. In addition, two have occurred, but the opposite need exists to coordinate the relative movement between tools and workpieces. That is to say, the reduction of characteristic size 'leads to an increase in the demand for dimensional accuracy, and at the same time, the overall size of the workpiece also increases. As a result, the accuracy, size, and speed requirements imposed on the tool positioning device have burdened the limits of existing positioning systems. Typical existing positioning devices are characterized by low and long strokes * or high and short strokes. For example, the low-speed and long-stroke positioning devices of X-Y displacement lift are characterized by high positioning accuracy; and the high-speed, short-stroke positioning devices of galvanometer-driven beam deflection devices are characterized by non-linear deflection angles. Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperative (please read the note on the back before filling out this page) The title proposed on July 30, 1985 is "for positioning a focused beam on a integrated circuit US Patent No. 4,53 2,40 2 describes a solution for long-stroke, high-speed positioning, one of which is, for example, a high-speed, short-stroke positioning device for an ammeter ("quick positioning" Device ") is combined with a long-stroke, low-speed, but high-accuracy positioning device (" low-speed position-fixing device. ") Such as an XY displacement lift. These two positioning devices can combine short-stroke and high-speed movements with long-stroke and precise movements to accurately and quickly position a tool such as a laser beam on a workpiece (such as an integrated circuit or Etch the target position on the circuit board). The above-mentioned combined motion of the fixed position first moves the low-speed positioning device to a position close to the eye on the workpiece. -5- The paper size applies to the Chinese National Standard (CNS) A4 specification (210X29 * 7 mm). Central Bureau of Standards, Ministry of Economic Affairs Employee Consumption Cooperation Du Yinlai 536 _ ^ _ V. Description of the invention (\) Stop the low-speed positioning device at a known position at the target position, then move the high-speed positioning device to the correct target position, stop the high-speed positioning device, and make the tool Operate on the target position, and then repeat the above steps to the next target position. However * the above positioning methods have serious shortcomings. That is, all start and stop actions will cause delays and inappropriately increase the time required for the tool to process the part. Another serious deficiency will also arise from computer aided machine tool control files or "databases". This control file is generally used to control the movement of the tool along the workpiece to a series of pre-set reference positions. This deficiency can be explained by laser processing of a workpiece, such as a building circuit with a small feature planning model that requires laser beam repair. If the low-speed positioning device can accurately move the laser beam between the models and the high-speed positioning device can quickly guide the laser beam to all small features that need to be repaired in each model, the positioning device and the laser beam can be used. Act together effectively. However, if the size of the largest model exceeds the range of motion of the high-speed positioning device, the database used to position the tool along the workpiece must be "formatted" to be compatible with each other that can fit in the range of motion of the high-speed positioning device. Section section. The trend toward increasing size, accuracy, and larger artifacts as described on K actually guarantees the need for formatted databases. The results of database formatting will conflict with short strokes, high-speed positioning actions, and long strokes. High-accuracy positioning actions are assigned for high-speed and low-speed positioning. -6- This paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) ----------'-- ^ --- -^ Order L ---- ^-End (please read the note $ on the back before filling out this page) Printed bags 4Q2536 at _B7_ by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Suitable for exercise instructions. For example, FIG. 1 shows a partial integrated circuit 10 having a regular model of a transistor and related electronic connection lines. The regular model is M—an ion implantation tool positioned by a formatted database for processing. In this example, by implanting boron ion control into the appropriate P-channel carrier area of the integrated circuit 10, the initial voltage value of the selected transistor can be adjusted. The area of the carrier to be ion implanted covers a larger area than the range of the pier of the high-speed fixed device. Therefore, the low-speed positioning device drives the ion shift tool in model 14 (the model is represented by a dashed line in the figure) to keep the origin 12 and the integrated circuit 10 in a straight line, and then the high-speed positioning device will perform the ion implantation. For the relatively short-stroke movements required between the tool and the integrated circuit 10, the carrier region within the model 14 is processed using the instructions from the database via M. After the model 14 is processed, the low-speed fixed-position mobile ion implantation tool is kept in line with the integrated circuit 10 at the origin 16 of the model 18, and then the high-speed positioning device is executed between the ion implanted tool and the integrated circuit 1 ◦ The relatively short-stroke motion required between them is used to process the carrier area within the pattern 18 through the instructions of the database through K. The processing steps described on M will be repeatedly applied to the origins 20, 24, 28, 32, and 36 of the different models 2 2, 26, 30, 34, and 38, until the integrated circuit 10 has been completely processed. It is worth noting that a connection pad 40 is not entirely included in a separate model. In this example, the connection pad and 40 need not be processed by ion implantation, and can be omitted for formatting purposes. -7- This paper size applies Chinese National Standard (CNS) Α4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) Order-Slope! 40S536 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs of the People's Republic of China ~ ——---- V. Description of the invention (〇 y I 1 1 The tool movement is performed in the manner of M increase. T The tool travels into the I path. Some pre-set low-efficiency / low-efficiency / V 1 I please 1 | Please specify the format of the macro of the instruction macro. It is best to read about the poor efficiency. 1 1 Optimize the result. • Ά Back 1 I 1 Formatting also depends on the movement ability and attention of the special positioning device used 1 I Type of tool being positioned 0 For example 9 Assignment to integrated circuit 1 0 Matters 1 1 Model It is necessary to fill in this 1 according to the model rules of Zhao integrated circuit 1 0 and according to the high-speed positioning device. It is described in the database. 0 If the tool type is changed, a different type of 1 I positioning device is required to handle different characteristics at different g-mark positions. The database 1 1 I may also have to be formatted again with M to direct the new Positioning device and 1 ordering tool 〇1 r formatting changes need to be in each database— “quotes in the workpiece 1 | and the adjacent grid boundary 〇 In the example of the integrated circuit 1 0 if an I thunder The beam instead of the ion implantation X is used to process the gold pad 1 of the connection pad 4 0. The connection pad 4 0 will be separated into two grids. The formatting shown in Figure 1 is not suitable. 0 If the workpiece includes a non-scale Type (for example, a hundred mark position for drilling holes on an etched / etched circuit board) > The same problem will occur. Some combinations of workpieces and tools It does not help the generation of format 0. Although the size of the I 1 I model is greater than the range of movement of the special high-speed positioning device, the rule of the 9 model can also be repeated. 0 Due to the increased mass and non-linearity, 9 1 1 Using a high-speed positioning device with a sufficiently large range of motion may reduce the production force II-0- 8- 1 1 1 This paper size applies to China National Standard (CNS) A4 (210X297 mm). Printing A7 -4¾¾¾¾¾6 ---- V. Description of the Invention (G) Therefore, what is needed is a method for accurately positioning different kinds of tools relative to different kinds of workpieces and adding κ without the need for a formatting tool travel path database. High-throughput devices and methods. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an improved apparatus and method for automatically and optimally assigning database positioning instructions to a multiple positioning device in a multiple tool processing system. One advantage of this invention is to provide a device and method for performing tool travel path operations on multiple workpieces simultaneously without the need for a formatted database. Another advantage of this invention is to provide an apparatus and method for improving the accuracy and throughput of multiple simultaneous tool travel path operations using a multi-rate positioning system. The multi-rate positioning system of this invention receives unformatted positioning instructions from a database, converts the instructions into a half-sinusoidal positioning signal, and then processes the half-sinusoidal positioning signal to drive individual different low-speed positioning devices and high-speed positioning devices. Low-frequency and high-frequency positioning signals to the target position specified by the database. The above-mentioned low-speed positioning device and high-speed positioning device generate movement in response to a series of positioning instruction data (no need to pause) * At the same time, coordinate different individual movement positions between each other, and use Μ to generate a temporary static above the target position defined by the data. Tool location. This multi-rate positioning system reduces the need to expand the range of motion of high-speed positioning devices, while providing a significant increase in the throughput of tool processing, and not -9-This paper size applies Chinese National Standard (CNS) Α4 specifications ( 210X297 mm) (Please read the notes on the back before filling this page) Order-line ί Printed by the Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 _B7_ V. Threat q) A formatted database is required. The above-mentioned half-sinusoidal positioning signal is divided into acceleration and position parts. By passing the position portion through a fourth-order contour shape filter having a fixed delay and generating a low-frequency position and acceleration portion for driving the low-speed positioning device, a higher tool