401348 A7 _ ________ B7 五、發明説明（i ) Γ - 本案為1997年2月25曰由Arun Agarwal提出申請之美 國專利申請㈣08/805,488號，，縮小喷墨印字頭孔口，’之部 分連續案，該案為1995年10月25曰由Weber提出申請之美 國專利申請案第08/547,885號，，非圓形印字頭孔口，，之部分 連續案’二案皆讓予本發明之受讓人。 ¥明背景 概略而言本發明係關於一種噴墨式印表機印字頭，特 別係關於印字頭毛口板及其製法，其中多個相關孔口容易 成形於孔口板。 喷墨式印表機藉由以控制方式喷射墨滴使墨滴著陸於 媒體例如紙上預定位置而形成文字及圖像。就最簡易形式 而言，此種印表機可構想為一種可移動及定位媒體於某個 位置之機構因此墨滴可著陸於媒體上，一列印卡匣其控制 墨水流動並排放墨水滴至媒體，及妥為控制硬體及軟體。 經漪部中央標準局員工消費合作社印裝 習知喷墨式印表機之列印卡匣包含一墨水容納區其視需要 儲存及供給墨水，及一印字頭其如印表機控制軟體指示加 熱及排出墨水。典型印字頭為層疊結構包括一半導體基層 ，一障層材料結構其係以墨水流道形成為蜂巢形，及一孔 口板其鑽孔小孔或將孔口設置為允許墨滴排除之圖樣。 習知喷墨式印表機變化十，擠出機構係由複數加熱器 電阻器形成於半導體基材上組成，該複數加熱器電阻器各 自關聯複數成形於障層之墨水射出腔室之一及複數孔口板 之孔口之一。各該加熱器電阻器係連結至印表機之控制軟 體，故各該電阻器可獨立激發，快速氣化部分墨水成為氣 -4- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公龙） 經漪部中央標率局員工消f合作社印製 A7 ^、'、一·_____Η 7 五、發明説明（2 ) , * ’包’隨後由孔口排出墨滴。墨水流入成形於障層環繞各個 加熱器電阻器之射出腔室内並等候加熱器電阻器之激發。 於射出墨滴及墨水氣泡塌陷後墨水再填裝射出腔室至一片 半月形成形於跨越孔口該點。障層通道經此通路墨水流經 其中而再填充射出腔室之障層通道之形式及縮窄可確立墨 水再填裝射出腔室速度及墨水半月半動力學。印表機、列 印卡E及印字頭構造之進一步細節可參考惠普公司期刊第 36卷第5期1985年5月及惠普公司期刊第45卷第1期1994年2 月。 列印卡E sx sf者面對之問題為維持高列印品質同時達 到尚列印速度。當小滴由於射出腔室内部之墨水快速沸騰 而由孔口擠出時，大部分射出墨水集中於小滴被導引朝向 媒體。但小部分被排出之墨水留在由小滴延伸至孔口表面 開口之尾。此種尾及關聯至噴墨著陸於媒體可能導致混淆 之列印圖像或文字。喷射問題可藉由減低列印工作速度或 經由最適化墨水射出腔室及障層相關進墨水導管之構造或 幾何解決。孔口幾何也影響噴霧，參考1996年2月29曰由 Weber等提出申請之美國專利申請案第08/608,923號，，非對 稱印字頭孔口 ”。 習知孔口板之製法利用於預先製備之心軸上之無電鍍 敷技術。此種心軸示例說明於第1圖（但未成比例），其中 基材101至少有一個矽或玻璃製成之平坦面。設置於基材 101之平坦面上為導電層1〇3通常為鉻或不鏽鋼膜。真空沉 積法如平®磁控管方法可用沉積此導電層103。另一種真 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公势) ----：------私衣—I (請先閲讀背面之注意事孔再填寫本頁)401348 A7 _ ________ B7 V. Description of the Invention (i) Γ-This case is US Patent Application No. 08 / 805,488, filed by Arun Agarwal on February 25, 1997, to reduce the orifice of the inkjet print head, 'Part of the continuous case This case is US Patent Application No. 08 / 547,885, filed by Weber on October 25, 1995. Non-circular printing head orifices, and part of the consecutive cases, 'The two cases are all assigned to the assignee of the present invention. people. [Background] In general, the present invention relates to a printing head of an inkjet printer, and more particularly to a printing head burr plate and a manufacturing method thereof, in which a plurality of related orifices are easily formed on the orifice plate. An inkjet printer forms characters and images by ejecting ink droplets in a controlled manner to land the ink droplets on a predetermined position on a medium such as paper. In its simplest form, this printer can be conceived as a mechanism that can move and position the media at a certain location so that ink droplets can land on the media, a print cartridge that controls ink flow and discharges ink droplets to the media , And proper control of hardware and software. The print cartridge of the inkjet printer that is printed by the staff of the Central Bureau of Standards of the Ministry of Economic Cooperation includes an ink containing area that stores and supplies ink as needed, and a print head that heats as instructed by the printer control software And eject ink. A typical printing head is a laminated structure including a semiconductor base layer, a barrier material structure formed in a honeycomb shape with ink flow channels, and an orifice plate with drilled holes or holes configured to allow ink droplets to be removed. The conventional inkjet printer has a variation of ten. The extrusion mechanism is composed of a plurality of heater resistors formed on a semiconductor substrate. The plurality of heater resistors are each associated with one of the ink ejection chambers formed in the barrier layer and One of the orifices of a plurality of orifice plates. Each of the heater resistors is connected to the printer's control software, so each of the resistors can be independently excited, and a portion of the ink can be quickly gasified. This paper size applies to China National Standard (CNS) A4 specifications (210X297). Long) The staff of the Central Standards Bureau of the Ministry of Economic Affairs printed A7 ^, ', a · _____ Η 7 Cooperatives. V. Description of the invention (2), *' packets' were then ejected from the orifice. The ink flows into the ejection chamber formed in the barrier layer around each heater resistor and waits for the heater resistor to be excited. After the ejected ink droplets and ink bubbles collapse, the ink fills the ejection chamber to a half-moon and forms at the point across the orifice. The form and narrowness of the barrier channel through which the ink flows through this channel and then refills the ejection chamber can establish the speed of ink refilling the ejection chamber and the half-moon and half-dynamics of the ink. For further details on the construction of the printer, print card E, and printhead, refer to Hewlett-Packard Journal Vol. 36 No. 5 May 1985 and Hewlett-Packard Journal Vol. 45 No. 1 February 1994. The problem faced by print card E sx sf users is to maintain high print quality while achieving high print speed. When the droplets are squeezed out of the orifice due to the rapid boiling of the ink inside the ejection chamber, most of the ejected ink is concentrated in the droplets and is directed toward the medium. However, a small portion of the discharged ink remains at the end of the opening extending from the droplet to the surface of the orifice. This tail and the associated inkjet landing in the media may cause confusing printed images or text. The ejection problem can be solved by reducing the printing speed or by optimizing the structure or geometry of the ink ejection chamber and barrier-related ink inlet ducts. Orifice geometry also affects spraying. Refer to US Patent Application No. 08 / 608,923, filed by Weber et al., February 29, 1996, for asymmetric printing head orifices. "The conventional orifice plate manufacturing method is used in advance to prepare The electroless plating technology on the mandrel. An example of this mandrel is illustrated in Figure 1 (but not to scale), in which the substrate 101 has at least one flat surface made of silicon or glass. It is arranged on the flat surface of the substrate 101 The conductive layer 10 is usually a chromium or stainless steel film. A vacuum deposition method such as Ping® magnetron method can be used to deposit this conductive layer 103. Another genuine paper size is applicable to China National Standard (CNS) A4 specification (210X297) ) ----: -------- Private Clothing—I (Please read the note on the back before filling in this page)
