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Application filed by Taiwan Semiconductor Mfg Co LtdfiledCriticalTaiwan Semiconductor Mfg Co Ltd
Priority to TW085105365ApriorityCriticalpatent/TW377477B/en
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Publication of TW377477BpublicationCriticalpatent/TW377477B/en
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices
(AREA)
Abstract
This invention is about a method of performing chemical mechanical polishing with an embedded polishing agent, whereby the polishing agent is embedded or dispersed on the surface of the article to be polished enhancing the efficiency in etching and at the same time cutting down the consumption of polishing agent. The said method requires a dielectric coating on the substrate, embedded or dispersed polishing powder, a polishing pad, and a polishing solvent for spraying on the area in between the substrate, and the polishing pad. Having prepared the above items, the surface of substrate to be polished needs to be pressed against the polishing surface for rotation of the substrate against the polishing pad.
TW085105365A1996-05-061996-05-06Method of chemical mechanical polishing with embedded polishing agent
TW377477B
(en)