processing throughput can be obtained. The unfiltered position and acceleration parts will be delayed by the same value as the fixed delay to generate the high-frequency position and acceleration parts used to drive the high-speed positioning device. The low-speed positioning device error caused by the unreacted phenomenon from the low-speed positioning device to the feed through the high-speed part of the contour shape filter can be μ. By guiding these feed-related errors to the high-speed positioning device, as Part of the high-speed positioning device command was corrected. Positioning errors caused by inertia and friction with the positioning device can be corrected by comparing the actual tool position with the tool position obtained in accordance with the instructions in a feedback network capable of correcting the positioning signals at low and high speed stages. . As described above * The multi-rate, multi-head positioning device embodiment of this invention receives and processes unformatted positioning instructions, drives the low-speed positioning device and the multiple high-speed positioning device mounted on the low-speed positioning device with M, and Multiple tools on multiple matching workpieces are simultaneously positioned relative to the phase position plus K. Each high-speed positioning device is coupled with a high-speed stage number processor for providing correction position data to each high-speed stage positioning device. M is used to compensate for the non-linearity of the high-speed stage and workpiece placement, branching, rotation, and rotation between multiple workpieces. Size variation. By adopting a single system to process multiple workpieces, this multiple speed _ 1 〇-This paper size is applicable to China National Standard (CNS) Α4 size (210X297 mm) (Please read the note on the back before filling (This page) Printed by the Central Standards Bureau, Ministry of Economic Affairs, Central Bureau of Standards, Consumer Cooperatives, A7 ^ 025¾ ^ ___ B-1- V. Description of the invention (Γ) The rate and multi-head positioning system reduce the cost of workpiece processing and improve the performance of workpiece processing. Production. In addition, 'the ability to handle jobs that have been placed, branched, rotated, and dimensionally altered' has reduced the number of returns for jobs that have been processed. A preferred implementation of such a multi-rate, multi-position positioning device is to cut a blind hole 'on an etched circuit board ("ECBS") while changing the production volume and process yield. In this embodiment, 'half of the tools are ultraviolet ("UV") lasers prepared to cut the conductor and dielectric layers, and the other half are infrared ("IR") lasers prepared to cut only the dielectric layer. The ultraviolet laser is stamped to cut an upper conductor layer and a part of the lower dielectric layer, while the infrared laser is stamped to cut the remaining dielectric layer without cutting through or damaging it. A second guide layer on the lower side. This combined laser processing step has a wider processing window for cutting blind holes on an etched circuit board. In addition, by cutting the dielectric layer in which the conductor layer has been cut in the etched circuit board, the throughput can be increased. By performing workpiece adjustments before each cutting step, M can be used to compensate for any etched circuit board placement, branching, rotation, and dimensional variations, which can increase process yield. Other objects and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings. Figure description: Figure 1 is a front view of an integrated circuit workpiece that is formatted KK for easy tool processing in accordance with the prior art positioning device lotus motion formatting architecture. -1 1- This paper size applies to Chinese National Standard (CNS) Α4 size (210X297 mm) (Please read the precautions on the back before filling this page) *? Τ 螋! Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 3536 _ ^ _ V. Description of the invention (° l) Figure 2 is a flow chart of the multi-stage laser beam positioning system of this invention. 0 Figures 3 A and 3 B The time-to-speed graph of the speed profile of the different two-segment and three-segment positioning devices processed by the positioning instruction of the invention. Fig. 4 is a partial side view showing a prior art galvanometer-driven mirror positioning device suitable for the present invention. Fig. 5 is a waveform diagram showing the speed and position of the high-speed positioning device phase and the low-speed positioning device phase corresponding to the positioning signal according to the present invention. FIG. 6 is an oblique view showing a multi-head laser processing system of the present invention. FIG. 7 is a simplified electronics of a digital signal processing system including multiple high-speed stage signal processors used in the multi-head laser processing system of FIG. 6. Block diagram. FIG. 8 is a simplified electronic block diagram of one of the multiple high-speed stage signal processors used in the digital signal processing system of FIG. 7. FIG. Detailed description of the preferred embodiment: Fig. 2 shows a multi-stage tool positioning device system 50 having a positioning instruction execution capability according to the present invention. The positioning device system 50 is only described by an example under K: one of them uses a digital signal processor ("DSP") 5 2 to control a high-speed galvanometer positioning device stage 5 4 1 "(high-speed stage 5 4 ”) single head, laser hole cutting -12- This paper size applies Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page), 1Τ 逡 ί A7 408536___b7_ 5. Description of the invention (ft) system, a low-speed X-axis displacement stage 56 ("low-speed stage 56"), and a laser beam 60 for guiding the laser beam to a single position 6 2 (for example, an etching circuit Low-speed Y-axis displacement stage 58 ("low-speed stage 58") at the target position on the board). Although the structure of the positioning device system 50 is that a single high-speed stage 54 is installed on the low-speed stage 56 and a military workpiece 62 is installed on the low-speed stage 58, other types such as multiple high-speed stages 54 are installed on the low-speed stage At 56, the construction of different tool positioning systems where multiple workpieces 6 2 are installed at low speed stage 5 8 at the same time can also easily adopt this invention. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back before filling this page) A system control computer 6 3 is used to process the tool travel path database stored in a database storage subsystem 64 . This database contains the processing parameters required to cut holes in the workpiece 62 and / or the laser beam 60 to process the shape of the rim. This database is generally compiled using a tool travel path generation program (such as SMARTCAM software produced by Cainex Manufacturing Technology Company, Eugene, Oregon, USA). The system control computer 6 3 transmits a part of the stored database to a laser controller 6 8. At the same time, the position control part of the database is transmitted to a variable bit processor 70 by M-string data. The mutation processor 70 interprets the string of data into position variation values ("d X and" and "dy") and speed for each desired change along the path of the laser beam 60 along the workpiece 62. Variation ("dv") and time variation ("dt") sections. Therefore, each movement of the laser beam 60 is defined by the dx, dy, dv, and dt portions. The dx, dy, and cv -1 3- This paper is in accordance with the Chinese National Standard (CNS) A4 specification (21 OX297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 408536 _ ^ _ 5. The description of the invention (f I) and dt will also be processed by a position contour device 92 into a half sinusoidal positioning signal. The laser controller 68 is controlled by the timing data generated by the mutation value processor 70. This laser controller will be subject to a synchronization technology that will launch the laser 76 and the high-speed phase 54 and the low-speed phase. Coordination of the triggering process of the movement synchronization of 56 and 58. The above-mentioned synchronization technology is, for example, the "radiation beam position and pollution coordination system" which has been designated on September 25, 995 and has been designated to grant the trustee of the application. What is described in U.S. Patent No. 5,4 5 3,5 94. The variance value processor 70 can generate dx, d y, dv, and d t according to the preferred BAS I C language signal processing steps described below with reference to FIGS. 3A and 3B. Before performing the preferred processing step named "gen-move", the limiting digits for maximum acceleration (ainax), maximum speed (vmex), and minimum time (tmin) will be defined by adding K. These limit values are physical hardware restrictions imposed by the special positioning device hardware (high speed or low speed). The above positioning device hardware needs to be moved for most of the distance because it corresponds to a special positioning instruction. For example, if the movement distance is less than 25% of the movement range of the maximum high-speed positioning device, the limit value will be set to the high-speed positioning device. Otherwise, the limit value will be set as the low-speed positioning device. The limiting values for high-speed stage 54 and low-speed stage 5 6 and 5 8 are: High-speed and low-speed-1 4-This paper size applies to China National Standard (CNS) Α4 size (210X297 mm) (Please read the note on the back first $ Entry on this page) :, π 40S536 A7 B7 V. Description of the invention ">) v ffl a X (meter / second) 1 0.25 amax (g) 50 1. 0 t in in (second / second) 2 20.0 step gen-move calculates a positioning device stage from any starting position, each starting speed is moved to any final position according to two lotus motion sections or three motion sections. And dx, dy, Values of dv and dt. Any of the moving sections includes several types of semi-sinusoidal acceleration sections ("Section 1"), fixed speed sections ("Section 2"), and semi-sinusoidal deceleration sections (" Segment 3 "). As shown in circle 3A, when the positioning instruction is large enough to cause the speed of the positioning device to reach ten Vmax or -Vmax, segment 2 is included between segment 1 and segment 3. Otherwise, as shown in FIG. 3B, a two-segment motion instruction in execution includes only the first and the third areas. 2 is 0). The step gen-move is usually described in accordance with the BASI C language (also known to skilled staff). (Please read the notes on the back before filling in this page) ί Central Ministry of Economics Standards of the Consumer Bureau of the Bureau of Staff and Workers of India Co., Ltd. The paper size applies to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) 402536 V. Description of invention Uj