4T 線 ^Ιό4Η 經濟部中央標準局員工消費合作社印聚 Α7 -----—________Β7 五、發明説明（3 ) —； —--: 空沉積法可用於沉積介電層105其典型為氮化石夕，藉真空 沉積法設置例如電漿促進化學蒸氣沉積法。介電層105需 要極薄，典型厚度為約0.3〇微米。介電層105以光阻罩遮 住，暴露於紫外光及引進電聚蚀刻過程，其去除大半介電 層，但於導電層103上預選位置之介電材料釦除外。當然 此等位置係預先決定為待形成於心軸頂上之孔口板之各孔 口位置。 此種可再使用心轴置於電成形浴，其中導電層103作 為陰極，而基底材料典型為鎳作為陽極。於電成形製程中 ，鎳金屬由陽極移轉至陰極，鎳（顯示為層1〇乃附接於導 電層103之導電區。因鎳金屬板係由心軸之各導電板均勻 形成，一旦介電釦105表面到達時，鎳以均勻且可預測之 圖樣鍍敷於介電層上方。鍍敷方法參數包括鍍敷時間經小 心控制’故形成於介電層釦1〇5之鎳層1〇7開口於介電表面 具有預定直徑（典型為約45微米）。此種直徑通常占介電層 知105直徑之1/3至1/5 ’如此導致鎳1〇7頂層於孔口板内面 115具有直徑d2之開口，直徑d2約為開口直徑d 1之3至5倍 ’後述開口為孔口板外面213之孔口。無電鑛敷方法完成 時’新形成之孔口板由心軸移出並鍍金以使孔口防蝕。金 屬孔口板製備之其他說明可參考美國專利4,733,971 ; 5，167,766 ; 5,443,713及5,560,837，各案讓予本發明之受 讓人。 喷墨技術使用點陣操縱形成圖像及文數文字，列印圖 像之色彩及色度係由圓像之假設重疊矩形格柵上層之各目 (請先閲讀背面之注意事項再填寫本頁) 裝. 訂 線Line 4T ^ Ιό4Η Consumers' Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, Printing Association Α7 -----——________ Β7 V. Description of the Invention (3) —; —--: The empty deposition method can be used to deposit the dielectric layer 105, which is typically nitride In the evening, a vacuum deposition method such as a plasma-assisted chemical vapor deposition method is provided. The dielectric layer 105 needs to be extremely thin, typically having a thickness of about 0.30 micrometers. The dielectric layer 105 is covered with a photoresist mask, exposed to ultraviolet light, and the introduction of an electropolymerization etching process, which removes most of the dielectric layer, but deducts the dielectric material at a preselected position on the conductive layer 103. Of course, these positions are determined in advance as the positions of the orifices of the orifice plate to be formed on the top of the mandrel. This reusable mandrel is placed in an electroforming bath in which the conductive layer 103 serves as the cathode and the base material is typically nickel as the anode. In the electroforming process, nickel metal is transferred from the anode to the cathode, and nickel (shown as layer 10 is attached to the conductive region of the conductive layer 103. Because the nickel metal plate is uniformly formed by the conductive plates of the mandrel, once When the surface of the electric button 105 arrives, nickel is plated on the dielectric layer in a uniform and predictable pattern. The plating method parameters include careful control of the plating time, so the nickel layer 1 formed on the dielectric layer button 105. 7 openings on the dielectric surface have a predetermined diameter (typically about 45 microns). Such diameters usually account for one-third to one-fifth of the diameter of the dielectric layer 105. This results in a nickel 107 top layer on the inner surface of the orifice 115 An opening with a diameter d2, the diameter d2 is about 3 to 5 times the opening diameter d 1 'the opening mentioned later is the opening of the outside 213 of the orifice plate. When the electroless deposit method is completed,' the newly formed orifice plate is removed from the mandrel and Gold plating to prevent corrosion of the orifices. For other instructions on the preparation of metal orifice plates, refer to U.S. Patents 4,733,971; 5,167,766; 5,443,713 and 5,560,837, each of which is assigned to the assignee of the present invention. Inkjet technology uses dot matrix manipulation to form images And text, print the color and color of the image Overlapped by the Department of the virtual circle as an upper rectangular grid of each mesh (Read Notes on the back and then fill the page) installed. Order Line
» H —I 1 I H— · 本紙乐尺度適用中國國家標準（CNS ) Λ4規格（210X297公犮） -6- 經濟部中央標準局員工消费合作社印製 A? -、-____ ’ Η 7 五、發明説明（4 ) , '~ : 標圏素（稱作’’像素”(pixels))是否有墨滴沉積於列印媒體調 控。記錄圖像内部之亮度連續性-色度過渡特別受使用墨 滴及點陣成像特有之量化影響。成像系統也導致散亂或系 統性亮度起伏波動俗稱粒度，以肉眼可辨識各點。估計未 經輔助之人類視覺系統可察覺個別點直至於列印圖像之直 徑縮小至小於或等於約20至25微米為止。因此點陣列印方 法之非期望之量化影響於業界現況係藉由縮小各滴尺寸及 以高解析度列印解決。通常1200點/吋（“dpi”）之列印圖像 之視覺感覺比600 dpi圖像更佳’而其又比3〇〇 dpi等改良 。此外非期望之量化影響可利用具有不同色彩密度（例如 兩個花青墨水列印卡匣，各於墨水之化學組成不同比例之 染料對容積比）或含不同類型化學色料之比色減小。 改良列印品質之裝置討論於具有改良性能之氣泡喷墨 —文，作者Enrico Manini，Olivetti於IS&T，s第 10屆非衝擊 性列印技術進展會議，1994年10月30日至11月4日路易安 那州紐奥良。Manini呈現一種構想，，利用各加壓腔室有數 個喷嘴而使用更多且更小的墨滴更均勻分布墨水，使墨水 細物沉積於紙張上”。由Manini提供之草圖顯示二喷嘴加 壓腔室，三喷嘴腔室及四喷嘴腔室。多喷嘴（或孔口）技術 之進一步改良揭示於Weber等於1997年3月5日提出申請之 美國專利申請案第08/812,385號，，於喷墨列印改良墨滴分 布之方法及裝置，，，該案讓予本發明之受讓人。 雖然多列印孔口之優點明顯，但具有緊密間隔列印孔 口之印字頭特別孔口叢集之實現技術尚未良好發展。習知 本紙依尺度適用中國國家標準（CNS )八4規格（21GX 297公t ) " ' ~ "" 裝 tM 訂 線 (請先閲讀背面之注意事項再填寫本頁) 經漪部中央標準局員工消費合作社印^ A7 - -一·-— B7 五、發明説明（5 ) — — 多孔口製法採用多個非導電知於導電基材心轴上，錄或其 金屬電/儿積於其上。不幸此種方法用於叢集列印孔口之效 果不佳’原m為加熱器電阻器與關聯設置腔室間之空間有 限無法允#個壯形成孔口同時允許孔口板夠厚而可符合 列印性育匕之構造設計要求及孔口板強度之製造要求及容易 處理。 發明概述 本發明涵蓋-種製造印字頭之方法及喷墨式印表機之 印字頭裝置。印字頭具有—孔口板附有至少二喷墨孔口工 作式彼此關聯且彼此相對於其間距中點相向設置。二孔口 各有或何區其係以該距離中點與另一孔口對稱。 圖式之簡單說明 第1圖為形成心軸之孔口板及形成於心軸上之孔口板 之剖面圖。 第2圖為習知印字頭之剖面圖，顯示一墨水射出腔室 〇 第3圖為習知印字頭之孔口板外表面之平面圖。 第4圖為習知印字頭之剖面圖示例說明墨水小滴之推 出。 第5圖為小滴·半月形系統之理論模式其可用於瞭解本 發明之性能。 第6A及6B圖為由孔口板外表面之平面囷顯示孔口表 面孔隙》 弟7圖為由孔口板外表面之平面圓顯示可用於本發明 ----------裝-- (諳先閲讀背面之注意事項再填寫本頁) 訂 ---線---- • I . I - —I I -I · 本紙银尺度適财國國家插準（CNS ) A4規招（2似297公势） 經濟部中央標準局員工消費合作社印製 401348 A7 - ---B7 五、發明説明（6 ) ， Γ 之孔口表面孔隙。 第8圖示例說明可用於本發明之形成孔口孔隙之技術 〇 第9圖不例說明可用於本發明之形成孔口孔隙之技術 〇 第10圖為由孔口板表面之平面圖，示例說明可用於本 發明之孔口表面孔隙及.關聯墨水射出腔室之孔口搪孔。 第11圖為可使用本發明且以粗體線顯示孔口群集之孔 口板之頂視平面圖。 第12圖為可用於本發明之印字頭之剖面圖，其顯示第 11圖之孔口板沿剖線所取之剖面圖。 第13圖為其上方沉積一非導電釦之心軸之剖面圖，及 例如第11圖所示電沉積孔口板之剖面圖（沿剖線Β _ Β所取） 〇 第14圖為印字頭之部分孔口板之頂視平面圖其顯示二 孔口且用於本發明。 第15圖為印字頭之部分孔口板之頂視平面圖顯示呈開 槽形式之四孔口其可用於本發明。 第16圖為印宇頭之部分孔口板之頂視平面圊顯示四孔 口其可用於本發明。 第Π圖為印字頭之部分孔口板之頂視平面圖顯示四孔 口其可用於本發明。 第18Α及18Β圖為印字頭之部分孔口板之頂視平面圖 顯示六孔口其可用於本發明。 --:丨：------裝----^--钉-----_線 (請先閱讀背面之注意事項再填寫本頁) 不紙狀度通辭國國家標準（c叫A4^( 210X297^,) -9 A7 137 五、發明説明（7 ) ‘ ~ 較佳具體例之詳細說明 習知印字頭之剖面圖顯示於第2圖。薄膜電阻器201形 成於半導體基材203表面上，典型藉由於半導體基材203表 面上之金屬化（未顯示出）連結至電力輸入。此外，多層可 對化’學及機械供給提供保護之層設置於加熱器電阻器2〇 i 上，但為求清晰起見未顯示於第2圖。一層障壁材料2〇5選 擇性設置於矽基材203表面上（或較小）藉此流向環繞加熱 器電阻器201之開口或墨水射出腔室207，故於激發加熱器 電阻器201前及通過孔口 209射出墨水前’墨水可積聚於射 出腔室。障層205之障壁材料習知為得自杜邦公司之paracj 或相當材料。孔口 209為於孔口板107由孔口板内面115延 伸至孔口板外面213，如前述可成形為孔口板之部分。 第3圖為習知印字頭（指示第2圖之剖線A-A)由孔口板 107外面213檢視孔口 209之頂視平面圖。墨水進給通道3〇1 存在於障層205而由較大墨水來源（未顯示出）輸送墨水至 墨水射出腔室。第4圓示例說明墨水由孔口 209排出後22微 秒時呈小墨滴401之墨水構型。習知孔口板（其中使用圓形 孔隙）中，小墨滴401產生一長尾403，可見向後延伸至至 少孔口板107之孔口 209。 於小墨滴401離開孔口板及排放小墨滴之氣化墨水氣 泡坍陷後，毛細力抽取墨水由墨水來源通過墨水進給通道 301抽取墨水。未受阻尼之系統中墨水衝回射出腔室太過 快速而過度填滿射出腔室207因而產生鼓起的半月形。然 後半月形於沉降平靜前以其水平位置擺動數週期。鼓起半 本紙张尺度適用中國國家標準（CNS ) A4規格（210X297公楚） i-------裝-- (請先閱讀背面之注意事p填舄本頁) 、^τ 線 經濟部中央標準局貝工消費合作社印製 經满部中央榡準局員工消費合作社印聚 401348 A7 ---:______ 五、發明説明（8 ) 月形之額外墨水增加小墨滴容積，故當半月形鼓起時排出 小墨滴。回縮之半月形縮小小滴容積，故於此週期部分小 滴被排出。印字頭設計者藉由增加墨水再填裝通道之流體 阻力來改良及最適化墨水再填裝及半月形系統之阻尼作用 。典型此種改良係藉由延長墨水之再填裝通道，縮小墨水 之再填裝通道剖面，或加大墨水黏度達成。此種墨水再填 裝流體阻力增加經常導致再填裝時間減慢及小墨滴喷射速 率及列印速度減低。 半月形系統之簡化分析為例如第5圖所示之機械模式 ’其中相當於被排出小墨滴質量之質塊501藉彈簧505偶聯 至固定結構503 ’彈簧具有與孔口有效半徑之倒數成比例 之彈簧常數K。質塊501也藉阻尼功能507偶聯至固定結構 503，阻尼功能係與通道流體阻力及其他墨水通道特徵相 關。本構造中’墨滴重量質塊501係與孔口直徑成比例。 如此若預定控制半月形特徵及性能，可藉由最適化墨水通 道或於機械模式調整彈著505之彈簧常數而調整阻尼功能 507之阻尼因數。 當小滴401由孔口射出時，大半小滴質塊係容納於小 滴401之前導端，而此質塊之速度最高。剩餘尾4〇3含有小 部分墨水及具有速度分布由接近等於小墨滴頭位置之相等 速度至低於小墨滴頭之墨水而位置最接近孔口孔隙之墨水 速度。偶爾於小滴過渡過程中，尾之墨水拉伸至尾由小滴 斷裂之點》部分殘存於尾之墨水被拉回印字頭孔口板丨〇7 ’於此處其典型形成環繞孔口之墨水糊◊此種墨水糊若未 本&張尺度適用中國國家標準（CNS ) A4規栝（2丨0父297公费)" ~-〜 --- 參 ：iT--------0 (筇先閲讀背面之注意事項再填寫本頁} -----B7 五、發明説明,（9 ) 經控制則由於使隨後小墨滴之方向誤導而使列印材料品質 低劣。其他部分小墨滴尾係於小墨滴沉積於媒體前被吸收 入小墨滴頭内。最後’部分於小墨滴尾之墨水既未返回印 字頭也未保留或吸收於小墨滴，反而產生以任意方向展開 之小於小滴之細霧。部分細霧於列印時到達媒體造成由小 墨滴形成之點邊緣粗糙並於媒體上產生非期望之點，降低 所需列印材料清晰度。 已知孔口孔隙209至外界環境之出口區決定小墨滴排 出之滴重量。進一步決定半月形之回復力（模式中之常數 K)部分係由孔口孔隙邊緣附近情況決定。如此為了提高 半月形之勁度，孔口搪孔之側邊及開口必須儘可能接近。 因此此乃與需維持小滴之特定滴重量（由孔口出口面積決 定）之需求矛盾。非圓形幾何提供加熱器電阻器上較大回 復力使小墨滴尾較快且較接近孔口板斷裂，因此產生較短 的小墨滴尾而顯著減少喷霧現象。 經漪部中央標準局員工消費合作社印聚 可用於減少喷霧之若干非圓形孔口為細長孔口具有一 主轴及一副軸’其中主轴尺寸比副軸大，二轴皆平行孔口 板之外表面》此種細長構造可為矩形及平行四邊形或印形 例如橢圓形及平行邊”赛車軌，，構造。使用容納於機型 HP51649A列印卡匣之墨水（得自惠普公司）及孔口孔隙面 積等於HP51649A卡匣使用之孔口孔隙面積，判定具有主 軸對副軸比由2比1至5比1之橢圓顯現所需半月形勁度及短 尾之小墨滴射出。 第6A-6B囷為孔口板外表面之平面圖示例說明各型孔 -12- 本紙張尺度適用中國國家榡準（CNS ) A4規格（210X297公f ) 經漪部中央標準局員工消費合作社印掣 401348 A7 p—^_________ 五、發明説明（10 ) ~ ： 口搪孔尺寸。第6A圖示例說明具有外部尺寸半徑r及外部 尺寸r與開口至射出腔室值&間之半徑比之圓形孔口。 HP51649A卡匣中r=17.5微米及Γ2=45微米。如此獲得孔口 板外表面之孔隙面積（r· π )=962平方微米。第6Β圖示例 說明橢圓外側孔口孔隙幾何，其中主軸/副軸比=2 : i，為 了維持等重小墨滴，孔口開口之外側面積維持於962平方 微米。如此由橢圓面積公式（Α=7Γ · a· b)求出橢圓之主軸 及副軸（a、b)對2 : 1橢圓而言分別為28 5微米及12 4微米 〇 如前文提示，較佳尾斷裂及減少隨後噴霧之主要促成 因素為縮小橢圓之副軸尺寸。於轴比為2 : i至約5 : i之範 圍内，觀察得喷霧現象減少。前文也發現之一項缺點為橢 圓孔口表面開口於孔口板之内表面（於墨水射出腔室）對應 之開口較大。此種内部開口於孔口間隔緊密俾改良列印解 析度時將重疊而干擾。此種干擾使來自一射出腔室之墨水 喷入峨鄰射出腔室及其他些微但有害影響。 為了解決干擾問題，橢圓於主軸方向扭曲主要為了產 生月牙形或四分之一月形。此種月牙形之副軸尺寸保留而 有效主軸縮短，同時總孔口孔隙面積保留恆定。使用月牙 形孔口開口可持續達成妥為減少喷霧。但月牙形對使用此 型印字頭之列印品質造成不同問題。離開孔口板之彈道並 非垂直孔口板表面，反而偏離垂直朝向孔口孔隙表面之負 曲率半徑方向傾斜。 為了解決月牙形孔口孔隙之彈道問題，經由重疊二月 本紙張尺度適用中) Μ規·-~— l ^-ST—-----^ (請先閲讀背面之注意事項再填耗本頁) A7 —____ B7 五、發明説明（11 ) · 牙形而月牙形之肢端彼此相背，提供另一種對稱形狀。此 種形狀示例說明於第7圖。修改後之孔口孔隙形狀可視為” 沙漏”形。較佳具體例中修改副軸（bH)設定於26微米，而 修改主轴（aH)設定為69微米。界定修改副轴邊緣之曲率半 徑（rH)約為47微米。此種獨特孔口孔隙形狀可保有狹窄副 軸開口’同時減少固定孔口孔隙面積要求的主抽尺寸。主 軸尺寸縮小可比較具相同孔口孔隙面積之摘圓形所能實現 之孔口間隔更緊密。又沙漏形孔口孔隙可以主軸及副軸為 轴提供對稱而克服小墨滴彈道誤差問題。 如前述，習知孔口孔板係由電鍍鎳或類似金屬於心軸 上然後使用耐化學材料如金鍍敷孔口板製成。先前已知利 用非導電釦於具有所需最終效果之形狀：圓形孔口孔隙。 但為了形成沙漏形孔口開口，決定可使用比沙漏形遠較不 複雜之知。由於電鍍孔口板期間，基底金屬係由導電面（ 包括其本身表面）之各個可利用方向均勻增長，故非導電 釦形狀被增長中的基底金屬隱匿。同理，知形狀細節可隨 著基底余屬的增長轉變成全然不同形狀。再度考慮第1圊 ，其中基底金屬107增長於非導電絕緣釦1〇5頂面上。於平 面圖檢視時，釦105之外廓細節隨著基底金屬1〇7於絕緣釦 105頂面上增長可被隱匿或轉成其他形狀。 發現利用直徑等於預定基底金屬增長之一族圓之分析 技術可置於同一平面上且與預定孔口形狀之外侧外廊成切 線曰圓周上相對於切點且共享同一直徑線之點接合至該 圓族群之類似點時必須顯示非導電釦形狀。替代程序係使 I紙張尺度適财關諸專（CNS) &4麟（21{)x297Wj -—~—- A7 -—______137 五、發明説明（12 ) — ~~ : 用由開始形狀之外側外廓之全部或代表性點數繪出半徑弧 。各弧之半徑端點（垂直於開始外廓點繪製之切線）界定於 鍍敷過程元成後於孔口形狀所得—點。參照第8圖將有助 於觀察利用圓族群之技術。 第8圖中，孔口孔隙之沙漏形狀標示為8〇 i。半徑等於 預定基底金屬增長之一族圓以圓8〇3表示。非導電釦外廓 顯示為805。該族圓之各個圓係於順著沙漏形狀邊緣之一 點與沙漏孔口形狀成切線。取直接跨越各圓直徑該點並接 合該等點獲得非導電釦形狀。當處理更複雜的孔口形狀時 ’發現非導電知形狀不需與孔口形狀相同。觀察於沙漏形 801之肢端，界定該形狀所需圓數目減少。 第9圖示例說明產生孔口開口 8〇1所需組成圓。接合於 切點反側圓周上各點獲得產生所需沙漏形孔口開口需要的 最小釦外廓。外廓構型包括弧9〇1及弧9〇3而產生形成主軸 末端及拋物線部分905及907邊緣而產生形成副軸末端之邊 緣。只要釦外廓之其餘部分未比圓直徑更靠近預定孔口形 狀’則藉由電鍵孔口板產生的沙漏孔口形將與釦外廓無關 ，識別之弧及拋物線區除外。 經漪部中央標準局員工消費合作社印製 外廓可用於提供改良孔口板對障壁材料之黏著性，允 許射出腔室設計成具較大墨水容積。第1〇圖示例說明當非 導電心軸釦形部分與孔口表面孔形無關時所得印字頭。孔 口孔隙801及釦形1〇〇1為清晰起見以實線顯示，但孔口孔 隙801係位於孔口板外表面及釦形係位於孔口板内表面。 孔口之搪扎當開始檢視孔口搪孔時係於墨水射出腔室並橫 -15- ^-- (請先閲讀背面之注項再填寫本頁) 線 本紙張尺度適用中國國家標準（CNS ) Λ4現格（210X297公#_ ) 五、發明説明（13 ) ~ '—^ 置孔口板表面之開口時，由知形職變化成沙漏形孔口 801 。-個具_中，障層材料構型以虛線顯示。障層材料咖 之島將墨水進入射出腔室1005之入口劃分為二墨水通道 1007及，而其餘射出腔室屬係由障壁材料壁 UHUOU，腕料定。障制料與孔口㈣之接觸面積 改良可於障壁島刪區段實現（以進—步虛線代表假說圓 釦外廓）。此種改良接觸面積為須呈圓形部分之釦形平方 結果俾更為匹配障壁材料之平方實務，及於基材提供矩形 剖面’即使當發生孔口板之未對正時也不會改變。又平方 實務可增加射出腔室之墨水容積。 為了實現改良列印品質特別於彩色用途，希望利用間 隔緊密之孔口供同時由各個間隔緊密孔口喷墨。當孔口間 隔夠緊密而可利用相同射出腔室及加熱器電阻器時，可射 出適當協調之小墨滴而可於媒體上實現複雜之墨水記號。 設置於導電心轴上之單—非導電材料知由於電成形孔口板 之要求厚度無法產生間隔緊密之射出孔口。本發明之特點 為成形非導電釦可於相對於射出腔室尺寸面積為小面積產 生多數孔口。 經^部中央標準局員工消費合作社印製 現在參考第11圖，可見具有平行四邊形周邊形狀且孔 對中平行四邊形之非導電釦可優異地用於電沉積孔口板產 生關聯且間隔緊密之孔口。第11囷之視圖為孔口板之頂視 平面圖顯示粗趙線之孔口叢集1101，1103，1105及1107。虛 線顯示非導電釦頂面，於其上形成四個叢集孔口。一具體 例中平行四邊形105’具有外部尺寸Χι = 170微米X yi = 16〇微 -16- 本紙張尺度賴巾ϋ國家標準（CNS ) Α4祕（2iGx297公楚) A7 A7 經濟部中央標準局員工消費合作社印聚 知 間 其 中 B7 五、發明説明（14 ) ,—" 米。孔1113設置於平行四邊形釦中心且於本具體例具有直 也1"3=1〇微米。如第12圖之剖面圖所示，其示例說明喷墨 式印表機印字頭之工作構造，加熱器電阻器2〇丨係設置於 由半導體基材203，障壁材料2〇5及内表面孔口板1〇7,其相 當於第2圖之内表面115形成之射出腔室2〇7内部。孔口板 ⑺了’係沿第11圖之剖線BB剖面獲得第12圖之視圖。此視 圖中，電沉積過程接合孔口 11〇3及11〇9末端（於12()1)及孔 口 1105及1107末端（於1203)藉此於一個射出腔室關聯之叢 集形成獨立孔口。當電沉積厚度為4〇微米時，各孔口之開 口面積等於約250平方微米。 第π圖顯示符合第丨圖所述方法形成孔口板1〇7，。較 佳具體例中，非導電釦105，係沉積成孔1113設置於非導電 知内部。沉積之非導電知尺寸如第i i圖所示但為了分析此 剖面可視為I：3加四剖面各具有s=4〇微米。如第13圖所示， 孔口板係沿第11圖之剖線BB剖開並顛倒。當鎳（或其他電 沉積材料）沉積於103之導電面時，其係由導電面包括透過 孔1U3暴露面（但非由非導電釦1〇5，）之各個方向均勻增長 。經一段時間後’當鎳鍍成厚40微米（非導電釦之各剖面s 尺寸）而使鎳接合於非導電知上方大部分面#時停止習 電沉積過程，但非導電知之周邊形狀與内孔之差異造成 隙保留於錄孔口板隙產生獨立但關聯之孔口， 彼此位置相反，介於孔σ間距中點係位於料電知之孔 相關孔口於孔口板外表面具有一致開口面積且以距離 中點為令心彼此對稱。例如第Η圖巾，孔口 1103及孔口 11〇7 Μ氏張尺度適财國 裝 ^ 訂 -線 (讀先閲誚背面之注意事項再填寫本頁) -17- 經濟部中央標準局員工消費合作社印掣 Α7 Β7 五、發明説明（15 ) . 環繞一孔口間之中點（等於非導電知之孔1 1 1 3所在位置）彼 此相對但具有對稱而一致之面積開口於孔口板表面。換言 之，於孔口 1103之孔口開口面積之一點具有一個對應點於 孔口 1107之孔口開口，出現於介於二點間繪出之假想線上 且包括二孔口間之中點》 第11圖之平行四邊形並非可於印字頭產生多個孔口之 唯一構型。曾經考慮若干具體例之細節並就第14_18B圖討 論。第14圖示例說明於孔口板表面關聯孔口開口 14〇1及 1403之兩種’’D字形，，。此二喷墨孔口係藉由使用橢圓形非 導電釦（以虛線顯示為釦1405之橢圓周邊）產生，其具有一 個擴圓孔H07對中於非導電釦之主軸與副軸之接合處。於 非導電知之孔與周邊間之形狀差異係經由使孔剖面之主軸 相對於釦之副軸定向產生。當使用電沉積過程及結束時， 形狀差異產生如第14圖所示空間。較佳具體例中非導電知 1405之主軸設定於乂2=220微米及副抽設定於y2=i6〇微米。 釦之孔1407之主軸設定為40微米及副軸設定為微米。習 知電沉積過程進行一段時間而使鎳鍍成增長至4〇微米厚度 。最初結果為二孔口 1401及1403各自具有開口面積等於約 1000平;ίτ微米。 第15圖示例說明一種四孔口叢集，其係由具有同心圓 孔1503之圓形非導電釦1501產生。釦之周邊於非導電知周 邊外廓具有四個凹口 1505，1507，1509及1511作為特徵，其 可使電沉積增長由凹口下方導電面增長至非導電釦表面上 。此種凹口增長產生金屬凹入非導電釦表面上，介於四孔 本紙張尺度適用中國國家標準（CNS > Α4说格（210Χ297公釐） ¢— (請先聞讀背面之注意事項^填寫本頁} 訂 線 A7 B7 五、發明説明（16 ) ' '~~ 口之孔口叢集間造成分離。當非導電釦直徑為160微米時 四孔口 1513，1515，1517及1519為具有面積約175平方微米 之窄開槽，中孔直徑為1〇微米，當孔口板厚度到達35微米 時停止電沉積過程。 第16圖示例說明於孔口板外表面之一個四孔口叢集， 該叢集係由具有橢圓周邊形狀之非導電釦（以虛線顯示於 1601)產生’釦具有凹口特徵16〇3及16〇5暴露非導電釦下 方之導電面且設置於沿主轴兩端。轴線可相對於釦軸線旋 轉之摘圓形孔1607係設置於知中心。當橢圓知主袖變成 X3=240微米及副轴變成乃=16〇微求時，凹口由非導電釦周 邊凹陷35微米，及貫穿非導電釦（至下方導電面）之橢圓釦 變成等於10微米X 40微米時，於叢集之各孔口之孔口板外 表面之開口面積約等於100平方微米。 經濟部中央標準局員工消費合作社印製 對第16圖所示設定可做數種變化。其中一例係使用呈 矩形之非導電知1701具有凹口 1703,1705於矩形短邊及圓 孔1707於中心。當非導電釦之長邊尺寸設定於x4=240微米 ，釦之短邊尺寸設定於3^= 160微米，凹口由短邊下割3 5微 米’圓孔直徑設定為10微米’及電沉積過程進行至鎳鍵成 厚40微米時’形成四個孔口 i7〇717〇9，171丨及1713各自具 有開口面積約250平方微米。預期第π圖之矩形非導電釦 可利用橢圓孔，而第16圊之橢園非導電孔可採用圓孔。 使用具有其他幾何形狀及孔之非導電釦可產生多於四 孔口之孔口叢集。六叢集孔口 1801-1806可以六角形（於第 18A圊以虛線顯示於1808)具有對中孔1810至導電面之非 -19- 本紙張尺度適用中國國家摞準（CNS ) Μ規格（210X297公廣） A7 A7 17 137 五、發明説明（ 導電知形成。當六角形釦設定為y5=l 60微米，孔成形為10 微米’及電沉積過程產生3 7.5微米鎳厚度時，各孔口開口 面積變成約100平方微米》至於替代例，釦如第丨8B圖所 示可於一維或多維扭曲。一釦尺寸設定為y6=16〇微米及另 尺寸没定為X6=220微米。10微米x 55微米之橢圓孔對中 於扭曲六角形。當電沉積法產生厚37.5微米之孔口板時， 各叢集孔口之開口面積為1〇〇平方微米。 如此根據前文說明可見，使用具有控制形狀之單一非 導電知及知中之一成形孔可形成間隔緊密之孔口叢集。此 種配置產生獨立但協調之孔口，其特別可用於產生高品質 圖像。 - 9 ----------^:----r--τ;τ------:線 -if ]..\ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印聚 -20· 經濟部中央標準局員工消費合作社印製 A7 137 1 ο 五、發明説明（） 元件標號對照 101...基材 1003，1011-5…障壁材料 103...導電層 1005…射出腔室 105...介電層 1007-9...墨水通道 107…鎳層，孔口板 105，···釦 11 5...内面 1113.·•孔 213...外表面 1103-9，1201··.孔口 201…薄膜電阻器 1401-3...孔 口開口 203...半導體基材 14 0 5...知 205...障層 1407...橢圓孔 207···墨水射出腔室 1501.··非導電釦 209···孑L 口 1503...孔 301...墨水進給通道 1505-1 1·.·凹口 401...小墨滴 1513-9".孔口 403…尾 1601…非導電釦 501…質塊 1603-5...凹口 503...固定結構 1607...橢圓孑L 505...彈簧 1701…非導電釦 507...阻尼功能 1703-5...凹口 901-3…電弧 1707...圓孔 905...主軸線部 1707-13...孔口 907...拋物線部 1801-6...叢集孔口 801...孔口板 1808...非導電釦 1001...釦形 1810...