PROCEDURE gen_move (g &, h &): REMARK " g " and " h " are pointers into an indexed array of positions and velocities extracted from the database. Xi = px (g &)! Initial x position! Um yi = py (g &)! initial y position xvi = vx (g &)! initial x velocity! um / sec yvi = vy (g &)! initial y velocity xf = px (h &) (final x position yf = py (h &)! final y position xvf = vx (h & +1)! final x velocity yvf + vy (h & +1)! final y velocity REMARK Calculate the maximum (or minimum) absolute velocity for X and Y movement based on the total change in position, initial and final velocities, and the minimum movement time (limited to vmax). dx = xf-xi dy = yf-yi xvmax = dx / tmin- (xvi + xvf) / 2 IF xvmax > vmax xvmax = vmax ENDIF IF xvmax < -vmax xvmax = -vmax ENDIF (Please read the precautions on the back before filling this page) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs

REMARK Assumes that dtl is employed. Y vmax = dy / tmin- (y vi + y vf) / 2 IF y vmax > vmax yvmax = vmax ENDIF dt3. If dtl and dt3 = tmin, maximum velocity -16- Applicable Chinese national standard (CNS > A4 specification (210 X 297 mm) A7 B7 402536 V. Description of invention ((+)

IF yvmax < -vmax yvmax = -vmax ENDIF (Please read the note on the back before filling in this page) REMARK Calculate dt for segments 1 and 3, assuming three segments are required to execute this particular positioning command. Kpo2 = (PI / 2) / amax dtl = MAX (tmin, ABS ((xvmax-xvi) * kpo2), ABS ((yvmax-yvi) * kpo2)) dt3 = MAX (tmin, ABS ((xvf-xvmax) * lq) 〇2 ), ABS ((yvf-yvmax) * kpo2)) REMARK Calculate dt2 for both the x and y axis (xdt2 and ydt2). If either result is positive, a constant velocity segment 2 is required. Xd0 and ydt2 also determine a dominant axis, ie, the axis that requires the most time to move at constant maximum velocity. IF xvmax > 0

xdt2 = (dx-((xvi + vmax) * dtl / 2)-((xvf + vmax) * dt3 / 2)) / vmax ELSE xdt2 = (dx-((xvi-vmax) * dtl / 2)-( (xvf-vmax) * dt3 / 2)) /-vmax ENDIF IF y vmax > 0 ydt2 = (dy-((yvi + vmax) * dtl / 2)-((yvf + vmax) * dt3 / 2)) / vmax

ELSE ydt2 = (dy-((yvi-vmax) * dtl / 2)-((yvf-vmax) * dt3 / 2)) /-vmax

ENDIF IF xdt2 > 0 OR ydt2 > 0! Three segment movement REMARK Calculate dp, dv for each movement segment IF xdt2 > ydt2! X axis Primary dxl = (xvi + xvmax) * dtl / 2 xdvl = xvmax-xvi dx2 = (( -xvi-xvmax) * dtl / 2) + ((-xvmax-xvf) * dt3 / 2) + dx xdv2 = 0 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs dx3 = (xvmax + xvf) * dt3 / 2 xdv3 = xvf-xvmax ydt2 = xdt2 kb = l / (2 * ydt2 + dt3 + dtl) dy 1 = ((yvi-y vf) * ((dtl * dt3) / 2 + (dy + yvi * ydt2) * dtl) * kb ydvl = ((-yvi-yvf) * dt3 + 2 * dy-2 * yvi * (ydt2 + dtl)) * kb dy2 = (2 * dy-dtl * yvi-dt2 * yvf) * ydt2 * kb ydv2 = 0 dy3 = ((yvf-yvi) * ((dt3 * dtl) / 2 + (dy + ydt2 * yvf) * dt3) * kb ydv3 = ((yvi + yvf) * dtl-2 * dy + 2 * ( dt3 + yd0) * yvf) * kb ELSE! Y primary axis -17- This paper size applies to China National Standard (CNS) A4 (210X297 mm) Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 402536 ί ^ Γ) dyl = (yvi + yvmax) * dtl / 2 ydvl = yvmax-xvi 'dy2 = ((-yvi-yvmax) * dtl / 2) + ((-yvmax-yvf) * dt3 / 2) + dy ydv2 = 0 dy3 = (y vmax + y vf) * dt3 / 2 ydv3 = yvf-yvmax xdt2 = ydt2 kb = l / (2 * xdt2 + dt3 + dtl) dxl = ((xvi-xvf) * ((dtl * dt3) / 2 + (dx + xvi * xdt2) * d tl) * kb xdvl = ((-xvi-xvf) * dt3 + 2 * dx-2 * xvi * (xdt2 + dtl)) * kb dx2 = (2 * dx-dtl * xvi-dG * xvf) * xdt2 * kb xdv2 = 0

dx3 = ((xvf-xvi) * ((dt3 * dtl) / 2 + (dx + xdt2 * xvf) * dt3) * kb xdv3 = ((xvi + xvf) * dtl-2 * dx + 2 * (dt3 + xdt2) * xvf) * kb ENDIF ELSE! two segment movement REMARK Calculate dtx and dty to determine dt for segments 1 and 3. twomovetime (xvi, xvf, xi, xf, xdt) twomovetime (yvi, yvf, yi, yf, ydt ) REMARK For two segment movement, dtl = dt3 = the larger of dtx or dty. Dtl = MAX (xdt, ydt) dt3 = dtl

REMARK Calculate dp and dv for segments 1 and 3. twosegmentmove xdt2 = 0 ydt2 = 0 dx2 = 0 dy2 = 0 xdv2 = 0 ydv2 = 0 ENDIF

RETURN REMARK End of procedure gen move PROCEDURE twosegmentmove dx 1 = dx / 2 + xvi * dt 1 / 4-xvf * dt 1/4 xdvl = dx / dtl-3 * xvi / 2-xvf / 2 dyl = dy / 2 + yvi * dtl / 4-yvf * dtl / 4 This paper size applies to Chinese National Standard (CNS) A4 (2 丨 0 X 297 mm) (Please read the precautions on the back before filling this page) Order 402536 A7 B7 5 , Description of invention (丨 L) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs

ydvl = dy / dtl-3 * yvi / 2-yvf / 2 dx3 = dx / 2-xvi * dt3 / 4 + xvf * dt3 / 4 xdv3 = -dx / dt3 + xvi / 2 + 3 * xvf / 2 dy3 = dy / 2-yvi * dt3 / 4 + yvf * dt3 / 4 ydv3 = -dy / dt3 + y vi / 2 + 3 * y vf / 2 RETURN PROCEDURE twomovetime (vi, vf, ip, fp, VAR dt) LOCAL kl , k2, k3 dt = tmin kl = 3 * vi + vf kls = kr2 k2 = (32 / PI) * amax * (fp-ip) k3 = PI / (8 * amax) IF kls + k2 > 0 dt = MAX (dt, k3 * (-kl + SQR (kls-k2))) ENDIF IF kls-k2 > 0 dt = MAX (dt, k3 * (kl + SQR (kls-k2)))) ENDIF kl = vi + 3 * vf kls = kr2 IF kls + k2 > 0 dt = MAX (dt, k3 * (-kl + SQR (kls + k2))) ENDIF IF kls-k2 > 0 dt = MAX (dt, k3 * (kl + SQR (kls-k2))) ENDIF RETURN -19- This paper size applies to Chinese National Standard (CNS) A4 (210X 297 mm) (Please read the notes on the back before filling this page) Order-A7 402536 B7 V. Description of the invention (1) (Please read the notes on the back before filling this page) Referring again to FIG. 2, the dx, dy, dv and dt parts generated by the variation value processor 70 are further processed by the position wheel device 72 The processing becomes the half-sinusoidal positioning signal required to move the high-speed phase 54 and the low-speed phases 56 and 58 when the database instructs. The ideal situation is that the acceleration of the positioning device is directly proportional to the driving force, and the driving force itself is directly proportional to the intensity of the current supplied to a positioning device driver such as a linear or rotary servo motor or a galvanometer coil. Thus, the positioning signal generated by the position contouring device 72 is a series of "full-frequency" half-sine-shaped acceleration-guided positioning steps used to cause the generation of motion as shown in Figs. 3A and 3B. The full frequency has a bandwidth of only about 250 Hz. This frequency band is large enough to drive a typical galvanometer to drive the mirror positioning device at its maximum frequency. Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, a digital signal processor 52K at a speed of 10,000 points per second, generated by using the dx, dy, dv, and dt parts generated by the mutation value processor 70 The real-time value of the full-frequency positioning signal is used as the input variable force of the sinusoidal value generating program executed in the digital signal processor 52. On the other hand, * dx, dy, dv, and dt parts can be used to address and read the matching sine waveform values stored in the sine value lookup table combined with the digital signal processor 52. The resulting full-frequency positioning signal has the acceleration and position components received by a contour-shaped waver 7 8. The contour-shaped waver 7 8 has a fixed signal generation delay and a signal processing unit. The shape of the wheel in the device 52 is compensated by the delay of the fixed signal of the wave device 7 -2 0 * This paper size applies the Chinese National Standard (CNS) Α4 specification (210 × 297 mm)