中孔 ---：------參----^—ir------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規枱（210X297公釐） -21 -»H —I 1 IH— · This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 gong) -6- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A--, -____ 'Η 7 V. Invention Explanation (4), '~: whether the ink droplets (called “pixels”) are deposited on the print media and controlled. The brightness continuity-color transition within the recorded image is particularly affected by the use of ink droplets The unique quantified effects of dot matrix imaging. The imaging system also causes scattered or systematic brightness fluctuations commonly known as granularity, which can be identified by the naked eye. It is estimated that the unassisted human visual system can detect individual points until the image is printed. The diameter is reduced to less than or equal to about 20 to 25 microns. Therefore, the undesired quantification of the dot array printing method affects the current situation in the industry by reducing the size of each droplet and printing at high resolution. Usually 1200 dots per inch (" dpi ") print image has better visual perception than 600 dpi image 'and it is improved over 300 dpi, etc. In addition, undesired quantified effects can be utilized with different color densities (for example, two cyan ink columns Stamp (Dye-to-volume ratios of different proportions of inks with different chemical compositions) or reduced colorimetric ratios containing different types of chemical colorants. Devices for improving print quality are discussed in Bubble Inkjet with Improved Performance-by Enrico Manini, Olivetti at IS & T, s 10th Non-Impact Printing Technology Progress Conference, October 30-November 4, 1994 New Orleans, Louisiana. Manini presents a concept that uses several pressure chambers with several The nozzles use more and smaller ink droplets to distribute the ink more evenly, so that ink fines are deposited on the paper. " The sketch provided by Manini shows a two-nozzle pressure chamber, a three-nozzle chamber and a four-nozzle chamber. The further improvement of the multi-nozzle (or orifice) technology is disclosed in Weber, US Patent Application No. 08 / 812,385 filed on March 5, 1997, a method and device for improving ink droplet distribution in inkjet printing, This case was assigned to the assignee of the present invention. Although the advantages of multi-printing orifices are obvious, the technology of implementing special clusters of printing heads with closely spaced printing orifices has not been well developed. This paper applies the Chinese National Standard (CNS) 8-4 specifications (21GX 297g t) according to the standard " '~ " " Install tM Thread (please read the precautions on the back before filling this page) Printed by the Bureau of Consumers of the Bureau of Standards ^ A7-----B7 V. Description of the invention (5)--The porous orifice method uses a plurality of non-conductive materials known on the mandrel of a conductive substrate, and records its metal electrical / electrical product. On it. Unfortunately, this method is not effective for cluster printing orifices. The original is that the space between the heater resistor and the associated installation chamber is limited. It is not allowed to form orifices while allowing the orifice plate to be thick enough to meet the requirements. The structural design requirements of printable daggers and the manufacturing requirements of orifice plate strength are easy to handle. SUMMARY OF THE INVENTION The present invention encompasses a method for manufacturing a print head and a print head device for an ink jet printer. The printing head has-the orifice plate is attached with at least two ink jet orifices, and the operation modes are associated with each other and are opposite to each other with respect to the midpoint of their pitch. The two orifices each have an area or areas that are symmetrical to the other orifice at this distance midpoint. Brief Description of the Drawings Figure 1 is a sectional view of an orifice plate forming a mandrel and an orifice plate formed on the mandrel. Figure 2 is a cross-sectional view of a conventional printing head, showing an ink ejection chamber. Figure 3 is a plan view of the outer surface of an orifice plate of the conventional printing head. Figure 4 is a cross-sectional view of a conventional print head illustrating the ejection of ink droplets. Fig. 5 is a theoretical model of the droplet-half moon system which can be used to understand the performance of the present invention. Figures 6A and 6B show the pore surface pores by the plane of the outer surface of the orifice plate. Figure 7 shows the flat circle display by the outer surface of the orifice plate. -(谙 Please read the precautions on the back before filling out this page) Order --- line ---- • I. I-—II -I · The paper's silver standard is suitable for rich countries' national standards (CNS) A4 regulations ( 2 (like 297 public momentum) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 401348 A7 ----- B7 V. Description of the invention (6), Pore surface pores of Γ. Fig. 8 illustrates a technique for forming an aperture pore that can be used in the present invention. Fig. 9 illustrates an example of the technique for forming an aperture pore that can be used in the present invention. Fig. 10 is a plan view of the surface of an orifice plate. It can be used in the pore surface pores of the present invention and the boring holes of the associated ink ejection chambers. Fig. 11 is a top plan view of an orifice plate to which the present invention can be applied and the orifice clusters are shown in bold lines. Fig. 12 is a sectional view of a printing head which can be used in the present invention, and shows a sectional view of the orifice plate of Fig. 11 taken along a section line. Fig. 13 is a cross-sectional view of a mandrel on which a non-conductive buckle is deposited, and for example, a cross-sectional view of an electrodeposition orifice plate shown in Fig. 11 (taken along section line B_B). Fig. 14 is a printing head. A top plan view of a portion of the orifice plate, which shows two orifices and is used in the present invention. Fig. 15 is a top plan view of a part of the orifice plate of the printing head showing that the four orifices in the form of a slot can be used in the present invention. Fig. 16 is a top plan view of a part of the orifice plate of the Yinyu head, showing four orifices which can be used in the present invention. Figure Π is a top plan view of a part of the orifice plate of the printing head showing a four-hole orifice which can be used in the present invention. Figures 18A and 18B are top plan views of part of the orifice plate of the printing head, showing six orifices which can be used in the present invention. -: 丨: ------ installation ---- ^-nail -----_ line (please read the precautions on the back before filling this page) c is called A4 ^ (210X297 ^,) -9 A7 137 V. Description of the invention (7) '~ Detailed description of the preferred specific examples The cross section of the conventional printing head is shown in Figure 2. The thin film resistor 201 is formed on a semiconductor substrate. The surface of the material 203 is typically connected to the power input by metallization (not shown) on the surface of the semiconductor substrate 203. In addition, multiple layers that can protect the chemical and mechanical supply are provided on the heater resistor 2. i, but not shown in Figure 2 for clarity. A layer of barrier material 205 is selectively placed on the surface of the silicon substrate 203 (or smaller) to flow to the opening or ink surrounding the heater resistor 201 The ejection chamber 207 can accumulate in the ejection chamber before the heater resistor 201 is excited and before the ink is ejected through the orifice 209. The barrier material of the barrier layer 205 is known as paracj or equivalent from DuPont. The orifice 209 extends from the inner surface 115 of the orifice plate to the outer surface 213 of the orifice plate 107, as described above. Shaped as the part of the orifice plate. Figure 3 is the top view of the conventional printing head (indicated by the section line AA in Figure 2) from the outside of the orifice plate 107 and the top view of the orifice 209 is viewed. A large ink source (not shown) is delivered to the ink ejection chamber at the barrier layer 205. The fourth circle example illustrates the ink configuration of a small ink droplet 401 at 22 microseconds after the ink is discharged from the orifice 209. It is known that in the orifice plate (in which a circular aperture is used), the small ink droplet 401 generates a long tail 403, which can be seen to extend backward to at least the orifice 209 of the orifice plate 107. The small ink droplet 401 leaves the orifice plate and discharges the small ink droplet. After the gasification of the ink bubbles collapses, the capillary force extracts the ink from the ink source through the ink feed channel 301. In an undamped system, the ink flushes back to the ejection chamber too quickly and overfills the ejection chamber 207, thereby generating a drum. The half-moon shape then swings in its horizontal position for several cycles before it subsides and calms down. The half-paper size is applied to the Chinese National Standard (CNS) A4 specification (210X297). I ------- pack- -(Please read the notes on the back first and fill in this page) , ^ Τ line printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, printed by the Ministry of Economic Affairs, Central Bureau of Standards, and the staff consumer cooperative printed 401348 A7 ---: ______ V. Description of the invention (8) Extra ink in the shape of a moon adds small ink droplets Volume, so the small ink droplets are discharged when the half-moon shape bulges. The retracted half-moon shape reduces the volume of the droplets, so part of the droplets are discharged during this period. The print head designer increases the fluid resistance of the ink to refill the channel to Improve and optimize the damping effect of the ink refilling and half-moon system. This type of improvement is typically achieved by extending the ink refilling channel, reducing the ink refilling channel profile, or increasing the ink viscosity. Such increased ink refill fluid resistance often results in slower refill times and reduced droplet ejection and print speeds. The simplified analysis of the half-moon system is, for example, the mechanical mode shown in FIG. 5 where the mass 501 equivalent to the mass of the ejected small ink droplets is coupled to the fixed structure 503 by the spring 505 'the spring has a reciprocal of the effective radius of the orifice Proportional spring constant K. The mass 501 is also coupled to the fixed structure 503 by a damping function 507, which is related to channel fluid resistance and other ink channel characteristics. In this configuration, the 'ink droplet weight mass 501 is proportional to the orifice diameter. In this way, if you want to control the characteristics and performance of the meniscus, you can adjust the damping factor of the damping function 507 by optimizing the ink channel or adjusting the spring constant of the spring 505 in the mechanical mode. When the droplet 401 is ejected from the orifice, most of the small droplet mass is contained at the leading end of the droplet 401, and the mass has the highest speed. The remaining tail 403 contains a small part of the ink and has a velocity distribution ranging from an equal velocity close to the position of the small ink droplet head to an ink velocity lower than the ink of the small ink droplet head and closest to the pores of the orifice. Occasionally during the droplet transition process, the tail ink stretches to the point where the tail breaks from the droplet. ”Part of the ink remaining in the tail is pulled back to the printing head orifice plate. 〇7 'Here it typically forms around the orifice Ink paste If this ink paste is not original & the scale is applicable to Chinese National Standard (CNS) A4 Regulations (2 丨 0 parent 297 public expense) " ~-~ --- See: iT ------- -0 (筇 Please read the precautions on the back before filling in this page} ----- B7 V. Description of the invention, (9) The quality of the printing material is inferior due to the misdirection of the small ink droplets after being controlled. Others Part of the small ink droplet tail is absorbed into the small ink droplet head before the small ink droplet is deposited on the medium. Finally, part of the ink at the small ink droplet tail is neither returned to the printing head nor retained or absorbed in the small ink droplet. The fine mist smaller than the droplet spread in any direction. Part of the fine mist reaches the media during printing, causing the edges of the dots formed by the small ink droplets to be rough and creating undesired dots on the media, reducing the clarity of the printing material required. It is known that the exit area from the orifice 209 to the external environment determines the weight of the droplet discharged by the small ink droplet. The restoring force (constant K in the mode) that determines the half-moon shape is determined by the conditions near the edge of the pore. In order to increase the stiffness of the half-moon, the sides and openings of the boring hole must be as close as possible. Contradictory to the need to maintain the specific drop weight of the droplet (determined by the orifice exit area). The non-circular geometry provides greater return force on the heater resistor to make the droplet tail faster and closer to the orifice plate break, As a result, short ink droplets are generated and the spray phenomenon is significantly reduced. The non-circular orifices that can be used to reduce spraying by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs can be used to reduce the number of non-circular orifices. The elongated orifices have a main axis and an auxiliary axis. "The main axis is larger than the auxiliary axis, and both axes are parallel to the outer surface of the orifice plate." This slender structure can be rectangular and parallelograms or printed shapes such as oval and parallel sides. Model HP51649A ink cartridge (available from Hewlett-Packard Company) and orifice pore area equal to the orifice pore area used by HP51649A cartridge. It is judged to have an ellipse with a major axis to a minor axis ratio of 2 to 1 to 5 to 1. Small ink droplets with half-moon stiffness and short tail ejection required for circular appearance. Section 6A-6B 囷 is a plan view of the outer surface of the orifice plate to illustrate various types of holes -12- This paper applies to China National Standards (CNS) A4 Specifications (210X297mmf) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China 401348 A7 p — ^ _________ V. Description of the invention (10) ~: Boring hole size. Figure 6A illustrates the outer diameter r and the outer diameter A circular orifice with a dimension