___ ^ __ 5. Description of the invention (< Γ) Rhino element 79. For example, the rhino element 79 will delay the laser-triggered counterbalance delay generated by the position contour device 72, using K and the high-speed stage 54 and the low-speed The delay movements of stages 56 and 58 remain the same. As described below, the contour shape filter 7 8 and the delay member 7 9 also work together to move the low-speed stages 5 6 and 5 8 smoothly over the average position. At the same time, the acceleration of the average position of the wheel is limited to 1 s, and the positioning movement of the high-speed stage 5 4 is within ± 10 mm. The position received by the wheel shape filter 7 8 is used to generate the drive. The filtered position command data required for the low-speed stages 5 6 and 5 8. The contour shape filter 7 8 itself is a fourth-order low-pass wave filter as shown in Equation 1. It is more suitable. 0) In Equation 1, ω is the natural or cut-off frequency of the contour wave filter 78 * € for damping ratio. Equal to 38 intensities per second and ξK is equal to 0, 707 is more appropriate. Since the g value of 0,707 will cause a phase delay that is linear to the cut-off frequency ω of the rim shape wave filter 78, a ξ value of 0 * 707 is considered as the critical damping ratio. This linear phase delay results in a fixed time delay for any semi-sinusoidal positioning signal with a frequency value of 1 up to the natural frequency. For the filter of Formula 1-2 1- This paper size applies the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) --Ί .----- ^ Order L --- ^-一-(Please read first Note the item on the back, please fill in this page.) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, A7, B7, 408S36. 5. Description of the invention (丨 1), the time delay is equal to 4 ξ / ω seconds. Since the wheel shape wave wave generator 78 generates a post-position command data with a fixed time delay relative to the position portion of the half-sine positioning signal, the fixed time delay is compensated by the delay element 79. The delay element 79 is suitably set in the digital signal processor 5 2 * The delay element itself becomes a signal for transmitting the acceleration and position profile of the half-sine positioning signal from the position wheel device 7 2 to the high-speed stage 54 The stylized delay of the processing elements. The first two of the above-mentioned high-speed signal processing elements are adders 80 and 82. Thus, the half-sine positioning signal guided to the high-speed stage 54 is synchronized in time with the filtered position instructions guided to the low-speed stages 56 and 58. The acceleration part generated from the position rotation device 72 is also subjected to K by the contour shape waver 7 8, and the subsequent acceleration command is provided by M to the adder 80 and a pre-processor 94. The adder 80 is used as a high-pass filter by removing the processing speed instruction from the acceleration portion of the full-frequency positioning signal, and forms a current that is sent to a pre-processor 86. Pre-acceleration signal. Similarly, the filtered position command and the delayed position portion of the half-sinusoidal positioning signal transmitted from the rim shape wave filter 78 are sent to the adders 90 and 82, respectively, processed by K and assigned to the low-speed stage 56 respectively. , 58 and high-speed phase 54. A high-current wave filter 97 and a low-speed wave filter 98 are conventional loop compensation filters that are used to maintain the high-speed stage 54 and the low-speed stage 56 and 58 units. -22- This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) I order 妗! Printed bags for consumer cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 40S536 A7 __B7 V. Description of the invention (τΑ) The rim shape wave waver 7 8M is connected in series with two or more second-order filters with a critical damping ratio and is metered. When the number of filters connected in series is increased to two K, the cut-off frequency of these filters themselves will increase by the square root of the number of chirpers (for example, the cut-off frequency of two detuners is the cut-off frequency of a single chirper). 1.414 times). Two series-connected wave wave generators M can provide good smooth wave wave effects, and at the same time, it is more appropriate to maintain the configuration of the whole wave wave filter. Through the bilinear transformation *, the inverse 轮 of the corridor shape filter shown in Equation 1 can be expressed as a discontinuous equal value. Equation 2 below shows the resulting digital conversion function.

Gz (z) = Az2 + 2z * lf ^ 2 + biz + b2f (2) (Please read the notes on the back before filling in this tribute) 4 represents the time domain formula of the filter output values yk and wk when the previous input value and output value are known. yk = wk + 2wl [., + wk.2-b1yk.rb2yk.2 wk = kCVk + aVn + V ^ -bjWk.j-biv ^ The coefficients in Equations 3 and 4 are determined by Equation 5-23- This paper scale applies Chinese National Standard (CNS) A4 specification (210X297 mm) ⑶ 402 536 V. Description of the invention (· /!) A7 B7 k bl b2 ω2Τ2 Α + 4ζΤω + Τ2 (ύ2, -8 + 2Γ2ω2 4 + 4ζΓω + Γζω2 -4ζΤω + 4 + Γ2ω2 4 + 4ζΓω + Γ2ω2 (5) Printed in Equation 5 by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, where T is the sampling period of the wave filter, ω is its cut-off frequency, and M and ί are Its damping ratio. For the wheel-shaped wave shaper 7 8, compared with the 10 ° ζ speed of the digital signal processor 52 updating the positioning data of the low-speed phases 56 and 58, the wheel-shaped shape filter is better. The cut-off frequency is 3851 degrees per second (approximately 6Hz) is a very low frequency. If this round-shaped wave shaper 78K1 0 仟 Η ζ rate is used to update the frequency of the low-speed stage, the extreme value of the non-mining filter moves closer to the army. Bitmap, the pseudo-number of the unconnected wave filter will become more sensitive to carry errors. Therefore, the above-mentioned contour shape filter 7 8K It is more appropriate to use two second-order chirpers as shown in Figures 3 and 4. Use M to reduce the order of the chirper formula and maintain the coefficients of the filter to be reasonably controlled. Contour shape chirpers 7 8 also receives the acceleration command from the position contour device 72 and generates the post-acceleration command that is sent to the servo pre-processor 94 and the adder 80. The required movement contour command κ uses 10 0 ζ It is more appropriate to update the speed for calculation. At the same time, the acceleration and the real (unaccepted command) position of the low speed stage are deleted from the adders 80 and 82 to generate high speeds. -24- This paper standard applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) (Please read the notes on the back before filling out this page) -1 Order printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 _Β2__ V. Acceleration and position command signals during the description phase of the invention. High speed phase The acceleration command signal is processed by the adder 80 and the pre-processor 86, and at the same time, the position command signal of the high-speed stage is processed by the adder 82 and the current oscillator 97. After processing, The high-speed phase signals are mixed in an adder 84 and then transmitted to a galvanometer driver 88. Similarly, the filtered acceleration instruction of the low-speed phase is processed by a pre-processor 94, while the low-speed phase passes. The post position command is processed by the adder 90 and the servo waver 98. After processing, the low-speed phase signals are mixed in an adder 92, and then transmitted to a linear servo motor driver 96. The galvanometer driver 8 8 provides a bias control current to the pair of mirrors in the high-speed phase 5 4 and the servo motor driver 9 6 provides the control current to the medium used to control the positioning status of the low-speed phases 5 6 and 5 8. Sexuality serves the motor. Fig. 4 shows a prior art galvanometer driving mirror positioning device X 100 for high speed stage 54. A galvanometer driver 88 (picture 2) provides a rotation control current on the conductor 102 to K's different X 粬 and Y-axis high-speed response DC motors 1 04, 1 06 * The two DC motors rotate the main shaft 1 07 in the bearing 1 08 Is used to selectively rotate a group of mirrors 1 10 and 1 12 so that the laser beam 60 is deflected toward an arbitrary lens 114 and irradiates a preset target position on the workpiece 62. -25- This paper size applies to Chinese National Standard (CNS) A4 (210x297 mm) --ί .----- irI .----- ^ 1- 1. (Please read the precautions on the back first (Fill in this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 4 Γ) S 5 3 6 Α7 Β7__ V. Description of the Invention (V7)) On the other hand, a type such as a piezoelectric element, a voice coil actuator or Bearingless kinematic positioning devices of other high-speed positioning devices with limited angles can be used instead of galvanometer-driven mirror positioning devices 100 in the positioning device system 50. Referring also to FIG. 2, another precise rotary or linear positioning mechanism mechanism K may replace the linear servo motors used to drive the low-speed stages 56 and 58. However, in the positioning device system 50, it is preferable that the linear motor K can respond to the position command at a low speed stage. Mixing the two signals of the low-speed stage position command and the high-speed stage position command can reduce the position error between the actual position and the position obtained after the laser beam 60 receives the command on the workpiece 62. The delayed high-speed phase position instruction in the adder 82 and the low-speed phase position instruction after the delay in the adder 90 indicate the ideal signal values required to cause the phases 54, 56, and 58 to be properly positioned. However, practical factors such as gravity, friction, mass M, and the inaccuracy of the full-frequency positioning signal generated by the position wheel device 72 have not been considered in the unmodified position command. By using position sensors 1 20 and 1 22 to detect the true positions of stages 54, 56 and 58, K is used to provide predicted position feedback data to the adders 8 2 and 9 0 in the digital processor 5 2 To solve the above practical factors. It is worth noting that the adder 82 on the positioning travel path at the high speed stage receives position feedback data from the position sensors 120 and 122 described above. The position sensors 120 and 122 can be of a type well-known to everyone: rotary capacitor plate, linear and rotary -26- This paper size adopts China National Standard (CNS) Α4 specification (210 × 297 mm) (please first Read the notes on the back and fill in this page), 1T A7 402536 __ B7 V. Inventor code scale, or interferometer motion detector using air-to-space analog to digital and / or digital to analog conversion techniques. (Please read the precautions on the back before filling in this page) When the m-ray beam 60 moves along the workpiece 62, the detected beam positions are continuously compared to the beam positions obtained after receiving instructions, and the position difference indicates that The above practical factors lead to the angle of the positioning error. In fact, the position data detected in the high-speed stage 54 and the low-speed stages 56, 58 are generated by the position sensors 120 and 122, and this detection is deleted from the position obtained by the instruction received in 90 in the adder. The measured position is used to generate position difference data in the adder 92 which is mixed with acceleration data transmitted from the pre-processor 94. Figure 5M graphically shows how the high-speed phase 54 and the low-speed phases 56, 58 coordinate each other's movements corresponding to a representative full-frequency positioning signal 128 (indicated by the thick line κ in the circle). This representative full-frequency The positioning signal is divided into a high-frequency position in the digital signal processor 5 2 (Figure 2). The signal part 130 ("HFP") printed by the Ministry of Economic Affairs Central Standards Bureau Consumer Consumer Cooperative and a low-frequency position ("LEP") signal part Servings 1 to 32. The high-frequency position signal part 1 30 represents the AC coupling of the full-frequency positioning signal 128, the 25 to 250 Hz high-pass channel part, and the low-frequency position signal part 1 2 3 represents the direct coupling of the full-frequency positioning signal 1 28. Low-pass channel portion from 0 to 25 Hz. Each half-sine-shaped positioning step in the full-frequency positioning signal 1 28 (represented by K with additional letters such as 128A, 128B, 128C, and 128D) will result in a high-frequency position signal 130 corresponding to the paper size applicable to Chinese countries. Standard (CMS > A4 specifications (210X297 mm) A7 B7 402536 V. Description of the invention (please read the notes on the back ^^ before filling out this page) Corresponding steps (eg 130A, 130B, 130C and 1 3 0 D ). In this example, each positioning step is about 10 milliseconds away from adjacent positioning steps, but if there is any time interval, this time interval is the timing data in the tool travel path database. Function 0 Figure 5 further shows that the high-speed phase 54 and the low-speed phase 56, 5 8 correspond to the high-frequency position signal portion 1 3 0 and the low-frequency position signal portion 1 32 respectively, and the high-speed phase speed waveform 1 34 and the low-speed phase waveform obtained 1 3 6. " Each high-frequency position signal part 130A, 130B, 13 OC and 1 3 0 D includes in particular the acceleration section which causes the high-speed stage 54 to undergo a sinusoidal velocity change. This sinusoidal velocity variation The M corresponds to the high-speed velocity waveform pulses 1 34A, 1 34B, 1 3 4C, and 1 34. The high-speed velocity waveform 1 34 has a transition in the direction of the cloth density and is fixed at about 100 mm per second. The numerical reference line 1 38. The reference line can be changed by mixing the adder 80 and the acceleration instruction after being delayed and delayed. The high-frequency position signal part printed by the staff consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 3 0 also indicates how the high-speed stage 54 corresponds to each high-speed pulse balance 134 in position. The peak-speed stage positioning displacement required in this example is approximately 2 * 8 mm, which happens to be a low-quality, The galvanometer drives the mirror positioning device within a linear range of 10 mm. The low-frequency position signal part 1 32 also indicates the low-speed stage 56 and 58. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) A7 402536 _B7_ 5 2. Description of the invention (νί) How to correspond to the low-speed velocity waveform 1 3 6 in position, the low-speed velocity waveform 1 36 shifts in the positive velocity direction and is fixed at about +100 mm per second In this example, the position change in the low-speed phase is linear with time, so that at least one of the low-speed phases 5 6 and 5 8 will not be moved by the positive. The full-frequency positioning signal 1 28 also indicates that the waveform 1 The net positions generated by combining the high-speed stage position and the low-speed stage position respectively represented by 32 and 1 30. The plateau sections 140A, 140B, 140C, and 1 40D indicate a time period of 10 milliseconds. During this time period, even Although all stages 54, 56 and 58 are moving, the position obtained from coordination remains fixed. From the plateau part 140C, it is clear that the waveforms 1 3 0 and 1 2 2 that cross each other below the plateau part actually have the same value, but the slopes of positive and negative signs are opposite. During the time period corresponding to the plateau portion 140, the laser 76 is triggered to process a hole in the workpiece 62. The coordinated positioning method described above is particularly advantageous for applications such as laser beam cutting holes. This processing method using laser beams to cut holes needs to move along the tool's path, move quickly between target positions, and In combination with the pause action at each target position, a laser is used to cut the hole. Of course, the positioning method described above is not limited to this application. Fig. 6 shows an embodiment of the multi-head positioning device 150 of the present invention, in which multiple workpieces 152A, 152B, 152C, ... -29- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read first Note on the back, please fill out this page again) Order printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 働 536 A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (1) Ί 1 5 2 Ν Available time Processed 0 (Hereinafter, a collective noun without an I letter is used to represent multiple X tools 9 For example:,, workpiece 1 2 5, 1 1 I) 0 Multi-speed positioning device 1 5 0 Low-speed stage 5 6 and The 5 1's 1 I read structure allows the workpiece 1 5 2 to be held > and read on the Y-axis low-speed stage 5 8 1 I 1 | bearing $ and multiple high-speed stages 1 5 4 A, 1 5 4 Β 1 5 4 C 1 Note 1 9… 1 5 4 N is in X The shaft is carried on the low-speed stage 5 6 0 Of course. Afflictions · Events 1 Item 1 The application roles of the low-speed stages 5 6 and 5 8 can also be interchanged by K. %% J X When carried on the high-speed stage 5 6 on the low-speed stage 1 5 4 Hundreds of increments of this page will add to the accumulated mass in this high-speed stage, which will cause it to be difficult to accelerate 0 to 1 1 is 0Λ- The mass accumulated in the Banran high-speed stage will cause it to be difficult to accelerate 0 so 1 I is high-speed Hundreds of N in stages 1 5 4 may vary depending on the type of positioning device and the method of ordering. 1 Hundreds of N in high-speed stages 1 5 4 carried on low-speed stages 5 6 are limited to 4 K. The inside is more suitable. 0 1 1 Each workpiece 15 2 has a processing tool mine 1 that matches it. Shoot 1 5 6 A 1 5 6 B 1 5 6 CN… 1 5 6 NR mirrors matched by phase 1 1 5 8 AV 1 5 8 B 1 5 8 C… > 1 5 -1 I 8 N and direct the processing energy towards the corresponding high-speed stage 1 5 4 A 1 Ί 1 5 4 B 1 5 4 C… 1 5 4 N 〇 High-speed stage 1 5 4. | Then deflection the processing energy toward the matched workpiece 1 5 2 plus 1 I. The working range 1 6 2 A 1 6 2 C… 1 6 2 N is actually 2 0 1 I mm long 20 mm wide square 100 mark position 0 1. Video recording 1 6 0 A Λ 1 6 0 B 、 1 6 0 C… 1 6 丨 0 N can be installed at low speed stage 5 6 t Μ Μ 相 相 笳 I-30-1 1 This paper size applies to China National Standard (CNS) A4 (210X297 mm) 40S536 A7 B7 Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Explanation (1 h I range 1 6 2 Detect whether the workpiece 1 5 2 is aligned with branches, rotation and dimensional variation 9 and aim and focus the radiography 1 5 6 〇 In the plan *, with each laser 15 6 and high-speed stage 15 4 can copy the same machining model 0 m * w \ on the workpiece 1 5 2 and 9 in some applications The variation of the model must match the change between the model and the branch rotation distortion of the workpiece geometrical scale factor. In addition, the non-linear conditions and "abbe error" of the high-speed stage must be corrected. The angle that cannot be detected from the position of the giant target) The above "abbe error 99" is induced by the position variation installed in the middle of the workpiece 1 5 2 at the low speed stage 5 8. Different from the prior art Multi-spindle drilling machine when driving each high-speed stage 1 5 4 plus Μ with reference to Figures 7 and 1 ^ 31 circle 8 as described in the multi-head positioning device 1 5 0 Programmable correction factors to compensate for the variation on M 0 0 Round 7 indicates how the multi-rate positioning device-digital signal processor 5 2 (圔 2) is used to coordinate multiple high-speed phases 1 5 4 and low-speed phases 5 6 As a result of the positioning condition between 5 and 5, a multi-head signal processor 1 7 0 0 is used in a similar manner to the digital signal processor 5 2 9 multi-head signal processor 1 7 0 received d from the system control computer 6 3 X dyd V and dt part of these d X Λ dy N d V and dt part is then processed by the position wheel device 7 2 processed into a semi-sinusoidal positioning signal 0 digital signal processor 1 7 0 also includes several similar digital The signal processing element 9 of the signal processor 5 2 is also the hull shape wave filter 7 8 Λ piano 31-(Please read the precautions on the back before filling this page) This paper size applies to Chinese national standards (CN S) A4 specification (21 OX297 mm) Order-Combine 丨 · Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 40S536 at B7 V. Description of the invention (d) Delay element 79, pre-processor 94, servo driver 96, low speed Phase 56, M and position sensor 122. Since FIG. 7 has been simplified, only the X-axis low-speed stage 56 processing elements are shown. Those skilled in this technology can understand that the relative stern axis components are also included. Only one military independent system control computer 63 is required to drive the low-speed phases 56, 58 and N high-speed phases 154. Each of the multiple high-speed stage signal processors 172A, 172B, 172C, ..., 172N receives the high-speed stage correction data from the system control computer 63. KK In this way, each high-speed stage signal processor 1 72 will receive the position command of the high-speed stage and the current low-speed stage position data, so that each one is guided to the high-speed stage 154 at a common set of target positions. M is further K-positioned by specific error correction data. Band 8 represents a representative high-speed stage signal processor 1 72 for receiving high-speed and low-speed stage positioning data from the digital signal processor 170 and receiving correction data from the system control computer 63. This correction data includes low-speed stage and workpiece-related correction data transmitted to a geometrical dimension correction process 180, and M and high-speed stage linear and scale factor correction data transmitted to a high-speed stage correction processor 182. The above-mentioned correction data can be calculated by formula or look-up table. However, the correction data used by the geometric size correction processor 180 and the high-speed stage correction processor K is based on the title of “Beam Positioning” given to the trustee of this patent application case. US Patent No. 4,94 1, 08 -32-System "This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page), 1T Ministry of Economic Affairs Printed by the Central Standards Bureau Shellfish Consumer Cooperative 402 536 37