r and a radius ratio between the opening and the value of the injection chamber. In the HP51649A cassette, r = 17.5 microns and Γ2 = 45 microns. The pore area (r · π) of the outer surface of the orifice plate is thus obtained. = 962 square microns. The example in Figure 6B illustrates the pore geometry of the outer orifice of the ellipse, where the ratio of the major axis to the minor axis = 2: i. In order to maintain small droplets of equal weight, the area outside the orifice opening is maintained at 962 square microns. In this way, the major and minor axes (a, b) of the ellipse are obtained from the ellipse area formula (Α = 7Γ · a · b). For a 2: 1 ellipse, they are 28 5 microns and 12 4 microns. The main contributing factor to tail breaks and reduction of subsequent spraying is to reduce the minor axis size of the ellipse. In the range of the axial ratio of 2: i to about 5: i, it was observed that the spray phenomenon was reduced. A disadvantage also found in the foregoing is that the opening of the elliptical orifice surface on the inner surface of the orifice plate (to the ink ejection chamber) is relatively large. Such internal openings will overlap and interfere when the orifices are closely spaced to improve print resolution. This interference causes ink from an ejection chamber to be sprayed into the adjacent ejection chamber and other minor but harmful effects. In order to solve the interference problem, the ellipse is twisted in the main axis direction mainly to generate a crescent shape or a quarter crescent shape. This kind of crescent-shaped minor axis is retained while the effective major axis is shortened, while the total aperture pore area is kept constant. Using a crescent-shaped orifice opening can continue to achieve proper spray reduction. However, crescent shapes cause different problems with print quality using this type of print head. The trajectory leaving the orifice plate is not perpendicular to the orifice plate surface, but instead deviates from the direction of the negative curvature radius perpendicular to the orifice hole surface. In order to solve the trajectory problem of the crescent-shaped aperture, the paper size is applicable through overlapping February) M standard ·-~ — l ^ -ST —----- ^ (Please read the precautions on the back before filling in this paper (Page) A7 —____ B7 V. Description of the Invention (11) • The tooth-shaped and crescent-shaped limbs face away from each other, providing another symmetrical shape. An example of this shape is illustrated in FIG. The modified pore shape can be regarded as "hourglass" shape. In the preferred embodiment, the minor axis (bH) is modified to 26 micrometers and the major axis (aH) is modified to 69 micrometers. The radius of curvature (rH) defining the edge of the modified layshaft is about 47 microns. This unique orifice pore shape can maintain a narrow countershaft opening 'while reducing the main draw size required for a fixed orifice pore area. The reduction in the size of the main shaft can make the orifice spacing closer than that achieved by a circular shape with the same orifice pore area. In addition, the hourglass-shaped orifice can provide symmetry to the axis by the primary and secondary axes to overcome the problem of small droplet trajectory errors. As mentioned before, the conventional orifice plate is made of electroplated nickel or similar metal on a mandrel and then plated with a chemical resistant material such as gold. It was previously known to use non-conductive buckles in a shape with the desired final effect: circular orifice pores. However, in order to form an hourglass-shaped orifice opening, it was decided to use a knowledge that is much less complicated than an hourglass. During the plating of the orifice plate, the base metal grows uniformly from each available direction of the conductive surface (including its own surface), so the shape of the non-conductive buckle is hidden by the growing base metal. In the same way, it is known that the details of the shape can be transformed into completely different shapes as the remaining genus of the base grows. Consider again No. 1 圊, where the base metal 107 grows on the top surface of the non-conductive insulating buckle 105. When viewed in a plan view, the outer details of the buckle 105 can be hidden or transformed into other shapes as the base metal 107 grows on the top surface of the insulating buckle 105. It is found that the analysis technique using a circle with a diameter equal to a predetermined base metal growth can be placed on the same plane and tangent to the outer porch of the shape of the predetermined orifice. The points on the circumference opposite to the tangent point and sharing the same diameter line are joined to the circle group The similarity must show the shape of the non-conductive buckle. The alternative program is to make I paper scales suitable for financial institutions (CNS) & 4 Lin (21 {) x297Wj ----- ~--A7--______137 V. Description of the invention (12)-~~: Use the outer side of the starting shape All or representative points of the outline draw a radius arc. The endpoints of the radii of each arc (tangent lines drawn perpendicular to the starting contour points) are defined as points obtained from the shape of the orifice after the plating process is completed. Reference to Figure 8 will help to observe the techniques of using the round group. In Figure 8, the hourglass shape of the pores at the orifices is labeled 80i. A circle with a radius equal to a predetermined base metal growth is represented by circle 803. The non-conductive buckle profile is shown as 805. Each circle of the family circle is located at a point along the edge of the hourglass shape and is tangent to the shape of the hourglass orifice. Take the point directly across the diameter of each circle and join these points to obtain a non-conductive buckle shape. When dealing with more complex orifice shapes, it was found that the non-conductive shape need not be the same as the orifice shape. Looking at the extremities of the hourglass shape 801, the number of circles required to define the shape is reduced. Figure 9 illustrates the composition circle required to create the orifice opening 801. Join the points on the circumference opposite to the tangent point to obtain the minimum buckle profile required to produce the desired hourglass-shaped opening. The outline configuration includes arcs 901 and 903 to produce the edges that form the ends of the major axis and the edges of the parabolic portions 905 and 907 and the edges that form the ends of the minor axis. As long as the rest of the buckle profile is not closer to the predetermined orifice shape than the circle diameter ’, the hourglass orifice shape produced by the key orifice plate will have nothing to do with the buckle profile, except for the identified arcs and parabolic areas. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, the profile can be used to provide improved adhesion of the orifice plate to the barrier material, allowing the injection chamber to be designed with a larger ink volume. Fig. 10 illustrates an example of the printing head obtained when the non-conductive mandrel button-shaped portion is not related to the hole shape of the orifice surface. The orifice pore 801 and the button shape 001 are shown by solid lines for clarity, but the orifice gap 801 is located on the outer surface of the orifice plate and the button shape is on the inner surface of the orifice plate. The boring of the orifice is tied to the ink ejection chamber and horizontal when starting to inspect the boring of the orifice. -15- ^-(Please read the note on the back before filling this page) The paper size of the paper applies the Chinese national standard (CNS ) Λ4 is present (210X297 公 #_) V. Description of the invention (13) ~ '— ^ When the opening on the surface of the orifice plate is placed, the shape of the hourglass changes into an hourglass-shaped orifice 801. In each case, the barrier material configuration is shown in dotted lines. Kashima, the barrier material, divides the entrance of ink into the injection chamber 1005 into two ink channels 1007 and the rest of the injection chamber belongs to the barrier material wall UHUOU, which is determined by the wrist material. The improvement of the contact area between the barrier material and the orifice can be realized in the deleted section of the barrier island (the dotted line represents the outline of the hypothesis circle). This improved contact area is the square of the buckle shape that has to be a round part. It better matches the squared practice of the barrier material, and provides a rectangular cross section on the substrate 'even if the orifice plate is misaligned. Another square practice can increase the ink volume of the ejection chamber. In order to achieve improved print quality especially for color applications, it is desirable to use closely spaced orifices for simultaneous ink jetting from each closely spaced orifice. When the orifices are closely spaced to allow the same ejection chamber and heater resistor to be used, small droplets of ink that are properly coordinated can be ejected to achieve complex ink marks on the media. The single-non-conductive material provided on the conductive mandrel knows that due to the required thickness of the electroformed orifice plate, closely spaced ejection orifices cannot be produced. A feature of the present invention is that the shaped non-conductive buckle can generate a large number of orifices with a small area relative to the size and area of the injection cavity. Printed by the Consumer Standards Cooperative Department of the Central Bureau of Standards. Now refer to Figure 11. It can be seen that non-conductive buckles with parallelogram peripheral shapes and centered parallelograms can be excellently used for electrodeposition orifice plates to generate closely spaced holes. mouth. View 11 is the top view of the orifice plate. The plan view shows the orifice clusters 1101, 1103, 1105, and 1107 of the thick Zhao line. The dotted line shows the top surface of the non-conductive buckle, and four cluster apertures are formed on it. In a specific example, the parallelogram 105 'has an external dimension Xι = 170 micrometers X yi = 16〇 micro-16-this paper size is the national standard (CNS) Α4 secret (2iGx297) Chu A7 A7 employees of the Central Standards Bureau of the Ministry of Economic Affairs Consumption cooperatives Yin Ju Zhi Jian, among which B7 V. Invention Description (14), "" Rice. The hole 1113 is provided at the center of the parallelogram buckle and has 1 " 3 = 10 micrometers in this specific example. As shown in the cross-sectional view of FIG. 12, which illustrates the working structure of the print head of an inkjet printer, the heater resistor 20 is provided by a semiconductor substrate 203, a barrier material 205, and an inner surface hole. The mouthpiece 107 corresponds to the inside of the injection chamber 207 formed by the inner surface 115 of FIG. 2. Orifice plate ’'is a cross-sectional view taken along line BB of FIG. 11 to obtain a view of FIG. 12. In this view, the electrodeposition process joins the ends of the orifices 1103 and 1109 (at 12 () 1) and the ends of the orifices 1105 and 1107 (at 1203) to form independent orifices in a cluster associated with the injection chamber. . When the electrodeposition thickness is 40 micrometers, the opening area of each orifice is equal to about 250 square micrometers. Figure π shows that the orifice plate 107 is formed in accordance with the method described in Figure 丨. In a preferred embodiment, the non-conductive buckle 105 is deposited as a hole 1113 and is disposed inside the non-conductive substrate. The deposited non-conductive dimensions are shown in Figure ii but for analysis this section can be viewed as I: 3 plus four sections each with s = 40 microns. As shown in Fig. 13, the orifice plate is cut along the line BB of Fig. 11 and turned upside down. When nickel (or other electrodeposited material) is deposited on the conductive surface of 103, it is uniformly grown in all directions from the conductive surface including the exposed surface through the hole 1U3 (but not from the non-conductive buckle 105). After a period of time, when the nickel is plated to a thickness of 40 micrometers (the dimensions of the sections of the non-conductive buckle) and the nickel is bonded to most of the non-conductive surface, the electrodeposition process is stopped, but the non-conductive shape The difference of the holes causes the gap to remain in the gap of the recording orifice, creating independent but related orifices, which are opposite to each other. The midpoint between the σ spacing of the holes is located in the hole. The relevant orifice has a uniform opening area on the outer surface of the orifice plate. And the center of distance is the symmetry of each other. For example, the second picture towel, the orifice 1103 and the orifice 1107 M Zhang Zhang scales are suitable for the country. Order-line (read the precautions on the back of the book before filling this page) -17- Employees of the Central Standards Bureau of the Ministry of Economic Affairs Consumption cooperative seal A7 B7 V. Description of the invention (15). Surround the center of a hole (equal to the position of the non-conductive hole 1 1 1 3) opposite to each other but with a symmetrical and consistent area opening on the surface of the orifice plate . In other words, a point at the opening area of the opening 1103 has a corresponding opening at the opening of the opening 1107, which appears on an imaginary line drawn between two points and includes the midpoint between the two openings. The parallelogram of the figure is not the only configuration that can create multiple openings in the print head. The details of several specific cases have been considered and discussed on Figure 14_18B. Figure 14 illustrates two types of '' D-shapes, which are