5. The formula described in the description of the invention (W 2 (K is abbreviated as "'0 8 2 patent") is more suitable. The linear and proportional circle errors in the high-speed stage are fairly fixed, and they are mainly caused by the high-speed stage. 1 54 are determined by individual different characteristics. Therefore, the high-speed stage correction processor 1 8 2 only requires relatively small and irregular correction data changes. For example, as described in the '082 patent, this correction data generates negative The lever guides each high-speed stage 154 to at least 13 calibration points on the matching calibration target, and a reflective energy detector senses the difference between the guided position and the correct target position , And provide the difference data to the system control computer 63, which is processed by K post-mine. The obtained correction data is transmitted to and stored in each high-speed stage correction processor 182. In addition, it is sensed by the matching photography 榇 160 Any errors between the guided position and the correct target position will also be adjusted and compensated. Therefore, the linear and proportional factor errors at the low speed stage are also quite fixed and do not require Modify the correction data on the other hand. On the other hand, the low-speed stage and the errors associated with the workpiece are quite variable *, and are mainly determined by workpiece placement, branching, rotation, M, and dimensional variation between workpieces 52. Therefore, Whenever the workpiece 1 52 changes, the geometric correction processor 1 80 needs to change a considerable amount of correction data. For example, the generation of the correction data is responsible for guiding the low-speed phases 56, 58 and each high-speed phase 1 54 to At least two (M and four are more suitable) are located on each matching workpiece 152. Calibration standards have been set. These calibration targets are, for example, an etched circuit board.隼 (CMS) A4 specification (2! OX297mm) (Please read the precautions on the back before filling this page) -fOrder