associated with the orifice openings 1401 and 1403 on the surface of the orifice plate. These two inkjet orifices are produced by using an oval non-conductive buckle (shown in dotted lines as the perimeter of the oval of the buckle 1405), which has an enlarged circular hole H07 centered at the junction of the main shaft and the countershaft of the non-conductive buckle. The difference in shape between the non-conductive hole and the periphery is caused by orienting the major axis of the hole section with respect to the secondary axis of the buckle. When the electrodeposition process is used and finished, the shape difference creates a space as shown in FIG. In the preferred embodiment, the main axis of the non-conductive electrode 1405 is set to 乂 2 = 220 microns and the sub-pump is set to y2 = i60 microns. The main axis of the buckle hole 1407 is set to 40 micrometers and the counter axis is set to micrometers. The conventional electrodeposition process is carried out for a period of time to increase the nickel plating to a thickness of 40 microns. The initial results were that the two orifices 1401 and 1403 each had an opening area equal to about 1000 square meters; τ m. Fig. 15 illustrates a four-hole cluster produced by a circular non-conductive buckle 1501 having concentric holes 1503. The periphery of the buckle has four notches 1505, 1507, 1509, and 1511 as features around the non-conductive periphery, which can increase the growth of electrodeposition from the conductive surface below the notch to the surface of the non-conductive buckle. The growth of this notch produces a metal recess on the surface of the non-conductive buckle, which is between four holes. The size of the paper is applicable to Chinese national standards (CNS > A4 grid (210 × 297 mm)) ¢ — (Please read the precautions on the back first ^ Fill out this page} Ordering line A7 B7 V. Description of the invention (16) '~~ Mouth clusters cause separation. When the diameter of the non-conductive buckle is 160 microns, the four ports 1513, 1515, 1517 and 1519 have areas A narrow slot of about 175 square microns with a mesopore diameter of 10 microns. When the thickness of the orifice plate reaches 35 microns, the electrodeposition process is stopped. Figure 16 illustrates an example of a four-hole cluster on the outer surface of the orifice plate. This cluster is generated by a non-conductive buckle with oval perimeter shape (shown in dotted line at 1601). The buckle has notched features 1603 and 1605 to expose the conductive surface below the non-conductive buckle and is provided at both ends along the main axis. The circular hole 1607 with the thread rotatable with respect to the button axis is set at the center of the know. When the main sleeve of the ellipse becomes X3 = 240 microns and the auxiliary axis becomes equal to 16μ, the notch is recessed from the periphery of the non-conductive button 35 Micron, and through non-conductive buckle (to the conductive surface below When the oval buckle becomes equal to 10 micrometers x 40 micrometers, the opening area on the outer surface of the orifice plate of each orifice in the cluster is equal to about 100 square micrometers. Printed on Figure 16 by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs The setting can be changed in several ways. One example is the use of a rectangular non-conductive substrate 1701 with notches 1703 and 1705 on the short side of the rectangle and a circular hole 1707 in the center. When the long side of the non-conductive buckle is set at x4 = 240 microns The size of the short side of the buckle is set to 3 ^ = 160 microns, the notch is cut from the short side to 35 microns, the diameter of the round hole is set to 10 microns, and the electrodeposition process is performed until the nickel bond becomes 40 microns thick. Ports i7〇717〇9, 171 丨 and 1713 each have an opening area of about 250 square micrometers. It is expected that the rectangular non-conductive buckle of the π figure can use an oval hole, and the oval non-conductive hole of the 16th can use a round hole. Non-conductive buckles with other geometries and holes can produce more than four orifice clusters. Six-cluster orifices 1801-1806 can be hexagonal (shown in dotted line at 18A 圊 1808) with centering holes 1810 to conductive面 之 非 -19- This paper is of suitable size Use China National Standard (CNS) M specifications (210X297). A7 A7 17 137 V. Description of the invention (Conductivity is formed. When the hexagonal buckle is set to y5 = l 60 microns, the hole is formed to 10 microns' and the electrodeposition process When a nickel thickness of 3 7.5 microns is generated, the opening area of each orifice becomes about 100 square microns. As an alternative, the buckle can be twisted in one or more dimensions as shown in Figure 丨 8B. The size of a buckle is set to y6 = 160 microns and The other dimensions are not set to X6 = 220 microns. The oval holes of 10 microns x 55 microns are centered in a twisted hexagon. When an electrode plate with an orifice thickness of 37.5 micrometers is produced, the opening area of each cluster orifice is 100 square micrometers. Thus, it can be seen from the foregoing description that a closely spaced orifice cluster can be formed by using a single non-conductive electrode having a controlled shape to form the hole. This configuration produces independent but coordinated orifices, which are particularly useful for producing high-quality images. -9 ---------- ^: ---- r--τ; τ ------: line-if] .. \ (Please read the notes on the back before filling this page ) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs-20 · Printed by the Consumers Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 137 1 ο 5. Description of the invention () Comparison of component numbers 101 ... 1003, 1011-5 ... barriers Material 103 ... conducting layer 1005 ... exposure chamber 105 ... dielectric layer 1007-9 ... ink channel 107 ... nickel layer, orifice plate 105, ... buckle 11 5 ... inner surface 1113 ... • Hole 213 ... outer surface 1103-9, 1201 .... hole 201 ... thin film resistor 1401-3 ... hole opening 203 ... semiconductor substrate 14 0 5 ... known 205 ... Barrier layer 1407 ... Ellipse hole 207 ... Ink ejection chamber 1501 ... Non-conductive buckle 209 ... L port 1503 ... Hole 301 ... Ink feed channel 1505-1 1 ... Notch 401 ... small ink drop 1513-9 ". orifice 403 ... tail 1601 ... non-conductive buckle 501 ... mass 1603-5 ... notch 503 ... fixed structure 1607 ... ellipse 孑 L 505 ... spring 1701 ... non-conductive buckle 507 ... damping function 1703-5 ... notch 901-3 ... arc 1707 ... round hole 905 ... main axis portion 1707-13. .. Orifice 907 ... Parabolic section 1801-6 ... Clustered orifice 801 ... Orifice plate 1808 ... Non-conductive buckle 1001 ... Buckle 1810 ... Center hole ---:- ----- Refer to ---- ^ — ir ------ ^ (Please read the notes on the back before filling in this page) The paper size is applicable to China National Standard (CNS) A4 gauge (210X297 mm) ) -twenty one -