V 402536 A7 ______ B7 V. Description of the Invention I) The target of hole machining or photoetching. Each camcorder 160 detects the difference between the guided position and the correct adjusted target position, and provides the difference data to the system control computer 63 for later processing. The obtained correction data for each workpiece 152 is transmitted to and stored in the matching geometry correction processor 180. For each high-speed stage signal processor 1 72, the corrected over-positioning data for Y W is transmitted from the correction processors i 80 and 1 82 to the pre-processor 86, the current actuator 88, and the high-speed stage 154. The position feedback data is generated by the position sensor 120 (shown in FIG. 2), and mixed in the adders 1 84 and 84 for correction. Those who are familiar with this technology can understand that the same procedure can also be applied to X fine positioning. When the correction data is applied to the high-speed stage 1 to 24, the positioning range κ of each high-speed stage is limited to the 18x18 mm range which is within its maximum linear positioning range of 20 x 20 mm, which is more appropriate.余 The remaining 2 mm positioning range is used by the correction conditions described on K. The above description describes the signal processing method of one-way lotus axis for each high-speed and low-speed positioning device stage. Those who are keen on this technology will easily understand how to replicate this signal processing method, and use K to coordinate the motion of different axes, different stages, and single or multiple high-speed positioning devices. Application example: A typical application of this invention is to cut holes, such as blind holes, with a laser on a multilayer etched circuit board. Multi-layer etched circuit boards are generally adapted to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) via the paper size of the notebook. ----------, ------ Order L ----- ^ 1 (Please read the precautions on the back before filling this page) Printed by the Central Standards Bureau of the Ministry of Economy, Shellfish Consumer Cooperatives, printed A7 492536 B7 V. Description of the invention (iv) Recorded, stacked together, made into thin sheets and stamped into many 0 ♦ 05 to 0 ♦ 0 8 mm thick circuit board layers are manufactured. Each layer contains different internal connection pads and conductor models. These internal connection pads and conductor models will form a complex combination of electronic component installation and internal connection after processing. The component and conductor density potentials of etched circuit boards increase along with the component and conductor density potentials of integrated circuits. As a result, the precise positioning of holes in the etched circuit board and the dimensional tolerance also increase proportionally. The above-mentioned stamping step will cause expansion and dimensional variation, which will cause variation in the proportionality factor and orthogonality between the etched road boards. In addition, when a multiple-etched circuit board (workpiece 152) is attached to the low-speed stage 58, variations in the clamping method will also cause size rotation and branching errors between the etched circuit boards. In addition, the variation in the thickness of the etched circuit board is not conducive to drilling through holes with a precise preset depth by mechanical processing. The method of this invention to solve the problem described in M is as follows: two to four adjustment eyes Etching is performed at a predetermined position on each etched circuit board (it is better to have a calibration target in each corner). Recording (Please read the notes on the back before filling out this page) 1.! Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. Electricity storage, electricity storage, electricity storage, power generation, power generation, power generation, storage, power generation, storage and distribution, positive control, control, and distribution, system integration, transmission, transmission, and transfer of materials to the transferred materials are subject to differences. In the middle of the order, the board of directors mentioned that ο enough road photos and got 8 feet of electricity. The correction principle of the device is used to correct the correction of the visual detection at the measurement place. The post-repair adjustment is 6 inches. M 1 is set with a ruler and a machine is used. He, shadow 3 paper Standards are applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) 402536 A7 B7 Central Standards of the Ministry of Economic Affairs (printed by employee consumer cooperatives) " X, invention description (ν;) 丨 1 a field 3H school project 摞 provides enough The difference data was given to the system control computer 6 3 with 1 IM to correct the% rotation branch between the etched circuit boards, the scale factor and the straight 1 | cross variation. An additional fourth calibration S mark can be used to correct the trapezoidal distortion in each etched circuit board before reading. 1 Read back II The variation of the thickness of the etched circuit board is soil 0 * 1 3 mm ( Soil 0 ♦ 0 Note 1 1 0 5) Depth of laser action field 0 Meaning 1 Item 1 Due to strict requirements of depth diameter 9 K and positioning tolerance 9 For any refilling tools for hole processing 9 The processing of blind holes is Very difficult to pick mb 戦 0 This is the page • V because blind holes are generally processed through the first carcass layer (for example copper aluminum 1 1 gold nickel, silver palladium Λ tin and lead) »through one or more layers Layer dielectric layer 1 | (For example, polyimide, FR _ 4 resin% phenylcyclobutene dicis-butene \ thimidine triazine > cyanocyanate-based resin ceramics ) And upward but I will not pass through the second conductor layer 0. The hole obtained will be plated with a conductive layer 1 1 The material is connected to the first and second conductor layers with K 0 1 1 Again reference circle 6 long The structure of the positioning device 1 5 0 is an etched circuit board blind hole cutting set 1 with a number of 1 N equal to a number (for example, 2 4 or 6 but 4 is more suitable 1 |) 0 laser 1 5 6 A and 1 5 6 C is an ultraviolet laser (wavelength is less than about 3 5 5 nm) 9 and lasers 1 5 6 B and 15 6 N are infrared lasers (wavelength is about 1 9 0 0 0 nm to about 1 0 ) 0 0 0 nanometer range »Μ is 9 9 0 0 0 nanometer is more suitable) 0 because the ultraviolet laser and infrared laser have different wavelengths of 1.1, 1 for high-speed stage 1 5 4 mirrors 1 5 8 and lenses must be suitable for each matching laser wavelength 0 1- 36-1 1 This paper size applies to Chinese National Standard (CNS) A4 (21 OX 297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 402536_b7_ V. Description of the invention 0x) When UV lasers 1 56a and 1 56 is able to cut the first calendar layer and the dielectric layer in a suitable manner. However, the laser energy level and pulse repetition rate must be precisely controlled * K is used to prevent unacceptable damage to the second conductor layer. This result resulted in a narrower "processing window". Therefore, the ultraviolet lasers 1 56 a and 1 56 c are controlled to cut through the first conductor layer and a part of the dielectric layer, and the processing program has a wider processing window. Infrared dielectric radios 156B and 156N have a wide processing window, cut through the remaining dielectric layer with M, and do not cut through or damage the second conductor layer. However, the first conductor layer must have been processed in advance. The cutting equipment for etching the blind holes of the circuit board uses ultraviolet lasers 156A and 156C to cut the first guide layer passing through the workpieces 52A and 152C. In addition, infrared lasers 156B and 156N are used to cut through Dielectric layers on workpieces 152B and 152N. The multi-head positioning device 150 is used to cut the blind hole in accordance with the preferred machining procedure. For example, suppose that eight batches of etched circuit board soap (EC Bl, ECB2, ..., and EC380) have been processed. Among them, the conductive layer K is feed, and the dielectric is F R-4 resin. The unprocessed ECB1 and ECB2 were placed on the low-speed stage 58 in the workpiece positions 1 52A and 1 52C, and were processed with M by ultraviolet lasers 156A and 156C, respectively. Perform the work piece adjustment procedure as follows: -37- This paper size applies to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling in this page) Order " 丨 · Α7 40 ^ 536 _Β7 ___ V. Description of the invention (Ό Introduce low-speed stages 56, 58 and high-speed stages 1 54 専 to the adjustment target position on the etched circuit board; (Please read the precautions on the back before filling out this page) The video recorder 1 60 detects the difference between the guided position and the correct target position, and provides the difference data to the system control computer 63, which is processed after M; K and the The correction data is stored in the matched high-speed phase signal processor 172. The low-speed phases 56, 58 and the high-speed phase 1 54 are positioned to a set of preset target positions, so that the ultraviolet lasers 1 56A and 1 5 6C can cut through Pass the first conductor layer on ECB1 and ECB2 at the position of this group. Once again, place the processed ECB 1 and ECB2 on the low-speed stage 58 in the workpiece positions 1 52B and 1 52N. To distinguish Processed by infrared media S 156B and 156N. Unprocessed ECB3 and ECB4 are placed on low-speed stage 58 in workpiece positions 1 52A and 1 52C, and UV lasers 1 56A and 1 are used respectively. 56C for processing. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs to execute the workpiece adjustment procedure. Position the low-speed stages 556, 58 and the high-speed stage 1 54 so that the UV lasers 1 56A and 1 56C can be cut through the ECB 3 and The first conductor layer at the target position on ECB4, and the infrared lasers 1 56 Β and 1 6 Ν will cut through the dielectric layer at the target position on EC Β 1 and ECB2 at the same time. This paper standard applies China National Standard (CNS > A4 specification (210X297 mm) 49S536 A7 _B7_ V. Description of the invention oL) Unload the processed ECB1 and ECB2 from the low-speed stage 58 ECB4 is placed on the low-speed stage 58 in workpiece positions 1 52B and 1 52N, and is processed by K by infrared lasers 156B and 156N. ECB 5 and ECB 6 that will be processed in the future are placed on workpiece position 1 52A. And 1 52C The low-speed stage 58 * is processed by using UV radiation 156A and 156C, respectively. The workpiece adjustment procedure is performed. Position the low-speed stage 56, 58 and the high-speed stage 154 so that the UV 156A and 156C can cut through On ECB5 and E CB6, the first conductor layer is located at the eye position, and the infrared lasers 1 56B and 1 56N are simultaneously cut through the dielectric layer on the ECB 3 and ECB 4 at the target position. Remove the processed ECB3 and ECB4 from the low-speed stage 58 〇 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Place the processed ECB5 and ECB6 again At low speed stages 58 in workpiece positions 152B and 152N, M is processed by infrared lasers 156B and 156N, respectively. E C Β 7 and E C Β 8 that will be processed in the future are placed on the low-speed stage 58 in the workpiece positions 1 52A and 1 52C, and treated with K by UV lasers 1 56A and 1 56C, respectively. Perform the workpiece adjustment procedure. '-39- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 402536 a? B7 V. Description of the invention (<)) Position the low-speed phases 56, 58 and the high-speed phase 1 54 so that Ultraviolet lasers 156A and 156C can cut through the first conductor layer at the eye position on ECB7 and ECB8, while infrared media flutes 1 56B and 1 56N are cut through at the same time on ECB5 and Ε C Β6 Dielectric layer at the eye position. Remove the processed ECB5 and ECB6 from the low-speed stage 58. Place the ECB7 and ECB8 that have been processed halfway on the low-speed stage 58 in the workpiece positions 152B and 152N again, and use the M laser to infra-red 1 56B and 1 56N to process. ECB7 and ECB8, which have been processed halfway in the future, are placed on the low-speed stage 58 in workpiece positions 1 52A and 1 52C, and treated with K by UV lasers 156B and 156N, respectively. Perform the workpiece adjustment procedure. The low-speed phases 56, 58 and the high-speed phase 154 are positioned so that the ultraviolet rays 1 56B and 1 56N can cut through the dielectric layer at the target position on ECB7 and ECC 8. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Remove the processed ECB7 and ECB8 from the low-speed stage 58. The blind hole cutting process on the eight workpieces is thus completed. This processing procedure can be used to process different numbers of workpieces simultaneously, and the number of batches is not limited to eight pieces, or etching circuits. Ultraviolet lasers 1 56A and 1 56C need to cut through the conductor layer -40- This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 402536 a? _B7_ V. The time of the invention is usually longer than It takes a long time for the infrared electric 156B and 156N to cut through the dielectric layer. Therefore, the longer processing time grasps the throughput of the processing. Because of the target of all tools on the multi-tool positioning device 150 The locations are actually the same, and different processing times can be solved by providing suitable different laser energy levels and pulse repetition rates for ultraviolet and infrared lasers. Printed by the Consumer Cooperative of the Central Standards Bureau, Ministry of Economic Affairs ( (Please read the precautions on the back before filling out this page) In some applications, it is necessary to cut larger holes with a diameter of about 200 microns or less. Because the ultraviolet laser beams 156A and 156 C have a beam diameter of only about 20 micron, multi-tool positioning device 150 must cause the ultraviolet beam to move along a spiral or circular path for use in a guided SI layer Cutting out the above-mentioned larger holes, so it takes more time to cut the above-mentioned larger holes. However, the beam diameters of the infrared lasers 1 56B and 1 56N are about 400 micrometers, and they are about the ultraviolet laser beam. 20 times the diameter. Therefore, when the larger diameter hole is cut through the dielectric layer, at least part of the infrared laser beam will cover the entire hole, while the ultraviolet laser beam will follow a spiral or The circular path moves, and a hole is cut in a conductive layer with M. Under the above conditions, the infrared laser beam remains at the target position for a considerable period of time, and different effective processing times can be borrowed again. It is solved by providing suitable different laser energy levels and pulse repetition rates for the use of ultraviolet and infrared lasers. If appropriate laser energy can be used, multiple workpieces can be applied by using appropriate energy distribution devices There can be a single laser between them. In this item-4 1- This paper size applies the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) ⑽536 at _ _B7_ V. Description of the invention (/ () The invention also considers the use of wavelength-switchable lasers. This invention provides a positioning accuracy, positioning speed, reduced stopping time, and non-formatted tool travel path Database, an improved combination of narrowing the moving range of K and high-speed stages, using M to significantly change the production volume of processing, and reduce the rejection of workpieces due to size and positioning variations. Consumption by employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by a cooperative (please read the notes on the back before filling out this page) Staff who are familiar with this technology will know that some of this invention can be implemented by different methods from the above-mentioned laser beam fine machining implementation . For example, in military or multi-head structures, quite a few types of tools can be moved by the high-speed positioning device stage. The above tools are, for example, fine-sized drills, punches, lasers, laser beams, and radiation beams. , Particle beams, beam generators, microscopes, lenses, optical instruments and cameras. In addition, many different positioning devices can also be used in different combinations, and different combinations can be selected from the following devices: including galvanometers, phonograms, piezoelectric energy converters, stepping Motor, M and guide pattern positioning device. The digital signal processor need not be fully digitized, and may include any suitable combination of analog and digital secondary circuits. Similarly, the contour shape, frequency bandwidth, and amplitude of the positioning signal described herein, and M and filter characteristics can all be changed by adding K to match the needs of other types of positioning applications. For those who are familiar with this technology, it is obvious that the details of the embodiment of the invention described on K can be modified without departing from the basic principles of the invention *. The scope of an invention must be determined solely by the scope of subsequent patent applications. -42- This paper size is applicable to China National Standard for Ladder (CNS) 8-4 (210 × 297 mm)

Claims (1)

f Printed by the Consumer Affairs Cooperative of the Central Bureau of the Ministry of Economic Affairs 1. A type of positioning instruction corresponding to a set of positioning instructions received from a database and simultaneously positioning multiple tools on a set of multiple connected workpieces A positioning device with M including: a slow positioning device table holding multiple associated workpieces with K and generating a large range of relative movement between multiple tools and multiple related workpieces; multiple fast positioning device tables Connected to the slow positioning device table uses M to generate a small range of relative motion between multiple tools and multiple associated workpieces; a signal processor that processes the positioning instruction set M to generate slow and fast motion control signals; a slow speed A positioning device driver that drives a slow positioning device table within a large range of relative motion corresponding to a slow motion control signal; a fast positioning device driver that drives multiple rapid positioning devices within a small range of relative motion corresponding to a rapid motion control signal Platform; M and the signal processor coordinate a large range of relative movement and a small range of relative linkage, so that when slow and fast positioning device When the table is moving at the same time, multiple tools can be temporarily stopped with respect to multiple workpieces at a preset time period. 2 · If the device in the scope of patent application is the first item, where the workpiece is a circuit board, M and multiple tools are laser beams, which trigger the laser beam in a preset time period, and use M to associate the circuit board Holes cut out in the middle 03. As in the device in the scope of patent application No. 2, wherein the thickness difference of these circuit boards is compensated by the field depth of each laser beam. 4 · If the device of the scope of patent application is the first item, in which the paper size of the slow-positioning paper is the size of China National Standard (CNS) A4 (210X297 mm) 1 ^ 1 nn n ^ i I clothing. (Please read first (Read the note on the back and fill in this page) f Printed by the Consumer Affairs Cooperative of the Central Bureau of the Ministry of Economic Affairs 1. A type of positioning instruction corresponding to a set of positioning instructions received from a database and simultaneously positioning multiple tools on a set of multiple connected workpieces A positioning device with M including: a slow positioning device table holding multiple associated workpieces with K and generating a large range of relative movement between multiple tools and multiple related workpieces; multiple fast positioning device tables Connected to the slow positioning device table uses M to generate a small range of relative motion between multiple tools and multiple associated workpieces; a signal processor that processes the positioning instruction set M to generate slow and fast motion control signals; a slow speed A positioning device driver that drives a slow positioning device table within a large range of relative motion corresponding to a slow motion control signal; a fast positioning device driver that drives multiple rapid positioning devices within a small range of relative motion corresponding to a rapid motion control signal Platform; M and the signal processor coordinate a large range of relative movement and a small range of relative linkage, so that when slow and fast positioning device When the table is moving at the same time, multiple tools can be temporarily stopped with respect to multiple workpieces at a preset time period. 2 · If the device in the scope of patent application is the first item, where the workpiece is a circuit board, M and multiple tools are laser beams, which trigger the laser beam in a preset time period, and use M to associate the circuit board Holes cut out in the middle 03. As in the device in the scope of patent application No. 2, wherein the thickness difference of these circuit boards is compensated by the field depth of each laser beam. 4 · If the device of the scope of patent application is the first item, in which the paper size of the slow-positioning paper is the size of China National Standard (CNS) A4 (210X297 mm) 1 ^ 1 nn n ^ i I clothing. (Please read first Read the note on the back of the page and fill in this page) 402536 A8 B8 C8 D8 々, Patent application scope The table includes an X-sleeve stage, a γ-sleeve stage, and multiple rapid positioning device tables are placed on the X-sleeve stage. . (Please read the notes on the back before filling this page.) 5. If the device in the scope of patent application No. 4 is used, multiple workpieces are placed on the Y-axis stage. 6. The device according to item 1 of the scope of patent application, wherein each of the plurality of workpieces includes a group of calibration targets that are substantially the same, and the device further includes: a sensor that detects the positioning of different groups of calibration targets to confirm different groups Calibration target positioning error; and at least one fast stage signal processor 'which processes the sensed positioning error and corrects a small range of relative motion to compensate for the positioning error * enabling multiple tools to simultaneously target targets on multiple associated workpieces Location group. 7. The device according to item 6 of the patent application, wherein the sensor comprises at least one video camera. 8 · The device according to item 6 of the patent application, wherein the sensor senses at least two calibration targets, and the positioning error itself includes the difference in rotation and offset between multiple workpieces. Employees' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China 9 · For the device in the scope of patent application 6, the sensor senses at least three calibration targets, and the positioning error itself includes rotation between multiple workpieces, Offset, scale factor, and orthogonality differences. 1 〇. The device according to item 6 of the patent application scope, wherein the sensor senses at least four calibration targets, and the positioning error itself includes rotation, offset, proportionality, and orthogonality between multiple workpieces Differences from trapezoidal distortion 0 -2- This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) A8 402536 § 6. Application for patent scope 11. One for the first and second same at least A method for cutting a preset hole pattern on a circuit board, and each circuit board itself has at least a first conductor layer, a dielectric layer, and a second conductor layer, including: generating at least first and second conductor layers, respectively; Wavelengths of the first and second laser beams; placing the circuit board on a slow positioning device table, using K to generate a large range of relative movement between the laser beam and the circuit board; providing at least for connection to a low speed positioning Device table and first and second rapid positioning device tables that generate small range relative motion between laser beam and associated circuit board; K and coordinate large range relative motion and small range The relative movement causes the first laser beam to cut a preset hole model in the first conductor layer of the first circuit board, and the second laser beam side is cut to the lead in the dielectric layer of the second circuit board. Hole model. 1 2. If the method of item 11 in the scope of patent application, it further includes: Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs X Please read the notes on the back before filling this page) According to the preset hole model, Relative to the circuit board, the slow and fast motion control signals required for positioning the laser; The corresponding slow motion control signals drive the slow positioning device within a large range of relative motion; M and the corresponding fast motion control signals are in a small range Drive the rapid positioning device table within relative motion. -3- This paper size applies to Chinese National Standard (CNS) A4 specification (210 × 297 mm) 402536 A8 B8 C8 D8 VI. Application scope of patent 1 3 · If the method of the scope of patent application No. 1 丨, the slow positioning device table An X-axis stage, a γ-axis stage, and a plurality of rapid positioning device stages are arranged on the X-axis stage. 1 4 · The method according to item 13 of the patent application scope, wherein the circuit boards are placed on a Y-axis stage. 15 · The method according to item 11 of the patent application range, wherein the first laser beam is generated by an ultraviolet laser, and the second laser beam is generated by an infrared laser. 16 · The method according to item 11 of the patent application range, wherein the first wavelength is less than about 355 nm, and the second wavelength is from about 1,000 millimeters to about 10,000 millimeters. In the micrometer range. 1 7 · The method according to item 11 of the scope of patent application, wherein the coordination step is performed, so that the first and second laser beams can simultaneously cut the dielectric of the first circuit board, the first conductor layer, and the second circuit board, respectively. Floor. 18 · The method according to item 11 of the scope of patent application, further comprising confirming that each circuit board has a set of calibration targets that are substantially the same; detecting the positioning targets M of different sets of calibration targets and confirming the positioning of each circuit board in association with each other Errors; processing of detected positioning errors; M and correction of small-area relative motion to compensate for positioning errors, so that each laser beam can be accurately positioned on a pre-set hole model on a connected circuit board. -4-This paper size is in accordance with Chinese Standard (CNS) A4 (210X297mm) ^^ 1 1 ^ 1 ^^ 1 an In I ^ mm ^^ 1 HI /:-';.^, one. ( (Please read the notes on the back before filling out this page.) Printed by Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs